KR101975135B1 - 조면화 처리 구리박 및 프린트 배선판 - Google Patents

조면화 처리 구리박 및 프린트 배선판 Download PDF

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Publication number
KR101975135B1
KR101975135B1 KR1020177023365A KR20177023365A KR101975135B1 KR 101975135 B1 KR101975135 B1 KR 101975135B1 KR 1020177023365 A KR1020177023365 A KR 1020177023365A KR 20177023365 A KR20177023365 A KR 20177023365A KR 101975135 B1 KR101975135 B1 KR 101975135B1
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KR
South Korea
Prior art keywords
roughened
copper foil
particle
roughening
insulating resin
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KR1020177023365A
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English (en)
Korean (ko)
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KR20170107040A (ko
Inventor
교스케 야나기
미사토 미조구치
사키코 도모나가
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미쓰이금속광업주식회사
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Publication of KR20170107040A publication Critical patent/KR20170107040A/ko
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/16—Electroplating with layers of varying thickness
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
KR1020177023365A 2015-04-28 2016-04-05 조면화 처리 구리박 및 프린트 배선판 KR101975135B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2015-092404 2015-04-28
JP2015092404 2015-04-28
PCT/JP2016/061127 WO2016174998A1 (ja) 2015-04-28 2016-04-05 粗化処理銅箔及びプリント配線板

Publications (2)

Publication Number Publication Date
KR20170107040A KR20170107040A (ko) 2017-09-22
KR101975135B1 true KR101975135B1 (ko) 2019-05-03

Family

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Application Number Title Priority Date Filing Date
KR1020177023365A KR101975135B1 (ko) 2015-04-28 2016-04-05 조면화 처리 구리박 및 프린트 배선판

Country Status (5)

Country Link
JP (1) JP6682516B2 (zh)
KR (1) KR101975135B1 (zh)
CN (1) CN107532322B (zh)
TW (1) TWI588302B (zh)
WO (1) WO2016174998A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI804323B (zh) * 2021-05-20 2023-06-01 日商三井金屬鑛業股份有限公司 粗化處理銅箔、附載體銅箔、銅箔積層板及印刷配線板

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CN107113971B (zh) * 2015-08-12 2019-04-26 古河电气工业株式会社 高频电路用铜箔、覆铜层压板、印刷布线基板
KR102340473B1 (ko) * 2017-04-25 2021-12-16 후루카와 덴키 고교 가부시키가이샤 표면 처리 동박
KR102297790B1 (ko) * 2017-05-19 2021-09-06 미쓰이금속광업주식회사 조화 처리 구리박, 캐리어를 구비한 구리박, 동장 적층판 및 프린트 배선판
KR20190040287A (ko) * 2017-07-31 2019-04-17 서키트 호일 룩셈부르크, 에스에이알엘 표면 처리 동박 및 동장 적층 기판
WO2019181924A1 (ja) * 2018-03-23 2019-09-26 古河電気工業株式会社 リードフレーム材およびその製造方法、ならびにそれを用いた半導体パッケージ
JP7166335B2 (ja) * 2018-03-27 2022-11-07 三井金属鉱業株式会社 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板
TWI669032B (zh) 2018-09-26 2019-08-11 金居開發股份有限公司 微粗糙電解銅箔及銅箔基板
KR102698875B1 (ko) 2018-12-13 2024-08-27 엘지이노텍 주식회사 인쇄회로기판
WO2020162056A1 (ja) * 2019-02-04 2020-08-13 パナソニックＩｐマネジメント株式会社 銅張積層板、樹脂付銅箔、および、それらを用いた回路基板
CN113795377A (zh) * 2019-05-15 2021-12-14 松下知识产权经营株式会社 覆铜箔层压板、带树脂的铜箔以及使用它们的电路板
TWI719698B (zh) * 2019-06-12 2021-02-21 金居開發股份有限公司 進階反轉電解銅箔及其銅箔基板
TWM608774U (zh) * 2019-06-19 2021-03-11 金居開發股份有限公司 進階反轉電解銅箔及應用其的銅箔基板
JP7392996B2 (ja) 2019-06-19 2023-12-06 金居開發股▲分▼有限公司 アドバンスド電解銅箔及びそれを適用した銅張積層板
TWI764170B (zh) 2019-06-19 2022-05-11 金居開發股份有限公司 微粗糙電解銅箔以及銅箔基板
JP2021021137A (ja) * 2019-06-19 2021-02-18 金居開發股▲分▼有限公司 長尺島状の微細構造を有するアドバンスト電解銅箔及びそれを適用した銅張積層板
KR20220106200A (ko) * 2020-02-04 2022-07-28 미쓰이금속광업주식회사 조화 처리 동박, 캐리어를 구비하는 동박, 동장 적층판 및 프린트 배선판
CN116997683A (zh) 2021-03-26 2023-11-03 三井金属矿业株式会社 粗糙化处理铜箔、带载体铜箔、覆铜层叠板及印刷电路板
KR20230159392A (ko) 2021-03-26 2023-11-21 미쓰이금속광업주식회사 조화 처리 구리박, 캐리어를 구비한 구리박, 동장 적층판 및 프린트 배선판
JPWO2022255422A1 (zh) * 2021-06-03 2022-12-08

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JP2001214299A (ja) * 2000-01-28 2001-08-07 Mitsui Mining & Smelting Co Ltd 表面処理銅箔及びその表面処理銅箔の製造方法並びにその表面処理銅箔を用いた銅張積層板
JP2010236058A (ja) * 2009-03-31 2010-10-21 Mitsui Mining & Smelting Co Ltd 粗化処理銅箔、粗化処理銅箔の製造方法及び銅張積層板
JP2015078421A (ja) * 2012-11-20 2015-04-23 Jx日鉱日石金属株式会社 キャリア付銅箔、キャリア付銅箔の製造方法、プリント配線板、プリント回路板、銅張積層板、及び、プリント配線板の製造方法

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JP4615226B2 (ja) 2004-02-06 2011-01-19 古河電気工業株式会社 基板用複合材及びそれを用いた回路基板
CN101851769B (zh) * 2005-03-31 2012-07-04 三井金属矿业株式会社 电解铜箔及其制造方法、表面处理电解铜箔、覆铜层压板及印刷电路板
JP2008231514A (ja) * 2007-03-20 2008-10-02 Mitsui Mining & Smelting Co Ltd 表面処理銅箔の製造方法
JP6425401B2 (ja) 2013-04-26 2018-11-21 Ｊｘ金属株式会社 高周波回路用銅箔、高周波回路用銅張積層板、高周波回路用プリント配線板、高周波回路用キャリア付銅箔、電子機器、及びプリント配線板の製造方法
JP2014224313A (ja) 2013-04-26 2014-12-04 Jx日鉱日石金属株式会社 高周波回路用銅箔、高周波回路用銅張積層板、高周波回路用プリント配線板、高周波回路用キャリア付銅箔、電子機器、及びプリント配線板の製造方法
CN104125711B (zh) * 2013-04-26 2017-10-24 Jx日矿日石金属株式会社 高频电路用铜箔、覆铜板、印刷布线板、带载体的铜箔、电子设备及印刷布线板的制造方法
JP6734785B2 (ja) * 2014-12-08 2020-08-05 三井金属鉱業株式会社 プリント配線板の製造方法

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Publication number Priority date Publication date Assignee Title
JP2001214299A (ja) * 2000-01-28 2001-08-07 Mitsui Mining & Smelting Co Ltd 表面処理銅箔及びその表面処理銅箔の製造方法並びにその表面処理銅箔を用いた銅張積層板
JP2010236058A (ja) * 2009-03-31 2010-10-21 Mitsui Mining & Smelting Co Ltd 粗化処理銅箔、粗化処理銅箔の製造方法及び銅張積層板
JP2015078421A (ja) * 2012-11-20 2015-04-23 Jx日鉱日石金属株式会社 キャリア付銅箔、キャリア付銅箔の製造方法、プリント配線板、プリント回路板、銅張積層板、及び、プリント配線板の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI804323B (zh) * 2021-05-20 2023-06-01 日商三井金屬鑛業股份有限公司 粗化處理銅箔、附載體銅箔、銅箔積層板及印刷配線板

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Publication number Publication date
JP6682516B2 (ja) 2020-04-15
TWI588302B (zh) 2017-06-21
CN107532322A (zh) 2018-01-02
KR20170107040A (ko) 2017-09-22
WO2016174998A1 (ja) 2016-11-03
CN107532322B (zh) 2019-07-16
JPWO2016174998A1 (ja) 2018-02-15
TW201706457A (zh) 2017-02-16

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