KR101853530B1 - 다층 리지드 플렉시블 기판 및 그 제조방법 - Google Patents

다층 리지드 플렉시블 기판 및 그 제조방법 Download PDF

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KR101853530B1
KR101853530B1 KR1020150136717A KR20150136717A KR101853530B1 KR 101853530 B1 KR101853530 B1 KR 101853530B1 KR 1020150136717 A KR1020150136717 A KR 1020150136717A KR 20150136717 A KR20150136717 A KR 20150136717A KR 101853530 B1 KR101853530 B1 KR 101853530B1
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South Korea
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flexible substrate
multilayer
rigid
layer
low
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Korean (ko)
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KR20160104532A (ko
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이치로 사카모토
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도시바 디엠에스 가부시키가이샤
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/304—Protecting a component during manufacturing

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
KR1020150136717A 2015-02-26 2015-09-25 다층 리지드 플렉시블 기판 및 그 제조방법 Active KR101853530B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2015-036557 2015-02-26
JP2015036557A JP6538372B2 (ja) 2015-02-26 2015-02-26 多層リジッドフレキシブル基板の製造方法

Publications (2)

Publication Number Publication Date
KR20160104532A KR20160104532A (ko) 2016-09-05
KR101853530B1 true KR101853530B1 (ko) 2018-04-30

Family

ID=56826491

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020150136717A Active KR101853530B1 (ko) 2015-02-26 2015-09-25 다층 리지드 플렉시블 기판 및 그 제조방법

Country Status (4)

Country Link
JP (1) JP6538372B2 (enrdf_load_stackoverflow)
KR (1) KR101853530B1 (enrdf_load_stackoverflow)
CN (1) CN105934109B (enrdf_load_stackoverflow)
TW (1) TWI613948B (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021020919A1 (ko) * 2019-07-30 2021-02-04 삼성전자 주식회사 경연성 인쇄 회로 기판 및 이를 포함하는 전자 장치

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002501676A (ja) * 1997-05-30 2002-01-15 テレダイン インダストリーズ、インコーポレーテッド 角度を持たせたプリプレグを用いた剛性／可撓性回路基盤
JP2002252469A (ja) * 2001-02-23 2002-09-06 Shin Etsu Chem Co Ltd 多層フレキシブル印刷配線板
KR200415210Y1 (ko) * 2006-02-14 2006-04-28 (주)인터플렉스 리지드 플렉시블 인쇄회로기판

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006066894A (ja) * 2004-07-28 2006-03-09 Hitachi Chem Co Ltd 印刷回路板
JP2006324406A (ja) * 2005-05-18 2006-11-30 Sharp Corp フレックスリジッド多層配線板
JP2007129153A (ja) * 2005-11-07 2007-05-24 Cmk Corp リジッドフレックス多層プリント配線板
CN101518163B (zh) * 2006-09-21 2011-06-08 株式会社大昌电子 刚挠性印刷电路板及该刚挠性印刷电路板的制造方法
JP5176680B2 (ja) * 2008-05-12 2013-04-03 富士通株式会社 多層プリント配線板，及び電子装置
TW201127228A (en) * 2010-01-22 2011-08-01 Ibiden Co Ltd Flex-rigid wiring board and method for manufacturing the same
US9480148B2 (en) * 2011-02-21 2016-10-25 Panasonic Intellectual Property Management Co., Ltd. Metal-clad laminate and printed wiring board
TW201340807A (zh) * 2011-12-28 2013-10-01 松下電器產業股份有限公司 撓性配線基板與其製造方法、使用其之裝載製品、及撓性多層配線基板
AT13434U1 (de) * 2012-02-21 2013-12-15 Austria Tech & System Tech Verfahren zur Herstellung einer Leiterplatte und Verwendung eines derartigen Verfahrens
WO2015132949A1 (ja) * 2014-03-07 2015-09-11 株式会社メイコー フレキシブル部を有するリジッドプリント配線基板の曲げ戻し方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002501676A (ja) * 1997-05-30 2002-01-15 テレダイン インダストリーズ、インコーポレーテッド 角度を持たせたプリプレグを用いた剛性／可撓性回路基盤
JP2002252469A (ja) * 2001-02-23 2002-09-06 Shin Etsu Chem Co Ltd 多層フレキシブル印刷配線板
KR200415210Y1 (ko) * 2006-02-14 2006-04-28 (주)인터플렉스 리지드 플렉시블 인쇄회로기판

Also Published As

Publication number Publication date
CN105934109B (zh) 2018-10-12
KR20160104532A (ko) 2016-09-05
JP2016157902A (ja) 2016-09-01
TW201705836A (zh) 2017-02-01
JP6538372B2 (ja) 2019-07-03
CN105934109A (zh) 2016-09-07
TWI613948B (zh) 2018-02-01

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