KR101882000B1 - 블라스트 가공 장치 및 블라스트 가공 방법 - Google Patents
블라스트 가공 장치 및 블라스트 가공 방법 Download PDFInfo
- Publication number
- KR101882000B1 KR101882000B1 KR1020137030232A KR20137030232A KR101882000B1 KR 101882000 B1 KR101882000 B1 KR 101882000B1 KR 1020137030232 A KR1020137030232 A KR 1020137030232A KR 20137030232 A KR20137030232 A KR 20137030232A KR 101882000 B1 KR101882000 B1 KR 101882000B1
- Authority
- KR
- South Korea
- Prior art keywords
- blasting
- blasting device
- blasting method
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
- B24C7/00—Equipment for feeding abrasive material; Controlling the flowability, constitution, or other physical characteristics of abrasive blasts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
- B24C7/00—Equipment for feeding abrasive material; Controlling the flowability, constitution, or other physical characteristics of abrasive blasts
- B24C7/0007—Equipment for feeding abrasive material; Controlling the flowability, constitution, or other physical characteristics of abrasive blasts the abrasive material being fed in a liquid carrier
- B24C7/003—Equipment for feeding abrasive material; Controlling the flowability, constitution, or other physical characteristics of abrasive blasts the abrasive material being fed in a liquid carrier with means for preventing clogging of the equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
- B24C3/00—Abrasive blasting machines or devices; Plants
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
- B24C9/00—Appurtenances of abrasive blasting machines or devices, e.g. working chambers, arrangements for handling used abrasive material
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Mixers Of The Rotary Stirring Type (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011208613 | 2011-09-26 | ||
JPJP-P-2011-208613 | 2011-09-26 | ||
PCT/JP2012/067558 WO2013046854A1 (ja) | 2011-09-26 | 2012-07-10 | ブラスト加工装置及びブラスト加工方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20140066667A KR20140066667A (ko) | 2014-06-02 |
KR101882000B1 true KR101882000B1 (ko) | 2018-07-25 |
Family
ID=47994912
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020137030232A KR101882000B1 (ko) | 2011-09-26 | 2012-07-10 | 블라스트 가공 장치 및 블라스트 가공 방법 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6020456B2 (ko) |
KR (1) | KR101882000B1 (ko) |
CN (1) | CN103596728A (ko) |
WO (1) | WO2013046854A1 (ko) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017030117A (ja) * | 2015-08-04 | 2017-02-09 | マツダ株式会社 | 固体粒噴射装置 |
JP2019157740A (ja) * | 2018-03-12 | 2019-09-19 | 日本特殊陶業株式会社 | エンジン構成部品 |
JP6984623B2 (ja) | 2019-02-01 | 2021-12-22 | 新東工業株式会社 | スラリー供給装置、湿式ブラスト加工装置及びスラリー供給方法 |
JP7146173B2 (ja) * | 2019-02-08 | 2022-10-04 | 新東工業株式会社 | 研磨加工装置、研磨加工システム及び研磨加工方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5947164A (ja) * | 1982-09-10 | 1984-03-16 | Nippon Steel Corp | 分級槽から供給するスラリ−濃度調整方法 |
JPS63156660A (ja) | 1986-12-17 | 1988-06-29 | Hitachi Plant Eng & Constr Co Ltd | 湿式プラスト洗浄装置 |
JPH03170269A (ja) * | 1989-11-29 | 1991-07-23 | Shibaura Eng Works Co Ltd | バリ取り装置 |
JP4169239B2 (ja) * | 2000-10-05 | 2008-10-22 | 株式会社スギノマシン | 液中表面加工装置および加工方法 |
JP4323181B2 (ja) * | 2003-02-17 | 2009-09-02 | カルソニックカンセイ株式会社 | 二重管用継手及びその製造方法 |
JP4549812B2 (ja) * | 2004-11-02 | 2010-09-22 | 株式会社ディスコ | 高圧液噴射式切断装置 |
JP2006206406A (ja) * | 2005-01-31 | 2006-08-10 | Clean Venture 21:Kk | 半導体粒子の製造方法および製造装置 |
JP4791787B2 (ja) * | 2005-09-22 | 2011-10-12 | Towa株式会社 | アブレイシブウォータジェットを使用した切断装置 |
JP2008229795A (ja) * | 2007-03-22 | 2008-10-02 | Towa Corp | 加工装置及び加工方法 |
-
2012
- 2012-07-10 JP JP2013535998A patent/JP6020456B2/ja active Active
- 2012-07-10 KR KR1020137030232A patent/KR101882000B1/ko active IP Right Grant
- 2012-07-10 WO PCT/JP2012/067558 patent/WO2013046854A1/ja active Application Filing
- 2012-07-10 CN CN201280026463.4A patent/CN103596728A/zh active Pending
Also Published As
Publication number | Publication date |
---|---|
CN103596728A (zh) | 2014-02-19 |
JPWO2013046854A1 (ja) | 2015-03-26 |
KR20140066667A (ko) | 2014-06-02 |
WO2013046854A1 (ja) | 2013-04-04 |
JP6020456B2 (ja) | 2016-11-02 |
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A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant |