KR101937360B1 - 레이저 리플로우 장치 - Google Patents

레이저 리플로우 장치 Download PDF

Info

Publication number
KR101937360B1
KR101937360B1 KR1020170090589A KR20170090589A KR101937360B1 KR 101937360 B1 KR101937360 B1 KR 101937360B1 KR 1020170090589 A KR1020170090589 A KR 1020170090589A KR 20170090589 A KR20170090589 A KR 20170090589A KR 101937360 B1 KR101937360 B1 KR 101937360B1
Authority
KR
South Korea
Prior art keywords
laser
transmitting plate
bonding
beam transmitting
reflow apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020170090589A
Other languages
English (en)
Korean (ko)
Inventor
최재준
김병철
김병록
김남성
Original Assignee
크루셜머신즈 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to KR1020170090589A priority Critical patent/KR101937360B1/ko
Application filed by 크루셜머신즈 주식회사 filed Critical 크루셜머신즈 주식회사
Priority to EP18835546.5A priority patent/EP3584826B1/en
Priority to US16/305,278 priority patent/US11213913B2/en
Priority to PCT/KR2018/007920 priority patent/WO2019017650A1/ko
Priority to CN201880013564.5A priority patent/CN110326096B/zh
Priority to JP2018562342A priority patent/JP2019534547A/ja
Priority to TW107124498A priority patent/TWI673126B/zh
Application granted granted Critical
Publication of KR101937360B1 publication Critical patent/KR101937360B1/ko
Priority to JP2019206625A priority patent/JP7188767B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • H01L21/67144—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/005—Soldering by means of radiant energy
    • B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, electron beams [EB]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B23K26/0738—Shaping the laser spot into a linear shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0838—Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0869—Devices involving movement of the laser head in at least one axial direction
    • B23K26/0876—Devices involving movement of the laser head in at least one axial direction in at least two axial directions
    • B23K26/0884—Devices involving movement of the laser head in at least one axial direction in at least two axial directions in at least three axial directions, e.g. manipulators, robots
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/16—Removal of by-products, e.g. particles or vapours produced during treatment of a workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • B23K26/706—Protective screens
    • H01L21/67132—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • B23K2103/56—Inorganic materials other than metals or composite materials being semiconducting

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Robotics (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Laser Beam Processing (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
  • Supply And Installment Of Electrical Components (AREA)
KR1020170090589A 2017-07-17 2017-07-17 레이저 리플로우 장치 Active KR101937360B1 (ko)

Priority Applications (8)

Application Number Priority Date Filing Date Title
KR1020170090589A KR101937360B1 (ko) 2017-07-17 2017-07-17 레이저 리플로우 장치
US16/305,278 US11213913B2 (en) 2017-07-17 2018-07-12 Laser reflow apparatus
PCT/KR2018/007920 WO2019017650A1 (ko) 2017-07-17 2018-07-12 레이저 리플로우 장치
CN201880013564.5A CN110326096B (zh) 2017-07-17 2018-07-12 激光回流焊装置
EP18835546.5A EP3584826B1 (en) 2017-07-17 2018-07-12 Laser reflow device
JP2018562342A JP2019534547A (ja) 2017-07-17 2018-07-12 レーザーリフロー装置
TW107124498A TWI673126B (zh) 2017-07-17 2018-07-16 雷射回流焊裝置
JP2019206625A JP7188767B2 (ja) 2017-07-17 2019-11-15 レーザーリフロー装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020170090589A KR101937360B1 (ko) 2017-07-17 2017-07-17 레이저 리플로우 장치

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020180139751A Division KR102022600B1 (ko) 2018-11-14 2018-11-14 레이저 리플로우 장치

Publications (1)

Publication Number Publication Date
KR101937360B1 true KR101937360B1 (ko) 2019-01-11

Family

ID=65015286

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020170090589A Active KR101937360B1 (ko) 2017-07-17 2017-07-17 레이저 리플로우 장치

Country Status (7)

Country Link
US (1) US11213913B2 (https=)
EP (1) EP3584826B1 (https=)
JP (2) JP2019534547A (https=)
KR (1) KR101937360B1 (https=)
CN (1) CN110326096B (https=)
TW (1) TWI673126B (https=)
WO (1) WO2019017650A1 (https=)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200119049A (ko) * 2019-04-09 2020-10-19 레이저쎌 주식회사 레이저 리플로우 장치의 레이저 가압 헤드 모듈
KR20200119047A (ko) * 2019-04-09 2020-10-19 레이저쎌 주식회사 레이저 리플로우 장치의 레이저 가압 헤드 모듈
KR20200129436A (ko) * 2019-05-08 2020-11-18 레이저쎌 주식회사 레이저 리플로우 장치의 레이저 가압 헤드 모듈
KR20200129437A (ko) * 2019-05-08 2020-11-18 레이저쎌 주식회사 레이저 리플로우 장치의 레이저 리플로우 방법
CN112404696A (zh) * 2019-08-22 2021-02-26 三星显示有限公司 激光设备
WO2021100960A1 (ko) * 2019-11-21 2021-05-27 레이저쎌 주식회사 레이저 리플로우 장치 및 레이저 리플로우 방법
CN116851864A (zh) * 2023-08-22 2023-10-10 东莞市德镌精密设备有限公司 一种用于封装基板与贴装元件焊接的焊接平台及焊接设备
US12611721B2 (en) * 2019-11-21 2026-04-28 Laserssel Co., Ltd. Laser reflow apparatus and laser reflow method

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101816291B1 (ko) 2016-10-20 2018-01-08 크루셜머신즈 주식회사 3차원 구조물을 위한 레이저 본딩장치
TWI693119B (zh) * 2019-03-06 2020-05-11 台灣愛司帝科技股份有限公司 應用於固接led的雷射加熱裝置
KR102747470B1 (ko) * 2019-07-05 2024-12-27 주식회사 엘지에너지솔루션 흄 제거 기능이 구비된 용접장치
CN114388393A (zh) * 2020-10-22 2022-04-22 均华精密工业股份有限公司 生产设备及固晶装置
CN114592224A (zh) * 2020-12-03 2022-06-07 泰科电子(上海)有限公司 回流熔融系统和导电端子生产系统
CN113547210A (zh) * 2021-07-15 2021-10-26 Tcl华星光电技术有限公司 颗粒物粘附装置与激光处理工艺
KR102695706B1 (ko) * 2022-05-24 2024-08-16 레이저쎌 주식회사 진공챔버를 구비한 가압 방식의 레이저 리플로우 장치
TWI885574B (zh) * 2022-11-30 2025-06-01 騰錂鐳射股份有限公司 雷射錫焊設備
CN116372379A (zh) * 2023-04-25 2023-07-04 西安交通大学 飞秒激光烧蚀金属的飞溅产物的处理方法
CN116884887B (zh) * 2023-09-06 2023-12-08 北京华卓精科科技股份有限公司 一种压合装置及压合方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011171551A (ja) * 2010-02-19 2011-09-01 Toyota Motor Corp 半導体装置の製造方法

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5227604A (en) * 1991-06-28 1993-07-13 Digital Equipment Corporation Atmospheric pressure gaseous-flux-assisted laser reflow soldering
JPH11134920A (ja) 1997-10-31 1999-05-21 Canon Inc 照明装置とこれを用いた画像読取装置及び情報処理装置
JPH11297764A (ja) * 1998-04-14 1999-10-29 Ricoh Co Ltd ボンディングツール及びそれを用いた半導体チップのボンディング方法
JP2001148403A (ja) * 1999-11-18 2001-05-29 Seiko Epson Corp 半導体チップの実装方法および装置
EP1400832B1 (en) 2002-09-19 2014-10-22 Semiconductor Energy Laboratory Co., Ltd. Beam homogenizer and laser irradiation apparatus and method of manufacturing semiconductor device
JP3744503B2 (ja) 2003-03-25 2006-02-15 松下電器産業株式会社 部品圧着装置および部品圧着方法
KR100549796B1 (ko) 2003-11-03 2006-02-08 주식회사 젯텍 레이저를 이용한 이방전도성필름 본딩 장치 및 방법
JP2005178220A (ja) * 2003-12-19 2005-07-07 Seiko Epson Corp 接合方法、接合構造、接合装置、液滴吐出ヘッドの製造方法、液滴吐出ヘッドおよび液滴吐出装置
JP4272634B2 (ja) * 2005-03-16 2009-06-03 芝浦メカトロニクス株式会社 電子部品の本圧着装置
JP2007111931A (ja) * 2005-10-19 2007-05-10 Toyota Motor Corp 熱可塑性樹脂部材のレーザ溶着方法およびレーザ溶着装置
JP2008153366A (ja) 2006-12-15 2008-07-03 Omron Corp 接合装置による接合方法
KR20090028161A (ko) 2007-09-14 2009-03-18 삼성테크윈 주식회사 반도체 칩 본딩 장치 및 방법
JP4880561B2 (ja) * 2007-10-03 2012-02-22 新光電気工業株式会社 フリップチップ実装装置
JP5214345B2 (ja) 2008-06-24 2013-06-19 ヤマハ発動機株式会社 レーザーリフロー方法および装置
JP5568730B2 (ja) * 2010-10-20 2014-08-13 株式会社アドウェルズ 接合装置
KR101245356B1 (ko) 2012-08-30 2013-03-19 (주)정원기술 플립 칩 본더의 가압 헤드
JP6237979B2 (ja) * 2013-03-15 2017-11-29 澁谷工業株式会社 ボンディング装置
KR102208495B1 (ko) 2015-10-27 2021-01-27 한화정밀기계 주식회사 플립칩 본딩 장치
KR101976103B1 (ko) 2017-05-10 2019-05-07 (주)안마이크론시스템 열 압착 본딩 장치

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011171551A (ja) * 2010-02-19 2011-09-01 Toyota Motor Corp 半導体装置の製造方法

Cited By (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200119049A (ko) * 2019-04-09 2020-10-19 레이저쎌 주식회사 레이저 리플로우 장치의 레이저 가압 헤드 모듈
KR20200119047A (ko) * 2019-04-09 2020-10-19 레이저쎌 주식회사 레이저 리플로우 장치의 레이저 가압 헤드 모듈
KR102199450B1 (ko) * 2019-04-09 2021-01-06 레이저쎌 주식회사 레이저 리플로우 장치의 레이저 가압 헤드 모듈
KR102228432B1 (ko) * 2019-04-09 2021-03-16 레이저쎌 주식회사 레이저 리플로우 장치의 레이저 가압 헤드 모듈
KR20200129436A (ko) * 2019-05-08 2020-11-18 레이저쎌 주식회사 레이저 리플로우 장치의 레이저 가압 헤드 모듈
KR20200129437A (ko) * 2019-05-08 2020-11-18 레이저쎌 주식회사 레이저 리플로우 장치의 레이저 리플로우 방법
KR102228434B1 (ko) * 2019-05-08 2021-03-16 레이저쎌 주식회사 레이저 리플로우 장치의 레이저 리플로우 방법
KR102228433B1 (ko) * 2019-05-08 2021-03-16 레이저쎌 주식회사 레이저 리플로우 장치의 레이저 가압 헤드 모듈
CN112404696A (zh) * 2019-08-22 2021-02-26 三星显示有限公司 激光设备
US12128503B2 (en) 2019-08-22 2024-10-29 Samsung Display Co., Ltd. Laser apparatus and laser machining method
US11612964B2 (en) 2019-08-22 2023-03-28 Samsung Display Co., Ltd. Laser apparatus and laser machining method
CN112404696B (zh) * 2019-08-22 2023-03-21 三星显示有限公司 激光设备
US20220410298A1 (en) * 2019-11-21 2022-12-29 Laserssel Co., Ltd. Laser reflow apparatus and laser reflow method
JP7550490B2 (ja) 2019-11-21 2024-09-13 レーザーセル カンパニー リミテッド レーザリフロー装置
JP2022548418A (ja) * 2019-11-21 2022-11-18 レーザーセル カンパニー リミテッド レーザリフロー装置及びレーザリフロー方法
KR20210062376A (ko) * 2019-11-21 2021-05-31 레이저쎌 주식회사 레이저 리플로우 장치 및 레이저 리플로우 방법
JP2023055748A (ja) * 2019-11-21 2023-04-18 レーザーセル カンパニー リミテッド レーザリフロー装置
JP7300788B2 (ja) 2019-11-21 2023-06-30 レーザーセル カンパニー リミテッド レーザリフロー装置
JP2023121758A (ja) * 2019-11-21 2023-08-31 レーザーセル カンパニー リミテッド レーザリフロー装置
US12611721B2 (en) * 2019-11-21 2026-04-28 Laserssel Co., Ltd. Laser reflow apparatus and laser reflow method
JP7409730B2 (ja) 2019-11-21 2024-01-09 レーザーセル カンパニー リミテッド レーザリフロー装置
JP2024022673A (ja) * 2019-11-21 2024-02-16 レーザーセル カンパニー リミテッド レーザリフロー装置
JP7218036B2 (ja) 2019-11-21 2023-02-06 レーザーセル カンパニー リミテッド レーザリフロー装置
WO2021100960A1 (ko) * 2019-11-21 2021-05-27 레이저쎌 주식회사 레이저 리플로우 장치 및 레이저 리플로우 방법
KR102901510B1 (ko) * 2019-11-21 2025-12-17 레이저쎌 주식회사 레이저 리플로우 장치 및 레이저 리플로우 방법
CN116851864A (zh) * 2023-08-22 2023-10-10 东莞市德镌精密设备有限公司 一种用于封装基板与贴装元件焊接的焊接平台及焊接设备

Also Published As

Publication number Publication date
TW201908042A (zh) 2019-03-01
JP7188767B2 (ja) 2022-12-13
EP3584826C0 (en) 2024-01-17
WO2019017650A1 (ko) 2019-01-24
TWI673126B (zh) 2019-10-01
US20210220945A1 (en) 2021-07-22
JP2019534547A (ja) 2019-11-28
EP3584826B1 (en) 2024-01-17
CN110326096B (zh) 2023-09-15
JP2020057790A (ja) 2020-04-09
EP3584826A4 (en) 2021-04-21
CN110326096A (zh) 2019-10-11
EP3584826A1 (en) 2019-12-25
US11213913B2 (en) 2022-01-04

Similar Documents

Publication Publication Date Title
KR101937360B1 (ko) 레이저 리플로우 장치
EP4063054B1 (en) Laser reflow device
KR102022600B1 (ko) 레이저 리플로우 장치
KR102199450B1 (ko) 레이저 리플로우 장치의 레이저 가압 헤드 모듈
KR102228432B1 (ko) 레이저 리플로우 장치의 레이저 가압 헤드 모듈
KR20220083629A (ko) 레이저 리플로우 장치의 레이저 리플로우 방법
KR102327167B1 (ko) 레이저 리플로우 장치의 레이저 가압 헤드 모듈
KR102228434B1 (ko) 레이저 리플로우 장치의 레이저 리플로우 방법
KR102174930B1 (ko) 레이저 리플로우 장치의 레이저 가압 헤드 모듈
KR102174929B1 (ko) 레이저 리플로우 장치의 레이저 리플로우 방법
KR20210039620A (ko) 레이저 리플로우 장치의 온도 센싱 모듈
KR20200129435A (ko) 레이저 리플로우 장치의 본딩대상물 이송 모듈
JP7504494B2 (ja) 真空チャンバーを設けた加圧方式のレーザリフロー装置
KR20210094906A (ko) 레이저 리플로우 장치
KR102228433B1 (ko) 레이저 리플로우 장치의 레이저 가압 헤드 모듈
US12611721B2 (en) Laser reflow apparatus and laser reflow method

Legal Events

Date Code Title Description
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

D13-X000 Search requested

St.27 status event code: A-1-2-D10-D13-srh-X000

D14-X000 Search report completed

St.27 status event code: A-1-2-D10-D14-srh-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

R15-X000 Change to inventor requested

St.27 status event code: A-3-3-R10-R15-oth-X000

R16-X000 Change to inventor recorded

St.27 status event code: A-3-3-R10-R16-oth-X000

PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

A107 Divisional application of patent
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0107 Divisional application

St.27 status event code: A-0-1-A10-A18-div-PA0107

St.27 status event code: A-0-1-A10-A16-div-PA0107

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R13-asn-PN2301

St.27 status event code: A-5-5-R10-R11-asn-PN2301

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

P14-X000 Amendment of ip right document requested

St.27 status event code: A-5-5-P10-P14-nap-X000

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

R18 Changes to party contact information recorded

Free format text: ST27 STATUS EVENT CODE: A-5-5-R10-R18-OTH-X000 (AS PROVIDED BY THE NATIONAL OFFICE)

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000