KR101946652B1 - 기판 세정 장치 및 그것을 구비한 기판 처리 장치 - Google Patents

기판 세정 장치 및 그것을 구비한 기판 처리 장치 Download PDF

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Publication number
KR101946652B1
KR101946652B1 KR1020130029717A KR20130029717A KR101946652B1 KR 101946652 B1 KR101946652 B1 KR 101946652B1 KR 1020130029717 A KR1020130029717 A KR 1020130029717A KR 20130029717 A KR20130029717 A KR 20130029717A KR 101946652 B1 KR101946652 B1 KR 101946652B1
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South Korea
Prior art keywords
substrate
cleaning
holding
processing
spin
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KR1020130029717A
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English (en)
Korean (ko)
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KR20130110041A (ko
Inventor
고지 니시야마
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가부시키가이샤 스크린 세미컨덕터 솔루션즈
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0412—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7608—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers

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  • Cleaning Or Drying Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR1020130029717A 2012-03-27 2013-03-20 기판 세정 장치 및 그것을 구비한 기판 처리 장치 Active KR101946652B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012072456A JP6001896B2 (ja) 2012-03-27 2012-03-27 基板洗浄装置およびそれを備えた基板処理装置
JPJP-P-2012-072456 2012-03-27

Publications (2)

Publication Number Publication Date
KR20130110041A KR20130110041A (ko) 2013-10-08
KR101946652B1 true KR101946652B1 (ko) 2019-02-11

Family

ID=49234581

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020130029717A Active KR101946652B1 (ko) 2012-03-27 2013-03-20 기판 세정 장치 및 그것을 구비한 기판 처리 장치

Country Status (4)

Country Link
US (1) US9623450B2 (https=)
JP (1) JP6001896B2 (https=)
KR (1) KR101946652B1 (https=)
TW (1) TWI584359B (https=)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9821348B2 (en) * 2013-10-22 2017-11-21 Taiwan Semiconductor Manufacturing Company, Ltd. Method and apparatus for water edge exposure and backside cleaning
CN104238158B (zh) * 2014-09-23 2017-02-08 深圳市华星光电技术有限公司 一种升降装置以及升降系统
JP6543534B2 (ja) * 2015-08-26 2019-07-10 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP6726575B2 (ja) 2016-02-01 2020-07-22 株式会社Ｓｃｒｅｅｎホールディングス 基板洗浄装置、基板処理装置、基板洗浄方法および基板処理方法
US10276365B2 (en) 2016-02-01 2019-04-30 SCREEN Holdings Co., Ltd. Substrate cleaning device, substrate processing apparatus, substrate cleaning method and substrate processing method
JP6626392B2 (ja) 2016-03-30 2019-12-25 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP6684191B2 (ja) * 2016-09-05 2020-04-22 株式会社Ｓｃｒｅｅｎホールディングス 基板洗浄装置およびそれを備える基板処理装置
JP6887371B2 (ja) * 2017-12-20 2021-06-16 株式会社荏原製作所 基板処理装置、基板処理装置の制御方法、プログラムを格納した記憶媒体
US11600484B2 (en) * 2019-08-22 2023-03-07 Taiwan Semiconductor Manufacturing Company Ltd. Cleaning method, semiconductor manufacturing method and a system thereof
TWI789842B (zh) * 2020-09-11 2023-01-11 日商芝浦機械電子裝置股份有限公司 基板處理裝置
JP7564693B2 (ja) 2020-11-26 2024-10-09 株式会社Ｓｃｒｅｅｎホールディングス 下面ブラシ、ブラシユニットおよび基板洗浄装置
KR102535766B1 (ko) * 2021-08-24 2023-05-26 (주)디바이스이엔지 백 노즐 어셈블리를 포함하는 기판 처리장치
JP2024046219A (ja) * 2022-09-22 2024-04-03 芝浦メカトロニクス株式会社 洗浄装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009260033A (ja) * 2008-04-16 2009-11-05 Sokudo Co Ltd 基板洗浄装置およびそれを備えた基板処理装置
JP2010028060A (ja) * 2008-07-24 2010-02-04 Tokyo Electron Ltd 液処理装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08108125A (ja) 1994-10-13 1996-04-30 Sony Disc Technol:Kk 液供給装置
JP3219375B2 (ja) * 1997-02-03 2001-10-15 大日本スクリーン製造株式会社 スクラブ洗浄部材およびそれを用いた基板処理装置、ならびに洗浄用ブラシ
JP3794808B2 (ja) * 1998-01-12 2006-07-12 大日本スクリーン製造株式会社 基板処理装置
JP4108941B2 (ja) * 2000-10-31 2008-06-25 株式会社荏原製作所 基板の把持装置、処理装置、及び把持方法
JP2002164314A (ja) * 2000-11-27 2002-06-07 Dainippon Screen Mfg Co Ltd 回転支持板およびそれを用いた基板処理装置
JP2006156520A (ja) * 2004-11-26 2006-06-15 Dainippon Screen Mfg Co Ltd 基板処理装置
JP4939376B2 (ja) 2007-11-13 2012-05-23 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP5091687B2 (ja) 2008-01-08 2012-12-05 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP4547016B2 (ja) 2008-04-04 2010-09-22 東京エレクトロン株式会社 半導体製造装置、半導体製造方法
JP5437168B2 (ja) 2009-08-07 2014-03-12 東京エレクトロン株式会社 基板の液処理装置および液処理方法
JP5699297B2 (ja) 2010-04-28 2015-04-08 株式会社ユーテック 基板処理装置及び薄膜の製造方法
US8485204B2 (en) * 2010-05-25 2013-07-16 Lam Research Ag Closed chamber with fluid separation feature
US9548223B2 (en) * 2011-12-23 2017-01-17 Lam Research Ag Apparatus for treating surfaces of wafer-shaped articles

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009260033A (ja) * 2008-04-16 2009-11-05 Sokudo Co Ltd 基板洗浄装置およびそれを備えた基板処理装置
JP2010028060A (ja) * 2008-07-24 2010-02-04 Tokyo Electron Ltd 液処理装置

Also Published As

Publication number Publication date
JP6001896B2 (ja) 2016-10-05
JP2013206993A (ja) 2013-10-07
TW201351490A (zh) 2013-12-16
KR20130110041A (ko) 2013-10-08
US20130258300A1 (en) 2013-10-03
US9623450B2 (en) 2017-04-18
TWI584359B (zh) 2017-05-21

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