KR101932208B1 - 기판 지지체, 기판 지지 위치 상에 기판을 로딩하기 위한 방법, 리소그래피 장치 및 디바이스 제조 방법 - Google Patents

기판 지지체, 기판 지지 위치 상에 기판을 로딩하기 위한 방법, 리소그래피 장치 및 디바이스 제조 방법 Download PDF

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Publication number
KR101932208B1
KR101932208B1 KR1020167031598A KR20167031598A KR101932208B1 KR 101932208 B1 KR101932208 B1 KR 101932208B1 KR 1020167031598 A KR1020167031598 A KR 1020167031598A KR 20167031598 A KR20167031598 A KR 20167031598A KR 101932208 B1 KR101932208 B1 KR 101932208B1
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South Korea
Prior art keywords
substrate
vacuum
substrate support
support position
clamping device
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KR1020167031598A
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English (en)
Korean (ko)
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KR20160143816A (ko
Inventor
마티누스 헨드리쿠스 안토니우스 린더스
크뤼즈프 닉 엘룻 드
밀씨 두사
마틴 호벤
요하네스 제라두스 마리아 멀더
토마스 포이츠
덴 흐벨 마르코 아드리아누스 피터 반
돈젠 폴 반
저스틴 요하네스 헤르마누스 게리첸
안토니 헨드릭 베르위즈
아브라함 알렉산더 소타우트
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에이에스엠엘 네델란즈 비.브이.
에이에스엠엘 홀딩 엔.브이.
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Publication of KR20160143816A publication Critical patent/KR20160143816A/ko
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70783—Handling stress or warp of chucks, masks or workpieces, e.g. to compensate for imaging errors or considerations related to warpage of masks or workpieces due to their own weight
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR1020167031598A 2014-05-06 2015-04-23 기판 지지체, 기판 지지 위치 상에 기판을 로딩하기 위한 방법, 리소그래피 장치 및 디바이스 제조 방법 KR101932208B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201461989313P 2014-05-06 2014-05-06
US61/989,313 2014-05-06
US201461989915P 2014-05-07 2014-05-07
US61/989,915 2014-05-07
PCT/EP2015/058831 WO2015169616A1 (en) 2014-05-06 2015-04-23 Substrate support, method for loading a substrate on a substrate support location, lithographic apparatus and device manufacturing method

Publications (2)

Publication Number Publication Date
KR20160143816A KR20160143816A (ko) 2016-12-14
KR101932208B1 true KR101932208B1 (ko) 2018-12-24

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020167031598A KR101932208B1 (ko) 2014-05-06 2015-04-23 기판 지지체, 기판 지지 위치 상에 기판을 로딩하기 위한 방법, 리소그래피 장치 및 디바이스 제조 방법

Country Status (8)

Country Link
US (1) US10656536B2 (zh)
JP (2) JP2017515148A (zh)
KR (1) KR101932208B1 (zh)
CN (1) CN106255924B (zh)
IL (1) IL248384B (zh)
NL (1) NL2014697A (zh)
TW (1) TWI585894B (zh)
WO (1) WO2015169616A1 (zh)

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JP6708455B2 (ja) 2016-03-25 2020-06-10 キヤノン株式会社 保持装置、保持方法、リソグラフィ装置、および物品の製造方法
NL2018555A (en) * 2016-04-20 2017-10-31 Asml Netherlands Bv Substrate support, lithographic apparatus and loading method
WO2018015121A1 (en) * 2016-07-21 2018-01-25 Asml Netherlands B.V. Lithographic method
JP6818881B2 (ja) 2016-10-20 2021-01-20 エーエスエムエル ネザーランズ ビー．ブイ． 圧力制御弁、リソグラフィ装置のための流体ハンドリング構造、及びリソグラフィ装置
US10446423B2 (en) * 2016-11-19 2019-10-15 Applied Materials, Inc. Next generation warpage measurement system
JP6803296B2 (ja) * 2017-05-29 2020-12-23 株式会社Ｓｃｒｅｅｎホールディングス 露光装置および基板処理装置
CN109256354B (zh) * 2017-07-14 2021-01-12 财团法人工业技术研究院 转移支撑件及转移模块
JP7071089B2 (ja) * 2017-10-31 2022-05-18 キヤノン株式会社 保持装置、保持方法、リソグラフィ装置および、物品の製造方法
GB201806377D0 (en) * 2018-04-19 2018-06-06 Metryx Ltd Semiconductor wafer mass metrology apparatus and semiconductor wafer mass metrology method
NL2022818A (en) 2018-04-26 2019-10-31 Asml Netherlands Bv Stage apparatus, lithographic apparatus, control unit and method
EP3385792A3 (en) 2018-04-26 2018-12-26 ASML Netherlands B.V. Stage apparatus for use in a lithographic apparatus
KR102041044B1 (ko) * 2018-04-30 2019-11-05 피에스케이홀딩스 주식회사 기판 지지 유닛
CN110456613B (zh) * 2019-07-08 2021-12-07 苏州源卓光电科技有限公司 一种应用于直写式曝光机的吸盘
KR102385650B1 (ko) * 2019-11-01 2022-04-12 세메스 주식회사 기판처리장치
CN111688402A (zh) * 2020-06-22 2020-09-22 河北宏泰铝业有限公司 一种铝单板自调式真空吸附平台
KR102416236B1 (ko) * 2020-10-29 2022-07-05 (주)에스티아이 패널 고정용 다단 척 및 이를 이용한 디스플레이 라미네이션 장치
US11749551B2 (en) * 2021-02-08 2023-09-05 Core Flow Ltd. Chuck for acquiring a warped workpiece
EP4402538A1 (en) * 2021-09-16 2024-07-24 ASML Netherlands B.V. Thermal conditioning unit, substrate handling device and lithographic apparatus
DE102021213421A1 (de) * 2021-11-29 2023-06-01 Festo Se & Co. Kg Ventilmodul und Verfahren zum Betreiben eines derartigen Ventilmoduls
GB202214927D0 (en) * 2022-10-10 2022-11-23 Metryx Ltd Device and wafer mass metrology apparatus

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Also Published As

Publication number Publication date
IL248384A0 (en) 2016-11-30
US20170192359A1 (en) 2017-07-06
US10656536B2 (en) 2020-05-19
JP2017515148A (ja) 2017-06-08
WO2015169616A1 (en) 2015-11-12
JP2019144599A (ja) 2019-08-29
TW201603178A (zh) 2016-01-16
KR20160143816A (ko) 2016-12-14
CN106255924B (zh) 2019-12-10
JP6806841B2 (ja) 2021-01-06
CN106255924A (zh) 2016-12-21
IL248384B (en) 2021-07-29
NL2014697A (en) 2016-03-31
TWI585894B (zh) 2017-06-01

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