KR101913994B1 - 혼합 합금 땜납 페이스트 - Google Patents

혼합 합금 땜납 페이스트 Download PDF

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Publication number
KR101913994B1
KR101913994B1 KR1020177027644A KR20177027644A KR101913994B1 KR 101913994 B1 KR101913994 B1 KR 101913994B1 KR 1020177027644 A KR1020177027644 A KR 1020177027644A KR 20177027644 A KR20177027644 A KR 20177027644A KR 101913994 B1 KR101913994 B1 KR 101913994B1
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South Korea
Prior art keywords
alloy
solder
paste
mixed
flux
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KR1020177027644A
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English (en)
Korean (ko)
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KR20180002606A (ko
Inventor
홍원 장
닝-청 리
Original Assignee
인듐 코포레이션
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Priority claimed from US14/643,868 external-priority patent/US9636784B2/en
Application filed by 인듐 코포레이션 filed Critical 인듐 코포레이션
Publication of KR20180002606A publication Critical patent/KR20180002606A/ko
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Publication of KR101913994B1 publication Critical patent/KR101913994B1/ko
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries
    • B22F1/0059—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/264—Bi as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C12/00—Alloys based on antimony or bismuth
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C30/00—Alloys containing less than 50% by weight of each constituent
    • C22C30/02—Alloys containing less than 50% by weight of each constituent containing copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C30/00—Alloys containing less than 50% by weight of each constituent
    • C22C30/04—Alloys containing less than 50% by weight of each constituent containing tin or lead
    • H05K3/3484—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/02—Alloys based on copper with tin as the next major constituent

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
KR1020177027644A 2015-03-10 2016-03-08 혼합 합금 땜납 페이스트 Active KR101913994B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/643,868 2015-03-10
US14/643,868 US9636784B2 (en) 2010-05-03 2015-03-10 Mixed alloy solder paste
PCT/US2016/021343 WO2016144945A1 (en) 2015-03-10 2016-03-08 Mixed alloy solder paste

Publications (2)

Publication Number Publication Date
KR20180002606A KR20180002606A (ko) 2018-01-08
KR101913994B1 true KR101913994B1 (ko) 2018-12-28

Family

ID=55587375

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020177027644A Active KR101913994B1 (ko) 2015-03-10 2016-03-08 혼합 합금 땜납 페이스트

Country Status (5)

Country Link
JP (1) JP2018511482A (enExample)
KR (1) KR101913994B1 (enExample)
CN (1) CN107530834A (enExample)
TW (1) TWI681063B (enExample)
WO (1) WO2016144945A1 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108857135A (zh) * 2018-03-12 2018-11-23 深圳市鑫富锦新材料有限公司 一种混合合金焊料膏
US10888958B2 (en) * 2018-05-29 2021-01-12 Indium Corporation Hybrid high temperature lead-free solder preform
CA3116600C (en) * 2018-10-24 2023-05-09 Alpha Assembly Solutions Inc. Low temperature soldering solutions for polymer substrates, printed circuit boards and other joining applications
TW202027899A (zh) * 2018-10-31 2020-08-01 德商羅伯特博斯奇股份有限公司 混合合金焊膏、其製造方法以及焊接方法
CN110029248B (zh) * 2019-04-17 2021-05-11 广东科学技术职业学院 一种3d打印用的金属膏体及其制备方法
US11267080B2 (en) * 2019-05-09 2022-03-08 Indium Corporation Low temperature melting and mid temperature melting lead-free solder paste with mixed solder alloy powders
CN110936062A (zh) * 2019-12-18 2020-03-31 陕西易莱德新材料科技有限公司 一种添加有铂金属的焊料及其制备方法
PH12022553232A1 (en) * 2020-04-29 2024-04-22 Indium Corp Lead-free solder paste with mixed solder powders for high temperature applications
JP7041710B2 (ja) * 2020-04-30 2022-03-24 千住金属工業株式会社 鉛フリーかつアンチモンフリーのはんだ合金、はんだボール、Ｂａｌｌ Ｇｒｉｄ Ａｒｒａｙおよびはんだ継手

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010167472A (ja) * 2009-01-26 2010-08-05 Fujitsu Ltd はんだ、はんだ付け方法及び半導体装置

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JP3091098B2 (ja) * 1994-11-01 2000-09-25 三井金属鉱業株式会社 熱交換器用はんだ合金
JPH11347784A (ja) * 1998-06-01 1999-12-21 Victor Co Of Japan Ltd はんだペースト及びそれを用いた電子回路装置
JP2003211289A (ja) * 2002-01-21 2003-07-29 Fujitsu Ltd 導電性接合材料、それを用いた接合方法及び電子機器
US7888411B2 (en) * 2003-04-01 2011-02-15 Creative Electron, Inc. Thermally conductive adhesive composition and process for device attachment
JP2005072173A (ja) * 2003-08-22 2005-03-17 Senju Metal Ind Co Ltd 電子部品およびソルダペースト
JP2005183903A (ja) * 2003-12-22 2005-07-07 Rohm & Haas Electronic Materials Llc 電子デバイスおよび電子デバイスを形成する方法
JP4391299B2 (ja) * 2004-04-19 2009-12-24 パナソニック株式会社 はんだ材料およびはんだ付け物品
JP4127320B2 (ja) * 2005-03-09 2008-07-30 千住金属工業株式会社 低融点金属粒子の製造方法及びその装置
US9162324B2 (en) * 2005-11-11 2015-10-20 Senju Metal Industry Co., Ltd. Solder paste and solder joint
JP5373464B2 (ja) * 2008-04-23 2013-12-18 パナソニック株式会社 導電性ペーストおよびこれを用いた実装構造体
JP5292977B2 (ja) * 2008-08-01 2013-09-18 富士電機株式会社 接合材、半導体装置およびその製造方法
JP5470816B2 (ja) * 2008-11-26 2014-04-16 富士通株式会社 電子装置の製造方法
JP2012523091A (ja) * 2009-04-02 2012-09-27 オーメット サーキッツ インク 混合された合金フィラーを含む伝導性組成物
US9017446B2 (en) * 2010-05-03 2015-04-28 Indium Corporation Mixed alloy solder paste
JP5278616B2 (ja) * 2010-06-30 2013-09-04 千住金属工業株式会社 Ｂｉ−Ｓｎ系高温はんだ合金
JP2014007192A (ja) * 2012-06-21 2014-01-16 Industrial Technology Research Institute Ｌｅｄウェハーを接合する方法、ｌｅｄチップを製造する方法及び接合構造
JP5958811B2 (ja) * 2012-07-12 2016-08-02 パナソニックＩｐマネジメント株式会社 はんだ材料及びこれを用いた実装構造体

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010167472A (ja) * 2009-01-26 2010-08-05 Fujitsu Ltd はんだ、はんだ付け方法及び半導体装置

Also Published As

Publication number Publication date
TWI681063B (zh) 2020-01-01
TW201700741A (zh) 2017-01-01
WO2016144945A1 (en) 2016-09-15
KR20180002606A (ko) 2018-01-08
CN107530834A (zh) 2018-01-02
JP2018511482A (ja) 2018-04-26

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