JP2014513434A - 除去プロファイルを生成するための研磨パラメータの選択 - Google Patents

除去プロファイルを生成するための研磨パラメータの選択 Download PDF

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Publication number
JP2014513434A
JP2014513434A JP2014508469A JP2014508469A JP2014513434A JP 2014513434 A JP2014513434 A JP 2014513434A JP 2014508469 A JP2014508469 A JP 2014508469A JP 2014508469 A JP2014508469 A JP 2014508469A JP 2014513434 A JP2014513434 A JP 2014513434A
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Japan
Prior art keywords
substrate
profile
pressure
removal
polishing
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JP2014508469A
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Japanese (ja)
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JP2014513434A5 (enExample
Inventor
ホワンボ ジャーン，
ギャレット ホー イー シン，
キン イー ヒョン，
ネイサン ボハノン，
チン チャン，
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Applied Materials Inc
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Applied Materials Inc
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Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of JP2014513434A publication Critical patent/JP2014513434A/ja
Publication of JP2014513434A5 publication Critical patent/JP2014513434A5/ja
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
    • G05B19/182—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by the machine tool function, e.g. thread cutting, cam making, tool direction control
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D16/00—Control of fluid pressure
    • G05D16/20—Control of fluid pressure characterised by the use of electric means
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45232—CMP chemical mechanical polishing of wafer

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Fluid Mechanics (AREA)
  • Human Computer Interaction (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP2014508469A 2011-04-29 2012-04-23 除去プロファイルを生成するための研磨パラメータの選択 Pending JP2014513434A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/098,257 US8774958B2 (en) 2011-04-29 2011-04-29 Selection of polishing parameters to generate removal profile
US13/098,257 2011-04-29
PCT/US2012/034702 WO2012148859A2 (en) 2011-04-29 2012-04-23 Selection of polishing parameters to generate removal profile

Publications (2)

Publication Number Publication Date
JP2014513434A true JP2014513434A (ja) 2014-05-29
JP2014513434A5 JP2014513434A5 (enExample) 2015-09-17

Family

ID=47068573

Family Applications (1)

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JP2014508469A Pending JP2014513434A (ja) 2011-04-29 2012-04-23 除去プロファイルを生成するための研磨パラメータの選択

Country Status (5)

Country Link
US (3) US8774958B2 (enExample)
JP (1) JP2014513434A (enExample)
KR (2) KR101831309B1 (enExample)
TW (2) TWI668078B (enExample)
WO (1) WO2012148859A2 (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014061587A (ja) * 2012-08-28 2014-04-10 Ebara Corp 弾性膜及び基板保持装置
KR20170028369A (ko) * 2014-06-27 2017-03-13 어플라이드 머티어리얼스, 인코포레이티드 다중 구역 화학 기계적 평탄화 연마 헤드를 위한 구성가능한 압력 설계
JP2022517729A (ja) * 2018-12-26 2022-03-10 アプライド マテリアルズ インコーポレイテッド プレストン行列ジェネレータ
JP2022551429A (ja) * 2019-09-27 2022-12-09 コーニング インコーポレイテッド 平坦さ機能要件を満たすフォトマスクブランクを仕上げるための目標トポグラフィマップの生成提供装置、システムおよび方法

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8774958B2 (en) 2011-04-29 2014-07-08 Applied Materials, Inc. Selection of polishing parameters to generate removal profile
JP5900196B2 (ja) * 2012-07-05 2016-04-06 株式会社Sumco ウェーハの片面研磨方法およびウェーハの片面研磨装置
RU2611096C2 (ru) * 2012-07-10 2017-02-21 Статойл Петролеум Ас Расчет параметра анизотропии
US9248544B2 (en) * 2012-07-18 2016-02-02 Applied Materials, Inc. Endpoint detection during polishing using integrated differential intensity
JP6266493B2 (ja) * 2014-03-20 2018-01-24 株式会社荏原製作所 研磨装置及び研磨方法
TWI658899B (zh) * 2014-03-31 2019-05-11 日商荏原製作所股份有限公司 研磨裝置及研磨方法
KR102276869B1 (ko) * 2016-06-30 2021-07-14 어플라이드 머티어리얼스, 인코포레이티드 화학적 기계적 연마 자동화된 레시피 생성
TWI816620B (zh) 2017-04-21 2023-09-21 美商應用材料股份有限公司 使用神經網路來監測的拋光裝置
TWI783037B (zh) * 2017-09-25 2022-11-11 美商應用材料股份有限公司 使用機器學習方式以產生製程控制參數的半導體製造
TWI794293B (zh) * 2017-09-25 2023-03-01 美商應用材料股份有限公司 使用製程控制參數矩陣的半導體製造
JP7068831B2 (ja) * 2018-01-18 2022-05-17 株式会社荏原製作所 研磨装置
JP6983306B2 (ja) * 2018-03-12 2021-12-17 東京エレクトロン株式会社 基板の反り修正方法、コンピュータ記憶媒体及び基板反り修正装置
TWI825075B (zh) 2018-04-03 2023-12-11 美商應用材料股份有限公司 針對墊子厚度使用機器學習及補償的拋光裝置、拋光系統、方法及電腦儲存媒體
US12017322B2 (en) 2018-08-14 2024-06-25 Taiwan Semiconductor Manufacturing Co., Ltd. Chemical mechanical polishing method
US12447578B2 (en) 2018-09-26 2025-10-21 Applied Materials, Inc. Compensation for substrate doping in edge reconstruction for in-situ electromagnetic inductive monitoring
EP3640972A1 (en) * 2018-10-18 2020-04-22 ASML Netherlands B.V. System and method for facilitating chemical mechanical polishing
TWI850338B (zh) * 2019-02-28 2024-08-01 美商應用材料股份有限公司 拋光墊、化學機械拋光系統、及控制拋光墊的背襯層的剛度的方法
US11282755B2 (en) 2019-08-27 2022-03-22 Applied Materials, Inc. Asymmetry correction via oriented wafer loading
US12311494B2 (en) 2021-03-03 2025-05-27 Applied Materials, Inc. Pressure signals during motor torque monitoring to provide spatial resolution
US11931853B2 (en) * 2021-03-05 2024-03-19 Applied Materials, Inc. Control of processing parameters for substrate polishing with angularly distributed zones using cost function
US11969854B2 (en) 2021-03-05 2024-04-30 Applied Materials, Inc. Control of processing parameters during substrate polishing using expected future parameter changes
CN113159121B (zh) * 2021-03-16 2022-07-19 华中科技大学 基于先验知识模型的机器人磨抛去除量预测方法及设备
US20220362903A1 (en) * 2021-05-12 2022-11-17 Taiwan Semiconductor Manufacturing Co., Ltd. Multiple polishing heads with cross-zone pressure element distributions for cmp
US20250114896A1 (en) * 2023-10-05 2025-04-10 Applied Materials, Inc. Individually rotatable platens and control of carrier head sweep

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006043873A (ja) * 2004-07-09 2006-02-16 Ebara Corp 研磨プロファイル又は研磨量の予測方法、研磨方法及び研磨装置、プログラム、記憶媒体
JP2008503356A (ja) * 2004-06-21 2008-02-07 株式会社荏原製作所 研磨装置および研磨方法
WO2008032753A1 (fr) * 2006-09-12 2008-03-20 Ebara Corporation Appareil de polissage et procédé de polissage

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US6439964B1 (en) * 1999-10-12 2002-08-27 Applied Materials, Inc. Method of controlling a polishing machine
US6544103B1 (en) * 2000-11-28 2003-04-08 Speedfam-Ipec Corporation Method to determine optimum geometry of a multizone carrier
US6540591B1 (en) * 2001-04-18 2003-04-01 Alexander J. Pasadyn Method and apparatus for post-polish thickness and uniformity control
US7698012B2 (en) 2001-06-19 2010-04-13 Applied Materials, Inc. Dynamic metrology schemes and sampling schemes for advanced process control in semiconductor processing
US7160739B2 (en) * 2001-06-19 2007-01-09 Applied Materials, Inc. Feedback control of a chemical mechanical polishing device providing manipulation of removal rate profiles
US6857947B2 (en) 2002-01-17 2005-02-22 Asm Nutool, Inc Advanced chemical mechanical polishing system with smart endpoint detection
US20050070205A1 (en) 2003-09-30 2005-03-31 Speedfam-Ipec Corporation Integrated pressure control system for workpiece carrier
US6932671B1 (en) * 2004-05-05 2005-08-23 Novellus Systems, Inc. Method for controlling a chemical mechanical polishing (CMP) operation
US7150673B2 (en) * 2004-07-09 2006-12-19 Ebara Corporation Method for estimating polishing profile or polishing amount, polishing method and polishing apparatus
US7115017B1 (en) 2006-03-31 2006-10-03 Novellus Systems, Inc. Methods for controlling the pressures of adjustable pressure zones of a work piece carrier during chemical mechanical planarization
US7699688B2 (en) 2006-11-22 2010-04-20 Applied Materials, Inc. Carrier ring for carrier head
US8774958B2 (en) 2011-04-29 2014-07-08 Applied Materials, Inc. Selection of polishing parameters to generate removal profile

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008503356A (ja) * 2004-06-21 2008-02-07 株式会社荏原製作所 研磨装置および研磨方法
JP2006043873A (ja) * 2004-07-09 2006-02-16 Ebara Corp 研磨プロファイル又は研磨量の予測方法、研磨方法及び研磨装置、プログラム、記憶媒体
WO2008032753A1 (fr) * 2006-09-12 2008-03-20 Ebara Corporation Appareil de polissage et procédé de polissage

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014061587A (ja) * 2012-08-28 2014-04-10 Ebara Corp 弾性膜及び基板保持装置
KR20170028369A (ko) * 2014-06-27 2017-03-13 어플라이드 머티어리얼스, 인코포레이티드 다중 구역 화학 기계적 평탄화 연마 헤드를 위한 구성가능한 압력 설계
JP2017520922A (ja) * 2014-06-27 2017-07-27 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ マルチゾーン化学機械平坦化研磨ヘッドのための設定可能な圧力設計
KR102309223B1 (ko) 2014-06-27 2021-10-06 어플라이드 머티어리얼스, 인코포레이티드 다중 구역 화학 기계적 평탄화 연마 헤드를 위한 구성가능한 압력 설계
JP2022517729A (ja) * 2018-12-26 2022-03-10 アプライド マテリアルズ インコーポレイテッド プレストン行列ジェネレータ
US11989492B2 (en) 2018-12-26 2024-05-21 Applied Materials, Inc. Preston matrix generator
JP7558173B2 (ja) 2018-12-26 2024-09-30 アプライド マテリアルズ インコーポレイテッド プレストン行列ジェネレータ
JP2022551429A (ja) * 2019-09-27 2022-12-09 コーニング インコーポレイテッド 平坦さ機能要件を満たすフォトマスクブランクを仕上げるための目標トポグラフィマップの生成提供装置、システムおよび方法

Also Published As

Publication number Publication date
TW201736043A (zh) 2017-10-16
TWI668078B (zh) 2019-08-11
TWI637813B (zh) 2018-10-11
WO2012148859A3 (en) 2013-03-21
US9213340B2 (en) 2015-12-15
US8774958B2 (en) 2014-07-08
TW201313392A (zh) 2013-04-01
WO2012148859A2 (en) 2012-11-01
KR101831309B1 (ko) 2018-02-22
US20120277897A1 (en) 2012-11-01
US20160096251A1 (en) 2016-04-07
US10493590B2 (en) 2019-12-03
KR101834711B1 (ko) 2018-03-05
KR20140028045A (ko) 2014-03-07
US20140277670A1 (en) 2014-09-18
KR20170071609A (ko) 2017-06-23

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