KR101940328B1 - 냉각 플레이트가 있는 유기 증기 젯 프린팅 장치 - Google Patents

냉각 플레이트가 있는 유기 증기 젯 프린팅 장치 Download PDF

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KR101940328B1
KR101940328B1 KR1020127008157A KR20127008157A KR101940328B1 KR 101940328 B1 KR101940328 B1 KR 101940328B1 KR 1020127008157 A KR1020127008157 A KR 1020127008157A KR 20127008157 A KR20127008157 A KR 20127008157A KR 101940328 B1 KR101940328 B1 KR 101940328B1
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nozzle
cooling system
active cooling
jet printing
organic
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KR20120058591A (ko
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폴 이 버로우스
시드하르드 하리크리쉬나 모한
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유니버셜 디스플레이 코포레이션
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    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12Organic material
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/228Gas flow assisted PVD deposition
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54Controlling or regulating the coating process
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54Controlling or regulating the coating process
    • C23C14/548Controlling the composition
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564Means for minimising impurities in the coating chamber such as dust, moisture, residual gases

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)
KR1020127008157A 2009-09-03 2010-09-02 냉각 플레이트가 있는 유기 증기 젯 프린팅 장치 Active KR101940328B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US23965609P 2009-09-03 2009-09-03
US61/239,656 2009-09-03
US12/870,125 US20110097495A1 (en) 2009-09-03 2010-08-27 Organic vapor jet printing with chiller plate
US12/870,125 2010-08-27
PCT/US2010/047625 WO2011028867A1 (en) 2009-09-03 2010-09-02 Organic vapor jet printing device with a chiller plate

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020167032350A Division KR20160136469A (ko) 2009-09-03 2010-09-02 냉각 플레이트가 있는 유기 증기 젯 프린팅 장치

Publications (2)

Publication Number Publication Date
KR20120058591A KR20120058591A (ko) 2012-06-07
KR101940328B1 true KR101940328B1 (ko) 2019-01-18

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KR1020127008157A Active KR101940328B1 (ko) 2009-09-03 2010-09-02 냉각 플레이트가 있는 유기 증기 젯 프린팅 장치
KR1020167032350A Ceased KR20160136469A (ko) 2009-09-03 2010-09-02 냉각 플레이트가 있는 유기 증기 젯 프린팅 장치

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Country Status (6)

Country Link
US (1) US20110097495A1 (https=)
EP (1) EP2473646B1 (https=)
KR (2) KR101940328B1 (https=)
CN (1) CN102597299B (https=)
IN (1) IN2012DN02784A (https=)
WO (1) WO2011028867A1 (https=)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012011913A1 (en) * 2010-07-22 2012-01-26 Universal Display Corporation Organic vapor jet printing
US20130273239A1 (en) * 2012-03-13 2013-10-17 Universal Display Corporation Nozzle design for organic vapor jet printing
US8728858B2 (en) 2012-08-27 2014-05-20 Universal Display Corporation Multi-nozzle organic vapor jet printing
CN103972095B (zh) * 2013-02-01 2017-06-13 中国科学院苏州纳米技术与纳米仿生研究所 金属氧化物薄膜场效应晶体管的制备方法
CN103972392A (zh) * 2013-02-01 2014-08-06 中国科学院苏州纳米技术与纳米仿生研究所 有机薄膜场效应晶体管的制备方法
EP2960059B1 (en) 2014-06-25 2018-10-24 Universal Display Corporation Systems and methods of modulating flow during vapor jet deposition of organic materials
US11220737B2 (en) 2014-06-25 2022-01-11 Universal Display Corporation Systems and methods of modulating flow during vapor jet deposition of organic materials
US11267012B2 (en) 2014-06-25 2022-03-08 Universal Display Corporation Spatial control of vapor condensation using convection
US9583707B2 (en) 2014-09-19 2017-02-28 Universal Display Corporation Micro-nozzle and micro-nozzle array for OVJP and method of manufacturing the same
US10566534B2 (en) 2015-10-12 2020-02-18 Universal Display Corporation Apparatus and method to deliver organic material via organic vapor-jet printing (OVJP)
US10704144B2 (en) 2015-10-12 2020-07-07 Universal Display Corporation Apparatus and method for printing multilayer organic thin films from vapor phase in an ultra-pure gas ambient
US10170701B2 (en) 2016-03-04 2019-01-01 Universal Display Corporation Controlled deposition of materials using a differential pressure regime
KR102369676B1 (ko) 2017-04-10 2022-03-04 삼성디스플레이 주식회사 표시 장치의 제조장치 및 표시 장치의 제조방법
KR20200138391A (ko) * 2018-06-15 2020-12-09 어플라이드 머티어리얼스, 인코포레이티드 증착 영역을 냉각시키기 위한 냉각 시스템, 증착 영역에서 재료를 증착하기 위한 어레인지먼트, 및 증착 영역에서 기판 상에 증착하는 방법
US20190386256A1 (en) 2018-06-18 2019-12-19 Universal Display Corporation Sequential material sources for thermally challenged OLED materials
CN108909184A (zh) * 2018-07-17 2018-11-30 深圳市华星光电技术有限公司 具有温度调节功能的打印喷头、打印装置
WO2023014528A1 (en) * 2021-08-05 2023-02-09 Sekisui Kydex, Llc Multi-station dye sublimation apparatus for pre-heating and for facilitating simultaneous sublimation cycles
US20230063757A1 (en) * 2021-08-18 2023-03-02 Universal Display Corporation Actively cooled heat sink for OVJP print head
US20230363244A1 (en) * 2022-05-09 2023-11-09 Universal Display Corporation Organic vapor jet printing system
US20230357918A1 (en) * 2022-05-09 2023-11-09 Universal Display Corporation Organic vapor jet printing system

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040226505A1 (en) * 2003-05-13 2004-11-18 Dainippon Screen Mfg. Co., Ltd. Treating solution supply nozzle, a substrate treating apparatus having this nozzle, and a method of manufacturing a treating solution supply nozzle
US20080241016A1 (en) * 2007-03-30 2008-10-02 Tokyo Electron Limited Plasma processing system, plasma measurement system, plasma measurement method, and plasma control system
JP2009132977A (ja) * 2007-11-30 2009-06-18 Tokyo Electron Ltd 成膜装置の制御方法、成膜方法、成膜装置、有機el電子デバイスおよびその制御プログラムを格納した記憶媒体

Family Cites Families (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3468308A (en) 1966-01-17 1969-09-23 Howard R Bierman Pressure infusion device for ambulatory patients with pressure control means
JPS621870A (ja) * 1985-06-25 1987-01-07 Nec Corp 蒸着装置
JPH0682642B2 (ja) * 1985-08-09 1994-10-19 株式会社日立製作所 表面処理装置
GB8909011D0 (en) * 1989-04-20 1989-06-07 Friend Richard H Electroluminescent devices
JPH0382020A (ja) * 1989-08-24 1991-04-08 Mitsubishi Electric Corp 化学気相成長装置
KR920003424A (ko) * 1990-07-13 1992-02-29 미다 가쓰시게 표면처리 장치, 표면처리방법 및 반도체장치의 제조방법
JP2951769B2 (ja) * 1991-05-07 1999-09-20 株式会社富士電機総合研究所 気相成長装置
US5421883A (en) * 1994-03-15 1995-06-06 Bowden Industries, Inc. Industrial parts cleaning method and system
US6200389B1 (en) * 1994-07-18 2001-03-13 Silicon Valley Group Thermal Systems Llc Single body injector and deposition chamber
US5707745A (en) * 1994-12-13 1998-01-13 The Trustees Of Princeton University Multicolor organic light emitting devices
US5703436A (en) * 1994-12-13 1997-12-30 The Trustees Of Princeton University Transparent contacts for organic devices
AU681934B2 (en) * 1995-03-14 1997-09-11 Kalford Pty Ltd A hinge
US5844363A (en) 1997-01-23 1998-12-01 The Trustees Of Princeton Univ. Vacuum deposited, non-polymeric flexible organic light emitting devices
US6091195A (en) * 1997-02-03 2000-07-18 The Trustees Of Princeton University Displays having mesa pixel configuration
US6013982A (en) * 1996-12-23 2000-01-11 The Trustees Of Princeton University Multicolor display devices
US5834893A (en) * 1996-12-23 1998-11-10 The Trustees Of Princeton University High efficiency organic light emitting devices with light directing structures
US6303238B1 (en) * 1997-12-01 2001-10-16 The Trustees Of Princeton University OLEDs doped with phosphorescent compounds
US6337102B1 (en) * 1997-11-17 2002-01-08 The Trustees Of Princeton University Low pressure vapor phase deposition of organic thin films
US6087196A (en) * 1998-01-30 2000-07-11 The Trustees Of Princeton University Fabrication of organic semiconductor devices using ink jet printing
JPH11273557A (ja) * 1998-03-19 1999-10-08 Mitsubishi Electric Corp プラズマディスプレイパネルの製造方法及びその製造に用いられるインクジェットプリンタ装置
US6108937A (en) * 1998-09-10 2000-08-29 Asm America, Inc. Method of cooling wafers
US6097147A (en) * 1998-09-14 2000-08-01 The Trustees Of Princeton University Structure for high efficiency electroluminescent device
US6294398B1 (en) * 1999-11-23 2001-09-25 The Trustees Of Princeton University Method for patterning devices
KR100470986B1 (ko) * 2000-03-14 2005-03-07 주성엔지니어링(주) 반도체소자 제조용 고진공 장치 및 이를 이용한 에피택셜막 형성방법
US7071615B2 (en) * 2001-08-20 2006-07-04 Universal Display Corporation Transparent electrodes
KR100998059B1 (ko) * 2001-09-04 2010-12-03 더 트러스티즈 오브 프린스턴 유니버시티 유기 필름을 제조하는 방법 및 디바이스
US7404862B2 (en) * 2001-09-04 2008-07-29 The Trustees Of Princeton University Device and method for organic vapor jet deposition
US7431968B1 (en) * 2001-09-04 2008-10-07 The Trustees Of Princeton University Process and apparatus for organic vapor jet deposition
US7744957B2 (en) * 2003-10-23 2010-06-29 The Trustees Of Princeton University Method and apparatus for depositing material
US20030230980A1 (en) * 2002-06-18 2003-12-18 Forrest Stephen R Very low voltage, high efficiency phosphorescent oled in a p-i-n structure
JP4380319B2 (ja) * 2002-12-19 2009-12-09 ソニー株式会社 蒸着装置および有機エレクトロルミネッセンス素子の製造方法
JP2004259634A (ja) * 2003-02-27 2004-09-16 Nippon Seiki Co Ltd 有機elパネルの製造方法、及びその有機elパネルの製造方法で用いられる有機層製膜装置
WO2005019106A1 (ja) * 2003-08-22 2005-03-03 Tokuyama Corporation シリコン製造装置
US7279704B2 (en) * 2004-05-18 2007-10-09 The University Of Southern California Complexes with tridentate ligands
US20060242967A1 (en) * 2005-04-28 2006-11-02 Taiwan Semiconductor Manufacturing Co., Ltd. Termoelectric heating and cooling apparatus for semiconductor processing
JP4894193B2 (ja) * 2005-08-09 2012-03-14 ソニー株式会社 蒸着装置、および表示装置の製造システム
US20070178225A1 (en) * 2005-12-14 2007-08-02 Keiji Takanosu Vapor deposition crucible, thin-film forming apparatus comprising the same, and method of producing display device
US7879401B2 (en) 2006-12-22 2011-02-01 The Regents Of The University Of Michigan Organic vapor jet deposition using an exhaust
JP5207433B2 (ja) * 2007-02-21 2013-06-12 ヤマハ発動機株式会社 船外機
US8375890B2 (en) * 2007-03-19 2013-02-19 Micron Technology, Inc. Apparatus and methods for capacitively coupled plasma vapor processing of semiconductor wafers
JP5201932B2 (ja) * 2007-09-10 2013-06-05 株式会社アルバック 供給装置、及び有機蒸着装置
EP2187709B1 (en) * 2007-09-10 2018-03-21 Ulvac, Inc. Vapor emission device, organic thin-film vapor deposition apparatus and method of organic thin-film vapor deposition
KR101441737B1 (ko) * 2009-05-01 2014-09-17 카티바, 인크. 유기 증기 인쇄용 장치 및 방법

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040226505A1 (en) * 2003-05-13 2004-11-18 Dainippon Screen Mfg. Co., Ltd. Treating solution supply nozzle, a substrate treating apparatus having this nozzle, and a method of manufacturing a treating solution supply nozzle
US20080241016A1 (en) * 2007-03-30 2008-10-02 Tokyo Electron Limited Plasma processing system, plasma measurement system, plasma measurement method, and plasma control system
JP2009132977A (ja) * 2007-11-30 2009-06-18 Tokyo Electron Ltd 成膜装置の制御方法、成膜方法、成膜装置、有機el電子デバイスおよびその制御プログラムを格納した記憶媒体

Also Published As

Publication number Publication date
US20110097495A1 (en) 2011-04-28
KR20120058591A (ko) 2012-06-07
IN2012DN02784A (https=) 2015-09-18
CN102597299B (zh) 2015-05-13
CN102597299A (zh) 2012-07-18
WO2011028867A1 (en) 2011-03-10
EP2473646A1 (en) 2012-07-11
EP2473646B1 (en) 2018-12-05
KR20160136469A (ko) 2016-11-29

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