TWI637813B - 選擇研磨參數以產生移除輪廓 - Google Patents

選擇研磨參數以產生移除輪廓 Download PDF

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Publication number
TWI637813B
TWI637813B TW101114548A TW101114548A TWI637813B TW I637813 B TWI637813 B TW I637813B TW 101114548 A TW101114548 A TW 101114548A TW 101114548 A TW101114548 A TW 101114548A TW I637813 B TWI637813 B TW I637813B
Authority
TW
Taiwan
Prior art keywords
substrate
chamber
pressure
profile
removal
Prior art date
Application number
TW101114548A
Other languages
English (en)
Chinese (zh)
Other versions
TW201313392A (zh
Inventor
張煥波
辛格瑞特浩宜
張靜宜
伯翰寧奈森
張清
Original Assignee
應用材料股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 應用材料股份有限公司 filed Critical 應用材料股份有限公司
Publication of TW201313392A publication Critical patent/TW201313392A/zh
Application granted granted Critical
Publication of TWI637813B publication Critical patent/TWI637813B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
    • G05B19/182—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by the machine tool function, e.g. thread cutting, cam making, tool direction control
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D16/00—Control of fluid pressure
    • G05D16/20—Control of fluid pressure characterised by the use of electric means
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45232—CMP chemical mechanical polishing of wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Fluid Mechanics (AREA)
  • Human Computer Interaction (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW101114548A 2011-04-29 2012-04-24 選擇研磨參數以產生移除輪廓 TWI637813B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/098,257 US8774958B2 (en) 2011-04-29 2011-04-29 Selection of polishing parameters to generate removal profile
US13/098,257 2011-04-29

Publications (2)

Publication Number Publication Date
TW201313392A TW201313392A (zh) 2013-04-01
TWI637813B true TWI637813B (zh) 2018-10-11

Family

ID=47068573

Family Applications (2)

Application Number Title Priority Date Filing Date
TW101114548A TWI637813B (zh) 2011-04-29 2012-04-24 選擇研磨參數以產生移除輪廓
TW106120666A TWI668078B (zh) 2011-04-29 2012-04-24 用於選擇研磨參數以產生移除輪廓的電腦程式產品

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW106120666A TWI668078B (zh) 2011-04-29 2012-04-24 用於選擇研磨參數以產生移除輪廓的電腦程式產品

Country Status (5)

Country Link
US (3) US8774958B2 (enExample)
JP (1) JP2014513434A (enExample)
KR (2) KR101834711B1 (enExample)
TW (2) TWI637813B (enExample)
WO (1) WO2012148859A2 (enExample)

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JP5900196B2 (ja) * 2012-07-05 2016-04-06 株式会社Sumco ウェーハの片面研磨方法およびウェーハの片面研磨装置
US20150160368A1 (en) * 2012-07-10 2015-06-11 Statoil Petroleum As Anisotropy parameter estimation
US9248544B2 (en) * 2012-07-18 2016-02-02 Applied Materials, Inc. Endpoint detection during polishing using integrated differential intensity
JP6158637B2 (ja) * 2012-08-28 2017-07-05 株式会社荏原製作所 弾性膜及び基板保持装置
JP6266493B2 (ja) * 2014-03-20 2018-01-24 株式会社荏原製作所 研磨装置及び研磨方法
TWI658899B (zh) * 2014-03-31 2019-05-11 Ebara Corporation 研磨裝置及研磨方法
US9610672B2 (en) * 2014-06-27 2017-04-04 Applied Materials, Inc. Configurable pressure design for multizone chemical mechanical planarization polishing head
WO2018005039A1 (en) * 2016-06-30 2018-01-04 Applied Materials, Inc. Chemical mechanical polishing automated recipe generation
TWI789385B (zh) 2017-04-21 2023-01-11 美商應用材料股份有限公司 使用神經網路來監測的拋光裝置
TWI783037B (zh) * 2017-09-25 2022-11-11 美商應用材料股份有限公司 使用機器學習方式以產生製程控制參數的半導體製造
TWI794293B (zh) 2017-09-25 2023-03-01 美商應用材料股份有限公司 使用製程控制參數矩陣的半導體製造
JP7068831B2 (ja) * 2018-01-18 2022-05-17 株式会社荏原製作所 研磨装置
KR102594342B1 (ko) * 2018-03-12 2023-10-26 도쿄엘렉트론가부시키가이샤 기판의 휨 수정 방법, 컴퓨터 기억 매체 및 기판 휨 수정 장치
TWI845444B (zh) 2018-04-03 2024-06-11 美商應用材料股份有限公司 針對墊子厚度使用機器學習及補償的拋光裝置、拋光系統、方法及電腦儲存媒體
US12017322B2 (en) * 2018-08-14 2024-06-25 Taiwan Semiconductor Manufacturing Co., Ltd. Chemical mechanical polishing method
WO2020067914A1 (en) 2018-09-26 2020-04-02 Applied Materials, Inc. Compensation for substrate doping in edge reconstruction for in-situ electromagnetic inductive monitoring
EP3640972A1 (en) * 2018-10-18 2020-04-22 ASML Netherlands B.V. System and method for facilitating chemical mechanical polishing
US11989492B2 (en) * 2018-12-26 2024-05-21 Applied Materials, Inc. Preston matrix generator
TWI850338B (zh) * 2019-02-28 2024-08-01 美商應用材料股份有限公司 拋光墊、化學機械拋光系統、及控制拋光墊的背襯層的剛度的方法
US11282755B2 (en) 2019-08-27 2022-03-22 Applied Materials, Inc. Asymmetry correction via oriented wafer loading
EP4034943A4 (en) * 2019-09-27 2023-10-04 Corning Incorporated DEVICES, SYSTEMS AND METHODS FOR GENERATING AND PROVIDING A TARGET TOPOGRAPHIC MAP FOR FINISHING A PHOTOMASK DRAFT SUBJECT TO FUNCTIONAL FLATRITY REQUIREMENTS
US12440942B2 (en) 2021-03-03 2025-10-14 Applied Materials, Inc. Pressure signals with different frequencies during friction monitoring to provide spatial resolution
WO2022187105A1 (en) * 2021-03-05 2022-09-09 Applied Materials, Inc. Control of processing parameters for substrate polishing with substrate precession
WO2022187146A1 (en) 2021-03-05 2022-09-09 Applied Materials, Inc. Control of processing parameters during substrate polishing using cost function or expected future parameter changes
CN113159121B (zh) * 2021-03-16 2022-07-19 华中科技大学 基于先验知识模型的机器人磨抛去除量预测方法及设备
US20220362903A1 (en) * 2021-05-12 2022-11-17 Taiwan Semiconductor Manufacturing Co., Ltd. Multiple polishing heads with cross-zone pressure element distributions for cmp
US20250114896A1 (en) * 2023-10-05 2025-04-10 Applied Materials, Inc. Individually rotatable platens and control of carrier head sweep

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US20040023606A1 (en) * 2002-01-17 2004-02-05 Yuchun Wang Advanced chemical mechanical polishing system with smart endpoint detection
CN1554118A (zh) * 2001-06-19 2004-12-08 Ӧ�ò��Ϲ�˾ 提供去除速率曲线处理的化学机械抛光设备的反馈控制
JP2006043873A (ja) * 2004-07-09 2006-02-16 Ebara Corp 研磨プロファイル又は研磨量の予測方法、研磨方法及び研磨装置、プログラム、記憶媒体
TW200607604A (en) * 2004-06-21 2006-03-01 Ebara Corp Polishing apparatus and polishing method
TW200822204A (en) * 2006-09-12 2008-05-16 Ebara Corp Polishing apparatus and polishing method

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US6439964B1 (en) * 1999-10-12 2002-08-27 Applied Materials, Inc. Method of controlling a polishing machine
US6544103B1 (en) * 2000-11-28 2003-04-08 Speedfam-Ipec Corporation Method to determine optimum geometry of a multizone carrier
US6540591B1 (en) * 2001-04-18 2003-04-01 Alexander J. Pasadyn Method and apparatus for post-polish thickness and uniformity control
US7698012B2 (en) 2001-06-19 2010-04-13 Applied Materials, Inc. Dynamic metrology schemes and sampling schemes for advanced process control in semiconductor processing
US20050070205A1 (en) 2003-09-30 2005-03-31 Speedfam-Ipec Corporation Integrated pressure control system for workpiece carrier
US6932671B1 (en) * 2004-05-05 2005-08-23 Novellus Systems, Inc. Method for controlling a chemical mechanical polishing (CMP) operation
US7150673B2 (en) * 2004-07-09 2006-12-19 Ebara Corporation Method for estimating polishing profile or polishing amount, polishing method and polishing apparatus
US7115017B1 (en) 2006-03-31 2006-10-03 Novellus Systems, Inc. Methods for controlling the pressures of adjustable pressure zones of a work piece carrier during chemical mechanical planarization
US7699688B2 (en) 2006-11-22 2010-04-20 Applied Materials, Inc. Carrier ring for carrier head
US8774958B2 (en) * 2011-04-29 2014-07-08 Applied Materials, Inc. Selection of polishing parameters to generate removal profile

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1554118A (zh) * 2001-06-19 2004-12-08 Ӧ�ò��Ϲ�˾ 提供去除速率曲线处理的化学机械抛光设备的反馈控制
US20040023606A1 (en) * 2002-01-17 2004-02-05 Yuchun Wang Advanced chemical mechanical polishing system with smart endpoint detection
TW200607604A (en) * 2004-06-21 2006-03-01 Ebara Corp Polishing apparatus and polishing method
JP2006043873A (ja) * 2004-07-09 2006-02-16 Ebara Corp 研磨プロファイル又は研磨量の予測方法、研磨方法及び研磨装置、プログラム、記憶媒体
TW200822204A (en) * 2006-09-12 2008-05-16 Ebara Corp Polishing apparatus and polishing method

Also Published As

Publication number Publication date
US10493590B2 (en) 2019-12-03
WO2012148859A3 (en) 2013-03-21
KR20170071609A (ko) 2017-06-23
US20160096251A1 (en) 2016-04-07
WO2012148859A2 (en) 2012-11-01
KR101831309B1 (ko) 2018-02-22
US9213340B2 (en) 2015-12-15
TW201736043A (zh) 2017-10-16
KR101834711B1 (ko) 2018-03-05
US8774958B2 (en) 2014-07-08
US20120277897A1 (en) 2012-11-01
KR20140028045A (ko) 2014-03-07
TW201313392A (zh) 2013-04-01
US20140277670A1 (en) 2014-09-18
TWI668078B (zh) 2019-08-11
JP2014513434A (ja) 2014-05-29

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