KR101834711B1 - 제거 프로파일을 생성하기 위한 폴리싱 파라미터들의 선택 - Google Patents

제거 프로파일을 생성하기 위한 폴리싱 파라미터들의 선택 Download PDF

Info

Publication number
KR101834711B1
KR101834711B1 KR1020177015865A KR20177015865A KR101834711B1 KR 101834711 B1 KR101834711 B1 KR 101834711B1 KR 1020177015865 A KR1020177015865 A KR 1020177015865A KR 20177015865 A KR20177015865 A KR 20177015865A KR 101834711 B1 KR101834711 B1 KR 101834711B1
Authority
KR
South Korea
Prior art keywords
chamber
pressure
substrate
profile
removal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020177015865A
Other languages
English (en)
Korean (ko)
Other versions
KR20170071609A (ko
Inventor
후안보 장
가레트 호 신
킹 이 흥
나단 보한논
칭 장
Original Assignee
어플라이드 머티어리얼스, 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 어플라이드 머티어리얼스, 인코포레이티드 filed Critical 어플라이드 머티어리얼스, 인코포레이티드
Publication of KR20170071609A publication Critical patent/KR20170071609A/ko
Application granted granted Critical
Publication of KR101834711B1 publication Critical patent/KR101834711B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
    • G05B19/182—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by the machine tool function, e.g. thread cutting, cam making, tool direction control
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D16/00—Control of fluid pressure
    • G05D16/20—Control of fluid pressure characterised by the use of electric means
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45232—CMP chemical mechanical polishing of wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Fluid Mechanics (AREA)
  • Human Computer Interaction (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
KR1020177015865A 2011-04-29 2012-04-23 제거 프로파일을 생성하기 위한 폴리싱 파라미터들의 선택 Active KR101834711B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/098,257 US8774958B2 (en) 2011-04-29 2011-04-29 Selection of polishing parameters to generate removal profile
US13/098,257 2011-04-29
PCT/US2012/034702 WO2012148859A2 (en) 2011-04-29 2012-04-23 Selection of polishing parameters to generate removal profile

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020137031787A Division KR101831309B1 (ko) 2011-04-29 2012-04-23 제거 프로파일을 생성하기 위한 폴리싱 파라미터들의 선택

Publications (2)

Publication Number Publication Date
KR20170071609A KR20170071609A (ko) 2017-06-23
KR101834711B1 true KR101834711B1 (ko) 2018-03-05

Family

ID=47068573

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020177015865A Active KR101834711B1 (ko) 2011-04-29 2012-04-23 제거 프로파일을 생성하기 위한 폴리싱 파라미터들의 선택
KR1020137031787A Active KR101831309B1 (ko) 2011-04-29 2012-04-23 제거 프로파일을 생성하기 위한 폴리싱 파라미터들의 선택

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020137031787A Active KR101831309B1 (ko) 2011-04-29 2012-04-23 제거 프로파일을 생성하기 위한 폴리싱 파라미터들의 선택

Country Status (5)

Country Link
US (3) US8774958B2 (enExample)
JP (1) JP2014513434A (enExample)
KR (2) KR101834711B1 (enExample)
TW (2) TWI637813B (enExample)
WO (1) WO2012148859A2 (enExample)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8774958B2 (en) * 2011-04-29 2014-07-08 Applied Materials, Inc. Selection of polishing parameters to generate removal profile
JP5900196B2 (ja) * 2012-07-05 2016-04-06 株式会社Sumco ウェーハの片面研磨方法およびウェーハの片面研磨装置
US20150160368A1 (en) * 2012-07-10 2015-06-11 Statoil Petroleum As Anisotropy parameter estimation
US9248544B2 (en) * 2012-07-18 2016-02-02 Applied Materials, Inc. Endpoint detection during polishing using integrated differential intensity
JP6158637B2 (ja) * 2012-08-28 2017-07-05 株式会社荏原製作所 弾性膜及び基板保持装置
JP6266493B2 (ja) * 2014-03-20 2018-01-24 株式会社荏原製作所 研磨装置及び研磨方法
TWI658899B (zh) * 2014-03-31 2019-05-11 Ebara Corporation 研磨裝置及研磨方法
US9610672B2 (en) * 2014-06-27 2017-04-04 Applied Materials, Inc. Configurable pressure design for multizone chemical mechanical planarization polishing head
WO2018005039A1 (en) * 2016-06-30 2018-01-04 Applied Materials, Inc. Chemical mechanical polishing automated recipe generation
TWI789385B (zh) 2017-04-21 2023-01-11 美商應用材料股份有限公司 使用神經網路來監測的拋光裝置
TWI783037B (zh) * 2017-09-25 2022-11-11 美商應用材料股份有限公司 使用機器學習方式以產生製程控制參數的半導體製造
TWI794293B (zh) 2017-09-25 2023-03-01 美商應用材料股份有限公司 使用製程控制參數矩陣的半導體製造
JP7068831B2 (ja) * 2018-01-18 2022-05-17 株式会社荏原製作所 研磨装置
KR102594342B1 (ko) * 2018-03-12 2023-10-26 도쿄엘렉트론가부시키가이샤 기판의 휨 수정 방법, 컴퓨터 기억 매체 및 기판 휨 수정 장치
TWI845444B (zh) 2018-04-03 2024-06-11 美商應用材料股份有限公司 針對墊子厚度使用機器學習及補償的拋光裝置、拋光系統、方法及電腦儲存媒體
US12017322B2 (en) * 2018-08-14 2024-06-25 Taiwan Semiconductor Manufacturing Co., Ltd. Chemical mechanical polishing method
WO2020067914A1 (en) 2018-09-26 2020-04-02 Applied Materials, Inc. Compensation for substrate doping in edge reconstruction for in-situ electromagnetic inductive monitoring
EP3640972A1 (en) * 2018-10-18 2020-04-22 ASML Netherlands B.V. System and method for facilitating chemical mechanical polishing
US11989492B2 (en) * 2018-12-26 2024-05-21 Applied Materials, Inc. Preston matrix generator
TWI850338B (zh) * 2019-02-28 2024-08-01 美商應用材料股份有限公司 拋光墊、化學機械拋光系統、及控制拋光墊的背襯層的剛度的方法
US11282755B2 (en) 2019-08-27 2022-03-22 Applied Materials, Inc. Asymmetry correction via oriented wafer loading
EP4034943A4 (en) * 2019-09-27 2023-10-04 Corning Incorporated DEVICES, SYSTEMS AND METHODS FOR GENERATING AND PROVIDING A TARGET TOPOGRAPHIC MAP FOR FINISHING A PHOTOMASK DRAFT SUBJECT TO FUNCTIONAL FLATRITY REQUIREMENTS
US12440942B2 (en) 2021-03-03 2025-10-14 Applied Materials, Inc. Pressure signals with different frequencies during friction monitoring to provide spatial resolution
WO2022187105A1 (en) * 2021-03-05 2022-09-09 Applied Materials, Inc. Control of processing parameters for substrate polishing with substrate precession
WO2022187146A1 (en) 2021-03-05 2022-09-09 Applied Materials, Inc. Control of processing parameters during substrate polishing using cost function or expected future parameter changes
CN113159121B (zh) * 2021-03-16 2022-07-19 华中科技大学 基于先验知识模型的机器人磨抛去除量预测方法及设备
US20220362903A1 (en) * 2021-05-12 2022-11-17 Taiwan Semiconductor Manufacturing Co., Ltd. Multiple polishing heads with cross-zone pressure element distributions for cmp
US20250114896A1 (en) * 2023-10-05 2025-04-10 Applied Materials, Inc. Individually rotatable platens and control of carrier head sweep

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040023606A1 (en) 2002-01-17 2004-02-05 Yuchun Wang Advanced chemical mechanical polishing system with smart endpoint detection
US20070102116A1 (en) 2001-06-19 2007-05-10 Applied Materials, Inc. Feedback control of chemical mechanical polishing device providing manipulation of removal rate profiles

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6439964B1 (en) * 1999-10-12 2002-08-27 Applied Materials, Inc. Method of controlling a polishing machine
US6544103B1 (en) * 2000-11-28 2003-04-08 Speedfam-Ipec Corporation Method to determine optimum geometry of a multizone carrier
US6540591B1 (en) * 2001-04-18 2003-04-01 Alexander J. Pasadyn Method and apparatus for post-polish thickness and uniformity control
US7698012B2 (en) 2001-06-19 2010-04-13 Applied Materials, Inc. Dynamic metrology schemes and sampling schemes for advanced process control in semiconductor processing
US20050070205A1 (en) 2003-09-30 2005-03-31 Speedfam-Ipec Corporation Integrated pressure control system for workpiece carrier
US6932671B1 (en) * 2004-05-05 2005-08-23 Novellus Systems, Inc. Method for controlling a chemical mechanical polishing (CMP) operation
CN1972780B (zh) * 2004-06-21 2010-09-08 株式会社荏原制作所 抛光设备和抛光方法
JP4689367B2 (ja) * 2004-07-09 2011-05-25 株式会社荏原製作所 研磨プロファイル又は研磨量の予測方法、研磨方法及び研磨装置
US7150673B2 (en) * 2004-07-09 2006-12-19 Ebara Corporation Method for estimating polishing profile or polishing amount, polishing method and polishing apparatus
US7115017B1 (en) 2006-03-31 2006-10-03 Novellus Systems, Inc. Methods for controlling the pressures of adjustable pressure zones of a work piece carrier during chemical mechanical planarization
US8246417B2 (en) * 2006-09-12 2012-08-21 Ebara Corporation Polishing apparatus and polishing method
US7699688B2 (en) 2006-11-22 2010-04-20 Applied Materials, Inc. Carrier ring for carrier head
US8774958B2 (en) * 2011-04-29 2014-07-08 Applied Materials, Inc. Selection of polishing parameters to generate removal profile

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070102116A1 (en) 2001-06-19 2007-05-10 Applied Materials, Inc. Feedback control of chemical mechanical polishing device providing manipulation of removal rate profiles
US20040023606A1 (en) 2002-01-17 2004-02-05 Yuchun Wang Advanced chemical mechanical polishing system with smart endpoint detection

Also Published As

Publication number Publication date
US10493590B2 (en) 2019-12-03
WO2012148859A3 (en) 2013-03-21
KR20170071609A (ko) 2017-06-23
US20160096251A1 (en) 2016-04-07
WO2012148859A2 (en) 2012-11-01
KR101831309B1 (ko) 2018-02-22
US9213340B2 (en) 2015-12-15
TW201736043A (zh) 2017-10-16
US8774958B2 (en) 2014-07-08
US20120277897A1 (en) 2012-11-01
TWI637813B (zh) 2018-10-11
KR20140028045A (ko) 2014-03-07
TW201313392A (zh) 2013-04-01
US20140277670A1 (en) 2014-09-18
TWI668078B (zh) 2019-08-11
JP2014513434A (ja) 2014-05-29

Similar Documents

Publication Publication Date Title
KR101834711B1 (ko) 제거 프로파일을 생성하기 위한 폴리싱 파라미터들의 선택
JP7561817B2 (ja) ニューラルネットワークを使用する分光モニタリング
KR102741434B1 (ko) 분광 모니터링을 위한 기계 학습 시스템을 위한 훈련 스펙트럼 생성
KR102813170B1 (ko) 반도체 처리의 모니터링을 위한 기계 학습 시스템들
US9490186B2 (en) Limiting adjustment of polishing rates during substrate polishing
TWI841926B (zh) 用於使用成本函數或預期的未來參數變化對基板拋光期間的處理參數的控制的電腦程式產品、方法及拋光系統
KR102904061B1 (ko) 기판 세차운동을 이용한 기판 연마를 위한 처리 파라미터들의 제어
US9289875B2 (en) Feed forward and feed-back techniques for in-situ process control
TW201524681A (zh) 於使用預測過濾器之基板硏磨時之硏磨速率調整
US20190096722A1 (en) Semiconductor fabrication using process control parameter matrix
CN115099386A (zh) 用于标记用于摄谱监测的机器学习系统的训练光谱的原位监测
JP7558173B2 (ja) プレストン行列ジェネレータ
US20240139906A1 (en) Control of carrier head sweep and platen shape

Legal Events

Date Code Title Description
A107 Divisional application of patent
A201 Request for examination
A302 Request for accelerated examination
PA0104 Divisional application for international application

St.27 status event code: A-0-1-A10-A18-div-PA0104

St.27 status event code: A-0-1-A10-A16-div-PA0104

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PA0302 Request for accelerated examination

St.27 status event code: A-1-2-D10-D17-exm-PA0302

St.27 status event code: A-1-2-D10-D16-exm-PA0302

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 9

U11 Full renewal or maintenance fee paid

Free format text: ST27 STATUS EVENT CODE: A-4-4-U10-U11-OTH-PR1001 (AS PROVIDED BY THE NATIONAL OFFICE)

Year of fee payment: 9