KR101953052B1 - 접착시트 및 반도체 장치의 제조 방법 - Google Patents

접착시트 및 반도체 장치의 제조 방법 Download PDF

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KR101953052B1
KR101953052B1 KR1020177025281A KR20177025281A KR101953052B1 KR 101953052 B1 KR101953052 B1 KR 101953052B1 KR 1020177025281 A KR1020177025281 A KR 1020177025281A KR 20177025281 A KR20177025281 A KR 20177025281A KR 101953052 B1 KR101953052 B1 KR 101953052B1
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adhesive layer
semiconductor element
adhesive
softening point
wire
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KR20170105640A (ko
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메구미 코다마
타카히로 토쿠야스
테츠로우 이와쿠라
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히타치가세이가부시끼가이샤
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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    • C09J7/00—Adhesives in the form of films or foils
    • C—CHEMISTRY; METALLURGY
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    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
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    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/062—Copolymers with monomers not covered by C09J133/06
    • C09J133/068—Copolymers with monomers not covered by C09J133/06 containing glycidyl groups
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    • C09J161/00—Adhesives based on condensation polymers of aldehydes or ketones; Adhesives based on derivatives of such polymers
    • C09J161/04—Condensation polymers of aldehydes or ketones with phenols only
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    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C09J163/04—Epoxynovolacs
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    • H01L24/29—
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    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P10/00—Bonding of wafers, substrates or parts of devices
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    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/304—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being heat-activatable, i.e. not tacky at temperatures inferior to 30°C
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    • C09J2413/00—Presence of rubbers containing carboxyl groups
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    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
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    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7438—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support with parts of the auxiliary support remaining in the finished device
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    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H10W72/01304—Manufacture or treatment of die-attach connectors using temporary auxiliary members, e.g. using sacrificial coatings or handle substrates
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    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07332—Compression bonding, e.g. thermocompression bonding
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    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H10W72/07338—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy hardening the adhesive by curing, e.g. thermosetting
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    • H10W72/07531—Techniques
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    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Die Bonding (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Sealing Material Composition (AREA)
KR1020177025281A 2012-03-08 2013-03-05 접착시트 및 반도체 장치의 제조 방법 Active KR101953052B1 (ko)

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JPJP-P-2012-052156 2012-03-08
JP2012052156 2012-03-08
JP2012288113 2012-12-28
JPJP-P-2012-288113 2012-12-28
PCT/JP2013/056002 WO2013133275A1 (ja) 2012-03-08 2013-03-05 接着シート及び半導体装置の製造方法

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KR1020167032236A Division KR20160139043A (ko) 2012-03-08 2013-03-05 접착시트 및 반도체 장치의 제조 방법

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KR20170105640A KR20170105640A (ko) 2017-09-19
KR101953052B1 true KR101953052B1 (ko) 2019-02-27

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KR1020177025281A Active KR101953052B1 (ko) 2012-03-08 2013-03-05 접착시트 및 반도체 장치의 제조 방법
KR1020207000826A Ceased KR20200006197A (ko) 2012-03-08 2013-03-05 접착시트 및 반도체 장치의 제조 방법
KR1020147024893A Ceased KR20140126736A (ko) 2012-03-08 2013-03-05 접착시트 및 반도체 장치의 제조 방법
KR1020167032236A Ceased KR20160139043A (ko) 2012-03-08 2013-03-05 접착시트 및 반도체 장치의 제조 방법
KR1020197005030A Active KR102067945B1 (ko) 2012-03-08 2013-03-05 접착시트 및 반도체 장치의 제조 방법

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KR1020207000826A Ceased KR20200006197A (ko) 2012-03-08 2013-03-05 접착시트 및 반도체 장치의 제조 방법
KR1020147024893A Ceased KR20140126736A (ko) 2012-03-08 2013-03-05 접착시트 및 반도체 장치의 제조 방법
KR1020167032236A Ceased KR20160139043A (ko) 2012-03-08 2013-03-05 접착시트 및 반도체 장치의 제조 방법
KR1020197005030A Active KR102067945B1 (ko) 2012-03-08 2013-03-05 접착시트 및 반도체 장치의 제조 방법

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Country Link
US (1) US9212298B2 (https=)
JP (3) JPWO2013133275A1 (https=)
KR (5) KR101953052B1 (https=)
CN (2) CN106024654B (https=)
TW (1) TWI485225B (https=)
WO (1) WO2013133275A1 (https=)

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