KR101857414B1 - 마킹 위치 보정장치 및 방법 - Google Patents

마킹 위치 보정장치 및 방법 Download PDF

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Publication number
KR101857414B1
KR101857414B1 KR1020160022833A KR20160022833A KR101857414B1 KR 101857414 B1 KR101857414 B1 KR 101857414B1 KR 1020160022833 A KR1020160022833 A KR 1020160022833A KR 20160022833 A KR20160022833 A KR 20160022833A KR 101857414 B1 KR101857414 B1 KR 101857414B1
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KR
South Korea
Prior art keywords
marking
screen
laser beam
transparent substrate
point
Prior art date
Application number
KR1020160022833A
Other languages
English (en)
Korean (ko)
Other versions
KR20170100359A (ko
Inventor
최상철
최영준
김수영
Original Assignee
주식회사 이오테크닉스
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 이오테크닉스 filed Critical 주식회사 이오테크닉스
Priority to KR1020160022833A priority Critical patent/KR101857414B1/ko
Priority to CN201680082198.XA priority patent/CN108701679B/zh
Priority to PCT/KR2016/004390 priority patent/WO2017146300A1/ko
Priority to TW105113793A priority patent/TWI627725B/zh
Publication of KR20170100359A publication Critical patent/KR20170100359A/ko
Application granted granted Critical
Publication of KR101857414B1 publication Critical patent/KR101857414B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26—Bombardment with radiation
    • H01L21/263—Bombardment with radiation with high-energy radiation
    • H01L21/268—Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67282—Marking devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/24—Optical enhancement of defects or not directly visible states, e.g. selective electrolytic deposition, bubbles in liquids, light emission, colour change

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Laser Beam Processing (AREA)
  • Length Measuring Devices By Optical Means (AREA)
KR1020160022833A 2016-02-25 2016-02-25 마킹 위치 보정장치 및 방법 KR101857414B1 (ko)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020160022833A KR101857414B1 (ko) 2016-02-25 2016-02-25 마킹 위치 보정장치 및 방법
CN201680082198.XA CN108701679B (zh) 2016-02-25 2016-04-27 标记位置校正装置及方法
PCT/KR2016/004390 WO2017146300A1 (ko) 2016-02-25 2016-04-27 마킹 위치 보정장치 및 방법
TW105113793A TWI627725B (zh) 2016-02-25 2016-05-04 標記位置校正裝置與方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020160022833A KR101857414B1 (ko) 2016-02-25 2016-02-25 마킹 위치 보정장치 및 방법

Publications (2)

Publication Number Publication Date
KR20170100359A KR20170100359A (ko) 2017-09-04
KR101857414B1 true KR101857414B1 (ko) 2018-05-15

Family

ID=59686444

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020160022833A KR101857414B1 (ko) 2016-02-25 2016-02-25 마킹 위치 보정장치 및 방법

Country Status (4)

Country Link
KR (1) KR101857414B1 (zh)
CN (1) CN108701679B (zh)
TW (1) TWI627725B (zh)
WO (1) WO2017146300A1 (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110111383B (zh) * 2018-05-08 2022-03-18 广东聚华印刷显示技术有限公司 玻璃基板的偏移校正方法、装置和系统
TWI698953B (zh) * 2018-07-13 2020-07-11 鈦昇科技股份有限公司 校正雷射打印方法
CN113275758B (zh) * 2021-06-28 2022-12-16 苏州赛腾精密电子股份有限公司 一种芯片规模晶圆级标记系统及激光标记方法
CN115179640B (zh) * 2022-06-27 2023-08-15 广东华中科技大学工业技术研究院 玻璃盖板贴合设备及玻璃盖板的激光定位校正方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008124142A (ja) * 2006-11-09 2008-05-29 Dainippon Screen Mfg Co Ltd 位置検出方法、位置検出装置、パターン描画装置及び被検出物

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001319846A (ja) * 2000-05-02 2001-11-16 Sanee Giken Kk 露光装置
JP2002310929A (ja) * 2001-04-13 2002-10-23 Mitsubishi Electric Corp 欠陥検査装置
KR100445974B1 (ko) * 2001-12-01 2004-08-25 주식회사 이오테크닉스 칩 스케일 마커의 마킹 위치 보정 방법 및 그 장치
US7119351B2 (en) * 2002-05-17 2006-10-10 Gsi Group Corporation Method and system for machine vision-based feature detection and mark verification in a workpiece or wafer marking system
FR2842131B1 (fr) * 2002-07-11 2004-08-13 Commissariat Energie Atomique Systeme et procede d'usinage d'objets a l'aide d'un laser
KR100584840B1 (ko) * 2002-12-24 2006-05-30 주식회사 이오테크닉스 칩 스케일 마커 및 마킹위치 보정방법
JP4351955B2 (ja) * 2004-06-03 2009-10-28 日立ビアメカニクス株式会社 基準点の位置決定方法
US20060243711A1 (en) * 2005-04-29 2006-11-02 Robert Paradis System and method for aligning a wafer processing system in a laser marking system
CN101106899A (zh) * 2006-07-14 2008-01-16 Juki株式会社 部件搭载位置校正方法及部件安装装置
JP5331321B2 (ja) * 2007-08-31 2013-10-30 ゴールドチャームリミテッド 表示装置の製造方法
JP5259211B2 (ja) * 2008-02-14 2013-08-07 ルネサスエレクトロニクス株式会社 半導体装置
JP2011086880A (ja) * 2009-10-19 2011-04-28 Advantest Corp 電子部品実装装置および電子部品の実装方法
CN104722928A (zh) * 2009-12-07 2015-06-24 Ipg微系统有限公司 激光加工及切割系统与方法
KR20110116894A (ko) * 2010-04-20 2011-10-26 한미반도체 주식회사 웨이퍼 마킹 시스템 및 웨이퍼 마킹방법
JP5800694B2 (ja) * 2011-11-30 2015-10-28 株式会社ディスコ ウエーハの位置補正方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008124142A (ja) * 2006-11-09 2008-05-29 Dainippon Screen Mfg Co Ltd 位置検出方法、位置検出装置、パターン描画装置及び被検出物

Also Published As

Publication number Publication date
WO2017146300A1 (ko) 2017-08-31
KR20170100359A (ko) 2017-09-04
CN108701679A (zh) 2018-10-23
TW201731061A (zh) 2017-09-01
CN108701679B (zh) 2021-10-29
TWI627725B (zh) 2018-06-21

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