KR101770007B1 - 비할로겐화된 경화제를 갖는 유전체 재료 - Google Patents

비할로겐화된 경화제를 갖는 유전체 재료 Download PDF

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Publication number
KR101770007B1
KR101770007B1 KR1020127014283A KR20127014283A KR101770007B1 KR 101770007 B1 KR101770007 B1 KR 101770007B1 KR 1020127014283 A KR1020127014283 A KR 1020127014283A KR 20127014283 A KR20127014283 A KR 20127014283A KR 101770007 B1 KR101770007 B1 KR 101770007B1
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South Korea
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epoxy resin
substrate
electrical
dielectric
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Korean (ko)
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KR20120103608A (ko
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조엘 에스 파이퍼
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쓰리엠 이노베이티브 프로퍼티즈 컴파니
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed capacitors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/10—Metal compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2206—Oxides; Hydroxides of metals of calcium, strontium or barium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2237—Oxides; Hydroxides of metals of titanium
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Laminated Bodies (AREA)
  • Organic Insulating Materials (AREA)
KR1020127014283A 2009-11-06 2010-10-21 비할로겐화된 경화제를 갖는 유전체 재료 Expired - Fee Related KR101770007B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US25880909P 2009-11-06 2009-11-06
US61/258,809 2009-11-06
PCT/US2010/053562 WO2011056455A2 (en) 2009-11-06 2010-10-21 Dielectric material with non-halogenated curing agent

Publications (2)

Publication Number Publication Date
KR20120103608A KR20120103608A (ko) 2012-09-19
KR101770007B1 true KR101770007B1 (ko) 2017-08-30

Family

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Family Applications (1)

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KR1020127014283A Expired - Fee Related KR101770007B1 (ko) 2009-11-06 2010-10-21 비할로겐화된 경화제를 갖는 유전체 재료

Country Status (6)

Country Link
US (1) US9247645B2 (https=)
EP (1) EP2497347A4 (https=)
JP (1) JP5716033B2 (https=)
KR (1) KR101770007B1 (https=)
CN (1) CN102598895B (https=)
WO (1) WO2011056455A2 (https=)

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KR20140107471A (ko) * 2011-12-21 2014-09-04 쓰리엠 이노베이티브 프로퍼티즈 컴파니 수지 조성물 및 이로부터 제조된 유전층 및 커패시터
WO2014039414A1 (en) * 2012-09-07 2014-03-13 3M Innovative Properties Company Silcone compositions and related methods
US20170226275A1 (en) * 2014-06-26 2017-08-10 Blue Cube Ip Llc Curable compositions
CN105693141B (zh) * 2014-08-29 2017-08-04 天津德高化成新材料股份有限公司 一种用于指纹传感器感应层的介电复合材料的制备方法
CN104292764A (zh) * 2014-10-31 2015-01-21 常熟市微尘电器有限公司 一种用于高储能电容器的复合介电材料及其制备方法
WO2016104398A1 (ja) * 2014-12-24 2016-06-30 京セラ株式会社 誘電体フィルムと、これを用いたフィルムコンデンサおよび連結型コンデンサ、ならびにインバータ、電動車輌
CN111344351B (zh) * 2018-02-01 2024-02-09 三井金属矿业株式会社 树脂组合物、带树脂铜箔、介电层、覆铜层叠板、电容器元件以及内置电容器的印刷电路板
JP7123786B2 (ja) * 2018-12-27 2022-08-23 三井金属鉱業株式会社 樹脂組成物、樹脂付銅箔、誘電体層、銅張積層板、キャパシタ素子及びキャパシタ内蔵プリント配線板
WO2020195236A1 (ja) 2019-03-27 2020-10-01 三井金属鉱業株式会社 樹脂組成物、樹脂付銅箔、誘電体層、銅張積層板、キャパシタ素子及びキャパシタ内蔵プリント配線板
CN113645917A (zh) * 2019-03-29 2021-11-12 康曼德公司 高介电常数电外科电极涂层
CN113156554B (zh) * 2020-01-03 2024-11-15 杭州柔谷科技有限公司 光学功能薄膜及其制备方法及柔性光电子器件
CN111363122B (zh) * 2020-02-17 2022-05-17 西南科技大学 一种三重交联高性能聚合物及其制备方法
WO2025058085A1 (ja) * 2023-09-15 2025-03-20 富士フイルム株式会社 フィルム、積層体、バンドパスフィルタ、及び通信端末

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KR100576882B1 (ko) * 2005-02-15 2006-05-10 삼성전기주식회사 Ｔｃｃ 특성이 우수한 커패시터용 수지 조성물 및 폴리머/세라믹 복합체
US20090073636A1 (en) * 2007-09-14 2009-03-19 Pramanik Pranabes K Polymer-ceramic composites with excellent tcc

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RU2139792C1 (ru) 1994-01-26 1999-10-20 Амп-Акцо Линлам Воф Способ изготовления слоистой конструкции и подложки для печатных плат на ее основе
US6274224B1 (en) * 1999-02-01 2001-08-14 3M Innovative Properties Company Passive electrical article, circuit articles thereof, and circuit articles comprising a passive electrical article
JP4497262B2 (ja) * 2000-09-29 2010-07-07 日本ゼオン株式会社 回路基板の製造方法
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US20090073636A1 (en) * 2007-09-14 2009-03-19 Pramanik Pranabes K Polymer-ceramic composites with excellent tcc

Also Published As

Publication number Publication date
EP2497347A2 (en) 2012-09-12
EP2497347A4 (en) 2015-08-12
CN102598895B (zh) 2016-06-08
JP5716033B2 (ja) 2015-05-13
US20110108309A1 (en) 2011-05-12
US9247645B2 (en) 2016-01-26
WO2011056455A3 (en) 2011-11-24
WO2011056455A2 (en) 2011-05-12
JP2013510429A (ja) 2013-03-21
CN102598895A (zh) 2012-07-18
KR20120103608A (ko) 2012-09-19

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