KR101760559B1 - 반도체 결함 분류 장치 및 반도체 결함 분류 장치용 프로그램을 기록한 비일시적인 컴퓨터 판독 가능 기록 매체 - Google Patents

반도체 결함 분류 장치 및 반도체 결함 분류 장치용 프로그램을 기록한 비일시적인 컴퓨터 판독 가능 기록 매체 Download PDF

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KR101760559B1
KR101760559B1 KR1020147029475A KR20147029475A KR101760559B1 KR 101760559 B1 KR101760559 B1 KR 101760559B1 KR 1020147029475 A KR1020147029475 A KR 1020147029475A KR 20147029475 A KR20147029475 A KR 20147029475A KR 101760559 B1 KR101760559 B1 KR 101760559B1
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유따까 단다이
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가부시키가이샤 히다치 하이테크놀로지즈
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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/001—Industrial image inspection using an image reference approach
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F18/00—Pattern recognition
    • G06F18/20—Analysing
    • G06F18/24—Classification techniques
    • G06F18/241—Classification techniques relating to the classification model, e.g. parametric or non-parametric approaches
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/0006—Industrial image inspection using a design-rule based approach
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/0008—Industrial image inspection checking presence/absence
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00—Features of devices classified in G01N21/00
    • G01N2201/12—Circuits of general importance; Signal processing
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2200/00—Indexing scheme for image data processing or generation, in general
    • G06T2200/24—Indexing scheme for image data processing or generation, in general involving graphical user interfaces [GUIs]
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/10—Image acquisition modality
    • G06T2207/10004—Still image; Photographic image
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0616—Monitoring of warpages, curvatures, damages, defects or the like

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  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Quality & Reliability (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Biochemistry (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • General Health & Medical Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Data Mining & Analysis (AREA)
  • Artificial Intelligence (AREA)
  • Bioinformatics & Cheminformatics (AREA)
  • Bioinformatics & Computational Biology (AREA)
  • Evolutionary Biology (AREA)
  • Evolutionary Computation (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Signal Processing (AREA)
KR1020147029475A 2012-04-23 2013-04-11 반도체 결함 분류 장치 및 반도체 결함 분류 장치용 프로그램을 기록한 비일시적인 컴퓨터 판독 가능 기록 매체 Active KR101760559B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2012-097793 2012-04-23
JP2012097793A JP6080379B2 (ja) 2012-04-23 2012-04-23 半導体欠陥分類装置及び半導体欠陥分類装置用のプログラム
PCT/JP2013/060939 WO2013161577A1 (ja) 2012-04-23 2013-04-11 半導体欠陥分類装置及び半導体欠陥分類装置用のプログラム

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KR20140147850A KR20140147850A (ko) 2014-12-30
KR101760559B1 true KR101760559B1 (ko) 2017-07-21

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US (1) US9881365B2 (https=)
JP (1) JP6080379B2 (https=)
KR (1) KR101760559B1 (https=)
WO (1) WO2013161577A1 (https=)

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JP6244329B2 (ja) * 2015-05-12 2017-12-06 東京エレクトロン株式会社 基板の検査方法、基板処理システム及びコンピュータ記憶媒体
JP6771495B2 (ja) * 2015-08-12 2020-10-21 ケーエルエー コーポレイション 設計を利用する先行層欠陥箇所の点検
TWI737659B (zh) * 2015-12-22 2021-09-01 以色列商應用材料以色列公司 半導體試樣的基於深度學習之檢查的方法及其系統
US11580375B2 (en) * 2015-12-31 2023-02-14 Kla-Tencor Corp. Accelerated training of a machine learning based model for semiconductor applications
JP6833366B2 (ja) * 2016-07-06 2021-02-24 キヤノン株式会社 情報処理装置、情報処理装置の制御方法及びプログラム
US10650509B2 (en) 2016-09-08 2020-05-12 Synopsys, Inc. Video overlay
WO2018134158A1 (en) * 2017-01-18 2018-07-26 Asml Netherlands B.V. Knowledge recommendation for defect review
KR101753686B1 (ko) * 2017-02-16 2017-07-19 강무성 회로 해석 및 검증이 가능한 시뮬레이션 시스템
US10402963B2 (en) * 2017-08-24 2019-09-03 Kla-Tencor Corporation Defect detection on transparent or translucent wafers
WO2019115426A1 (en) * 2017-12-13 2019-06-20 Asml Netherlands B.V. Prediction of out of specification physical items
CN108318495A (zh) * 2018-04-11 2018-07-24 广东理工学院 瓷砖检测系统
EP3801932B1 (en) * 2018-06-07 2023-07-19 Wilco AG Inspection process and system
JP6767432B2 (ja) * 2018-06-11 2020-10-14 ファナック株式会社 縫い目検査装置
JP7053417B2 (ja) * 2018-09-13 2022-04-12 キオクシア株式会社 欠陥検査装置および欠陥検査方法
US10902620B1 (en) * 2019-04-18 2021-01-26 Applied Materials Israel Ltd. Registration between an image of an object and a description
CN112308816B (zh) * 2019-07-23 2024-02-06 纬创资通股份有限公司 影像辨识装置、影像辨识方法及其存储介质
CN113804244B (zh) * 2020-06-17 2024-06-25 富联精密电子(天津)有限公司 缺陷分析方法及装置、电子装置及计算机可读存储介质
CN112036514B (zh) * 2020-11-04 2021-07-13 腾讯科技（深圳）有限公司 一种图像分类方法、装置、服务器及计算机可读存储介质

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WO2011004534A1 (ja) * 2009-07-09 2011-01-13 株式会社 日立ハイテクノロジーズ 半導体欠陥分類方法，半導体欠陥分類装置，半導体欠陥分類プログラム

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JP4916116B2 (ja) * 2005-02-01 2012-04-11 株式会社ホロン パターン特定方法およびパターン特定装置
JP2007102153A (ja) * 2005-09-08 2007-04-19 Advanced Mask Inspection Technology Kk 画像補正装置、パターン検査装置、画像補正方法、及びレチクル
US20070053583A1 (en) 2005-09-08 2007-03-08 Advanced Mask Inspection Technology Inc. Image correcting apparatus, pattern inspection apparatus, and image correcting method, and reticle
JP5068591B2 (ja) 2007-06-29 2012-11-07 株式会社日立ハイテクノロジーズ 半導体欠陥分類方法、半導体欠陥分類装置、半導体欠陥分類装置のプログラム、半導体欠陥検査方法、および、半導体欠陥検査システム
US8980651B2 (en) * 2011-09-30 2015-03-17 Tokyo Electron Limited Overlay measurement for a double patterning

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WO2011004534A1 (ja) * 2009-07-09 2011-01-13 株式会社 日立ハイテクノロジーズ 半導体欠陥分類方法，半導体欠陥分類装置，半導体欠陥分類プログラム

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JP2013225618A (ja) 2013-10-31
KR20140147850A (ko) 2014-12-30
JP6080379B2 (ja) 2017-02-15
WO2013161577A1 (ja) 2013-10-31
US9881365B2 (en) 2018-01-30
US20150213596A1 (en) 2015-07-30

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