KR101909299B1 - 발광 디바이스의 제조를 위한 적층 지지막 및 그 제조 방법 - Google Patents

발광 디바이스의 제조를 위한 적층 지지막 및 그 제조 방법 Download PDF

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KR101909299B1
KR101909299B1 KR1020137013389A KR20137013389A KR101909299B1 KR 101909299 B1 KR101909299 B1 KR 101909299B1 KR 1020137013389 A KR1020137013389 A KR 1020137013389A KR 20137013389 A KR20137013389 A KR 20137013389A KR 101909299 B1 KR101909299 B1 KR 101909299B1
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optical elements
film
light emitting
elements
support film
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Korean (ko)
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KR20130140039A (ko
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그리고리 바신
폴 스콧 마틴
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루미리즈 홀딩 비.브이.
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V9/00—Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0361—Manufacture or treatment of packages of wavelength conversion means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0363—Manufacture or treatment of packages of optical field-shaping means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24851—Intermediate layer is discontinuous or differential
    • Y10T428/2486—Intermediate layer is discontinuous or differential with outer strippable or release layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24926—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including ceramic, glass, porcelain or quartz layer

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Led Device Packages (AREA)
  • Optical Filters (AREA)
  • Led Devices (AREA)
KR1020137013389A 2010-10-27 2011-10-20 발광 디바이스의 제조를 위한 적층 지지막 및 그 제조 방법 Active KR101909299B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US40718010P 2010-10-27 2010-10-27
US61/407,180 2010-10-27
PCT/IB2011/054684 WO2012056378A1 (en) 2010-10-27 2011-10-20 Laminate support film for fabrication of light emitting devices and method its fabrication

Publications (2)

Publication Number Publication Date
KR20130140039A KR20130140039A (ko) 2013-12-23
KR101909299B1 true KR101909299B1 (ko) 2018-10-17

Family

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KR1020137013389A Active KR101909299B1 (ko) 2010-10-27 2011-10-20 발광 디바이스의 제조를 위한 적층 지지막 및 그 제조 방법

Country Status (7)

Country Link
US (1) US9351348B2 (https=)
EP (1) EP2633554A1 (https=)
JP (3) JP2013541220A (https=)
KR (1) KR101909299B1 (https=)
CN (1) CN103180945B (https=)
TW (1) TWI560400B (https=)
WO (1) WO2012056378A1 (https=)

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US9299687B2 (en) 2012-10-05 2016-03-29 Bridgelux, Inc. Light-emitting assemblies comprising an array of light-emitting diodes having an optimized lens configuration
JP2014075527A (ja) * 2012-10-05 2014-04-24 Nippon Telegr & Teleph Corp <Ntt> 半導体素子構造およびその作製法
DE102012109806A1 (de) 2012-10-15 2014-04-17 Osram Opto Semiconductors Gmbh Strahlungsemittierendes Bauelement
JP6713720B2 (ja) * 2013-08-30 2020-06-24 エルジー イノテック カンパニー リミテッド 発光素子パッケージ及びそれを含む車両用照明装置
US20160131328A1 (en) * 2014-11-07 2016-05-12 Lighthouse Technologies Limited Indoor smd led equipped for outdoor usage
CN106449951B (zh) * 2016-11-16 2019-01-04 厦门市三安光电科技有限公司 一种发光二极管封装结构的制作方法
WO2019003775A1 (ja) * 2017-06-29 2019-01-03 京セラ株式会社 回路基板およびこれを備える発光装置
WO2019218336A1 (en) 2018-05-18 2019-11-21 Rohm And Haas Electronic Materials Llc Method for producing led by one step film lamination
US11022791B2 (en) 2018-05-18 2021-06-01 Facebook Technologies, Llc Assemblies of anisotropic optical elements and methods of making
US11527684B2 (en) * 2020-12-04 2022-12-13 Lumileds Llc Patterned downconverter and adhesive film for micro-LED, mini-LED downconverter mass transfer

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US20070096131A1 (en) 2005-10-28 2007-05-03 Lumileds Lighting U.S. Llc Laminating encapsulant film containing phosphor over LEDS
US20090020779A1 (en) * 2007-06-27 2009-01-22 Namics Corporation Method of preparing a sealed light-emitting diode chip
US20090053528A1 (en) 2006-04-25 2009-02-26 Asahi Glass Company, Limited Release film for semiconductor resin molds
US20090173960A1 (en) * 2004-06-09 2009-07-09 Koninklijke Philips Electronics N.V. Semiconductor light emitting device with pre-fabricated wavelength converting element
US20100051984A1 (en) * 2008-09-02 2010-03-04 Scott West Phosphor-Converted LED

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US20070267646A1 (en) * 2004-06-03 2007-11-22 Philips Lumileds Lighting Company, Llc Light Emitting Device Including a Photonic Crystal and a Luminescent Ceramic
US7352011B2 (en) * 2004-11-15 2008-04-01 Philips Lumileds Lighting Company, Llc Wide emitting lens for LED useful for backlighting
JP4615981B2 (ja) 2004-12-08 2011-01-19 スタンレー電気株式会社 発光ダイオード及びその製造方法
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US20070096131A1 (en) 2005-10-28 2007-05-03 Lumileds Lighting U.S. Llc Laminating encapsulant film containing phosphor over LEDS
US20090053528A1 (en) 2006-04-25 2009-02-26 Asahi Glass Company, Limited Release film for semiconductor resin molds
US20090020779A1 (en) * 2007-06-27 2009-01-22 Namics Corporation Method of preparing a sealed light-emitting diode chip
US20100051984A1 (en) * 2008-09-02 2010-03-04 Scott West Phosphor-Converted LED

Also Published As

Publication number Publication date
US9351348B2 (en) 2016-05-24
JP2019220720A (ja) 2019-12-26
JP6595044B2 (ja) 2019-10-23
EP2633554A1 (en) 2013-09-04
JP2018160678A (ja) 2018-10-11
WO2012056378A1 (en) 2012-05-03
TWI560400B (en) 2016-12-01
JP6883632B2 (ja) 2021-06-09
US20130221835A1 (en) 2013-08-29
TW201231873A (en) 2012-08-01
CN103180945A (zh) 2013-06-26
JP2013541220A (ja) 2013-11-07
KR20130140039A (ko) 2013-12-23
CN103180945B (zh) 2016-12-07

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