KR101891189B1 - 연마 공구 및 그 제조방법 그리고 연마물의 제조방법 - Google Patents

연마 공구 및 그 제조방법 그리고 연마물의 제조방법 Download PDF

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Publication number
KR101891189B1
KR101891189B1 KR1020160085360A KR20160085360A KR101891189B1 KR 101891189 B1 KR101891189 B1 KR 101891189B1 KR 1020160085360 A KR1020160085360 A KR 1020160085360A KR 20160085360 A KR20160085360 A KR 20160085360A KR 101891189 B1 KR101891189 B1 KR 101891189B1
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KR
South Korea
Prior art keywords
abrasive
mass
metal
less
metal matrix
Prior art date
Application number
KR1020160085360A
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English (en)
Korean (ko)
Other versions
KR20170009736A (ko
Inventor
이쿠노리 마츠나가
케이이치 미나미
유키히로 후지모리
마사유키 카타다
Original Assignee
미츠이켄사쿠토이시 가부시키가이샤
야치요 마이크로사이엔스 가부시키가이샤
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Application filed by 미츠이켄사쿠토이시 가부시키가이샤, 야치요 마이크로사이엔스 가부시키가이샤 filed Critical 미츠이켄사쿠토이시 가부시키가이샤
Publication of KR20170009736A publication Critical patent/KR20170009736A/ko
Application granted granted Critical
Publication of KR101891189B1 publication Critical patent/KR101891189B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02008—Multistep processes
    • H01L21/0201—Specific process step
    • H01L21/02013—Grinding, lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0009—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using moulds or presses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02008—Multistep processes
    • H01L21/0201—Specific process step
    • H01L21/02024—Mirror polishing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
KR1020160085360A 2015-07-15 2016-07-06 연마 공구 및 그 제조방법 그리고 연마물의 제조방법 KR101891189B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JPJP-P-2015-141548 2015-07-15
JP2015141548 2015-07-15
JPJP-P-2016-102736 2016-05-23
JP2016102736A JP6687231B2 (ja) 2015-07-15 2016-05-23 研磨工具及びその製造方法並びに研磨物の製造方法

Publications (2)

Publication Number Publication Date
KR20170009736A KR20170009736A (ko) 2017-01-25
KR101891189B1 true KR101891189B1 (ko) 2018-08-23

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020160085360A KR101891189B1 (ko) 2015-07-15 2016-07-06 연마 공구 및 그 제조방법 그리고 연마물의 제조방법

Country Status (3)

Country Link
JP (1) JP6687231B2 (ja)
KR (1) KR101891189B1 (ja)
TW (1) TWI597130B (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BR112019027340A2 (pt) * 2017-06-19 2020-07-07 Saint-Gobain Abrasives, Inc. artigos abrasivos e métodos de formação dos mesmos
CN107457717B (zh) * 2017-09-22 2019-07-30 禹州市昆仑模具有限公司 一种磨具成型用的压力设备
CN109967753A (zh) * 2019-03-04 2019-07-05 江苏萌达新材料科技有限公司 一种用于玻璃磨具的铜锡33合金粉末的生产方法
KR102432921B1 (ko) * 2020-11-18 2022-08-18 주식회사 세한텍 유리 시트 연마 휠 및 그 제조 방법

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5584365B2 (ja) * 2010-09-03 2014-09-03 サンーゴバン アブレイシブズ，インコーポレイティド 結合研磨物品および形成方法
JP2014522740A (ja) * 2011-07-22 2014-09-08 スリップナクサス アクチボラグ 脆性材料を機械加工するための研削工具及び研削工具を作製する方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2971764B2 (ja) 1994-12-26 1999-11-08 株式会社ノリタケカンパニーリミテド 砥粒固定型研磨定盤
JP5481198B2 (ja) 2006-12-28 2014-04-23 サン−ゴバン セラミックス アンド プラスティクス，インコーポレイティド サファイア基板の研削方法
JP4590513B2 (ja) 2008-12-04 2010-12-01 国立大学法人秋田大学 ソーワイヤおよびその製造方法
JP2012094559A (ja) * 2010-10-22 2012-05-17 Sumco Corp 硬脆性ウェーハの平坦化加工方法および平坦化加工用パッド
JP5373171B1 (ja) 2012-10-20 2013-12-18 株式会社ナノテム 砥石およびそれを用いた研削・研磨装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5584365B2 (ja) * 2010-09-03 2014-09-03 サンーゴバン アブレイシブズ，インコーポレイティド 結合研磨物品および形成方法
JP2014522740A (ja) * 2011-07-22 2014-09-08 スリップナクサス アクチボラグ 脆性材料を機械加工するための研削工具及び研削工具を作製する方法

Also Published As

Publication number Publication date
TW201702004A (zh) 2017-01-16
JP2017024161A (ja) 2017-02-02
JP6687231B2 (ja) 2020-04-22
TWI597130B (zh) 2017-09-01
KR20170009736A (ko) 2017-01-25

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