KR101758921B1 - 수지형, 성형체 및 성형체의 제조 방법 - Google Patents

수지형, 성형체 및 성형체의 제조 방법 Download PDF

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Publication number
KR101758921B1
KR101758921B1 KR1020110009664A KR20110009664A KR101758921B1 KR 101758921 B1 KR101758921 B1 KR 101758921B1 KR 1020110009664 A KR1020110009664 A KR 1020110009664A KR 20110009664 A KR20110009664 A KR 20110009664A KR 101758921 B1 KR101758921 B1 KR 101758921B1
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KR
South Korea
Prior art keywords
resin
smooth surface
contact angle
static contact
treatment
Prior art date
Application number
KR1020110009664A
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English (en)
Korean (ko)
Other versions
KR20110090808A (ko
Inventor
요시히사 하야시다
타쿠로 사츠카
요시아키 타카야
토시후미 타케모리
Original Assignee
마루젠 세끼유가가꾸 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 마루젠 세끼유가가꾸 가부시키가이샤 filed Critical 마루젠 세끼유가가꾸 가부시키가이샤
Publication of KR20110090808A publication Critical patent/KR20110090808A/ko
Application granted granted Critical
Publication of KR101758921B1 publication Critical patent/KR101758921B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
    • B29C33/3842—Manufacturing moulds, e.g. shaping the mould surface by machining
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/42—Moulds or cores; Details thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Polymerisation Methods In General (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
KR1020110009664A 2010-02-04 2011-01-31 수지형, 성형체 및 성형체의 제조 방법 KR101758921B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010022779 2010-02-04
JPJP-P-2010-022779 2010-02-04

Publications (2)

Publication Number Publication Date
KR20110090808A KR20110090808A (ko) 2011-08-10
KR101758921B1 true KR101758921B1 (ko) 2017-07-17

Family

ID=44690176

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020110009664A KR101758921B1 (ko) 2010-02-04 2011-01-31 수지형, 성형체 및 성형체의 제조 방법

Country Status (3)

Country Link
JP (1) JP5693925B2 (ja)
KR (1) KR101758921B1 (ja)
TW (1) TWI476093B (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7137325B2 (ja) * 2018-03-08 2022-09-14 株式会社ダイセル 成型品の離型方法、及び離型装置
JP7137324B2 (ja) * 2018-03-08 2022-09-14 株式会社ダイセル 成型品の離型方法、及び離型装置
US20210001538A1 (en) * 2018-03-08 2021-01-07 Daicel Corporation Mold-release method for molded article, and mold-release device
KR20190111743A (ko) * 2018-03-22 2019-10-02 스미토모 세이카 가부시키가이샤 복합부재 및 그 제조방법

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006112062A1 (ja) 2005-03-30 2006-10-26 Zeon Corporation 樹脂型及びそれを用いた成形体の製造方法
JP2007230229A (ja) * 2006-02-01 2007-09-13 Canon Inc インプリント用モールド、該モールドによる構造体の製造方法、部材の製造方法
JP2007320072A (ja) * 2006-05-30 2007-12-13 Asahi Glass Co Ltd モールドおよびその製造方法
WO2008051166A1 (en) * 2006-10-25 2008-05-02 Agency For Science, Technology And Research Modification of surface wetting properties of a substrate

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101679568B (zh) * 2007-06-20 2012-07-04 旭硝子株式会社 光固化性组合物及表面具有精细图案的成形体的制造方法
KR101702278B1 (ko) * 2008-05-29 2017-02-03 아사히 가라스 가부시키가이샤 광경화성 조성물 및 표면에 미세 패턴을 갖는 성형체의 제조 방법

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006112062A1 (ja) 2005-03-30 2006-10-26 Zeon Corporation 樹脂型及びそれを用いた成形体の製造方法
JP2007230229A (ja) * 2006-02-01 2007-09-13 Canon Inc インプリント用モールド、該モールドによる構造体の製造方法、部材の製造方法
JP2007320072A (ja) * 2006-05-30 2007-12-13 Asahi Glass Co Ltd モールドおよびその製造方法
WO2008051166A1 (en) * 2006-10-25 2008-05-02 Agency For Science, Technology And Research Modification of surface wetting properties of a substrate

Also Published As

Publication number Publication date
JP2011178155A (ja) 2011-09-15
KR20110090808A (ko) 2011-08-10
TWI476093B (zh) 2015-03-11
JP5693925B2 (ja) 2015-04-01
TW201127609A (en) 2011-08-16

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