JP2018511482A - 混成合金ソルダペースト - Google Patents

混成合金ソルダペースト Download PDF

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Publication number
JP2018511482A
JP2018511482A JP2017547978A JP2017547978A JP2018511482A JP 2018511482 A JP2018511482 A JP 2018511482A JP 2017547978 A JP2017547978 A JP 2017547978A JP 2017547978 A JP2017547978 A JP 2017547978A JP 2018511482 A JP2018511482 A JP 2018511482A
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JP
Japan
Prior art keywords
alloy
solder
solder paste
weight
paste
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2017547978A
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English (en)
Japanese (ja)
Other versions
JP2018511482A5 (enExample
Inventor
ザン，ホンウェン
リー，ニン−チェン
Original Assignee
インディウム コーポレーション
インディウム コーポレーション
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US14/643,868 external-priority patent/US9636784B2/en
Application filed by インディウム コーポレーション, インディウム コーポレーション filed Critical インディウム コーポレーション
Publication of JP2018511482A publication Critical patent/JP2018511482A/ja
Publication of JP2018511482A5 publication Critical patent/JP2018511482A5/ja
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/264—Bi as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C12/00—Alloys based on antimony or bismuth
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C30/00—Alloys containing less than 50% by weight of each constituent
    • C22C30/02—Alloys containing less than 50% by weight of each constituent containing copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C30/00—Alloys containing less than 50% by weight of each constituent
    • C22C30/04—Alloys containing less than 50% by weight of each constituent containing tin or lead
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/02—Alloys based on copper with tin as the next major constituent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2017547978A 2015-03-10 2016-03-08 混成合金ソルダペースト Pending JP2018511482A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/643,868 US9636784B2 (en) 2010-05-03 2015-03-10 Mixed alloy solder paste
US14/643,868 2015-03-10
PCT/US2016/021343 WO2016144945A1 (en) 2015-03-10 2016-03-08 Mixed alloy solder paste

Publications (2)

Publication Number Publication Date
JP2018511482A true JP2018511482A (ja) 2018-04-26
JP2018511482A5 JP2018511482A5 (enExample) 2018-09-06

Family

ID=55587375

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017547978A Pending JP2018511482A (ja) 2015-03-10 2016-03-08 混成合金ソルダペースト

Country Status (5)

Country Link
JP (1) JP2018511482A (enExample)
KR (1) KR101913994B1 (enExample)
CN (1) CN107530834A (enExample)
TW (1) TWI681063B (enExample)
WO (1) WO2016144945A1 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108857135A (zh) * 2018-03-12 2018-11-23 深圳市鑫富锦新材料有限公司 一种混合合金焊料膏
US10888958B2 (en) * 2018-05-29 2021-01-12 Indium Corporation Hybrid high temperature lead-free solder preform
EP3870389A1 (en) * 2018-10-24 2021-09-01 Alpha Assembly Solutions Inc. Low temperature soldering solutions for polymer substrates, printed circuit boards and other joining applications
US12030139B2 (en) * 2018-10-31 2024-07-09 Robert Bosch Gmbh Sn—Cu mixed alloy solder paste, method of making the same and soldering method
CN110029248B (zh) * 2019-04-17 2021-05-11 广东科学技术职业学院 一种3d打印用的金属膏体及其制备方法
US11267080B2 (en) * 2019-05-09 2022-03-08 Indium Corporation Low temperature melting and mid temperature melting lead-free solder paste with mixed solder alloy powders
CN110936062A (zh) * 2019-12-18 2020-03-31 陕西易莱德新材料科技有限公司 一种添加有铂金属的焊料及其制备方法
US11738411B2 (en) * 2020-04-29 2023-08-29 Indium Corporation Lead-free solder paste with mixed solder powders for high temperature applications
JP7041710B2 (ja) * 2020-04-30 2022-03-24 千住金属工業株式会社 鉛フリーかつアンチモンフリーのはんだ合金、はんだボール、Ｂａｌｌ Ｇｒｉｄ Ａｒｒａｙおよびはんだ継手

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08132279A (ja) * 1994-11-01 1996-05-28 Mitsui Mining & Smelting Co Ltd 熱交換器用はんだ合金
JP2005072173A (ja) * 2003-08-22 2005-03-17 Senju Metal Ind Co Ltd 電子部品およびソルダペースト
JP2005305472A (ja) * 2004-04-19 2005-11-04 Matsushita Electric Ind Co Ltd はんだ材料およびはんだ付け物品
WO2006095417A1 (ja) * 2005-03-09 2006-09-14 Senju Metal Industry Co., Ltd. 低融点金属粒子の製造方法及びその装置
JP2009283453A (ja) * 2008-04-23 2009-12-03 Panasonic Corp 導電性ペーストおよびこれを用いた実装構造体
JP2010036199A (ja) * 2008-08-01 2010-02-18 Fuji Electric Systems Co Ltd 接合材、半導体装置およびその製造方法
JP2010129664A (ja) * 2008-11-26 2010-06-10 Fujitsu Ltd 電子装置及びその製造方法
JP2010167472A (ja) * 2009-01-26 2010-08-05 Fujitsu Ltd はんだ、はんだ付け方法及び半導体装置
WO2012002173A1 (ja) * 2010-06-30 2012-01-05 千住金属工業株式会社 Bi-Sn系高温はんだ合金
JP2014007192A (ja) * 2012-06-21 2014-01-16 Industrial Technology Research Institute Ｌｅｄウェハーを接合する方法、ｌｅｄチップを製造する方法及び接合構造
JP2014018803A (ja) * 2012-07-12 2014-02-03 Panasonic Corp はんだ材料及びこれを用いた実装構造体

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11347784A (ja) * 1998-06-01 1999-12-21 Victor Co Of Japan Ltd はんだペースト及びそれを用いた電子回路装置
JP2003211289A (ja) * 2002-01-21 2003-07-29 Fujitsu Ltd 導電性接合材料、それを用いた接合方法及び電子機器
US7888411B2 (en) * 2003-04-01 2011-02-15 Creative Electron, Inc. Thermally conductive adhesive composition and process for device attachment
JP2005183903A (ja) * 2003-12-22 2005-07-07 Rohm & Haas Electronic Materials Llc 電子デバイスおよび電子デバイスを形成する方法
KR101088658B1 (ko) * 2005-11-11 2011-12-01 가부시키가이샤 무라타 세이사쿠쇼 솔더 페이스트와 땜납 이음매
KR102089843B1 (ko) * 2009-04-02 2020-03-17 오르멧 서키츠 인코퍼레이티드 혼합된 합금 충전재를 함유하는 전도성 조성물
US9017446B2 (en) * 2010-05-03 2015-04-28 Indium Corporation Mixed alloy solder paste

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08132279A (ja) * 1994-11-01 1996-05-28 Mitsui Mining & Smelting Co Ltd 熱交換器用はんだ合金
JP2005072173A (ja) * 2003-08-22 2005-03-17 Senju Metal Ind Co Ltd 電子部品およびソルダペースト
JP2005305472A (ja) * 2004-04-19 2005-11-04 Matsushita Electric Ind Co Ltd はんだ材料およびはんだ付け物品
WO2006095417A1 (ja) * 2005-03-09 2006-09-14 Senju Metal Industry Co., Ltd. 低融点金属粒子の製造方法及びその装置
JP2009283453A (ja) * 2008-04-23 2009-12-03 Panasonic Corp 導電性ペーストおよびこれを用いた実装構造体
JP2010036199A (ja) * 2008-08-01 2010-02-18 Fuji Electric Systems Co Ltd 接合材、半導体装置およびその製造方法
JP2010129664A (ja) * 2008-11-26 2010-06-10 Fujitsu Ltd 電子装置及びその製造方法
JP2010167472A (ja) * 2009-01-26 2010-08-05 Fujitsu Ltd はんだ、はんだ付け方法及び半導体装置
WO2012002173A1 (ja) * 2010-06-30 2012-01-05 千住金属工業株式会社 Bi-Sn系高温はんだ合金
JP2014007192A (ja) * 2012-06-21 2014-01-16 Industrial Technology Research Institute Ｌｅｄウェハーを接合する方法、ｌｅｄチップを製造する方法及び接合構造
JP2014018803A (ja) * 2012-07-12 2014-02-03 Panasonic Corp はんだ材料及びこれを用いた実装構造体

Also Published As

Publication number Publication date
TW201700741A (zh) 2017-01-01
WO2016144945A1 (en) 2016-09-15
KR20180002606A (ko) 2018-01-08
CN107530834A (zh) 2018-01-02
KR101913994B1 (ko) 2018-12-28
TWI681063B (zh) 2020-01-01

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