TW201127609A - Resinous mold insert, molded article, and method of manufacturing molded article - Google Patents

Resinous mold insert, molded article, and method of manufacturing molded article Download PDF

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Publication number
TW201127609A
TW201127609A TW100103616A TW100103616A TW201127609A TW 201127609 A TW201127609 A TW 201127609A TW 100103616 A TW100103616 A TW 100103616A TW 100103616 A TW100103616 A TW 100103616A TW 201127609 A TW201127609 A TW 201127609A
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TW
Taiwan
Prior art keywords
resin
smooth surface
resin mold
contact angle
static contact
Prior art date
Application number
TW100103616A
Other languages
Chinese (zh)
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TWI476093B (en
Inventor
Yoshihisa Hayashida
Takuro Satsuka
Yoshiaki Takaya
Toshifumi Takemori
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Maruzen Petrochem Co Ltd
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Publication of TW201127609A publication Critical patent/TW201127609A/en
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Publication of TWI476093B publication Critical patent/TWI476093B/en

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00Moulds or cores; Details thereof or accessories therefor
    • B29C33/38Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
    • B29C33/3842Manufacturing moulds, e.g. shaping the mould surface by machining
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00Moulds or cores; Details thereof or accessories therefor
    • B29C33/42Moulds or cores; Details thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00Moulds or cores; Details thereof or accessories therefor
    • B29C33/56Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polymerisation Methods In General (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

The present invention provides a resinous mold insert used for nanoimprint lithography, which is easy to release, and which even been treated with a hydrophilic treatment, the surface thereof still maintains good precision of the fine shape formed thereon. The invented resinous mold insert is composed of a material containing a resin ingredient (a) and made by the following process: coating the resin ingredient (a) on the smooth face of a substrate having a smooth face; and after drying to form a resin layer (A) having a smooth face, disposing 3 μ L of water on the smooth face of the formed resin layer (A), of which the static contact angle determined according to JIS R 3257 can satisfy the following condition (1). Condition (1) coating a resin ingredient (b) in the material of which the object to be transferred is composed on the smooth face of substrate having a smooth face; and after drying to form a resin layer (B) having a smooth face, disposing 3 μ L of water on the smooth face of the formed resin layer (B), of which the static contact angle (Y1) determined according to JIS R 3257 has a difference with the static contact angle (X1) which the absolute value is 20DEG to 60DEG.

Description

201127609 四、 指定代表圖: (一) 本案指定代表圖為:無。 (二) 本代表圖之元件符號簡單說明:無。 五、 本案若有化學式時,請揭示最_示發明特徵的化學式: 無0 六、 發明說明: 【發明所屬之技術領域】 本發明關於樹脂模仁、成形體、及成形體之製造方法, 更詳、田地關於’用於微細構造之成形技術的樹脂製的奈米 印壓用的模仁,容易從轉寫對象離型,表面即使經親水化 處理,表面的微細形狀的精確度仍良好之樹脂模仁、成形 體、及成形體之製造方法。 【先前技術】 習知在LSI或記憶體等半導體製造領域中,微細圖案 的形成方法使用微影技術。然而微影技術的製程繁複,而 且一次可加工面積小,有設備成本非常高的問題。因此近 來較微影技術製程單純、一次可加工面積大(即,可一次大 面積轉寫)、设備成本低的奈米印壓法受到矚目。奈米印壓 、、大 ”體地為’將形成奈米狀(nanometer order)微細形狀 的Μ仁’壓於樹脂而達到奈米狀微細加工的方法。因此, 根據此奈米印壓法,可如上述以簡單製程且低成本複製微 201127609 細圖案。而且,可使用由矽膠 Η匕笙糾媸士从』 U IlC〇n)、石英、金屬、樹 月曰#所構成的楔具作為模仁。 奈米印塵法已報導有埶 ,,、不水印壓法、光(UV)奈米印壓 法# 熱奈未印壓法為,將楛彳-4 # 仁加熱至樹脂製的轉寫射象 的玻璃轉移溫度以上,祐厭“ W轉冩對冢 上知愚於轉寫對象,佶料半灿·十太本 狀的微細形狀轉印於轉穹 …H'未 W丨d寫對象之方法(例 專利文獻1)。光夺米印厭土 * ^ 1 、堅法為,將透光的石英等模仁,施 Μ於由光硬化性樹脂所禮 所構成的轉寫對象後,在施壓的狀雜 下對該模仁照射紫外光箄 Ί 、 卜先4先,使轉寫對象硬化,而使微米 狀或奈米狀的微細形狀轉印 π ,义锝舄對象之方法(例如非專 利文獻2、非㈣文獻3及專利文獻2)β 熱奈米印壓法使用的模仁’主要使用由石夕膠或錄等所 構成的模具,光奈米印壓法使用的模仁,主要使用由 等所構成的模具。 、 然而,由石夕膠、禮、4 _ 修鎳、石央等所構成的模仁具有昂貴且 污染及破損風險高的問題。因此’近年來使用樹脂製的模 仁(樹u U具體的提案有’由含有環狀稀烴共聚物(⑶◦ 的材料所構成的樹脂模仁(例如專利文獻3),或含有脂環 式構造之熱塑性樹脂及含有羥基之脂肪酸酯化合物、具有 寺疋玻璃轉移/皿度(Tg)及特定嫁融流率(購)的樹脂模仁 (例如專利文獻4)。 ' [先前技術文獻] [專利文獻] [專利文獻1 ]國際申請公開號w〇〇4/〇62886 201127609 [專利文獻2]特開2007-84625號公報 [專利文獻3]特開2007-55235號公報 [專利文獻4]特開2006-35823號公報 [非專利文獻] [非專利文獻 1]S. γ. Chou, P. R. Krauss, P. J. Renstrom: Appl. Phys. Lett., 67(1995) p.3114 [非專利文獻 2]T. Bailey, B. J. Chooi,M. Colburn, M. Meissi, S. Shaya, J. G. Ekerdt, S. V. Screenivasan, C. G. Willson: J. Vac. Sci. Technol., B18(2000) p.3572201127609 IV. Designation of the representative representative: (1) The representative representative of the case is: None. (2) A brief description of the symbol of the representative figure: None. 5. In the case of a chemical formula, please disclose the chemical formula of the most characteristic features of the invention: None. 6. Description of the Invention: Technical Field of the Invention The present invention relates to a resin mold, a molded body, and a method for producing the molded body. In detail, the mold of the nano-printing resin made of resin for the molding technology of the fine structure is easy to be released from the transfer target, and the surface of the fine shape is excellent even if the surface is hydrophilized. A resin mold, a molded body, and a method of producing a molded body. [Prior Art] Conventionally, in the field of semiconductor manufacturing such as LSI or memory, a method of forming a fine pattern uses a lithography technique. However, the lithography technology has a complicated process, and the processing area at one time is small, and the equipment cost is very high. Therefore, recently, the nano-printing method which is simpler than the lithography process, has a large processing area at a time (that is, can be transferred at a large area), and has low equipment cost has attracted attention. The nano-printing method and the large-sized body are a method of pressing a resin having a nanometer order and a fine shape to a resin to achieve nano-fine processing. Therefore, according to the nano-pressing method, As described above, the micro-201127609 fine pattern is reproduced in a simple process and at a low cost. Moreover, a wedge composed of 矽 Η匕笙 Η匕笙 从 』 』 U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U The nano-printing method has been reported to have flaws, no watermarking, and light (UV) nano-printing method #热奈不印压法, heating 楛彳-4# kernel to resin-made transfer Like the glass transfer temperature above, you are tired of "W turn to the 冩 冢 知 知 愚 愚 转 转 转 转 转 转 转 转 转 转 转 转 转 转 转 微 微 微 微 微 微 微 微 微 微 微 微 微 微 微 微 微 微 微 微 微 微Method (Example Patent Document 1). The light-grained rice-printed ridiculous soil * ^ 1 , the firming method, the light-transmissive quartz and other molds are applied to the transfer object composed of the photo-curable resin, and the pressure is applied to the mold. The method of irradiating the ultraviolet light 箄Ί, 卜 first 4 first, hardening the transfer object, and transferring the micro- or nano-shaped fine shape to the π, the object of the ( (for example, non-patent literature 2, non-four documents) 3 and Patent Document 2) The mold core used in the β-thermal nano-printing method mainly uses a mold composed of Shi Xijiao or recorded, and the mold used in the photon printing method is mainly composed of the like. Mold. However, the mold core consisting of Shi Xijiao, Li, 4 _ Nickel, Shiyang, etc. is expensive and has a high risk of contamination and damage. Therefore, in recent years, a resin-made mold core has been used (there is a proposal for a resin mold core composed of a material containing a cyclic thin hydrocarbon copolymer ((3) ( (for example, Patent Document 3), or an alicyclic type. A thermoplastic resin having a structure, a fatty acid ester compound containing a hydroxyl group, a resin mold having a temple glass transition/dish (Tg) and a specific graft flow rate (for example, Patent Document 4). [ [Prior Art Document] [Patent Document 1] [Patent Document 1] [Patent Document 1] Japanese Laid-Open Patent Publication No. 2007-84625 (Patent Document 3) JP-A-2006-35823 [Non-Patent Document] [Non-Patent Document 1] S. γ. Chou, PR Krauss, PJ Renstrom: Appl. Phys. Lett., 67 (1995) p. 3114 [Non-Patent Document 2] T. Bailey, BJ Chooi, M. Colburn, M. Meissi, S. Shaya, JG Ekerdt, SV Screenivasan, CG Willson: J. Vac. Sci. Technol., B18(2000) p.3572

Lett., 63(1993) p.2002 【發明内容】 【發明所欲解決之問題】 及4所記載之構成樹脂模仁的樹脂Lett., 63 (1993) p.2002 [Disclosed] [The problem to be solved by the invention] and the resin constituting the resin mold core described in 4

然而,專利文獻3及4所言己 成分,與構成轉寫對象的材料中 因此,樹脂模仁與轉寫對象的親 201127609 差異。又雖麸兔^ …、馬相同的樹脂模仁,因為位置而使(部分的) 表面性質形狀不 具體為接觸角的差異),因此因為表面 性質形狀不同,巩怕本丄 心咱產生離型性的差異。因此期望開發從 轉寫:象容易離型的樹脂模仁。 、 冓成祕知拉仁的樹脂成分與構成轉寫對象的樹脂成 刀的11貝形狀類似的情形,#由以親水化處理樹脂模仁具 有微細形狀的 > 而 I卸’使接觸角變小,可降低樹脂模仁與轉 寫對象的親和性。 ^ 戍而,經由上述親水化處理,會產生表However, the components of Patent Documents 3 and 4 and the materials constituting the transfer target are therefore different from the pros and the pros. In addition, although the bran rabbit ^ ..., the same resin mold of the horse, because of the position (partial) surface property shape is not specifically the difference of the contact angle), therefore, due to the different surface properties and shape, Sexual differences. It is therefore desirable to develop a resin mold from a transfer: a mold that is easy to release. In the case where the resin component of Laren is similar to the shape of the 11-shell resin of the resin forming the object to be transferred, #there is a fine shape of the resin mold by hydrophilization treatment> Small, can reduce the affinity of the resin mold and the transfer object. ^ 戍 ,, via the above hydrophilization treatment, will produce a table

片劣化(即微細形狀減少)的問題。因此殷切開發經親 水化處理也LV、士 I 、 减〉、微細形狀(即表面微細形狀的精確度 良好)的樹脂模仁。 本毛明為解決上述習知技術之課題所形成,以提供容 易攸轉寫對象離开j i 離良表面經親水化處理時表面微細形狀的 精確度仍良好2姑+ y , 十之树知杈仁、成形體、及成形體之製造方法 為目的。 【解決問題之技術手段】 本發明人們為達成上述課題積極討論之結果,著眼於 構成樹脂模仁之材料中的樹脂成分的表面性質形與構成轉 Y寸象之材料中的樹脂成分的表面性質形狀的關係,發現 =構成樹脂模仁的材料中的樹脂成分之對3/ZL的水之靜 觸角’與構成轉寫對象的材料中的樹脂成分之對3 /z L的 7之靜接觸角的差的絕對值》2Q。霄者,可達成上述課 題’遂完成本發明。 據本發明’提供下列樹脂模仁、成形體及成形體之 201127609 製造方法。 荦乂樹脂成分(a)之材料所構成,表面上形成圖 分二用的:細形狀,將該微細形狀轉寫於由含有樹脂成 :之材:所構成的轉寫對象所用之奈米印壓用的樹脂 、-’該樹脂模仁為,將上述樹脂成分(a)塗佈於呈有平滑 面的基材之該平滑面上,使乾燥或照射光,形成具有平滑 面的樹脂層(A)後’形成的該樹脂層(A)的上述平滑面上配 置3以的水’根據nSR 3257測定的靜接觸角(χι)滿足 下列條件(1)者: 條件(1):構成上述轉寫對象之材料中的上述樹脂成分 (Μ,塗佈於具有平滑面的基材之該平滑面上,使乾燥或照 射光,形成具有光滑面的樹脂層(Β)後,該形成的樹脂層(Β) 的該平滑面上配置3# L的水,根據jIS R 3257測定的靜 接觸角(Y1)與上述靜接觸角(X1)的差的絕對值為2〇。〜6〇。。 [2 ]如上述[1 ]所述之樹脂模仁’其中,形成微細形狀 的上述表面經親水化處理。 [3 ]如上述[2 ]所述之樹脂模仁,其中,該樹脂模仁為, 形成上述樹脂層(A)後,形成的該樹脂層(a)的上述平滑面 以親水化處理’經親水化處理的上述平滑面上配置3 A L的 水,根據JIS R 3257測定的靜接觸角(X2)滿足下列條件(2) 者: 條件(2):上述靜接觸角(Y1)與上述靜接觸角(X2)的差 ((Y1)-(X2))為 20°〜60°。 [4 ]如上述[2 ]或[3 ]所述之樹脂模仁,其中,上述親水 201127609 - 化處理係進行uv臭氧處理。 [5] 如上述[2]或[3]所述之樹脂模仁,其中,上述親水 化處理係進行電暈放電處理。 ’ [6] 如上述[2]或[3]所述之樹脂模仁,其中,上述親水 化處理係進行電漿放電處理。 ’ [7] 如上述[1]或[2]項所述之樹脂模仁,其中,上述表 面經離型劑處理而得。 [8] 如上述⑴或[2]所述之樹脂模仁’其中,上述樹脂 •成分⑷包含熱塑性樹脂’上述表面上的微細形狀經熱奈米 印壓而形成。 [9] 如上述[8]所述之樹脂模仁,其中,上述熱塑性樹 脂為選自下列所組成之群組之至少1種:環狀烯烴系樹 脂、聚烯烴樹脂、丙烯酸樹脂、聚碳酸酯樹脂、聚乙烯醚 樹脂、及聚苯乙烯樹脂。 [1 0 ]如上述[1 ]或[2 ]項所述之樹脂模仁,其中,上述 • 樹脂成分U)包含光硬化性樹脂,上述表面上的微細形狀經 光奈米印壓而形成。 [11]如上述[10]所述之樹脂模仁,其中,上述光硬化 性樹脂含有來自選自下列所組成之群組之至少1種硬化性 化合物的構造單位:直鏈狀乙烯醚化合物、脂環乙稀驗化 。物、環氧化合物、氧雜環丁院(oxetane)化合物、及丙稀 酸化合物。 [1 2 ]如上述[1 ]或[2 ]所述之樹脂模仁,其中,該樹脂 模仁為熱奈米印壓用。 201127609 [13 ]如上述[1 ]或[2 ]所述之樹脂模仁 模仁為光奈米印壓用。 ~ H該樹脂 [⑷由轉寫上述⑴或[2]所述之樹脂模仁的表面 形成的微細形狀而得的成形體。 [15] 一種成形體之製造方法,使用由含有㈣成分⑷ 之材料所構成,表面上形成圖案形成用的微細形狀的樹脂 =仁’經由將上述樹脂模仁的該微細形狀轉寫於由含有樹 脂成分(b)之材料所構成的轉寫對象,使上述樹脂模仁的該 微細形狀之反轉形狀形成於表面而得成形體之製造: 上述樹脂模仁為,將上述樹脂成分⑷塗佈於具有平滑 面的基材之該平滑面上,使乾燥或照射光,形成具有平滑 面的樹脂層⑴後,形成的該樹脂層⑴的上述平滑面上配 置3W的水,根據JISR 3257測定的靜接觸角⑴)滿足 下列條件(1 )之樹脂模仁·· 條件(1).構成上述轉寫對象之材料中的上述樹脂成分 ⑻’塗佈於具有平滑面的基材之上述平滑面上,使乾燥或 射光I成具有平滑面的樹脂層⑻後,該形成的樹脂層 ()勺上述平,月面上配置3 V L的水,根據R 3257測定 的靜接觸角ΟΠ)與上述靜接觸角⑼的差的絕對值為 20。〜60。 〇 Π6]如上述[15]所述之成形體之製造方法,其中,上 :樹月曰杈仁由形成微細形狀之上述表面經親水化處理而 付且上述樹脂模仁&,形成上述樹脂層⑴後,形成的該 曰層(A )的上述平滑面以親水化處理,經親水化處理的上 201127609 述平滑面上配置3 “ L的7k ,姥M T T C η # 的水根據JIS I? 3257測定的靜接 觸角(X 2)滿足下列條件(2)之樹脂模仁: 條件(2):上述靜接觸角(γι)與上述靜接觸角(χ2)的差 ((Y1)-(Χ2 ))為 20。〜60。。 【發明之效果】 ,本备月之樹月曰核仁為用於微細構造之成形技術的樹脂 製的奈米印壓用的模仁,可容易從轉寫對象離型,其表面 雖經親水化處理,也能遠丨# t此運幻表面微細形狀的精確度良好的 效果。 本發明之成形體為’使用可容易從轉寫對象離型,且 表面雖左親水化處理也能達到表面微細形狀的精確度良好 的樹脂模仁所形成者,田μ 成者因此達到具有良好微細圖案的效果。 本發明之成形體的製造方法使用可容# 型,且m… 1史用τ谷易攸轉寫對象離 ’·’·k親水化處理也能達到声而外* ^ 逹幻表面彳政細形狀的精確 度良好的樹脂模介所帮#本 犋仁所形成者,因此達到可製 細圖案之成形體的效果。 有良好微 【實施方式】 以下說明為實施本發明之形g,但本發 實施之型態。亦g卩+ 卜丨艮方;下列 “即,在不脫離本發明旨趣之範圍 此技術領域中诵受· a 基方; 更、改良等者,可理醢比屈 遇田的變 了里解&屬於本發明之範圍。 [1 ]樹脂模仁: 本發明之樹脂模仁,由含 3有樹月曰成刀(a)之材料所構 201127609 成,表面上形成圖案形成用的微細形狀,將該微細形狀轉 寫於由含有樹脂成分⑻之材料所構成的轉寫對象所用之 奈米印壓用的樹脂模仁,將樹脂成分(a)塗佈於具有平滑面 的基材之該平滑面上,使乾燥或照射光,形成具有平滑面 的樹脂層(A)後,形成的該樹脂層(人)的平滑面上配置匕 的水,根據JIS R 3257測定的靜接觸角(χι)滿足下列條 (1)者。 ’、 條件(1):構成轉寫對象之材料中的樹脂成分(b),塗 佈於具有平滑面的基材之該平滑面上,使乾燥或照射光: 形成具有充滑面的樹脂層(B)後,該形成的樹脂層(b)的平 滑面上配置3“的水’根據川R 3257測定的靜接觸角 (Y1)與上述靜接觸角(X1)的差的絕對值為2〇。〜6〇。。 此述樹脂模仁為用於微細構造成形技術之樹脂製的夺 米印壓用的模仁,纟易從轉寫對象離型,表面經親水域 理時:表面微細形狀的精確度也良好。料,上述絕對值 為20 60時,可獲得上述之效果,但不滿2〇。者,離型性 惡化,而超過60。者,離型性雖良好但微細形 變差。 如上所述,上述絕對值必須為20。〜60。,較佳為 n更佳為2G。〜55。。上述絕對值在上列較佳範圍内, -、有可更合易;轉寫對象離型,及表面經親水化處理時, 表面微細形狀的精確度優良的優點。 樹脂成分U)較佳為包含熱塑性樹脂者。熱塑性樹脂可 列舉例如環狀烯烴系樹脂、聚烯烴樹脂、丙烯酸樹脂、聚 10 201127609 碳酸酯樹脂、聚乙烯醚樹脂、聚苯乙烯樹脂'聚乙烯對笨 二甲酸樹脂、氣化乙烯樹脂等。其中以選自由環狀烯烴系 樹脂、聚烯烴樹脂、丙烯酸樹脂、聚碳酸酯樹脂、聚乙稀 喊樹脂、及聚笨乙烯樹脂所組成之群組的至少1種為佳, 以環狀烯烴系樹脂為更佳。環狀烯烴系樹脂可例如環狀稀 經開環聚合/氫化體(C〇p樹脂)、環狀稀烴共聚物(c〇c樹 脂)。The problem of sheet deterioration (ie, reduction in fine shape). Therefore, it is ardent to develop a resin mold which is also subjected to hydrophilic treatment, such as LV, ±, and minus, and a fine shape (i.e., a fine surface having a fine shape). The present invention has been developed to solve the above-mentioned problems of the prior art, so as to provide an easy to twirling object to leave the ji away from the surface of the surface, the precision of the surface fine shape is still good 2 + + y, the ten tree knows The purpose of manufacturing the kernel, the molded body, and the molded body is for the purpose. [Means for Solving the Problem] As a result of active discussion of the above-mentioned problems, the present inventors focused on the surface property of the resin component in the material constituting the resin mold core and the surface property shape of the resin component in the material constituting the Y-inch image. The relationship between the static electric contact angle of the resin composition in the material constituting the resin mold core to the 3/ZL of the resin composition and the resin component in the material constituting the transfer object is 3/z L of 7 The absolute value of the difference is 2Q. The latter can achieve the above problems 遂 to complete the present invention. According to the present invention, the following manufacturing method of the resin mold, the molded body and the molded body is provided. The resin composition (a) is composed of a material, and a fine shape is formed on the surface, and the fine shape is transferred to a nanoprint used for a transfer object composed of a resin: The resin for pressing, the resin resin (a) is applied to the smooth surface of the substrate having a smooth surface, and dried or irradiated with light to form a resin layer having a smooth surface ( A) After the 'water layer 3 of the resin layer (A) formed on the smooth surface is formed, the static contact angle measured by nSR 3257 satisfies the following condition (1): Condition (1): constitutes the above-mentioned rotation The resin component (Μ, which is applied to the smooth surface of the substrate having a smooth surface, is dried or irradiated with light to form a resin layer having a smooth surface, and the resin layer is formed. 3# L of water is placed on the smooth surface of (Β), and the absolute value of the difference between the static contact angle (Y1) and the static contact angle (X1) measured according to jIS R 3257 is 2 〇. 6 〇. 2] The resin mold core according to the above [1], wherein the surface on which the fine shape is formed is hydrophilized. [3] The resin mold core according to the above [2], wherein the resin mold core is formed by the resin layer (A), and the smooth surface of the resin layer (a) is hydrophilized. Water of 3 AL is disposed on the smooth surface of the hydrophilization treatment, and the static contact angle (X2) measured according to JIS R 3257 satisfies the following condition (2): Condition (2): The above static contact angle (Y1) is in contact with the above static contact The difference of the angle (X2) ((Y1) - (X2)) is from 20 to 60. [4] The resin mold of the above [2] or [3], wherein the above-mentioned hydrophilic 201127609 - chemical treatment system [5] The resin mold core according to the above [2] or [3] wherein the hydrophilization treatment is performed by corona discharge treatment. ' [6] as described above [2] or [3] The resin mold core according to the above [1] or [2], wherein the surface is treated with a release agent. [8] The resin mold according to the above (1) or [2] wherein the resin component (4) contains a thermoplastic resin, and the fine shape on the surface is hot-pressed. [9] The resin mold according to the above [8], wherein the thermoplastic resin is at least one selected from the group consisting of a cyclic olefin resin, a polyolefin resin, an acrylic resin, and a poly The resin mold of the above-mentioned [1] or [2], wherein the resin component U) contains a photocurable resin, The fine shape on the surface described above is formed by photon printing. [11] The resin mold core according to the above [10], wherein the photocurable resin contains a structural unit derived from at least one curable compound selected from the group consisting of a linear vinyl ether compound, Alicyclic acetylation test. , an epoxy compound, an oxetane compound, and an acrylic acid compound. [1] The resin mold core according to the above [1] or [2] wherein the resin mold core is used for hot nano printing. 201127609 [13] The resin mold core according to the above [1] or [2] is used for photon printing. ~H This resin [(4) A molded article obtained by transferring the fine shape formed on the surface of the resin mold core described in the above (1) or [2]. [15] A method for producing a molded body, comprising using a material containing the component (4) (4), and forming a fine resin for pattern formation on the surface of the resin = kernel" by transferring the fine shape of the resin mold to be contained The object to be transferred by the material of the resin component (b) is formed by forming an inverted shape of the fine shape of the resin mold on the surface to obtain a molded body: the resin mold is coated with the resin component (4) After drying or irradiating light on the smooth surface of the substrate having a smooth surface to form a resin layer (1) having a smooth surface, 3 W of water is placed on the smooth surface of the formed resin layer (1), and measured according to JIS R 3257. The static contact angle (1)) is a resin mold having the following condition (1). (1) The resin component (8) in the material constituting the transfer target is applied to the smooth surface of the substrate having a smooth surface. After drying or illuminating the resin layer (8) having a smooth surface, the formed resin layer () is placed on the flat surface, and 3 VL of water is disposed on the moon surface, and the static contact angle measured according to R 3257 is the same as the above-mentioned static connection. ⑼ absolute difference angle is 20. ~60. The method for producing a molded article according to the above [15], wherein: the above-mentioned resin is formed by the hydrophilization treatment of the surface on which the finely shaped shape is formed, and the resin mold core & After the layer (1), the smooth surface of the ruthenium layer (A) formed is hydrophilized, and the water of 7 k, 姥MTTC η# of 3 L is arranged on the smooth surface of the hydrophilization treatment of the above-mentioned 201127609 according to JIS I? 3257 The measured static contact angle (X 2 ) satisfies the resin mold of the following condition (2): Condition (2): the difference between the above static contact angle (γι) and the above static contact angle (χ2) ((Y1)-(Χ2) The effect of the invention is as follows: [Effect of the invention] The sap of the sap of the sap of the moon is a resin for the nano-pressing of the resin for the fine structure, and can be easily transferred from the object. The release type, although the surface is hydrophilized, can also have a good effect of the fine shape of the surface of the phantom. The molded body of the present invention can be easily used from a transfer object, and the surface is The left hydrophilization treatment can also form a resin mold with good precision of the surface fine shape. Therefore, the result of the formation of a fine micropattern is achieved. The method for producing a molded body of the present invention can be used as a type, and m... 1 history of using the τ谷易攸 transfer object from the '·'·k hydrophilization treatment It is also possible to achieve the sound and the outer surface of the molded body of the fine-grained pattern. MODES FOR CARRYING OUT THE INVENTION The following description is directed to the form of the present invention, but the present invention is also in the form of the present invention. The following "i.e., in the technical field without departing from the scope of the present invention, Fang; more, improved, etc., can be considered to be more than the scope of the present invention. [1] Resin Mold: The resin mold of the present invention is made of a material containing a material of 3 sapphire knives (a) 201127609, and a fine shape for pattern formation is formed on the surface, and the fine shape is transferred to The resin mold core for nano-press printing used for the transfer target made of the material containing the resin component (8), the resin component (a) is applied to the smooth surface of the substrate having a smooth surface, and dried or irradiated. After forming a resin layer (A) having a smooth surface, water is formed on the smooth surface of the formed resin layer (human), and the static contact angle (χι) measured according to JIS R 3257 satisfies the following (1) . ', Condition (1): The resin component (b) in the material constituting the transfer target is applied to the smooth surface of the substrate having a smooth surface to dry or irradiate light: to form a resin layer having a smooth surface After (B), the absolute value of the difference between the static contact angle (Y1) measured by Kawasaki R 3257 and the above static contact angle (X1) is 3 in the smooth surface of the formed resin layer (b). 〇.~6〇.. The resin mold core is a resin for the micro-structure forming technology. It is easy to remove from the transfer object, and the surface is hydrophilic. The accuracy of the shape is also good. When the above absolute value is 20 60, the above effect can be obtained, but if it is less than 2 〇, the release property is deteriorated, and when it exceeds 60, the release property is good but the fineness is poor. As described above, the above absolute value must be 20. ~ 60. Preferably, n is preferably 2G. ~ 55. The above absolute value is in the above preferred range, -, more convenient; When the object is released and the surface is hydrophilized, the precision of the surface fine shape is excellent. Resin composition U) It is preferable to contain a thermoplastic resin. Examples of the thermoplastic resin include a cyclic olefin resin, a polyolefin resin, an acrylic resin, a poly 10 201127609 carbonate resin, a polyvinyl ether resin, and a polystyrene resin 'polyethylene-p-dicarboxylic acid resin. A gasified vinyl resin or the like, wherein at least one selected from the group consisting of a cyclic olefin resin, a polyolefin resin, an acrylic resin, a polycarbonate resin, a polyethylene resin, and a polystyrene resin is preferred. The cyclic olefin-based resin is more preferably used. The cyclic olefin-based resin may, for example, be a ring-shaped ring-opening polymerization/hydrogenated product (C〇p resin) or a cyclic hydrocarbon copolymer (c〇c resin).

樹脂成分(a)包含熱塑性樹脂的情形,樹脂模仁宜為使 表面上微細形狀藉由熱奈米印壓而形成者。藉由熱奈米印 壓形成微細形狀’可以良好效率形成良好的微細形狀。 樹脂成分(a)較佳為包含光硬化性樹脂者 樹脂為含有來自硬化性化合物之構造單位者,硬化性化合 物例如直鏈狀乙烯醚化合物、脂環乙烯醚化合物、環氧化 合物、氧雜環丁烷(oxetane)化合物、丙烯酸化合物、順丁 2酸軒等。其中以直鏈狀乙烯醚化合物、脂環乙晞輕化 ^衣氧化合物、氧雜環丁烷(oxetane)化合物、及丙烯 酸化合物為佳。此述化合物可使用單冑i種或2種以上。 彳來自4自由直鏈狀乙稀驗化合物、脂環乙稀_ 化δ物、環氧化合物、 稀酸化人物心★ (如⑽)化合物、及兩 單位者為佳。 1種硬化性化合物的構造 、曰成分U)包含光硬化性樹脂 使表面上捭,心,, 树知核仁宜為 微、.‘田形狀經由光奈米印壓 — 印壓形成押& / v成者。精由光奈米 i〜成微細形狀,可以_ 了以良好效率形成良好的微細形狀。 201127609 樹脂成分(a)降卜.+、& μ .. '、上述熱塑性樹脂或光硬化性樹脂以 外’可列舉熱硬化性樹脂。 本發明之樹脂模仁除限 -^ ,. 、h七 、由3有树月曰成为(a)之材料 所構成,沒有特別限制,σ /、有樹脂成分(a)所構成者也可, 也可以更包含滑齋丨、γ祭 抗氧化劑、帶電防止劑、紫外線安定 劑、整平劑(1 evei in § agent)(表面調整劑)、黏度調整劑、 聚合起始劑、増稠劑等的其他成份(添加劑)。 本發月之樹月曰松仁較佳在形成微細形狀的表面以親水 化處理。表面經親水化處理,可使樹脂層表面的靜接觸角 容易降低,可得到具有良好離型性的樹脂模仁。又在製造 ί曰杈{之後、’“見水化處理而使表面性質形狀變化的情形 時’樹脂模仁的製造工轻ψ χ相π + y 以私中不但可確保與由金屬等所構成 的金屬模具之良好的離都性,太迪u a 雖!性在親水化處理後,藉由此親 水化處理使樹脂模仁與轉寫對象的親和性降低,可獲得具 有與轉寫對象良好離型性的樹脂模仁。 而且,在親水化處理的情形時,較佳為下列靜接觸角 U2)滿足下列條件⑺所處理者。靜接觸角(χ2)為將上述樹 脂成分⑷塗佈於具有平滑面的基材之平滑面上,使乾燥或 照射光,形成具有平滑面的樹脂層(Α)後,形成的樹脂層⑴ 的平滑面經親水化處理,親水化處理的平滑面上配置^ 的水’根據J IS R 3257所測定的值。 條件(2):上述靜接觸角(Y1)與上述靜接觸角(χ2)的差 ((Υ1)-(Χ2))為 20。〜60。。 因此,本發明之樹脂模仁較佳如上述為,靜接觸角(γι) 12 201127609 與上述靜接觸角(X2)的差為2G。,。,較 佳為2〇。必。靜接觸角⑼與上述靜接觸角(χ2)^ = =圍内’可得到特別容易從轉寫對象離型,及表面瘦 …理時,表面微細形狀的精確度優良的樹脂心。 ,水化處理可列舉㈣臭氧處理、電暈放電處理、電聚 “理、金屬納處理等。其中以,臭氧處理、電晕放電 處理、電漿放電處理為佳。 經UV臭氧處理而親水化的情形’具有可在大氣中進行 面處理’且對樹脂的損害小的優點。υν臭氧處理的條件 •沒有特別限制,可適宜採用習 i曰7 gj悚件,但具體可列 用低壓水銀燈,在空氣中,ag如vc仏 、 …、射距離1 〇〜30mm的條件,進 4亍UV照射之處理0险供厭^ & μ 处里除低壓水銀燈以外,可列舉氙準分子燈 (Xe excimer lamp)等。 經電暈放電處理而辅a , 而親水化的情形,與UV臭氧處理相 同’具有可在大氣中進行表面處理,且處理速度快的優點。 電晕放電處理的條件沒有特別限制,可適宜採用習知條 件/、體例如在工乳中以〇. 5~2〇贿的放電空隙施加周波 數10kHz〜100kHz的高周波、高電壓的處理。 經電漿放電處理而親水化的情形,因為可只改質樹脂 模仁的表面,具有不影響樹脂成分u)的界面(磁)特性之 優點。電聚放電處理的條件沒有特別限制,可適宜採用習 知條件,具體例如,在氧氣存在下以⑽(反應性離子姓刻) 處理,或在氮氣存在下以逆濺鍍處理。 本發明之樹脂松仁的表面較佳為經離型劑處理所得 13 201127609 者。進行此種離型劑處理具有使離型性變得更好的優點。 離里劑的處理可以是經由浸塗法、旋轉塗佈法、喷霧塗佈 法等將離型劑塗佈在樹脂模仁的表面所進行。離型劑可 例如氟系溶劑、矽膠系離型劑等。離型劑的處理,在樹脂 模4的表面進行親水化處理的情形時,可以在親水化處理 之前進行,也可以在親水化處理之後進行,但較佳在親水 化處理之後進行。 [2 ]樹脂模仏的製造方法:In the case where the resin component (a) contains a thermoplastic resin, the resin mold core is preferably formed by hot pressing on the surface of the fine shape. By forming a fine shape by hot nano printing, a good fine shape can be formed with good efficiency. The resin component (a) preferably contains a photocurable resin, and the resin contains a structural unit derived from a curable compound, and a curable compound such as a linear vinyl ether compound, an alicyclic vinyl ether compound, an epoxy compound, or an oxygen heterocycle. An oxetane compound, an acrylic compound, a cis-butanic acid, and the like. Among them, a linear vinyl ether compound, an alicyclic oxime, an oxynitride compound, an oxetane compound, and an acrylic compound are preferred. The compound described above may be used alone or in combination of two or more.彳 From 4 free linear ethylene compounds, alicyclic ethoxylates, epoxy compounds, dilute acidified people's hearts ★ (such as (10)) compounds, and two units are preferred. The structure of one type of curable compound, the bismuth component U) contains a photocurable resin to make the surface 捭, heart, and the nucleolus is preferably micro, and the shape of the field is printed by light nano-printing and stamping. / v into the person. Fine light nanometer i~ into a fine shape, can form a good fine shape with good efficiency. 201127609 Resin component (a) is a thermosetting resin, and the above thermoplastic resin or photocurable resin is used. The resin mold core of the present invention is composed of a material of (a) which is composed of a material having a structure of (a), and is not particularly limited, and σ /, which is composed of a resin component (a), may be used. It may also include a sinter, an anti-oxidant, a charge inhibitor, an ultraviolet stabilizer, a leveling agent (surface modifier), a viscosity modifier, a polymerization initiator, a thickener, etc. Other ingredients (additives). The pine tree of the present month is preferably hydrophilized on the surface of the finely shaped surface. By hydrophilizing the surface, the static contact angle of the surface of the resin layer can be easily lowered, and a resin mold having good release property can be obtained. In addition, in the case of manufacturing 曰杈 、 之后 见 见 见 见 见 见 见 见 见 ' ' ' ' ' ' 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂The good detachment of the metal mold, Taidi ua, although the hydrophilicity treatment, the affinity of the resin mold and the transfer object is reduced by the hydrophilization treatment, and it is possible to obtain a good separation from the transfer object. Further, in the case of the hydrophilization treatment, it is preferred that the following static contact angle U2) satisfy the following condition (7). The static contact angle (χ2) is to apply the above resin component (4) to have After smoothing or irradiating light on a smooth surface of a smooth surface, a resin layer having a smooth surface is formed, and the smooth surface of the formed resin layer (1) is hydrophilized, and the smooth surface of the hydrophilization treatment is disposed. The water 'is a value measured according to J IS R 3257. Condition (2): The difference between the above static contact angle (Y1) and the above static contact angle (χ2) ((Υ1) - (Χ2)) is 20 to 60. Therefore, the resin mold of the present invention is preferably as described above, and has a static contact angle ( ι) 12 201127609 The difference from the above static contact angle (X2) is 2G., preferably 2 〇. It is necessary to make the static contact angle (9) and the above static contact angle (χ2)^ = = The resin core is excellent in the accuracy of the fine surface shape from the transfer object, and the surface is thin. The hydration treatment can be exemplified by (4) ozone treatment, corona discharge treatment, electropolymerization, metal nano treatment, and the like. Among them, ozone treatment, corona discharge treatment, and plasma discharge treatment are preferred. The case of hydrophilization by UV ozone treatment has the advantage of being surface-treated in the atmosphere and having little damage to the resin. Υν Ozone treatment conditions • There is no special restriction, it can be suitable to use the i曰7 gj悚, but specifically can use low-pressure mercury lamps, in the air, ag such as vc仏, ..., shooting distance 1 〇~30mm, into 4 亍 UV irradiation treatment 0 insurance for 厌 ^ & μ in addition to low-pressure mercury lamps, can be cited Xen excimer lamp (Xe excimer lamp). The corona discharge treatment is supplemented with a, and the hydrophilization is the same as the UV ozone treatment, which has the advantage of being surface-treated in the atmosphere and having a high processing speed. The conditions of the corona discharge treatment are not particularly limited, and it is possible to suitably apply a high-frequency, high-voltage treatment of a cycle number of 10 kHz to 100 kHz in a discharge gap of a 5~2 bribe in a working milk. In the case of hydrophilization by plasma discharge treatment, since only the surface of the resin mold core can be modified, there is an advantage that the interface (magnetic) property of the resin component u) is not affected. The conditions of the electropolymerization discharge treatment are not particularly limited, and conventional conditions can be suitably employed, for example, treatment with (10) (reactive ion surname) in the presence of oxygen or reverse sputtering in the presence of nitrogen. The surface of the resin pine kernel of the present invention is preferably obtained by treatment with a release agent 13 201127609. Performing such a release agent treatment has the advantage of making the release property better. The treatment of the eliminator may be carried out by applying a release agent to the surface of the resin mold by a dip coating method, a spin coating method, a spray coating method or the like. The release agent may, for example, be a fluorine-based solvent or a silicone-based release agent. When the treatment of the release agent is carried out by hydrophilization treatment on the surface of the resin mold 4, it may be carried out before the hydrophilization treatment or after the hydrophilization treatment, but it is preferably carried out after the hydrophilization treatment. [2] Manufacturing method of resin mold:

本發明之樹脂模仁,當構成的材料中的樹脂成分u 為熱塑性樹脂所構成的情形(亦即,表面上的微細形狀㈣ 奈米印壓所形成的情形),可如下述方法製造。首先,準伟 已形成所欲凹凸圖案的金屬模具(如參考第2圖)。此金屬 模具的材料,例如矽膠(siUc〇n)、石英、⑽、鎳、钽等 金屬、玻璃碳等。其次準備由熱塑性樹脂所構成的樹脂膜。 熱塑性樹脂可例如上述之環站接么Jit 述炙衣狀烯烴糸樹脂、聚烯烴樹脂、 丙烯酸樹脂、聚碳酸酯樹脂、¥ 7 ^ 策乙烯醚樹脂、聚苯乙烯樹 脂等。第2A圖為以模式圖鞀千p+ ηη η η + ^ 、囤顯不已形成凹凸圖案15的金屬 模具1之剖面圖。The resin mold of the present invention can be produced by the following method in the case where the resin component u in the constituent material is composed of a thermoplastic resin (that is, a fine shape on the surface (4) formed by nano-pressing). First, Zhunwei has formed a metal mold for the desired relief pattern (see Figure 2). The material of the metal mold is, for example, silicone (siUc〇n), quartz, (10), nickel, ruthenium or the like, glassy carbon or the like. Next, a resin film composed of a thermoplastic resin is prepared. The thermoplastic resin can be, for example, a ring-like olefin resin, a polyolefin resin, an acrylic resin, a polycarbonate resin, a vinyl ether resin, a polystyrene resin or the like. Fig. 2A is a cross-sectional view of the metal mold 1 in which the uneven pattern 15 is formed by the pattern diagram 鼗 thousand p + ηη η η + ^ .

接著,如第2B圖所示,以pL 以已形成所欲凹凸圖案15的 表面與上述樹脂膜3接觸的妝能,* Lu 啁町狀慼,在上述樹脂膜3上配置 上述金屬模具1。之後使用公知e两 文尺用a知印壓機等,加熱同時將金 屬模具施壓於樹脂膜(參考第?Γ固、 μ 、t芩弟圓)。之後,將樹脂膜從金 屬模具離型,如第2D圓所示’可得形成所欲凹凸圖案17(金 屬模具1的凹凸圖帛15的反轉形狀)的樹脂模仁5。第% 14 201127609 為顯示將金屬模…於樹脂膜3的狀態之剖面圖,第 圖:顯示形成所欲凹凸圖案17的樹脂模仁5之剖面圖。 其次’本發明之樹脂模卩,當構成的材料中的樹脂成 ::)為光硬化性樹脂所構成的情形,可如下述方法製造。 百先準備已形成所欲凹凸圖案的金屬模具。此金屬模具的 才料可例如石央等。其次將光硬化性樹脂塗佈在基板上, :基板上形成塗膜。光硬化性樹脂可例如含有來自由直鏈 η烯喊化σ物、脂%乙烯趟化合物、環氧化合物 '氧雜 衣丁坑(oxetane)化合物、丙烯酸化合物等所構成之硬化性 化,物的構造單位者。基板可❹m膜、環狀稀煙樹脂 膜荨的樹脂膜切晶圓等的半導體基板等。塗膜的形成方 法:採用習知方法,例如使用塗佈棒等的方法或旋轉塗佈 法等。 接著,以已形成所欲凹凸圖案的表面與上述塗膜接觸 的狀態’在上述塗獏上配置金屬模具。之後使用公知的印 壓機等:將金屬模具施壓於塗膜。之後照射特定光使塗膜 “形成更化樹月曰暝。之後將硬化樹脂臈及PET膜從金 屬松具離型,獲得形成所欲凹凸圖案的樹脂模仁。照射的 光波長可視光硬化性樹脂適宜選擇。 [3 ]樹脂模仁的用途: 本發明之樹脂模仁可用於獲得經熱奈米印壓或光奈米 印壓而使轉寫對象的表面(樹脂表面)具有凹凸形狀的成形 體。此成形體具體可例如光碟成形體、光纖維、照相機用 的透鏡、投影機用的透鏡、LBP用的ΡΘ透鏡、棱鏡、液 15 201127609 晶顯示元件(LCD)、光擴散板、導光板、偏光膜、相位差膜、 亮度提升膜、集光膜等的光學成形品;液體藥品容器、安 瓶、輸液用袋、點眼藥容器、半導體用的晶圓格納容器等 的各種清淨容器;注射器、醫療用輸液管等醫療器材;矽 晶、藍寳石等的基板加工用的遮罩等。 本發明之樹脂模仁可為熱奈米印壓用,也可為光奈米 印壓用。#即,可用於熱奈米印壓法,也可用於光奈:印 壓法。 當為熱奈米印壓用的情形時,樹脂模仁可為以熱奈米 印壓形成表面上微細形狀者,也可以為以光奈米印屋形成 表面上微細形狀者’但以熱奈米㈣所形成者為佳。經光 奈米印壓所形成者,樹脂模仁的耐熱性不充分,在轉印於 轉寫對象之時恐會因熱而使樹脂模半 微細形狀者,也可以為=未印㈣成表面上 去/ “ 為先奈未印壓形成表面上微細形狀 ^ 光奈米印壓所形成者為佳。經光奈㈣壓所形成 樹脂模仁的製造時間短料,對轉寫對象 時間也短’因此具有短時間製造成形體的優點。 含有為光奈米印壓用者。即,* 樹脂的情形:、經=::=b)包含光硬化性 於轉寫對象,但本發明之樹形_卩 ^堅法之樹脂模仁。以此述光奈米印壓用樹二述光奈米 用的情形,光奈米印壓法較熱奈米印壓法具:::::: 16 201127609 造目的成形體的優點。 [4 ]成形體: 尽贫明之成 月且 馮轉印本發明之樹脂模仁的表面上形 成的微細形狀所得者。亦即,由轉印本發明之樹脂模仁表 面上所形成的微細形狀之轉寫對象所構成者。此述成形體 為使用「容易從轉寫對象離型,即使表面經親水化處理,表 面的微細形狀精確度良好的樹脂模仁」所形成,因此具有良 好的微細圖案。 成形體具體可列舉上述之光碟成形體、光纖維、^目 機用的透鏡、投影機用的透鏡、up用的Μ透鏡、稜鏡、 液晶顯示元件陶、光擴散板、導光板、偏光膜、相位差 :儿度提升膜、集光膜等的光學成形品;液體藥品容器、 :瓶、輸㈣、點眼藥容器、半導體用的晶圓格納容哭 專的各種清淨容器;注射器、醫療用 。 石夕晶 '藍寶石等的基板加工用的遮罩等。 “材, [5 ]成形體的製造方法: Θ之成形體的製造方法為’使用由含有樹脂成分 二之/料:構成,表面上形成圖案形成用的微細形狀的樹 丄由將上述樹脂模仁的微細形狀轉寫於由含有榭 曰成分(b)之材料所構成的轉寫 細氷社' 夕缸 优上返钳月日杈仁的微 :&轉形狀形成於表面而得成形體之成形體的梦 方法’使用的樹脂模七A,胳μ、+.也 衣1^ 平、、具而沾发 樹脂成分⑷塗佈於具有 “::材之平滑面上,使乾燥或照射光,形成具有平 μ的树脂層(A)後,形成的該樹脂層(A)的平滑面上配置 201127609 3以的水’根據m R 3257測定的靜接觸Μχι)滿足下 列條件(1)之樹脂模仁。 條件⑴=構成上述轉寫對象之材料中的樹脂成分 〇〇’塗佈於具有平滑面的基材之平滑面上,使乾燥或照射 先’形成具有平滑面的樹脂層⑻後’开,成的樹脂層⑻的 平滑面上配置WL的水,根據mR 3257測定的靜接觸 角(Y1)與靜接觸角(XI)的差的絕對值為20。~60。。 根據此製造方法’使用「容易從轉寫對象離型,即使表 面經親水化處理,表面的微細形狀精確度良好的樹脂模七」 而形成成形體,因此可製造具有良好微細圖案的成形體。 含有構成樹脂模仁的樹脂成分(a)之材料,可使用與上 述含有樹脂成分⑷之材料相同的材料,成轉寫對象:樹 脂成分⑻可列I熱塑性樹脂、光硬化性樹脂等。*塑性樹 脂具體例如環狀烯烴系樹脂、聚烯烴樹脂、丙稀酸樹脂、 聚碳酸酯樹脂、聚乙烯醚樹脂、聚苯乙烯樹脂等。光硬化 性樹脂具體例如直鏈狀乙烯醚化合物、脂環乙烯_化人 物、環氧化合物、氧雜環丁院(。xetane)化合物、丙稀酸: 合物等。 因此,轉寫對象依用途而異’但可為例如厚卢 心心ra的膜狀或板狀者’或形成於基材上的奈米形= 至微米形狀的薄膜狀者等。只有以樹脂成分構成的情形 時’多為膜狀或板狀者。形成薄膜的情形時,可將含有構 成上述轉寫對象之樹脂成分的材料塗佈於PET膜、矽曰 等平板基材上使乾燥而得。經熱奈米㈣法轉印樹脂= 18 201127609 的微細形狀時,較佳加教棘官刺 $ t 宜“ 竿乂佳加熱轉寫對象以成為柔軟的狀態。轉 舄條件可適當採用習知條件。 &月之成&體的製造方法較佳使用由形成微細形狀 y面經親水化處理而得的樹脂模仁q在形成樹脂層⑴ 後,形成的樹脂層⑴的平滑面以親水化處理,經親水化處 理的平滑面上配置3以的水,根據川㈠…測定的靜 接觸角(X2)滿足下列條件(2)的樹脂模仁。Then, as shown in Fig. 2B, the surface of the desired concave-convex pattern 15 is formed in pL so as to be in contact with the resin film 3, and the metal mold 1 is placed on the resin film 3. Then, the metal mold is pressed to the resin film by heating with a known stamping machine or the like (refer to the first tamping, μ, t 芩 圆 circle). Thereafter, the resin film is released from the metal mold, and as shown by the 2nd circle, the resin mold core 5 in which the desired uneven pattern 17 (the reverse shape of the uneven pattern 15 of the metal mold 1) is formed can be obtained. No. % 201127609 is a cross-sectional view showing a state in which a metal mold is applied to the resin film 3, and is a cross-sectional view showing a resin mold core 5 in which a desired uneven pattern 17 is formed. Next, the resin mold of the present invention may be produced by the following method in the case where the resin in the constituent material is formed of a photocurable resin. A metal mold that has formed a desired concave and convex pattern is prepared. The material of this metal mold can be, for example, Shiyang. Next, a photocurable resin is applied onto the substrate, and a coating film is formed on the substrate. The photocurable resin may, for example, contain a curable compound derived from a linear η olefin yttrium compound, a fat oxime compound, an epoxy compound oxetane compound, an acrylic compound, or the like. Construction unit. The substrate may be a semiconductor substrate such as a wafer or a resin film of a ring-shaped thin smoke resin film, or the like. The method of forming the coating film is a conventional method, for example, a method using a coating bar or the like, a spin coating method, or the like. Next, a metal mold is placed on the above-mentioned coating enamel in a state in which the surface on which the desired concave-convex pattern is formed is in contact with the coating film. Thereafter, a known press or the like is used: the metal mold is pressed against the coating film. After that, the specific light is irradiated to cause the coating film to "form a green moon. After that, the cured resin crucible and the PET film are released from the metal loosening to obtain a resin mold which forms a desired concave-convex pattern. The wavelength of the irradiated light is visible light curability. The resin is suitably selected. [3] Use of Resin Mold: The resin mold of the present invention can be used for obtaining a surface having a concave-convex shape on a surface (resin surface) of a transfer object by hot nano printing or light nano printing. Specifically, the molded body may be, for example, a disk molded body, an optical fiber, a lens for a camera, a lens for a projector, a ΡΘ lens for LBP, a prism, a liquid 15 201127609 crystal display element (LCD), a light diffusing plate, and a light guide plate. Optical molded articles such as a polarizing film, a retardation film, a brightness enhancement film, and a light-harvesting film; various cleaning containers such as a liquid medicine container, an ampoule, an infusion bag, an eye drop container, and a wafer Genna container for a semiconductor; Medical equipment such as syringes and medical infusion tubes; masks for processing substrates such as twins and sapphire, etc. The resin mold of the present invention may be used for hot nano printing or light nano printing. #。, can be used for hot nano printing method, can also be used for the light: printing method. When it is used for hot nano printing, the resin mold can be pressed on the surface by hot nano printing. In the case of a fine shape, it is also possible to form a fine shape on the surface by a light nano-printing house, but it is preferably formed by a hot nano (four). The heat-resistant property of the resin mold core is insufficient when formed by the light nano-printing. When transferring to a transfer object, the resin mold may be semi-finely shaped due to heat, or it may be = unprinted (four) on the surface / "Previously unprinted to form a fine shape on the surface ^ Light nanoprint It is better to form the pressure. The resin mold is formed by the light (4) pressure, and the manufacturing time of the resin mold is short, and the time for transferring the object is also short. Therefore, there is an advantage that the molded body is produced in a short time. Contains the user for the printing of light nano. Namely, in the case of * resin: ? =:: = b) contains a photocurable object to be transferred, but the resin of the present invention is a resin mold. In this case, the light nano-printing is used in the case of the light-sensitive nanometer. The light nano-printing method is more hot than the nano-printing method:::::: 16 201127609 The advantages of the molded body. [4] Molded body: A fine shape which is formed on the surface of the resin mold of the present invention by the moon and von. That is, it is composed of a transfer object of a fine shape formed on the surface of the resin mold of the present invention. The molded article described above is formed by using a "resin mold which is easily released from a transfer target and has a surface having a fine surface shape with a hydrophilic surface treatment", and thus has a fine fine pattern. Specific examples of the molded article include the above-described optical disk molded body, optical fiber, lens for a projector, a lens for a projector, a Μ lens for up, 稜鏡, a liquid crystal display device, a light diffusing plate, a light guide plate, and a polarizing film. , phase difference: optical molded products such as children's lifting film and light collecting film; liquid medicine containers, bottles, transmissions (4), eye drops containers, wafers for semiconductors, various cleaning containers, etc.; syringes, medical use. Shi Xijing A mask for processing substrates such as sapphire. "Materials, [5] Method for producing a molded article: The method for producing a molded article of tantalum is to use a resin having a fine shape for forming a pattern on the surface of a resin composition comprising a resin component The fine shape of the kernel is transferred to a micro-fabricated ice-baked corps made of a material containing the bismuth component (b), and the micro-shape: & The dream method of the molded body' uses a resin mold of seven A, a sm, a smock, a smear, and a resin component (4) coated on a smooth surface having a ":: material to be dried or irradiated. Light, after forming the resin layer (A) having a flat μ, the water on the smooth surface of the resin layer (A) formed in 201127609 3 is set to the following condition (1). Resin mold. Condition (1) = the resin component 〇〇 in the material constituting the above-described transfer target is applied to a smooth surface of a substrate having a smooth surface, and is dried or irradiated to form a resin layer (8) having a smooth surface. The water of WL was placed on the smooth surface of the resin layer (8), and the absolute value of the difference between the static contact angle (Y1) and the static contact angle (XI) measured by mR 3257 was 20. ~60. . According to this production method, a molded article having a fine fine pattern can be produced by using a "resin mold which is easy to be released from a transfer target and having a surface having a fine surface shape with good precision after hydrophilization treatment". The material containing the resin component (a) constituting the resin mold core can be a material to be transferred by using the same material as the above-mentioned resin component (4). The resin component (8) can be a thermoplastic resin or a photocurable resin. The plastic resin is specifically, for example, a cyclic olefin resin, a polyolefin resin, an acrylic resin, a polycarbonate resin, a polyvinyl ether resin, or a polystyrene resin. The photocurable resin is specifically, for example, a linear vinyl ether compound, an alicyclic ethylene-based compound, an epoxy compound, an oxetane compound, or an acrylic acid compound. Therefore, the object to be transferred differs depending on the application, but may be, for example, a film-like or plate-like shape of a thick heart center ra or a film shape formed on a substrate of a nanometer shape to a micrometer shape. In the case of a resin component, it is often a film or a plate. In the case of forming a film, a material containing a resin component constituting the above-described transfer target may be applied to a flat film substrate such as a PET film or a crucible to be dried. When the resin is transferred by the thermal nano (four) method = 18 201127609, it is better to teach the spine to spur the thorns. It is better to heat the object to become soft. The conditions of the transfer can be appropriately determined. It is preferable to use a resin mold core q obtained by hydrophilizing a fine-shaped y-face to form a smooth surface of the resin layer (1) formed by hydrophilization after forming the resin layer (1). In the treatment, the water on the hydrophilized smooth surface was placed at 3, and the resin contact of the following condition (2) was satisfied according to the static contact angle (X2) measured by Kawasaki (1).

條件⑵:上述靜接觸角(γι)與上述靜接觸角(χ2)的差 ((Υ1)-(Χ2))為 20。〜60。。 親水化處理可例如上述之丨丨ν * # 士 J上返之υν臭虱處理、電暈放電處 理、電漿放電處理、金屬鈉處理等。 【實施例】 以下基於實施例及比較例具體說明本發明,然而本發 明不侷限於此述之實施例及比較例。 表1及表2顯示,作為樹脂模仁之材料所使用的樹脂 (樹脂成分⑷)、作為轉寫對象之材料所使用的樹脂(樹脂 成分⑻卜表i中「乙烯_甲基苯基降冰片烯共聚物」為特開 2005-239975號公報所記載之乙烯/甲基笨基降冰片烯共聚 物(以下以「Et-MePhNB」表示)。表 2 中「TCDVE/1_AdVE = 70/30」為三環癸烷乙烯醚(TCDVE)/卜金剛烷乙烯醚 (HdVE)以質量比7Q : 3Q混合,得到混合物,對所得混合 物10。質量冑’添力。5. 〇質量部的聚合起始劑(和光純藥工 業公司製造,商品名「WPI113」)、1〇質量部的整平劑(楠 本化成公司製,商品名「DISPARL〇N1761」)、15質量部的 19 201127609 增稠劑(川崎化學公司製,商品名「UVS-1221」)、及1. 〇質 量部的黏度調整劑(特開2005-239975號公報所記載之乙 烯/甲基苯基降冰片烯共聚物)所得者。「ΡΑΚ相當品」為混 合硬化性單體之53.2質量%的三丙二醇二丙烯酸酯、9.9 質量%的三曱氧基丙院三丙烯酸酯、27.0質量%的Ν-乙烯基 -2-吡咯酮、起始劑之9. 0質量%的CibaJapan公司製的商 品名「IRGACURE651」、及整平劑之〇.9質量%的倘本化成公 司製的商品名「DISPARL0N1761」者。 [表1] 樹脂種類 製造源、商品名 Tg 或 Tm (°C) 接觸S (°) 熱塑性樹脂(1) 環烯烴聚合物(COP) Opt is公司製 商品名「ZF-16丨 Tg 158 95. 6 熱塑性樹脂(2) 環烯烴聚合物(COP) Optis公司製 商品名「ZF-14 1 Tg 140 97.5 熱塑性樹脂(3) 環烯烴共聚物(C0C) 乙烯-甲基苯基降冰片烯共聚物 (Et-MePhNB 樹脂) Tg 135 96.6 熱塑性樹脂(4) 環烯烴共聚物(C0C) Daicel化學工業公司製 商品名「Topas8007」 Tg 82 86.0 熱塑性樹脂(5) 線狀低密度聚乙烯 (LLDPE) 四國化工公司製 商品名「HC-31」 Tm 110 101.8 熱塑性樹脂(6) 聚曱基曱基丙烯酸酯 (PMMA) Aldrich公司製 Tg 103 67.9 熱塑性樹脂(7) 聚笨乙烯(PS) Aldrich 公司製(Mw=192, 000) Tg 106 85.9 [表2] 單體種類 製造源、商品名 Tr(°C) 接觸角η 光硬化性樹脂(1) 乙烯醚系單體 TCDVE/l-AdVE=70/30 155 80.1 光硬化性樹脂(2) 丙烯酸系單體 Microresist 公司製 「mr-UVCur21SF」 126 75.8 光硬化性樹脂(3) 丙烯酸系單體 PAK相當品 71 54.2 以下顯示各種物性值的測定方法及各特性的評價方 法0 [靜接觸角]: 201127609 <以JIS R 3257「基板玻璃表面的濕潤性試驗方法」中的 旧^法」為基準,以下列方法測定靜接觸角。靜接觸角的 測定使用協和界面科學公司製「_ SLUING Μ· SA-襲」量測。首先說明熱可塑性樹脂的靜接觸角的測定 方法。Condition (2): The difference between the above static contact angle (γι) and the above static contact angle (χ2) ((Υ1) - (Χ2)) is 20. ~60. . The hydrophilization treatment may be, for example, the above-mentioned 丨丨ν*#JJ 上ν 虱 虱 treatment, corona discharge treatment, plasma discharge treatment, metal sodium treatment, and the like. [Examples] Hereinafter, the present invention will be specifically described based on examples and comparative examples, but the present invention is not limited to the examples and comparative examples described herein. Table 1 and Table 2 show the resin (resin component (4)) used as the material of the resin mold core, and the resin used as the material to be transferred (resin component (8), "ethylene-methylphenyl norbornene in Table i" The copolymer is an ethylene/methyl phenyl-norbornene copolymer (hereinafter referred to as "Et-MePhNB") described in JP-A-2005-239975. In Table 2, "TCDVE/1_AdVE = 70/30" is three. Cyclodecane vinyl ether (TCDVE) / adamantane vinyl ether (HdVE) is mixed at a mass ratio of 7Q: 3Q to obtain a mixture, and the resulting mixture is 10. The mass 胄 'Addition force. 5. The polymerization initiator of the 〇 mass portion ( Manufactured by Wako Pure Chemical Industries Co., Ltd., trade name "WPI113"), 1 〇 leveling agent of quality department (product name "DISPARL〇N1761" manufactured by Kusumoto Kasei Co., Ltd.), 19 201127609 thickener of 15 mass parts (Kawasaki Chemical Co., Ltd. The product name "UVS-1221") and the viscosity adjuster of the 〇 mass part (the ethylene/methylphenyl norbornene copolymer described in JP-A-2005-239975). "product" is a mixed hardening monomer of 53.2% by mass of tripropylene Manufactured by Ciba Japan Co., Ltd., a diol acrylate, a 9.9 mass% trimethyloxypropane triacrylate, a 27.0 mass% hydrazine-vinyl-2-pyrrolidone, and a starter. "IRGACURE 651" and the leveling agent are 9% by mass of the product name "DISPARL0N1761" manufactured by the company. [Table 1] Resin type manufacturing source, trade name Tg or Tm (°C) Contact S (°) Thermoplastic Resin (1) Cycloolefin Polymer (COP) Trade name "ZF-16丨Tg 158 95. 6 Thermoplastic Resin (2) Cycloolefin Polymer (COP) manufactured by Optis Co., Ltd. under the trade name "ZF-14" 1 Tg 140 97.5 Thermoplastic Resin (3) Cyclic Olefin Copolymer (C0C) Ethylene-Methylphenyl Norbornene Copolymer (Et-MePhNB Resin) Tg 135 96.6 Thermoplastic Resin (4) Cyclic Olefin Copolymer (C0C) Daicel Chemical Product name "Topas8007" manufactured by the industrial company Tg 82 86.0 Thermoplastic resin (5) Linear low-density polyethylene (LLDPE) Trade name "HC-31" manufactured by Shikoku Chemical Co., Ltd. Tm 110 101.8 Thermoplastic resin (6) Polyfluorenyl fluorenyl Acrylate (PMMA) Tg 103 67.9 made by Aldrich Co., Ltd. (7) Polystyrene Alkyne (PS) Aldrich (Mw=192, 000) Tg 106 85.9 [Table 2] Monomer type manufacturing source, trade name Tr (°C) Contact angle η Photocurable resin (1) Vinyl ether monomer TCDVE /l-AdVE=70/30 155 80.1 Photocurable resin (2) Acrylic monomer "Mr-UVCur21SF" manufactured by Microresist 126 75.8 Photocurable resin (3) Acrylic monomer PAK equivalent 71 54.2 The following shows various Method for measuring physical property value and method for evaluating each property 0 [Static contact angle]: 201127609 <Measurement of static contact by the following method based on the old method in JIS R 3257 "Test method for wettability of substrate glass surface" angle. The measurement of the static contact angle was measured using "_SLUING Μ· SA- attack" manufactured by Kyowa Interface Science Co., Ltd. First, a method of measuring the static contact angle of the thermoplastic resin will be described.

百先準備如下示之具有平滑面的樹脂層。之後,在此 樹脂層表面(平滑面)上配置3" L的水,量測此時的樹脂層 表面與水滴表面的切線角度Θ (參考第i圖)。熱塑性樹脂 (1)、(2)使用0ptls公司製的商品名「2卜16」、商品名厂 ZF-14」(分別為長10。瞧寬⑽晴厚〇 —的片)作為樹脂 層。熱塑性樹脂(3)、⑷係溶於溶劑(十氫化萘(decaiin)) 後’以塗佈棒將溶於上述溶劑之上述樹脂平滑地塗佈於基 板(玻璃板)上,之後在真空箱乾燥’得到表面平滑(具有平 滑面)的樹脂層。熱塑性樹脂⑸使用四國化工公司製的商 品名「hc-31」(長100_><寬⑽戰厚〇 lmm的片)作為樹脂 層。熱塑性樹脂⑹以熱成形為長⑽随寬⑽瞻厚_ 的片’㈣表面平滑(具有平滑面)的樹脂。熱塑性樹脂⑺ 係溶於溶劑(二乙基苯)後,以塗佈棒將溶於上述溶劑之上 述樹脂平滑地塗佈於基板(玻璃板)上,之後在真空箱乾 燥,得到表面平滑(具有平滑面)的樹脂層。 其次說明光硬化性樹脂的靜接觸角的測定方法。首先 以塗佈棒將光硬化性樹脂塗佈於基板的平滑面i,形成塗 膜,形成的塗膜經照光使上述塗膜硬化,得到表面具有= 滑面的樹脂層。之後’在所得的樹脂層表面(平滑面)上配 21 201127609 置3 " L的水,s測此時的樹脂層表面與水滴表面的切線角 度以參考第1圖)。量測結果,如表卜表3中「接觸角(。) 」攔所不,表5、表6中以「接觸角χΓ)」或「接觸 攔所示^ [親水化處理後的靜接觸角] 親水化處理後的靜接觸角’同上述[靜接觸角]的評價 方法’在形成樹脂層之後,將此樹脂層表面(平滑面)親水 化處理,在經親水化處理的樹脂層表面配置液滴,測定角 度Θ。表3顯示實施例及比較例使用之樹脂的^臭氧處 理或電漿放電處理後的靜接觸角(。)。經親水化處 觸角變小。 親水化處理進行UV臭氧處理、電衆放電處理。UV臭 氧處理使帛EYEGRA職8公司製的uv臭氧洗淨裝置、「 = -2506(附有臭氧分解裝置⑽—舰_d)」’以低壓水銀 -、照射距離l〇mm的條件照射訂。uv臭氧洗淨裝置内的 排氣時間為2分鐘。進行uv臭氧處理時,如表“員示之處 理時間(秒)。 電聚放電處理進行第一電聚放電處理及第二電激放電 :理之2種電梁放電處理。第一電毁放電處理使用神鋼精 機公司製的m刻裝置「ΕΧΑΜ」’以氧氣(壓力15㈤、 輪出功率20W、處理時間1分鐘的條件進行。第二電衆放 電處理使用芝冑MeehatrGnies公司製㈣錄裝置 「CFS-4ES」,在氮氣(壓力〇5Pa)、輸出功率5⑽、處理 時間!分鐘的條件下,進行逆進行電t放電處理時, 22 201127609 • 如表3中顯示之「〇2、15Pa下、20W、1分鐘RIE」或「N2、 15Pa下、50W、1分鐘逆滅鍵」。 [表3] UV臭氧處理時間(秒)或 電漿放電處理條件 接觸角(°) 熱塑性樹脂(1) (ZF-16) 10 90.6 熱塑性樹脂(1) (ZF-16) 30 81.8 熱塑性樹脂(1) (ZF-16) 60 69.3 熱塑性樹脂(1) (ZF-16) 300 55. 9 熱塑性樹脂(1) (ZF-16) 600 35.2 熱塑性樹脂(1) (ZF-16) 1800 10.3 熱塑性樹脂(2) (ZF-14) 300 58.4 熱塑性樹脂(7) (PS) 60 29.2 光硬化性樹脂(1) (UNP-/3) 300 51.6 光硬化性樹脂(2) (Microresist) 300 52.1 熱塑性樹脂(1) (ZF-16) 〇2、15Pa 下、20W、1 分鐘 RIE 32.0 熱塑性樹脂(1) (ZF-16) 沁、15Pa下、50W、1分鐘逆減:錄 52.7A resin layer having a smooth surface as shown below is prepared. Thereafter, water of 3 " L was placed on the surface (smooth surface) of the resin layer, and the tangential angle Θ of the surface of the resin layer and the surface of the water droplet at this time was measured (refer to Fig. i). As the thermoplastic resin (1) and (2), the product name "2 Bu 16" manufactured by Opts Co., Ltd., and the product name ZF-14" (sheets each having a length of 10. 瞧 width (10) and a thickness of 瞧) were used as the resin layer. After the thermoplastic resins (3) and (4) are dissolved in a solvent (decaiin), the above-mentioned resin dissolved in the above solvent is smoothly applied onto a substrate (glass plate) by a coating bar, followed by drying in a vacuum oven. 'A resin layer having a smooth surface (having a smooth surface) is obtained. As the thermoplastic resin (5), a trade name "hc-31" (length 100_><width (10) thick 〇lmm sheet) manufactured by Shikoku Chemical Co., Ltd. was used as the resin layer. The thermoplastic resin (6) is thermoformed into a resin having a long (10) width (10) thickness _ of the sheet '(iv) smooth surface (having a smooth surface). After the thermoplastic resin (7) is dissolved in a solvent (diethylbenzene), the above-mentioned resin dissolved in the above solvent is smoothly applied onto a substrate (glass plate) by a coating bar, and then dried in a vacuum box to obtain a smooth surface (having Smooth surface) resin layer. Next, a method of measuring the static contact angle of the photocurable resin will be described. First, a photocurable resin is applied onto the smooth surface i of the substrate by a coating bar to form a coating film, and the formed coating film is cured by irradiation to obtain a resin layer having a surface having a sliding surface. Then, on the surface (smooth surface) of the obtained resin layer, water of 3 " L was placed, and the tangential angle of the surface of the resin layer and the surface of the water droplet at this time was measured to refer to Fig. 1). The measurement results are as shown in Table 3, "Contact angle (.)", in Table 5 and Table 6, "contact angle χΓ" or "contact stop" ^ [hydrophilic contact angle after hydrophilization The static contact angle after the hydrophilization treatment is the same as the above [Method for evaluating the static contact angle]. After the resin layer is formed, the surface of the resin layer (smooth surface) is hydrophilized and disposed on the surface of the hydrophilized resin layer. Droplet, angle Θ was measured. Table 3 shows the static contact angle (.) after the ozone treatment or the plasma discharge treatment of the resin used in the examples and the comparative examples. The hydrophilization at the hydrophilization became small. Treatment, electricity discharge treatment. UV ozone treatment to 帛EYEGRA job 8 company uv ozone cleaning device, " = -2506 (with ozone decomposition device (10) - ship _d)" with low pressure mercury -, irradiation distance l 〇mm conditions are ordered. The exhaust time in the uv ozone cleaning unit is 2 minutes. When the uv ozone treatment is performed, the treatment time (seconds) is shown in the table. The electro-discharge treatment performs the first electro-discharge treatment and the second electro-excitation discharge: two kinds of electric beam discharge treatments are treated. The first electric-destructive discharge The processing was carried out using the m-cut device "ΕΧΑΜ" of Kobelco Seiki Co., Ltd. with oxygen (pressure 15 (five), 20 watts of power, and processing time of 1 minute. The second electric discharge was processed by Meehatr Gnies Co., Ltd. (4) recording device "CFS" -4ES", when nitrogen gas (pressure 〇 5Pa), output power 5 (10), processing time! minutes, reverse electric discharge treatment, 22 201127609 • As shown in Table 3, “〇2, 15Pa, 20W” , 1 minute RIE" or "N2, 15Pa, 50W, 1 minute reverse bond". [Table 3] UV ozone treatment time (seconds) or plasma discharge treatment conditions Contact angle (°) Thermoplastic resin (1) (ZF -16) 10 90.6 Thermoplastic Resin (1) (ZF-16) 30 81.8 Thermoplastic Resin (1) (ZF-16) 60 69.3 Thermoplastic Resin (1) (ZF-16) 300 55. 9 Thermoplastic Resin (1) (ZF -16) 600 35.2 Thermoplastic Resin (1) (ZF-16) 1800 10.3 Thermoplastic Tree (2) (ZF-14) 300 58.4 Thermoplastic Resin (7) (PS) 60 29.2 Photocurable resin (1) (UNP-/3) 300 51.6 Photocurable resin (2) (Microresist) 300 52.1 Thermoplastic resin ( 1) (ZF-16) 〇2, 15Pa, 20W, 1 minute RIE 32.0 Thermoplastic resin (1) (ZF-16) 沁, 15Pa, 50W, 1 minute reduction: Record 52.7

以下對於角度0的量測方法具體說明。首先以樹脂層 的平滑面朝上的狀態,將樹脂層承載於「AUTO SLIDING ANGLE SA-30DM」的試料台。此試料台可上下左右移動。之 後,以注射筒吸取蒸餾水,將此注射筒固定在上述「AUT0 SLIDING ANGLE SA-30DM」。之後,在注射筒前端形成3// L 23 201127609 的液滴狀的蒸德水(液滴),卩此液滴不由注射筒前_ Γ 的狀態,緩慢地移動試料台,使注射筒前端的液滴緩慢地 與樹脂層表面(平滑面)接觸,在樹脂層的平滑面上配置液 滴(參考第1圖)。之後,以上述「AUT〇 SLiDING angle SA-3_」裝設的光學讀取裳置,讀取配置於樹脂層表面的 上述液滴的影像,量測如第i圖所示之樹脂層u的表面與 水滴(液滴M3的表面之切線角度0。角度"量測以「 删SL麵G ANGLE SA_3_附屬的「_分析 統合系統 FAMAS 2.1.0, i# ^ . τ „ 」進订。在平滑面上配置液滴因此 可排除因微細形狀的潑水效果之影響。亦即,也可量測形 成微細形狀後的樹脂層之上述微細形狀部分(形成微細形 狀的表面上)配置液滴的狀態之「角度Θ」,但因形成的微 細形狀不同,潑水效果恐怕也不同。因此,為了不產生因 狀的不同所產生的潑水效果的差異,在平滑面上配 置液滴而量測「角度0」。 如上述分制定作為樹脂模仁材料所使用的樹脂與轉 寫對象的材料所使用的樹脂 _「靜_差」。具二==測㈣靜 〃體马,從式.(作為轉寫對 使用的樹脂的靜接觸角)_(作為樹脂模仁之材料所 的树脂的靜接觸角),計算「靜接觸角的差」。表 t顯示「靜接觸角的差(ζ=γ_χ)」。 [玻璃轉移溫度()或軟化溫度(Tm)]: 玻璃轉移溫度㈤使用SaU。電子工 知描熱量分析儀(型號「職侧叫及「⑽= 24 201127609 昇溫至20(TC:時的吸熱峰計算。軟化溫度(Tm)使用Μ。 電子工業公司冑的具有應變測定功能的熱機械分析儀(型 號「EXSTAR_G」及「衝SS6剛」),將石英探針“以特定 荷重壓入樹脂的狀態’置入上述型號「m/ss咖」的加熱 爐内’使上述石英探針及樹脂升溫,使上述樹脂軟化,觀 察石英探針塵入的舉動而計算。在熱塑性樹脂的情形時, 測定玻璃轉移溫度(Tg)或軟化溫度(Tm)。在光硬化性樹脂 勺it形%測疋硬化後的樹脂之玻璃轉移溫度(Tg)。 [離型性]: 如實施例、比較例,分別準備表面形成微細形狀的樹 脂模仁及轉寫對象。其次,以轉寫對象與樹脂模仁表面(微 :,)接觸的狀態使之重疊,之後,將樹脂模仁施壓於 ””對象之後’將樹脂模仁從轉寫對象脫離。如此進行印 坚。評估樹脂模仁從轉寫對象脫離時的剝離性。評估基準,The following describes the measurement method of the angle 0 in detail. First, the resin layer was placed on the sample stage of "AUTO SLIDING ANGLE SA-30DM" with the smooth surface of the resin layer facing upward. This sample table can be moved up, down, left, and right. Thereafter, distilled water was taken up by a syringe, and the syringe was fixed to the above "AUT0 SLIDING ANGLE SA-30DM". Thereafter, droplets of distilled water (droplets) of 3// L 23 201127609 are formed at the front end of the syringe, and the droplets are moved from the front of the syringe to the front of the syringe. The droplets are slowly brought into contact with the surface (smooth surface) of the resin layer, and droplets are placed on the smooth surface of the resin layer (refer to Fig. 1). Thereafter, the optical reading of the "AUT〇SLiDING angle SA-3_" is used to read the image of the droplet disposed on the surface of the resin layer, and the surface of the resin layer u as shown in Fig. i is measured. With the water droplets (the tangential angle of the surface of the droplet M3 is 0. The angle " is measured by " deleting the SL surface G ANGLE SA_3_ attached to the "_analysis integration system FAMAS 2.1.0, i# ^ . τ „ ". By arranging the liquid droplets on the smooth surface, it is possible to eliminate the influence of the water-repellent effect of the fine shape, that is, the state in which the fine-shaped portion (on the surface on which the fine-formed surface is formed) of the resin layer having the fine shape is disposed is disposed. The "angle Θ" is different depending on the fine shape formed. Therefore, in order to prevent the difference in water splash effect due to the difference in shape, droplets are placed on the smooth surface to measure "angle 0". As described above, the resin used as the resin for the resin mold material and the resin used for the material to be transferred are defined as "static_poor". With two == measured (four) static body horse, from the formula. Static contact angle to the resin used)_( The "static contact angle of the resin of the resin mold material" is calculated as "the difference in static contact angle". Table t shows "the difference in static contact angle (ζ = γ_χ)". [Glass transfer temperature () or softening temperature (Tm) )]: Glass transfer temperature (5) Use SaU. Electronic work to describe the heat analyzer (model "" side called "(10) = 24 201127609 heating up to 20 (TC: when the endothermic peak is calculated. Softening temperature (Tm) use Μ. The thermomechanical analyzer (model type "EXSTAR_G" and "rushing SS6 just") with the strain measurement function of the industrial company 置 put the quartz probe "in a state of being pressed into the resin with a specific load" into the above model "m/ss coffee" In the heating furnace, the quartz probe and the resin are heated to soften the resin, and the behavior of the quartz probe dust is observed. In the case of a thermoplastic resin, the glass transition temperature (Tg) or softening temperature (Tm) is measured. The glass transition temperature (Tg) of the resin after the hardening of the photocurable resin was measured. [Displacement]: As in the examples and comparative examples, the resin molds and the transfer were prepared on the surface to form a fine shape. Object. Second, The transfer object is overlapped with the surface of the resin mold core (micro:,), and then the resin mold is pressed to the "" object to remove the resin mold from the transfer object. Evaluating the peelability of the resin mold core when it is detached from the transfer object.

=:模仁無法從轉寫對象剝離時或即使剝離卻使轉寫 ==形狀破損的情形,紀錄為不良「B」,對於樹脂模 象離型且未認定轉寫對象的微細形狀破損的 2之r 「G」°表4顯示實施例及比較例中使用的 (=別的印壓條件。當轉寫對象的樹脂為光硬化樹脂 涂膜狀能w 將樹月曰拉仁施壓於光硬化前的 寫對象之後’對該塗膜以表4所示條件照射 寫對象之後將樹脂模仁從轉寫對象剝離。對於轉 膜,:=Γ塑性樹脂(參考表5、表6)時,針_ 、,、’’’、轉寫對象’以表4所示之條件經加熱、加 25 201127609 壓、壓力維持、冷卻之製程,將樹脂模仁壓入後,將樹脂 模仁從轉寫對象剝離。表5顯示進行UV臭氧處理時的處理 時間。進行電漿放電處理的情形時,顯示「〇2、1 5Pa下、2 0W、1分鐘RIE」或「N2、15Pa下、50W、1分鐘逆濺鍍」。 [表 4] _ 壓板溫度 (°C) 施壓階段 溫度(°C) 壓力 (MPa) 壓力維持 時間(秒) 冷卻溫度 (°C) 照射量 (mW/cm2) 照射時間 (秒) 光源 熱塑性樹脂(1) (ZF-16) 195 195 1.5 60 100 - 一 - 熱塑性樹脂(2) (ZF-14) 170 170 1.5 60 100 - - - 熱塑性樹脂(3) (Et-MePhNB 樹脂) 150 150 1.0 60 100 - - - 熱塑性樹脂(4) (Topas8007) 106 106 1.0 60 60 - - - 熱塑性樹脂(5) (LLDPE) 120 120 1.0 60 80 - - - 熱塑性樹脂(6) (PMMA) 130 130 1.0 60 80 - - - 熱塑性樹脂σ) (PS) 160 160 2.0 60 100 - - - 光硬化性樹脂(1) (UNP-/3) 常溫 常溫 1.0 10 - 20 38 LED ; 365nm 光硬化性樹脂(2) (Microresist) 常溫 常溫 1.0 10 - 50 20 南壓 水銀燈 光硬化性樹脂(3) (PAK相當品) 常溫 常溫 1.0 10 - 50 20 高壓 水銀燈=: When the mold can not be peeled off from the transfer object or even if it is peeled off, the transfer is == the shape is broken, and the record is bad "B", and the resin pattern is removed and the fine shape of the transfer object is not damaged. r "G" ° Table 4 shows the conditions used in the examples and the comparative examples (= other stamping conditions. When the resin to be transferred is a photo-curable resin coating film, w can be applied to the light. After the object to be written before hardening, the resin mold was peeled off from the transfer target after the coating film was irradiated with the conditions shown in Table 4. For the transfer film, when: = plastic resin (refer to Table 5, Table 6), Needle _,,, ''', transfer object 'heated under the conditions shown in Table 4, add 25 201127609 pressure, pressure maintenance, cooling process, after pressing the resin mold, the resin mold is transferred from the resin Table 5 shows the processing time when UV ozone treatment is performed. When plasma discharge treatment is performed, "〇2, 1 5Pa, 20W, 1 minute RIE" or "N2, 15Pa, 50W, 1" is displayed. Minute reverse sputtering. [Table 4] _ Platen temperature (°C) Pressure stage temperature (°C) Pressure (MPa) Pressure Holding time (seconds) Cooling temperature (°C) Irradiation amount (mW/cm2) Irradiation time (seconds) Light source thermoplastic resin (1) (ZF-16) 195 195 1.5 60 100 - One - Thermoplastic resin (2) (ZF- 14) 170 170 1.5 60 100 - - - Thermoplastic resin (3) (Et-MePhNB resin) 150 150 1.0 60 100 - - - Thermoplastic resin (4) (Topas8007) 106 106 1.0 60 60 - - - Thermoplastic resin (5) (LLDPE) 120 120 1.0 60 80 - - - Thermoplastic Resin (6) (PMMA) 130 130 1.0 60 80 - - - Thermoplastic Resin σ) (PS) 160 160 2.0 60 100 - - - Photocurable Resin (1) ( UNP-/3) Normal temperature normal temperature 1.0 10 - 20 38 LED; 365nm photocurable resin (2) (Microresist) Normal temperature normal temperature 1.0 10 - 50 20 South pressure mercury light curing resin (3) (PAK equivalent) Normal temperature normal temperature 1.0 10 - 50 20 high pressure mercury lamp

[表5] 樹脂模仁· 轉寫對象 樹脂模仁的 微細形狀之 精確度 樹脂 UV臭氧處理時間 (秒)或電漿放電 接觸角 X 樹脂 接觸角 Y 接觸角的差 (Z=Y-X) 離型性 處理條件 (。) (。) 實施例1 熱塑性樹脂(1) (2F-16) 0 95.6 熱塑性樹脂(6) (PMMA) 67.9 -27.7 G - 實施例2 熱塑性樹脂(1) (ZF-16) 60 69.3 熱塑性樹脂(3) (Et-MePhNB 樹脂) 96.6 27.3 G G 實施例3 熱塑性樹脂(1) (2F-16) 300 55.9 熱塑性樹脂(3) (Et-MePhNB 樹脂) 96.6 40.7 G G 實施例4 熱塑性樹脂(1) (ZF-16) 300 55.9 熱塑性樹脂(5) (LLDPE) 101.8 45.9 G G 實施例5 熱塑性樹脂(2) (ZF-14) 300 58.4 熱塑性樹脂(4) (Topas8007) 86.0 27.6 G G 實施例6 光硬化性樹脂(1) (UNP-冷) 300 51.6 熱塑性樹脂(4) (Topas8007) 86.0 34.4 G G 實施例7 熱塑性樹脂(1) (ZF-16) 300 55.9 光硬化性樹脂(1) (UNP-yS) 80.1 24.2 G G 26 201127609[Table 5] Resin mold · Reproducible resin mold core fineness accuracy Resin UV ozone treatment time (seconds) or plasma discharge contact angle X Resin contact angle Y Contact angle difference (Z = YX) Release Sexual treatment conditions (.) (Example) Thermoplastic resin (1) (2F-16) 0 95.6 Thermoplastic resin (6) (PMMA) 67.9 - 27.7 G - Example 2 Thermoplastic resin (1) (ZF-16) 60 69.3 Thermoplastic Resin (3) (Et-MePhNB Resin) 96.6 27.3 GG Example 3 Thermoplastic Resin (1) (2F-16) 300 55.9 Thermoplastic Resin (3) (Et-MePhNB Resin) 96.6 40.7 GG Example 4 Thermoplastic Resin (1) (ZF-16) 300 55.9 Thermoplastic Resin (5) (LLDPE) 101.8 45.9 GG Example 5 Thermoplastic Resin (2) (ZF-14) 300 58.4 Thermoplastic Resin (4) (Topas 8007) 86.0 27.6 GG Example 6 Photocurable resin (1) (UNP-cool) 300 51.6 Thermoplastic resin (4) (Topas 8007) 86.0 34.4 GG Example 7 Thermoplastic resin (1) (ZF-16) 300 55.9 Photocurable resin (1) (UNP- yS) 80.1 24.2 GG 26 201127609

實施例8 熱塑性樹脂(2) (ZF-14) 300 58.4 光硬化性樹脂(1) (UNP-/5) 80. 1 21.7 G G 實施例9 熱塑性樹脂(2) (ZF-14) 0 97.5 光硬化性樹脂(2) (Microresist) 75.8 -21.7 G - 實施例10 熱塑性樹脂(2) (ZF-14) 0 97.5 光硬化性樹脂(3) (PAK相當品) 54.2 -43.3 G - 實施例11 熱塑性樹脂(7) (PS) 60 29.2 光硬化性樹脂(1) (UNP-^) 80. 1 50. 9 G G 實施例12 光硬化性樹脂(1) (UNP-召) 300 51.6 光硬化性樹脂(1) OJNP-冷) 80.1 28.5 G G 實施例13 光硬化性樹脂(2) (Microresist) 300 52.1 光硬化性樹脂(1) (UNP-冷) 80.1 28.0 G G 實施例14 熱塑性樹脂(1) (ZF-16) 、15Pa 下、 20W、1分鐘 32.0 熱塑性樹脂(4) (Topas8007) 86.0 54.0 G G 實施例15 熱塑性樹脂(1) (ZF-16) 〇2、15Pa 下、 20W、1分鐘 32.0 光硬化性樹脂(1) (UNP-y9) 80.1 48.1 G G 實施例16 熱塑性樹脂(1) (ZF-16) 吣、0 5Pa 下、 50W、1分鐘逆濺度 52.7 熱塑性樹脂(4) (Topas8007) 86.0 33.3 G G 實施例17 熱塑性樹脂(1) (ZF-16) N2' 0. 5Pa 下、 50W、1分鐘鐘逆濺度 52.7 光硬化性樹脂(1) (UNP-/5) 80.1 27.4 G GExample 8 Thermoplastic Resin (2) (ZF-14) 300 58.4 Photocurable Resin (1) (UNP-/5) 80. 1 21.7 GG Example 9 Thermoplastic Resin (2) (ZF-14) 0 97.5 Photohardening Resin (2) (Microresist) 75.8 - 21.7 G - Example 10 Thermoplastic Resin (2) (ZF-14) 0 97.5 Photocurable Resin (3) (PAK equivalent) 54.2 - 43.3 G - Example 11 Thermoplastic Resin (7) (PS) 60 29.2 Photocurable resin (1) (UNP-^) 80. 1 50. 9 GG Example 12 Photocurable resin (1) (UNP-call) 300 51.6 Photocurable resin (1) ) OJNP-Cool) 80.1 28.5 GG Example 13 Photocurable resin (2) (Microresist) 300 52.1 Photocurable resin (1) (UNP-cold) 80.1 28.0 GG Example 14 Thermoplastic resin (1) (ZF-16 , 15Pa, 20W, 1 minute 32.0 Thermoplastic Resin (4) (Topas8007) 86.0 54.0 GG Example 15 Thermoplastic Resin (1) (ZF-16) 〇2, 15Pa, 20W, 1 minute 32.0 Photocurable resin ( 1) (UNP-y9) 80.1 48.1 GG Example 16 Thermoplastic Resin (1) (ZF-16) 吣, 0 5Pa, 50W, 1 minute Reverse Splash 52.7 Thermoplastic Resin (4) (Topas8007) 86.0 33.3 G G Example 17 Thermoplastic Resin (1) (ZF-16) N2' 0. 5Pa, 50W, 1 minute counter-reflection 52.7 Photocurable resin (1) (UNP-/5) 80.1 27.4 G G

[微細形狀的精確度]: 樹脂模仁的微細形狀的精確度評價為,使用日本電子 公司製的電界放射型掃描電子顯微鏡(FE-SEM)(型號Γ J S Μ - 6 7 0 0 F」),獲得親水化處理前後的樹脂模仁的微細形狀 的高度(深度)之觀察倍率10萬倍的影像,量測所得影像之 微細形狀的高度(深度)。具體為,對於親水化處理前的微 細形狀的高度,「親水化處理前的微細形狀的高度與親水化 Φ 處理後的微細形狀的高度差」的比例,超過20%者以不良ΓΒ 」表示,20%以下者以良好「G」表示。此比例於下述記載為「 微細形狀變化率」。表5、表6中未進行親水化處理者以「-」表示。此評價於表5、表6中以「樹脂模仁的微細形狀之 精確度」表示。 第3圖為實施例5所得之UV臭氧處理後的樹脂模仁表 面的SEM照片。微細形狀的高度(深度)以符號「D」表示。 (實施例1) 27 201127609[Precision of the fine shape]: The accuracy of the fine shape of the resin mold was evaluated by using an electric-radiation scanning electron microscope (FE-SEM) manufactured by JEOL Ltd. (Model Γ JS Μ - 6 7 0 0 F) The image obtained by observing the height (depth) of the fine shape of the resin mold core before and after the hydrophilization treatment at a magnification of 100,000 times was measured, and the height (depth) of the fine shape of the obtained image was measured. Specifically, the ratio of the height difference between the height of the fine shape before the hydrophilization treatment and the height of the fine shape after the hydrophilization treatment Φ is higher than the height of the fine shape before the hydrophilization treatment, and the ratio is more than 20%. 20% or less are indicated by a good "G". This ratio is described below as "fine shape change rate". Those who have not been hydrophilized in Tables 5 and 6 are indicated by "-". This evaluation is shown in Tables 5 and 6 as "accuracy of the fine shape of the resin mold core". Fig. 3 is a SEM photograph of the surface of the resin mold after UV ozone treatment obtained in Example 5. The height (depth) of the fine shape is indicated by the symbol "D". (Example 1) 27 201127609

使用直徑22〇nm(精確度±10%)、深度2〇〇ηηι(精確度 的形成孔狀圖案的矽膠製金屬模具,經熱奈米印壓法將上 述圖案轉印於環狀烯烴系樹脂(環烯烴聚合物(C〇p); 0PTIS 公司製,商品名「ZF-16」)膜。具體為,首先準備如第以圖 所不矽膠製的金屬模具i。其次,如第2B圖所示以形成 孔狀圖案的表面與上述樹脂M 3接觸的狀態,在樹脂臈3 上配置矽膠製的金屬模具丨。之後設置於SCI νΑχ公司製的 熱奈米印壓裝置「VX-2000」的壓台上。之後,在壓板溫度 1951、壓台溫度195t、壓力15pa、壓力維持時間6〇秒= 冷卻溫度100°C的條件下,於上述樹脂膜(熱塑性樹脂 (1)(ZF-16))進行印壓(將上述金屬模具壓於上述樹脂 膜)。之後脫壓,從壓台取出(如第2C圖所示),將上述樹 脂膜3(樹脂模仁5)從上述金屬模具丨離型。如此,得到轉 寫上述金屬模具的孔狀圖案的膜(形成直徑215_、深度 204nm的孔狀圖案之樹脂模仁5)(參考第2D圖)。之後,在 所得的樹脂模仁的微細形狀面(表面)上滴下Daikin公司 製的離型劑「0PT00L DSX」,塗佈全表面。之後風乾,在' ^ C的熱板上烤1 0分鐘。烤後以氟系溶劑「demnums〇lve町 (DAIKIN公司製)」清洗剩餘的離型劑(洗去),獲得樹脂模 仁。另一方面,轉寫對象使用由長i〇〇_x寬100随父厚lmm 的聚曱基丙烯酸曱酯樹脂(PMMA)所構成的片(熱塑性樹脂 (6))。使用此述(樹脂模仁、片)進行上述之評價。 (實施例2) 除了進行親水化處理以外’同實施例丄之方法獲得樹 28 201127609 月匕抬y— 曰、—°親水化處理為UV臭氧處理。具體為,UV臭氧處The above pattern was transferred to a cyclic olefin resin by a hot nano-pressing method using a tantalum metal mold having a diameter of 22 〇 nm (accuracy ± 10%) and a depth of 2 〇〇 ηι (accurately formed in a hole pattern). (cycloolefin polymer (C〇p); manufactured by PTIS Co., Ltd., trade name "ZF-16"). Specifically, first, a metal mold i prepared as shown in Fig. 2 is prepared. Secondly, as shown in Fig. 2B In a state in which the surface on which the hole pattern is formed is in contact with the resin M 3 , a metal mold 丨 made of silicone rubber is placed on the resin crucible 3. Then, it is placed in a hot nano press device "VX-2000" manufactured by SCI Αχ Αχ. On the pressure table, after the pressure plate temperature 1951, the pressure table temperature 195t, the pressure 15pa, the pressure maintenance time 6 = seconds = the cooling temperature 100 ° C, the above resin film (thermoplastic resin (1) (ZF-16) Pressing (pressing the above-mentioned metal mold to the above resin film), then depressurizing, taking out from the press table (as shown in Fig. 2C), and peeling off the above-mentioned resin film 3 (resin mold 5) from the above metal mold In this way, a film in which a hole pattern of the above metal mold is transferred (forming a straight line) 215_, a resin mold core 5) having a hole pattern of a depth of 204 nm (refer to FIG. 2D). Thereafter, a release agent "0PT00L DSX" manufactured by Daikin Co., Ltd. was dropped on the fine-shaped surface (surface) of the obtained resin mold. After coating the entire surface, it was air-dried and baked on a hot plate of 'C C for 10 minutes. After baking, the remaining release agent (washed off) was washed with a fluorine-based solvent "demnums〇lve-machi (manufactured by DAIKIN)". Resin mold. On the other hand, the transfer object uses a sheet (thermoplastic resin (6)) composed of a polyacrylonitrile acrylate resin (PMMA) having a length of 100 Å and a thickness of 1 mm. (Resin mold, sheet) The above evaluation was carried out. (Example 2) In addition to the hydrophilization treatment, the same method as in Example 获得 was used to obtain tree 28 201127609 匕 y 曰 —, - ° hydrophilization treatment to UV ozone Treatment, specifically, UV ozone

里使用EYE GRAPHICS公司製的UV臭氧洗淨裝置厂 〇C 25〇6(附有臭氧分解裝置OCA-150L-D)」,低壓水銀燈、 在臭氧存在下、照射距離1 Omm、UV臭氧處理時間60秒的 條件,對樹脂模仁進行uv照射。uy臭氧洗淨裝置内的排 气·]為2刀鐘。親水化處理後’在樹脂模仁表面的微細 形狀面(uv照射面)滴下Daikin公司製的離型劑「〇pT〇〇L DSX」,塗佈全表面。之後風乾,在1〇(rc的熱板上烤1〇分 鐘。烤後以氟系溶劑「DEMNUMSOLVENT(DAIKIN公司製)」清 洗剩餘的離型劑(洗去),獲得樹脂模仁。 ,轉寫對象準備如下述所得之片。首先以塗 佈棒將表5所㈣脂(Et-Mep_)溶於十氫化萘(decalin) 的溶解液塗佈在由長i 〇 Q_x寬⑽_厚G. i随的聚乙缚對 笨二甲酸⑹即膜上’形成塗膜。之後對於形成的塗膜, 進行真空乾燥’製成在上述ΡΕΤ表面形成樹脂m — Mep刚) 的膜之片。使用此述(樹脂模仁、片)進行上述之評價。 (實施例3、5) | %段矸間,進行Uv臭 氧處理以外’同實施例2之方法捭馄从* 、 ^乍為各樹脂模仁及韓 寫對象的片。使用此述(樹脂模仁、ΰ、“ ^ 片)進行上述之評價。 (實施例4) ' 使用表5所示之樹脂及表 氧處理,及使用四國化學工業 lOOmmx寬 l〇〇nimx厚 0.1mm 的 ν 1J υ V 旲 公司製的商品名「HC,長 片)作為轉寫對象以外,同Ϊ 29 201127609 施例2之方法獲得作 述(樹脂模仁、片)進行上,、 轉寫對象的片。使用此 a ^進仃上述之評價。 (實施例6 ) 使用直挺220nm(精確度十〗,、 ^ ^ ^ ^ ~ 0)、,衣度 200nm(精確度 ±5%) 的开〆成孔狀圖案的石英萝全 &具’經UV奈米㈣法將孔 狀圖案轉寫於光硬化性樹脂,獲得樹脂模仁。 _ 先在PET製的膜上以塗佈棒塗佈光硬化樹 月曰(TCDVE/l-AdVE = 70/30),开〈忐泠时 ;形成塗膜。以石英製金屬模具 1孔狀圖案的表面與上述塗膜接觸的狀態,在上述塗膜 上配置上述金屬模具後’設置於熱屋機旧—⑴…麵公 ::製)的壓台上。其次’以壓板溫度為常溫 '壓台溫度為常 '皿£力1 · OMPa、麼力保持時f日,j 〇秒的條件(參考表4 ), 對光硬化樹脂⑴⑽P1)進行印壓(將上述金屬模具厂堅於 上述塗膜)。之後M,從I台取出。之後使肖LED光源 (Η0ΥΑ公司製「醜啊]vc」,波長365μ),訂照射量 20㈣/cm2, UV照射時間38秒的條件下,對上述塗膜”昭 射,使上述塗膜硬化,形成硬化樹脂膜。之後將硬化樹脂 膜及PET膜從上述金屬模具離型。如此獲得表面轉印(形成) 微細孔狀圖案的親水化處理前樹脂模仁(形成直徑21 〇、 深度2 01 nm的孔狀圖案的樹脂模仁)。 其次對於所得的親水化處理前樹脂模仁進行uv臭氧 處理(親水化處理)。uv臭氧處理使用EYE GRAPHICS公司 製的UV臭氧洗淨裝置r〇c-2506(附有臭氧分解裝置 OCA-150L-D)」,低壓水銀燈、在臭氧存在下、照射距離1〇mm 30 201127609 的條件,對親水化處理前的樹脂模仁進行uv照射。uv臭 氧洗淨裝置内的排氣時間為2分鐘。冑水化處理後,在樹 脂模仁表面的微細形狀面(uv照射面)滴下Daikin公司製 的離型劑「OPTOOL DSX」,塗佈全表面。之後風乾,在1〇〇 °C的熱板上烤10分鐘。烤後以IL系溶劑Γ 咖麵謂T(隨IN公51製)」清洗剩餘的離型劑(洗 去),獲得樹脂模仁。 另-方面,轉寫對象準備如下述所得之片。首先以塗 佈棒在長10〇mmx£ 100ramx厚^㈣的pET膜上塗佈熱塑性 樹脂⑷(Topa测7)溶於十A化萘(deGalin)的溶解液,形 成塗膜。之後對於形成的塗膜’進行真空乾燥,製成在上 =PET表面形成樹脂(T〇pas8〇〇7)膜之片。使用此述(樹脂 模仁、片)進行上述之評價。 (實施例7、8、11 ) 使用表5所示之樹脂及表5所示處理時間,進行訂臭 氧处理及使用在長l〇〇mmx寬1〇〇111似厚〇 1随的PH膜上 以塗佈棒塗佈光硬化樹脂⑴形成塗模的片(上述塗膜光硬 化之别的片)作為轉寫對象以外,同實施例2之方法獲得作 為各樹脂模仁及各轉寫對象的各片。使用此述(樹脂模仁、 片)進行上述之評價。 (實施例9、1 〇 ) 使用表5所示之樹脂及使用在長1〇〇Μχ寬1〇〇_父厚 〇、. 1mm的PET膜上以塗佈棒塗佈| 5所示之光硬化樹脂形 成土膜的片(上述塗膜光硬化之前的片)作為轉寫對象以 31 201127609 外’同實施例1之t i # 仁、片)進> Η 獲得樹脂模仁。使用此述(樹脂模 乃)進仃上述之評價。 (實施例12、13) 除使用表5所示之格^ 脂模仁。同實施例7 施例6之方法獲得樹 之方法獲得作為轉寫對象的片。使用 此述(樹腊模仁、片)進行上述之評價。 使用 (貫施例1 4、1 5) 之方電處理(親水化處理)以外,同實施例2 的電喂:讀月曰杈仁。電漿放電處理使用神鋼精機公司製 的電漿蝕刻裝置「ΕΧΑΜ」, 〇nw . 乳乳力15Pa)、輸出功率 2⑽、處理時間i分鐘 料下進仃RIE處理。本條件在 15Pa下、酬、i分鐘」表示。 作」—方面,對於轉寫對象,實施例14同實施例5獲得 象” 片#施例15同實施例7獲得作為轉寫對 象之片。使用此述(樹脂模仁、片)進行上述之評價。 (實施例1 6、1 7) 、 使用芝冑Mechatronics》司製的滅鑛裝置 &4ES」’在氮氣(壓力〇5pa)、輸出功率⑽、處理 :間1分鐘的條件,藉由逆㈣處理進行電聚放電處理以 ,冋貫施例2獲得樹脂模仁。本條件在表5中以「心、 • 5Pa下、5〇W、1分鐘逆賤鍍」表示。 你另—方面’對於轉寫對象’實施例“同實施例5獲得 為轉寫對象之片。實施例17同實施例7獲得作為轉寫對 象之片。使用此述(樹脂模仁、片)進行上述之評價。 32 201127609 • (比較例 1、6、7、1 0、11、1 5、1 6) 除使用表6所示樹脂以外,同實施例1獲得樹脂模仁。 另一方面,對於轉寫對象,比較例1同實施例2獲得作為 轉寫對象的片。比較例6同實施例4獲得作為轉寫對象的 片。比較例7同實施例6獲得作為轉寫對象的片。比較例 1 0、11、1 5、1 6同實施例7獲得作為轉寫對象的片。使用 此述(樹脂模仁、片)進行上述之評價。 [表6] 樹脂模仁 轉寫對象 接觸角的差 (Z=Y-X) 離型性 樹'脂模仁的微細 形狀之精確度 樹脂 UV臭氧 處理時間 (秒) 接觸角X (。) 樹脂 接觸角Y (。) 比較例1 熱塑性樹脂(1) (ZF-16) 0 95.6 熱塑性樹脂(3) (Et-MePhMB 樹脂) 96.6 1.0 Β - 比較例2 熱塑性樹脂(1) (ZF-16) 10 90.6 熱塑性樹脂(3) (Et-MePhNB 樹脂) 96.6 6.0 Β G 比較例3 熱塑性樹脂(1) (ZF-16) 30 81.8 熱塑性樹脂(3) (Et-MePhNB 樹脂) 96.6 14.8 Β G 比較例4 熱塑性樹脂(1) (ZF-16) 600 35.2 熱塑性樹脂(3) (Et-MePhNB 樹脂) 96.6 61.4 G Β 比較例5 熱塑性樹脂(1) (ZF-16) 1800 10,3 熱塑性樹脂(3) (Et-MePhNB 樹脂) 96.6 86.3 G Β 比較例6 熱塑性樹脂(1) (ZF-16) 0 95.6 熱塑性樹脂(5) CLLDPE) 101.8 6.2 Β - 比較例7 熱塑性樹脂(2) (ZF-14) 0 97.5 熱塑性樹脂(4) (Topas8007) 86.0 11.5 Β - 比較例8 光硬化性樹脂(1) (UNP-泠) 0 80.1 熱塑性樹脂(4) (Topas8007) 86.6 5.9 Β - 比較例9 光硬化性樹脂(1) 0 80.1 光硬化性樹脂(1) (UNP-^) 80.1 0 Β - 比較例10 熱塑性樹脂(]) (ZF-16) 0 95.6 光硬化性樹脂(1) (UNP-召) 80.1 -15.5 Β - 比較例11 熱塑性樹脂(2) (ZF-14) 0 97.5 光硬化性樹脂(1) (UNP-泠) 80. 1 -17.4 Β - 比較例12 熱塑性樹脂(2) (ZF-14) 300 58.4 光硬化性樹脂(2) (Microresist) 75.8 17.4 Β G 比較例13 熱塑性樹脂(2) (ZF-14) 300 58.4 光硬化性樹脂(3) (PAK相當品) 54.2 -4.2 Β G 比較例14 光硬化性樹脂(2) (Microresist) 0 75.8 光硬化性樹脂(1) (UNP-^) 80.1 4.3 Β - 比較例15 熱塑性樹脂(6) (PMMA) 0 67.9 光硬化性樹脂(1) (UNP-冷) 80.1 12.2 Β - 比較例16 熱塑性樹脂(7) (PS) 0 85.9 光硬化性樹脂(1) (UNP-石) 80.1 -5.8 Β - (比較例2〜5、1 2、1 3) 33 201127609 uv臭氧處理時間如表6所示時間變化,及除使用表6 所示樹脂以外,同實補2獲得樹脂模仁。另—方面,對 於轉寫對象’比較例2〜5同實施例2獲得作為轉寫對象之 片。比較例12、13除使用表6所示樹脂以外,同實施例7 獲得作為轉寫對象之片。使用此述(樹脂模仁、片)進行上 述之評價。 (比較例8) 使用直徑22〇nm(精確度±1〇%)、深度2〇〇nm(精確度⑽ 的形成孔狀圖案的石英製金屬模具,經u v奈米印壓法將孔 狀圖案轉寫於光硬化性樹脂,獲得樹脂模仁。 八體為首先在PET製的膜上以塗佈棒塗佈光硬化樹 脂(TmE/HdvE=7Q/3()),形成塗膜。以石英製金屬模具 形成孔狀圖案的表面與上述塗膜接觸的狀態,在上述塗膜 上配置上述金屬模具後,設置於熱壓機ΓΑΗ-1Τ」的壓台上。 以壓板溫度為常溫、壓台溫度為常溫、壓力 l.OPa、壓力保持時間10秒的條件(參考表4),對光硬化 樹脂(1) ( U N P - /5 )進行印壓(將上述金屬模具壓於上述塗 膜)之後脫壓,從壓台取出。之後使用LED光源(H0YA公 司衣「EXECURE-H-1VC」,波長 365nm),UV 照射量 20mW/cm2, 叭照射時間38秒的條件下,對上述塗膜ϋν照射,使上述 塗臈硬化,形成硬化樹脂膜。之後將硬化樹脂膜及ρΕτ膜 從上述金屬模具離型。如此獲得表面轉印孔狀圖案的樹脂 模仁(形成直徑206ηπι、深度197nm的孔狀圖案的樹脂模 仁)。在樹脂模仁表面的微細形狀面滴下Daikin公司製的 34 201127609 離型劑「OPTOOL DSX」, 愛佈全表面。之後風乾,在]nn。 的熱板上烤10分鐘。昧 i00cThe UV ozone cleaning device factory 〇C 25〇6 (with ozone decomposing unit OCA-150L-D) made by EYE GRAPHICS, low pressure mercury lamp, in the presence of ozone, irradiation distance 1 Omm, UV ozone treatment time 60 In the second condition, the resin mold was irradiated with uv. The exhaust gas in the uy ozone cleaning device is 2 knives. After the hydrophilization treatment, the release agent "〇pT〇〇L DSX" manufactured by Daikin Co., Ltd. was dropped on the fine-shaped surface (uv irradiation surface) of the surface of the resin mold, and the entire surface was applied. After that, it was air-dried and baked on a hot plate of RC for 1 minute. After baking, the remaining release agent (washed off) was washed with a fluorine-based solvent "DEMNUMSOLVENT (manufactured by DAIKIN)" to obtain a resin mold. The object was prepared as follows. First, the solution of the (4) lipid (Et-Mep_) dissolved in decalin was coated with a coating bar at a length i 〇Q_x width (10)_thick G. i. The film was formed by forming a coating film on the film (6), that is, on the film, and then vacuum-drying the formed film to form a film of the film m-Mep just formed on the surface of the above-mentioned crucible. The above evaluation was carried out using the above (resin mold, sheet). (Examples 3 and 5) | In the case of the Uv odor treatment, the method of the second embodiment was carried out in the same manner as in Example 2, from *, and 乍 to each of the resin molds and the Korean object. The above evaluation was carried out using the above-mentioned (resin mold, enamel, "^ sheet") (Example 4) 'Use the resin shown in Table 5 and the oxygen treatment, and use the chemical industry of the four countries chemical industry lOOmmx wide l〇〇nimx thick 0.1mm ν 1J υ V 旲 的 的 HC HC HC HC HC HC HC HC HC HC HC HC 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 The slice of the object. Using this a ^ to evaluate the above. (Example 6) Using straight 220 nm (accuracy ten, ^ ^ ^ ^ ~ 0), clothing 200 nm (accuracy ± 5%) Quartz radish & with a hole pattern to transfer the hole pattern to the photocurable resin by the UV nano (four) method to obtain a resin mold. _ First coated with a coating on a PET film Cloth-hardened tree sap (TCDVE/l-AdVE = 70/30), when 忐泠 ;; forming a coating film. The surface of the quartz metal mold 1 hole pattern is in contact with the coating film, in the above coating After the above-mentioned metal mold is placed on the film, it is placed on the press table of the hot house machine-(1)...face:: system. Secondly, the pressure of the platen is normal temperature. The temperature is a constant '1' OMPa, the force is maintained at f, the condition of j 〇 second (refer to Table 4), and the photo-curable resin (1) (10) P1) is pressed (the above-mentioned metal mold factory is firmly adhered to the above coating film) After that, M is taken out from the I. After that, the LED light source ("Ugly" vc", wavelength 365μ), the irradiation amount of 20 (four)/cm2, and the UV irradiation time of 38 seconds are applied to the coating film. In the shot, the coating film is cured to form a cured resin film, and then the cured resin film and the PET film are released from the metal mold, thereby obtaining a resin mold before hydrophilization treatment by surface transfer (forming) of a fine pore pattern ( A resin mold having a pore pattern of 21 直径 and a depth of 2 01 nm was formed. Next, uv ozone treatment (hydrophilization treatment) was carried out on the resin mold before the obtained hydrophilization treatment. UV treatment by EYE GRAPHICS was used for the UV ozone treatment. Ozone cleaning device r〇c-2506 (with ozonolysis unit OCA-150L-D)", low-pressure mercury lamp, in the presence of ozone, irradiation distance 1〇mm 30 201127609, the resin mold before hydrophilization treatment Perform uv irradiation. The exhaust time in the uv odor oxygen cleaning device is 2 minutes. After the hydration treatment, the release agent "OPTOOL DSX" manufactured by Daikin Co., Ltd. was dropped on the fine-shaped surface (uv-irradiated surface) of the surface of the resin mold, and the entire surface was applied. After air drying, bake for 10 minutes on a hot plate at 1 °C. After baking, the remaining release agent (washed off) was washed with an IL solvent, T (with IN), to obtain a resin mold. On the other hand, the transfer target is prepared as described below. First, a thermoplastic resin (4) (Topa 7) dissolved in a solution of deGalin was coated on a pET film having a length of 10 mm mm × 100 ramx thick (4) with a coating bar to form a coating film. Thereafter, the formed coating film ' was vacuum dried to form a film of a resin (T〇pas8〇〇7) film formed on the upper surface of the PET. The above evaluation was carried out using the above (resin mold, sheet). (Examples 7, 8, and 11) Using the resin shown in Table 5 and the treatment time shown in Table 5, the ozone treatment was carried out and the use was carried out on a PH film having a length of 1 mm and a width of 111 Å. The sheet which was coated with the photo-curable resin (1) by a coating bar (the other film of the photo-curing of the coating film) was used as a transfer target, and the method of Example 2 was carried out as a resin mold and each transfer target. Each piece. The above evaluation was carried out using the above (resin mold, sheet). (Examples 9 and 1) The resin shown in Table 5 was used, and the light shown in the coating film was coated with a coating film on a PET film having a length of 1 inch wide and a thickness of 1 mm. The sheet in which the hardened resin was formed into a soil film (the sheet before the photo-curing of the coating film described above) was transferred as a transfer target to the ti #仁, sheet of the same example as in the above-mentioned Example 1 2011. The above evaluation was carried out using this (resin mold). (Examples 12 and 13) The use of the granules shown in Table 5 was used. A method of obtaining a tree by the method of Example 7 was carried out in the same manner as in Example 7 to obtain a sheet as a transfer target. The above evaluation was carried out using this description (tree wax mold, sheet). The electric feeding of the same example 2 was used except for the square electric treatment (hydrophilization treatment) of (Examples 14 and 15): The plasma discharge treatment was carried out using a plasma etching apparatus "ΕΧΑΜ" manufactured by Kobelco Seiki Co., Ltd., 〇nw. milk strength 15 Pa), output power 2 (10), and processing time i minutes. This condition is expressed at 15Pa, reward, i minutes. In the same manner as in the fifth embodiment, the image obtained in the same manner as in the fifth embodiment was obtained in the same manner as in the fifth embodiment. In the same manner as in the seventh embodiment, the sheet to be transferred was obtained. The above-mentioned (resin mold, sheet) was used for the above-mentioned Evaluation (Example 1 6 and 1 7), using the ore-eliminating device & 4ES" of the Mechatronics Division, under the conditions of nitrogen (pressure 〇 5pa), output power (10), and treatment: 1 minute. The reverse (d) treatment was carried out by electropolymerization discharge treatment to obtain a resin mold core by the application of Example 2. These conditions are shown in Table 5 as "heart, • 5 Pa, 5 〇 W, 1 minute reverse 贱 plating". In another aspect, the 'transfer object' embodiment is obtained as the transfer target piece in the same manner as in the embodiment 5. The embodiment 17 obtains the piece as the transfer target in the same manner as in the embodiment 7. This is described (resin mold, sheet). The above evaluation was carried out. 32 201127609 • (Comparative Examples 1, 6, 7, 10, 11, 15, 5, and 16) The resin mold was obtained in the same manner as in Example 1 except that the resin shown in Table 6 was used. For the transfer target, the sample as the transfer target was obtained in the same manner as in the second embodiment. In the comparative example 6, the slice as the transfer target was obtained as in the fourth embodiment. In the comparative example 7, the slice as the transfer target was obtained in the same manner as in the sixth embodiment. Comparative Example 1 0, 11, 1, 5, and 16 A sheet to be transferred was obtained in the same manner as in Example 7. The above evaluation was carried out by using the above (resin mold, sheet). [Table 6] Resin mold transfer object contact Difference in angle (Z=YX) Precision of the fine shape of the release tree 'fatty mold resin Resin UV ozone treatment time (seconds) Contact angle X (.) Resin contact angle Y (.) Comparative Example 1 Thermoplastic resin (1) ) (ZF-16) 0 95.6 Thermoplastic Resin (3) (Et-MePhMB Resin) 96.6 1.0 Β - Comparative Example 2 Plastic resin (1) (ZF-16) 10 90.6 Thermoplastic resin (3) (Et-MePhNB resin) 96.6 6.0 Β G Comparative Example 3 Thermoplastic resin (1) (ZF-16) 30 81.8 Thermoplastic resin (3) (Et- MePhNB resin) 96.6 14.8 Β G Comparative Example 4 Thermoplastic resin (1) (ZF-16) 600 35.2 Thermoplastic resin (3) (Et-MePhNB resin) 96.6 61.4 G Β Comparative Example 5 Thermoplastic resin (1) (ZF-16) 1800 10,3 Thermoplastic Resin (3) (Et-MePhNB Resin) 96.6 86.3 G Β Comparative Example 6 Thermoplastic Resin (1) (ZF-16) 0 95.6 Thermoplastic Resin (5) CLLDPE) 101.8 6.2 Β - Comparative Example 7 Thermoplastic Resin (2) (ZF-14) 0 97.5 Thermoplastic Resin (4) (Topas8007) 86.0 11.5 Β - Comparative Example 8 Photocurable resin (1) (UNP-泠) 0 80.1 Thermoplastic resin (4) (Topas8007) 86.6 5.9 Β - Comparative Example 9 Photocurable resin (1) 0 80.1 Photocurable resin (1) (UNP-^) 80.1 0 Β - Comparative Example 10 Thermoplastic resin (]) (ZF-16) 0 95.6 Photocurable resin (1) (UNP-Call) 80.1 -15.5 Β - Comparative Example 11 Thermoplastic Resin (2) (ZF-14) 0 97.5 Photocurable Resin (1) (UNP-泠) 80. 1 -17.4 Β - Comparative Example 12 Thermoplastic Resin (2) (ZF-14) 300 58.4 Photocurable Resin (2) (Microresist) 75.8 17.4 Β G Comparative Example 13 Thermoplastic Resin (2) (ZF-14) 300 58.4 Photocurable Resin (3) ( PAK equivalent) 54.2 -4.2 Β G Comparative Example 14 Photocurable resin (2) (Microresist) 0 75.8 Photocurable resin (1) (UNP-^) 80.1 4.3 Β - Comparative Example 15 Thermoplastic resin (6) (PMMA 0 67.9 Photocurable resin (1) (UNP-cold) 80.1 12.2 Β - Comparative Example 16 Thermoplastic resin (7) (PS) 0 85.9 Photocurable resin (1) (UNP-stone) 80.1 -5.8 Β - ( Comparative Example 2 to 5, 1 2, 1 3) 33 201127609 The uv ozone treatment time was changed as shown in Table 6, and the resin mold was obtained in the same manner as in Table 2 except that the resin shown in Table 6 was used. On the other hand, for the transfer of the object 'Comparative Examples 2 to 5, the same as Example 2, the slice as the transfer target was obtained. In Comparative Examples 12 and 13, a sheet as a transfer target was obtained in the same manner as in Example 7 except that the resin shown in Table 6 was used. The above evaluation was carried out using the above (resin mold, sheet). (Comparative Example 8) A hole-shaped pattern was formed by a uv nano-pressing method using a quartz metal mold having a diameter of 22 〇 nm (accuracy ± 1 〇 %) and a depth of 2 〇〇 nm (accuracy (10)). The photo-curable resin was transferred to obtain a resin mold. The eight-body was first coated with a photo-curable resin (TmE/HdvE=7Q/3()) on a film made of PET to form a coating film. The surface of the metal mold to form the hole pattern is in contact with the coating film, and the metal mold is placed on the coating film, and then placed on a press table of the hot press ΓΑΗ-1Τ. The platen temperature is normal temperature and the pressing table is used. The temperature is normal temperature, pressure l.OPa, pressure holding time of 10 seconds (refer to Table 4), after printing the photocurable resin (1) ( UNP - /5 ) (pressing the above metal mold to the above coating film) After depressurization, it was taken out from the press table, and then the above coating film ϋν was irradiated with an LED light source (H0YA company "EXECURE-H-1VC", wavelength 365 nm), a UV irradiation amount of 20 mW/cm2, and a barrel irradiation time of 38 seconds. , the above coating is hardened to form a cured resin film, and then the resin film and the pΕτ film are hardened. The above-mentioned metal mold was released, and a resin mold core having a surface transfer hole pattern (a resin mold having a hole pattern of 206 nm and a depth of 197 nm) was obtained in this manner. A micro-shaped surface of the surface of the resin mold was dropped by a Daikin company. 201127609 Release agent "OPTOOL DSX", love the whole surface of the cloth. After air drying, bake for 10 minutes on the hot plate of nn. 昧i00c

烤後以氟系溶劑「DEMNUMSOLVENT (DAIKIN公司製)」清、、车井, 仁。另-方面,轉寫^餘的離型劑(洗去)’獲得樹脂模 .f象同實施例6獲得作為轉寫對象 片。使用此述(樹脂模仁^ ^ 片)進订上述之評價。 (比較例9) 同比較例8獲得樹t .y 3杈仁。另一方面,轉寫對象回每 施例7獲得作為轉寫 巧对象冋貫 舄對象之片。使用此述(樹脂模仁' 進仃上述之評價。 巧) (比較例14) 除使用表6所示椒 樹月曰以外,同比較例8獲得樹脂槿 另一方面,轉寫對象 惧仁 使用此述(樹脂模仁、 豕之片。 月)進行上述之評價。 攸表5及表6可4n 可確認實施例卜17二、比較例1〜16之樹脂模仁相比, 型性良好),表面即使v:r可容易從轉寫對象離型(離 確度仍良好。。親水化處理’表面的微細形狀的精 … Μ 5的樹脂模仁的情升[雖離型性良好 ± 脂模仁的微細形狀样过办 但樹 巾狀精確度不佳。具體而言, 看,微細形狀的變化至 奴例4來 ,^ ^ 车為21%,比較例5的微細形壯^ β 化率為64%。 化狀的變 [產業利用性]After roasting, it is cleaned with a fluorine-based solvent "DEMNUMSOLVENT (manufactured by DAIKIN)", and the car is well. On the other hand, the transfer agent (removal) obtained by transferring the resin was obtained as the transfer target sheet as in the same manner as in Example 6. The above evaluation was made using this (resin mold) sheet. (Comparative Example 9) A tree t.y 3 was obtained in the same manner as in Comparative Example 8. On the other hand, the transfer object is returned to each of the embodiments 7 to obtain a slice as a transfer object. Using this description (Resin Molding' Admitted to the above evaluation. (Comparative Example 14) In addition to the use of the P. sylvestris shown in Table 6, the resin was obtained in the same manner as in Comparative Example 8, on the other hand, the transfer target was used. The above evaluation (resin mold, sputum sheet. month) was carried out as described above.攸 Table 5 and Table 6 can be confirmed by 4n, and the resin molds of Comparative Examples 1 to 16 are good in type. The surface can be easily removed from the transfer object even if v:r (the accuracy is still Good. Hydrophilic treatment of the surface of the fine shape of the fine... Μ 5 resin mold kernels of the rise [although the release is good ± fine mold shape of the fat mold, but the accuracy of the tree towel is not good. Words, see, the change of the fine shape to the slave example 4, ^ ^ car is 21%, the fineness of the comparative example 5 is 64%. The change of the chemical property [industrial use]

本發明之樹脂抬y I 、仁較佳適用作為奈米印壓用的樹脂模 35 201127609 仁。 體。 學成 本發明之成形體較佳適用 的光學成形 光膜等的光 本發明之λ #蚰· n ^ ^ 本么月之^體的製造方 ^ m ^ m 作為集 形體使用之可能的成形品。 【圖式簡單說明】 中接觸角的測定狀態 第1圖顯示以模式圖表示本發明 之說明圖。 第2A圖顯示以模式圖矣+ 士 ^ 犋式圖表不本發明之樹脂模仁的一 施型態的製造工程之剖面圖。 第2B圖顯示以描;夫(gj主-丄,々 、式圖表不本發明之樹脂模仁的一實 施型態的製造工程之剖面圖。 第2 C圖顯示以模式圖表示本發明之樹脂模仁的一實 施型態的製造工程之剖面圖。 第2D圖顯示以模式圖表示本發明之樹脂模仁的一實 施型態的製造工程之剖面圖。 第3圖為實施例5所得的經uv臭氧處理後的樹脂模仁 之掃描電子顯微(SEM)相片。 主要元件符號說明】 1〜金屬模具; 5〜樹脂模仁, 13〜水滴; 3〜樹脂膜; 11〜樹脂層; 15, 17〜凹凸圖案 36The resin of the present invention is preferably used as a resin mold for nanoimprinting. body. The light of the optically-formed optical film or the like which is preferably applied to the molded article of the present invention is λ #蚰· n ^ ^ The manufacturing method of the body of the month ^ m ^ m is a possible molded article used as a shaped body. [Description of Modes] Measurement State of Contact Angle FIG. 1 is an explanatory view showing the present invention in a schematic diagram. Fig. 2A is a cross-sectional view showing a manufacturing process of a mode in which the resin mold of the present invention is not in the pattern diagram + ^ 犋 图表 chart. Fig. 2B is a cross-sectional view showing the manufacturing process of an embodiment of the resin mold of the present invention, which is not shown in Fig. 2C. Fig. 2C is a view showing the resin of the present invention in a schematic view. Sectional view of a manufacturing process of a mold core. Fig. 2D is a cross-sectional view showing a manufacturing process of an embodiment of the resin mold of the present invention in a schematic view. Fig. 3 is a view showing the process of Example 5. Scanning electron microscopy (SEM) photograph of resin mold kernel after OV ozone treatment. Description of main components: 1~metal mold; 5~resin mold, 13~ water drop; 3~resin film; 11~resin layer; 15, 17 ~ Concave pattern 36

Claims (1)

201127609 七、申睛專利範圍: 1.—種樹脂模仁,由含有樹脂成分(a)之材料所構成, 表:上形成圖案形成用的微細形狀,將該微細形狀轉寫於 由含有樹脂成分(b)之材料所構成的轉寫對象所用之 印壓用的樹脂模仁, 不/、 該樹脂模仁為,將上述樹脂成分(a)塗佈於具有平滑面 .材之忒平巧面上,使乾燥或照射光,形成具有平滑面 鲁的樹脂層(Α)後’形成的該樹脂層⑴的上述平滑面上配置 的水’根據m R 3257測定的靜接觸角(χι)滿足下 列條件(1)者: 條件(1):構成上述轉寫對象之材料中的上述樹脂成分 (b) ’塗佈於具有平滑面的基材之該平滑面上,使乾燥或照 射光,形成具有光滑面的樹脂層(B)後,該形成的樹脂層(B) 的該平滑面上配置3#L的水,根據川R 3257測定的靜 接觸角(Y1)與上述靜接觸角(X1)的差的絕對值為20。〜60。。 _ 2.如申請專利範圍第1項所述之樹脂模仁,其中,形 成微細形狀的上述表面經親水化處理。 3 ·如申请專利範圍第2項所述之樹脂模仁,其中,該 樹脂模仁為,形成上述樹脂層以)後,形成的該樹脂層 的上述平滑面以親水化處理,經親水化處理的上述平滑面 上配置3//L的水,根據JIS R 3257測定的靜接觸角(χ2) 滿足下列條件(2)者: 條件(2):上述靜接觸角(γι)與上述靜接觸角(χ2)的差 ((Y1)-(Χ2))為 20。〜60。。 37 201127609 4.如申请專利範圍第2或3項所述之樹脂模仁,其中, 上述親水化處理係進行UV臭氧處理。 5·如申請專利範圍第2或3項所述之樹脂模仁,其中, 上述親水化處理係進行電暈放電處理。 6. 如申請專利範圍第2或3項所述之樹脂模仁,其中, 上述親水化處理係進行電漿放電處理。 7. 如申請專利範圍第1或2項所述之樹脂模仁,其中, 上述表面經離型劑處理。 8. 如申請專利範圍第1或2項所述之樹脂模仁,其中, 上述樹脂成分(a)包含熱塑性樹脂,上述表面上的微細形狀 經熱奈米印壓而形成。 9. 如申請專利範圍第8項所述之樹脂模仁,其中,上 述熱塑性樹脂為選自下列所組成之群組之至少丨種:環狀 烯烴系樹脂、聚烯烴樹脂、丙烯酸樹脂、聚碳酸酯樹脂、 聚乙烯趟樹脂、及聚苯乙稀樹脂。 1 0.如申請專利範圍第丨或2項所述之樹脂模仁,其 中,上述樹脂成分(a)包含光硬化性樹脂,上述表面上的微 細形狀經光奈米印壓而形成。 11. 如申凊專利範圍第1 〇項所述之樹脂模仁,其中, 上述光硬化性樹脂含有來自選自下列所组成之群組之至少 1種硬化性化合物的構造單位:直鏈狀乙烯醚化合物、脂 環乙烯醚化合物、環氧化合物、氧雜環丁烷(〇xetane)化合 物、及丙烯酸化合物。 12. 如申請專利範圍第1或2項所述之樹脂模仁,其 38 201127609 中,該樹脂模仁為熱奈米印壓用。 士 13.如申請專利範圍第1或2項所述之樹脂模仁,其 ,該樹脂模仁為光奈米印壓用。 士 種成形體,由轉寫申請專利範圍第1或2項所述 之树月曰杈仁的表面上所形成的微細形狀而得。 15.種成形體之製造方法,包括: 使用由含有樹脂成分(a)之材料所構成,表面上形成圖 案形成用的微細形狀的樹脂模仁, 、由將上述樹脂杈仁的該微細形狀轉寫於由含有樹脂 、,()之材料所構成的轉寫對象’使上述樹脂模仁的該微 、田形狀之反轉形狀形成於表面而得成形體之製造方法, 上述樹脂模仁為,將上述樹脂成分(a)塗佈於具有平滑 面的基材之該平滑面上’使乾燥或照射光,形成具有平滑 面的樹脂層(A)後,形成的該樹脂層⑷的上述平滑面上配 置WL的水’根據川R 3257測定的靜接觸角⑴)滿足 下列條件(1)之樹脂模仁: 條件(1).構成上述轉寫對象之材料中的上述樹脂成分 (b) i佈於具有平滑面的基材之上述平滑面上,使乾燥或 照射光’形成具有平滑面的樹脂層⑻後,該形成的樹脂層 (B)的上述平滑面上配置3" L的水’根據3257測定 的靜接觸角(Y1)盘卜, /、上述靜接觸角(XI)的差的絕對值為 20。〜60。。 、16,如申請專利範圍第15項所述之成形體之製造方 法’其中’上述樹脂模仁由形成微細形狀之上述表面經親 39 201127609 成上述樹脂層(Α) 覩水化處理,經親 ,根據 JIS R 3257 水化處理而得’且上述樹脂模仁為,形 後,形成的該樹脂層(A)的上述平滑面以^ 水化處理的上述平滑面上配置3 μ L的水 測定的靜接觸角(Χ2)滿足下列條件(2)之樹脂模仁: 條件(2):上述靜接觸角(γι)與上述靜接觸角(Χ2)的差 ((Υ1)-(Χ2))為 20。〜60。。 參 40201127609 VII. Applicable patent scope: 1. A resin mold kernel consisting of a material containing a resin component (a), a fine shape for forming a pattern on the surface, and the micro shape is transferred to a resin component (b) The resin mold for printing used for the transfer target of the material is not /, the resin mold is used, and the resin component (a) is applied to a smooth surface having a smooth surface. The dry contact angle (χι) measured by m R 3257 is satisfied by drying or irradiating light to form a resin layer having a smooth surface and forming a smooth surface of the resin layer (1). Condition (1): Condition (1): The resin component (b) in the material constituting the transfer target is applied to the smooth surface of the substrate having a smooth surface, and dried or irradiated with light to form After the smooth surface of the resin layer (B), 3#L of water is disposed on the smooth surface of the formed resin layer (B), and the static contact angle (Y1) measured according to the Sichuan R 3257 and the above static contact angle (X1) The absolute value of the difference is 20. ~60. . 2. The resin mold core according to claim 1, wherein the surface of the fine shape is hydrophilized. The resin mold core according to claim 2, wherein the resin mold core is formed by forming the resin layer, and the smooth surface of the resin layer is hydrophilized and hydrophilized. The water on the smooth surface is 3//L, and the static contact angle (χ2) measured according to JIS R 3257 satisfies the following condition (2): Condition (2): The above static contact angle (γι) and the above static contact angle The difference ((Y1) - (Χ2)) of (χ2) is 20. ~60. . The resin mold core according to claim 2, wherein the hydrophilization treatment is carried out by UV ozone treatment. The resin mold according to claim 2, wherein the hydrophilization treatment is performed by a corona discharge treatment. 6. The resin mold according to claim 2, wherein the hydrophilization treatment is a plasma discharge treatment. 7. The resin mold according to claim 1 or 2, wherein the surface is treated with a release agent. 8. The resin mold according to claim 1 or 2, wherein the resin component (a) contains a thermoplastic resin, and the fine shape on the surface is formed by hot stamping. 9. The resin mold core according to claim 8, wherein the thermoplastic resin is at least one selected from the group consisting of a cyclic olefin resin, a polyolefin resin, an acrylic resin, and a polycarbonate. Ester resin, polyethylene resin, and polystyrene resin. The resin mold core according to claim 2, wherein the resin component (a) contains a photocurable resin, and the fine shape on the surface is formed by photon printing. 11. The resin mold according to claim 1, wherein the photocurable resin contains a structural unit derived from at least one curable compound selected from the group consisting of linear ethylene An ether compound, an alicyclic vinyl ether compound, an epoxy compound, an oxetane compound, and an acrylic compound. 12. The resin mold core according to claim 1 or 2, wherein the resin mold core is used for hot nano printing. The resin mold core according to claim 1 or 2, wherein the resin mold core is used for photon printing. The molded body is obtained by transferring the fine shape formed on the surface of the sapling of the tree glutinous rice described in the first or second aspect of the patent application. A method for producing a molded article comprising: using a resin mold comprising a resin component (a) and forming a fine shape for forming a pattern on the surface, and transferring the fine shape of the resin coix seed A method for producing a molded body obtained by forming a reversed shape of the micro- and field-shaped shape of the resin mold core by a transfer target made of a material containing a resin or a (), wherein the resin mold is Applying the resin component (a) to the smooth surface of the substrate having a smooth surface, drying or irradiating light to form a resin layer (A) having a smooth surface, and forming the smooth surface of the resin layer (4) The resin having the WL disposed on the WL is a resin mold having the following conditions (1): (1). The above-mentioned resin component (b) i cloth constituting the material of the above-mentioned transfer object After the resin layer (8) having a smooth surface is formed on the smooth surface of the substrate having a smooth surface by drying or irradiating light, the water surface of the resin layer (B) formed on the smooth surface is disposed 3" As measured by 3257 Contact angle (Y1) disk Bu, /, the difference between the absolute value of the static contact angle (XI) is 20. ~60. . The method for producing a molded article according to claim 15, wherein the above-mentioned resin mold core is formed into a finely shaped surface by the pro-39 201127609 into a resin layer (Α), and is subjected to hydration treatment. According to JIS R 3257 hydration treatment, and the resin mold is formed, the smooth surface of the resin layer (A) formed is measured by disposing 3 μL of water on the smooth surface of the hydration treatment. The static contact angle (Χ2) is the resin mold of the following condition (2): Condition (2): The difference between the above static contact angle (γι) and the above static contact angle (Χ2) ((Υ1)-(Χ2)) is 20. ~60. . Reference 40
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