KR101955749B1 - 이방 도전성 필름용 조성물, 이방 도전성 필름 및 이를 이용한 반도체 장치 - Google Patents

이방 도전성 필름용 조성물, 이방 도전성 필름 및 이를 이용한 반도체 장치 Download PDF

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Publication number
KR101955749B1
KR101955749B1 KR1020150104549A KR20150104549A KR101955749B1 KR 101955749 B1 KR101955749 B1 KR 101955749B1 KR 1020150104549 A KR1020150104549 A KR 1020150104549A KR 20150104549 A KR20150104549 A KR 20150104549A KR 101955749 B1 KR101955749 B1 KR 101955749B1
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KR
South Korea
Prior art keywords
anisotropic conductive
conductive film
compound
mpa
bisphenol
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KR1020150104549A
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English (en)
Korean (ko)
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KR20170011633A (ko
Inventor
김정섭
강경희
김하나
서현주
황자영
고연조
권순영
박경수
송기태
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삼성에스디아이 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 삼성에스디아이 주식회사 filed Critical 삼성에스디아이 주식회사
Priority to KR1020150104549A priority Critical patent/KR101955749B1/ko
Priority to CN201680042952.7A priority patent/CN107851478B/zh
Priority to PCT/KR2016/004417 priority patent/WO2017014414A1/ko
Priority to TW105113206A priority patent/TWI649399B/zh
Publication of KR20170011633A publication Critical patent/KR20170011633A/ko
Application granted granted Critical
Publication of KR101955749B1 publication Critical patent/KR101955749B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Non-Insulated Conductors (AREA)
KR1020150104549A 2015-07-23 2015-07-23 이방 도전성 필름용 조성물, 이방 도전성 필름 및 이를 이용한 반도체 장치 KR101955749B1 (ko)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020150104549A KR101955749B1 (ko) 2015-07-23 2015-07-23 이방 도전성 필름용 조성물, 이방 도전성 필름 및 이를 이용한 반도체 장치
CN201680042952.7A CN107851478B (zh) 2015-07-23 2016-04-27 非等向性导电膜用组成物、非等向性导电膜及使用其的显示装置
PCT/KR2016/004417 WO2017014414A1 (ko) 2015-07-23 2016-04-27 이방 도전성 필름용 조성물, 이방 도전성 필름 및 이를 이용한 디스플레이 장치
TW105113206A TWI649399B (zh) 2015-07-23 2016-04-28 非等向性導電膜用組成物、非等向性導電膜及使用其的顯示裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020150104549A KR101955749B1 (ko) 2015-07-23 2015-07-23 이방 도전성 필름용 조성물, 이방 도전성 필름 및 이를 이용한 반도체 장치

Publications (2)

Publication Number Publication Date
KR20170011633A KR20170011633A (ko) 2017-02-02
KR101955749B1 true KR101955749B1 (ko) 2019-03-07

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KR1020150104549A KR101955749B1 (ko) 2015-07-23 2015-07-23 이방 도전성 필름용 조성물, 이방 도전성 필름 및 이를 이용한 반도체 장치

Country Status (4)

Country Link
KR (1) KR101955749B1 (zh)
CN (1) CN107851478B (zh)
TW (1) TWI649399B (zh)
WO (1) WO2017014414A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102207299B1 (ko) * 2017-12-29 2021-01-25 국도화학 주식회사 이방 도전성 필름, 이를 포함하는 디스플레이 장치 및／또는 이를 포함하는 반도체 장치
WO2023128631A1 (ko) * 2021-12-28 2023-07-06 주식회사 노피온 접착수지혼합물, 유동성이 조절된 자가조립형 이방성 도전접착제

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130168847A1 (en) 2011-12-28 2013-07-04 Young Woo Park Anisotropic conductive film and electronic device including the same
KR101391697B1 (ko) 2011-12-14 2014-05-07 제일모직주식회사 이방성 도전 필름용 조성물 및 이를 이용한 이방성 도전 필름

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000100872A (ja) * 1998-09-17 2000-04-07 Sony Corp 電子部品装置およびそのリペアー方法
JP4933704B2 (ja) * 2000-06-23 2012-05-16 帝人化成株式会社 ポリカーボネート樹脂溶液の製造方法
JP4265140B2 (ja) * 2002-02-28 2009-05-20 日立化成工業株式会社 異方導電性接着剤組成物、それを用いた回路端子の接続方法及び接続構造体
JP4449325B2 (ja) * 2003-04-17 2010-04-14 住友ベークライト株式会社 半導体用接着フィルム、半導体装置、及び半導体装置の製造方法。
JP2004359830A (ja) 2003-06-05 2004-12-24 Kyocera Chemical Corp 導電性接着剤組成物
KR20100020029A (ko) * 2007-06-13 2010-02-19 히다치 가세고교 가부시끼가이샤 회로 접속용 필름상 접착제
KR100920612B1 (ko) * 2007-11-08 2009-10-08 제일모직주식회사 이방 전도성 필름용 조성물 및 이를 이용한 이방 전도성필름

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101391697B1 (ko) 2011-12-14 2014-05-07 제일모직주식회사 이방성 도전 필름용 조성물 및 이를 이용한 이방성 도전 필름
US20130168847A1 (en) 2011-12-28 2013-07-04 Young Woo Park Anisotropic conductive film and electronic device including the same

Also Published As

Publication number Publication date
WO2017014414A1 (ko) 2017-01-26
KR20170011633A (ko) 2017-02-02
TW201704410A (zh) 2017-02-01
CN107851478A (zh) 2018-03-27
CN107851478B (zh) 2019-08-13
TWI649399B (zh) 2019-02-01

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