KR101765244B1 - 증착 장치 및 증착 방법 - Google Patents
증착 장치 및 증착 방법 Download PDFInfo
- Publication number
- KR101765244B1 KR101765244B1 KR1020150178600A KR20150178600A KR101765244B1 KR 101765244 B1 KR101765244 B1 KR 101765244B1 KR 1020150178600 A KR1020150178600 A KR 1020150178600A KR 20150178600 A KR20150178600 A KR 20150178600A KR 101765244 B1 KR101765244 B1 KR 101765244B1
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/06—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/48—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating by irradiation, e.g. photolysis, radiolysis, particle radiation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/48—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating by irradiation, e.g. photolysis, radiolysis, particle radiation
- C23C16/483—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating by irradiation, e.g. photolysis, radiolysis, particle radiation using coherent light, UV to IR, e.g. lasers
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- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Vapour Deposition (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electrodes Of Semiconductors (AREA)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020150178600A KR101765244B1 (ko) | 2015-12-14 | 2015-12-14 | 증착 장치 및 증착 방법 |
JP2016025526A JP6194034B2 (ja) | 2015-12-14 | 2016-02-15 | 蒸着装置及び蒸着方法 |
TW105104679A TWI604085B (zh) | 2015-12-14 | 2016-02-18 | 沈積裝置 |
TW106120964A TWI634232B (zh) | 2015-12-14 | 2016-02-18 | 沈積方法 |
CN201610959641.9A CN107012446B (zh) | 2015-11-11 | 2016-10-27 | 沉积装置及沉积方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020150178600A KR101765244B1 (ko) | 2015-12-14 | 2015-12-14 | 증착 장치 및 증착 방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20170070947A KR20170070947A (ko) | 2017-06-23 |
KR101765244B1 true KR101765244B1 (ko) | 2017-08-07 |
Family
ID=59081249
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020150178600A KR101765244B1 (ko) | 2015-11-11 | 2015-12-14 | 증착 장치 및 증착 방법 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP6194034B2 (zh) |
KR (1) | KR101765244B1 (zh) |
TW (2) | TWI634232B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11661656B2 (en) | 2020-01-22 | 2023-05-30 | Eq Tech Plus Co., Ltd. | Thin film forming apparatus and radical unit for forming thin film |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101925579B1 (ko) | 2017-06-23 | 2018-12-05 | 참엔지니어링(주) | 증착 장치 |
KR102100801B1 (ko) * | 2018-04-12 | 2020-04-14 | 참엔지니어링(주) | 증착 장치 및 방법 |
KR102310047B1 (ko) | 2019-06-07 | 2021-10-08 | 참엔지니어링(주) | 증착 장치 |
KR102314016B1 (ko) * | 2019-10-14 | 2021-10-19 | 주식회사 서연이화 | 레이더 전파 투과형 커버의 제조방법 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005171272A (ja) * | 2003-12-08 | 2005-06-30 | Sony Corp | レーザcvd装置 |
JP2008112958A (ja) | 2006-10-03 | 2008-05-15 | Sony Corp | 加工装置、及び配線基板の製造装置 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6154041A (ja) * | 1984-08-25 | 1986-03-18 | Hitachi Maxell Ltd | 磁気記録媒体の製造方法 |
JPS6350474A (ja) * | 1986-08-21 | 1988-03-03 | Hitachi Ltd | 磁性薄膜の形成方法 |
JP3082716B2 (ja) * | 1997-08-08 | 2000-08-28 | 日本電気株式会社 | レーザcvd装置及び方法 |
CN100343417C (zh) * | 2002-03-19 | 2007-10-17 | 株式会社液晶先端技术开发中心 | 布线金属层的形成方法、选择性形成金属的方法、选择性形成金属的装置及基板装置 |
JP5476519B2 (ja) * | 2010-01-20 | 2014-04-23 | 株式会社ブイ・テクノロジー | レーザ加工装置 |
JP5994090B2 (ja) * | 2012-02-29 | 2016-09-21 | 株式会社ブイ・テクノロジー | レーザ加工装置 |
JP2014019937A (ja) * | 2012-07-23 | 2014-02-03 | Omron Corp | レーザ加工装置 |
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2015
- 2015-12-14 KR KR1020150178600A patent/KR101765244B1/ko active IP Right Grant
-
2016
- 2016-02-15 JP JP2016025526A patent/JP6194034B2/ja active Active
- 2016-02-18 TW TW106120964A patent/TWI634232B/zh active
- 2016-02-18 TW TW105104679A patent/TWI604085B/zh active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005171272A (ja) * | 2003-12-08 | 2005-06-30 | Sony Corp | レーザcvd装置 |
JP2008112958A (ja) | 2006-10-03 | 2008-05-15 | Sony Corp | 加工装置、及び配線基板の製造装置 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11661656B2 (en) | 2020-01-22 | 2023-05-30 | Eq Tech Plus Co., Ltd. | Thin film forming apparatus and radical unit for forming thin film |
Also Published As
Publication number | Publication date |
---|---|
JP6194034B2 (ja) | 2017-09-06 |
TWI634232B (zh) | 2018-09-01 |
KR20170070947A (ko) | 2017-06-23 |
JP2017110286A (ja) | 2017-06-22 |
TW201720949A (zh) | 2017-06-16 |
TW201732076A (zh) | 2017-09-16 |
TWI604085B (zh) | 2017-11-01 |
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E902 | Notification of reason for refusal | ||
AMND | Amendment | ||
E601 | Decision to refuse application | ||
AMND | Amendment | ||
X701 | Decision to grant (after re-examination) |