KR101899239B1 - 반도체 패키지의 전자파 차폐막 형성 장치 및 반도체 패키지의 전자파 차폐막 형성 방법 - Google Patents

반도체 패키지의 전자파 차폐막 형성 장치 및 반도체 패키지의 전자파 차폐막 형성 방법 Download PDF

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Publication number
KR101899239B1
KR101899239B1 KR1020170036323A KR20170036323A KR101899239B1 KR 101899239 B1 KR101899239 B1 KR 101899239B1 KR 1020170036323 A KR1020170036323 A KR 1020170036323A KR 20170036323 A KR20170036323 A KR 20170036323A KR 101899239 B1 KR101899239 B1 KR 101899239B1
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KR
South Korea
Prior art keywords
spray
nozzle
semiconductor package
conductive solution
aerosol
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KR1020170036323A
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English (en)
Korean (ko)
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KR20170113191A (ko
Inventor
홍승민
김건희
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주식회사 프로텍
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Publication of KR20170113191A publication Critical patent/KR20170113191A/ko
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Publication of KR101899239B1 publication Critical patent/KR101899239B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/60—Protection against electrostatic charges or discharges, e.g. Faraday shields
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • B05B1/005—Nozzles or other outlets specially adapted for discharging one or more gases
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B13/00—Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
    • B05B13/02—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B13/00—Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
    • B05B13/02—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work
    • B05B13/0221—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work characterised by the means for moving or conveying the objects or other work, e.g. conveyor belts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B13/00—Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
    • B05B13/02—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work
    • B05B13/0278—Arrangement or mounting of spray heads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B13/00—Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
    • B05B13/02—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work
    • B05B13/04—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work the spray heads being moved during spraying operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B13/00—Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
    • B05B13/02—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work
    • B05B13/04—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work the spray heads being moved during spraying operation
    • B05B13/0405—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work the spray heads being moved during spraying operation with reciprocating or oscillating spray heads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B17/00—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups
    • B05B17/04—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods
    • B05B17/06—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/02—Processes for applying liquids or other fluent materials performed by spraying
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
    • B05D5/12—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain a coating with specific electrical properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
KR1020170036323A 2016-03-24 2017-03-22 반도체 패키지의 전자파 차폐막 형성 장치 및 반도체 패키지의 전자파 차폐막 형성 방법 KR101899239B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020160035125 2016-03-24
KR20160035125 2016-03-24

Publications (2)

Publication Number Publication Date
KR20170113191A KR20170113191A (ko) 2017-10-12
KR101899239B1 true KR101899239B1 (ko) 2018-09-14

Family

ID=59899528

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020170036323A KR101899239B1 (ko) 2016-03-24 2017-03-22 반도체 패키지의 전자파 차폐막 형성 장치 및 반도체 패키지의 전자파 차폐막 형성 방법

Country Status (3)

Country Link
KR (1) KR101899239B1 (zh)
TW (1) TWI624927B (zh)
WO (1) WO2017164566A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230080257A (ko) 2021-11-29 2023-06-07 주식회사 프로텍 스프레이 펌프

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3882038A1 (en) * 2020-03-18 2021-09-22 Heraeus Deutschland GmbH & Co. KG Assembly for an inkjet printer, inkjet printer and method for printing a functional layer on a surface of a three-dimensional electronic device
KR102642318B1 (ko) * 2022-08-30 2024-03-04 엔트리움 주식회사 전자 장치의 제조 방법
KR102650018B1 (ko) * 2022-08-30 2024-03-22 엔트리움 주식회사 전자 장치의 제조 방법

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101350952B1 (ko) 2012-09-17 2014-01-16 한국생산기술연구원 플럭스 코팅장치
JP2014127594A (ja) * 2012-12-26 2014-07-07 Nichia Chem Ind Ltd 発光装置の製造方法およびスプレーコーティング装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101097036B1 (ko) * 2010-05-19 2011-12-22 디아이티 주식회사 기판 코팅장치
KR101244673B1 (ko) * 2011-04-12 2013-03-18 한국광기술원 형광체 코팅 장치 및 방법
WO2014083782A1 (ja) * 2012-11-30 2014-06-05 アピックヤマダ株式会社 レジスト膜形成装置とその方法、導電膜形成および回路形成装置とその方法、電磁波シールド形成装置とその方法、短波長高透過率絶縁膜の成膜装置とその方法、蛍光体の成膜装置とその方法、微量材料合成装置とその方法、樹脂モールド装置、樹脂モールド方法、薄膜形成装置、有機ｅｌ素子、バンプ形成装置とその方法、配線形成装置とその方法、および、配線構造体
KR101479248B1 (ko) * 2014-05-28 2015-01-05 (주) 씨앤아이테크놀로지 액상 점착제를 이용한 반도체 패키지의 전자파 차폐를 위한 스퍼터링 방법 및 이를 위한 스퍼터링 장치
KR101479251B1 (ko) * 2014-08-07 2015-01-05 (주) 씨앤아이테크놀로지 반도체 패키지의 전자파 차폐를 위한 스퍼터링 장치 및 이를 포함한 인라인 스퍼터링 증착 시스템
KR101640773B1 (ko) * 2014-09-15 2016-07-19 (주) 에스에스피 전자파 차폐막을 구비한 반도체 패키지의 제조 방법 및 이를 위한 장치

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101350952B1 (ko) 2012-09-17 2014-01-16 한국생산기술연구원 플럭스 코팅장치
JP2014127594A (ja) * 2012-12-26 2014-07-07 Nichia Chem Ind Ltd 発光装置の製造方法およびスプレーコーティング装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230080257A (ko) 2021-11-29 2023-06-07 주식회사 프로텍 스프레이 펌프

Also Published As

Publication number Publication date
TW201803078A (zh) 2018-01-16
KR20170113191A (ko) 2017-10-12
WO2017164566A1 (ko) 2017-09-28
TWI624927B (zh) 2018-05-21

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