KR101973613B1 - 발광 소자 및 이를 구비한 조명 시스템 - Google Patents

발광 소자 및 이를 구비한 조명 시스템 Download PDF

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KR101973613B1
KR101973613B1 KR1020120101819A KR20120101819A KR101973613B1 KR 101973613 B1 KR101973613 B1 KR 101973613B1 KR 1020120101819 A KR1020120101819 A KR 1020120101819A KR 20120101819 A KR20120101819 A KR 20120101819A KR 101973613 B1 KR101973613 B1 KR 101973613B1
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South Korea
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light emitting
lead electrode
layer
disposed
emitting chip
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Korean (ko)
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KR20140035211A (ko
Inventor
윤여찬
오성주
정재환
김진성
민봉걸
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엘지이노텍 주식회사
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Priority to KR1020120101819A priority Critical patent/KR101973613B1/ko
Priority to US13/835,555 priority patent/US9219208B2/en
Priority to EP13178622.0A priority patent/EP2709177B1/en
Priority to JP2013183880A priority patent/JP6306842B2/ja
Priority to CN201310418515.9A priority patent/CN103682071B/zh
Publication of KR20140035211A publication Critical patent/KR20140035211A/ko
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Publication of KR101973613B1 publication Critical patent/KR101973613B1/ko
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/83—Electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/853—Encapsulations characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/16—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor

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KR1020120101819A 2012-09-13 2012-09-13 발광 소자 및 이를 구비한 조명 시스템 Active KR101973613B1 (ko)

Priority Applications (5)

Application Number Priority Date Filing Date Title
KR1020120101819A KR101973613B1 (ko) 2012-09-13 2012-09-13 발광 소자 및 이를 구비한 조명 시스템
US13/835,555 US9219208B2 (en) 2012-09-13 2013-03-15 Light emitting device and lighting system including the same
EP13178622.0A EP2709177B1 (en) 2012-09-13 2013-07-30 Light emitting device
JP2013183880A JP6306842B2 (ja) 2012-09-13 2013-09-05 発光素子及びこれを具備した照明システム
CN201310418515.9A CN103682071B (zh) 2012-09-13 2013-09-13 发光器件

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020120101819A KR101973613B1 (ko) 2012-09-13 2012-09-13 발광 소자 및 이를 구비한 조명 시스템

Publications (2)

Publication Number Publication Date
KR20140035211A KR20140035211A (ko) 2014-03-21
KR101973613B1 true KR101973613B1 (ko) 2019-04-29

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KR1020120101819A Active KR101973613B1 (ko) 2012-09-13 2012-09-13 발광 소자 및 이를 구비한 조명 시스템

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US (1) US9219208B2 (enExample)
EP (1) EP2709177B1 (enExample)
JP (1) JP6306842B2 (enExample)
KR (1) KR101973613B1 (enExample)
CN (1) CN103682071B (enExample)

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USD778846S1 (en) * 2014-12-15 2017-02-14 Kingbright Electronics Co. Ltd. LED component
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US10217904B2 (en) * 2015-02-03 2019-02-26 Epistar Corporation Light-emitting device with metallized mounting support structure
US10109562B2 (en) 2015-02-06 2018-10-23 Osram Opto Semiconductors Gmbh Leadframe and chip package comprising a leadframe
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KR101700306B1 (ko) * 2015-06-19 2017-01-31 주식회사 세미콘라이트 반도체 발광소자
KR102378761B1 (ko) * 2015-07-21 2022-03-25 엘지이노텍 주식회사 일체형 발광 패키지 및 이를 이용한 차량용 램프
JP6245239B2 (ja) * 2015-09-11 2017-12-13 日亜化学工業株式会社 半導体レーザ素子の製造方法
KR102487685B1 (ko) * 2015-11-10 2023-01-16 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광 소자 및 이를 구비한 조명 장치
KR102562091B1 (ko) * 2016-02-12 2023-08-02 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광 소자 패키지
KR102709497B1 (ko) * 2016-10-27 2024-09-26 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 반도체 소자 패키지
KR102680862B1 (ko) 2016-12-16 2024-07-03 삼성전자주식회사 반도체 발광장치
CN108269899B (zh) * 2016-12-30 2020-06-05 光宝光电(常州)有限公司 发光二极管封装结构及其制造方法
KR102739650B1 (ko) * 2017-02-10 2024-12-09 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광 모듈
KR102360856B1 (ko) * 2017-06-08 2022-02-10 주식회사 아모센스 세라믹 기판 및 이를 포함하는 엘이디 패키지
CN107420856B (zh) * 2017-07-11 2020-01-03 深圳市华星光电技术有限公司 一种反射片及其制作方法、背光模组
KR102385940B1 (ko) * 2017-09-01 2022-04-13 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광소자 패키지 및 광원 장치
KR102593571B1 (ko) * 2018-10-26 2023-10-24 주식회사 아모텍 다이오드 복합소자
CN112310056B (zh) 2019-08-02 2024-06-18 日亚化学工业株式会社 发光装置和面发光光源
JP7277791B2 (ja) 2020-08-31 2023-05-19 日亜化学工業株式会社 発光装置および面状光源
JP7206504B2 (ja) 2020-09-30 2023-01-18 日亜化学工業株式会社 発光装置
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Also Published As

Publication number Publication date
CN103682071B (zh) 2018-10-02
EP2709177A2 (en) 2014-03-19
KR20140035211A (ko) 2014-03-21
JP6306842B2 (ja) 2018-04-04
CN103682071A (zh) 2014-03-26
JP2014057062A (ja) 2014-03-27
EP2709177B1 (en) 2017-08-30
US20140070249A1 (en) 2014-03-13
EP2709177A3 (en) 2015-11-04
US9219208B2 (en) 2015-12-22

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