KR101747688B1 - Led를 위한 광 산란 및 변환판 - Google Patents

Led를 위한 광 산란 및 변환판 Download PDF

Info

Publication number
KR101747688B1
KR101747688B1 KR1020117030162A KR20117030162A KR101747688B1 KR 101747688 B1 KR101747688 B1 KR 101747688B1 KR 1020117030162 A KR1020117030162 A KR 1020117030162A KR 20117030162 A KR20117030162 A KR 20117030162A KR 101747688 B1 KR101747688 B1 KR 101747688B1
Authority
KR
South Korea
Prior art keywords
layer
systems
lighting
thickness
conversion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020117030162A
Other languages
English (en)
Korean (ko)
Other versions
KR20120030425A (ko
Inventor
한스-헬무트 베크텔
마티아스 하이드만
피터 제이. 슈미트
Original Assignee
코닌클리케 필립스 엔.브이.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 코닌클리케 필립스 엔.브이. filed Critical 코닌클리케 필립스 엔.브이.
Publication of KR20120030425A publication Critical patent/KR20120030425A/ko
Application granted granted Critical
Publication of KR101747688B1 publication Critical patent/KR101747688B1/ko
Assigned to 루미리즈 홀딩 비.브이. reassignment 루미리즈 홀딩 비.브이. 권리의 전부이전등록 Assignors: 코닌클리케 필립스 엔.브이.
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V13/00—Producing particular characteristics or distribution of the light emitted by means of a combination of elements specified in two or more of main groups F21V1/00 - F21V11/00
    • F21V13/02—Combinations of only two kinds of elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
    • H10H20/8512—Wavelength conversion materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8514—Wavelength conversion means characterised by their shape, e.g. plate or foil
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/882—Scattering means

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)
  • Optical Elements Other Than Lenses (AREA)
  • Luminescent Compositions (AREA)
  • Circuit Arrangement For Electric Light Sources In General (AREA)
  • Planar Illumination Modules (AREA)
  • Electroluminescent Light Sources (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Laminated Bodies (AREA)
KR1020117030162A 2009-05-19 2010-05-17 Led를 위한 광 산란 및 변환판 Active KR101747688B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP09160613.7 2009-05-19
EP09160613 2009-05-19
PCT/IB2010/052167 WO2010134011A2 (en) 2009-05-19 2010-05-17 Light scattering and conversion plate for leds

Publications (2)

Publication Number Publication Date
KR20120030425A KR20120030425A (ko) 2012-03-28
KR101747688B1 true KR101747688B1 (ko) 2017-06-16

Family

ID=42983411

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020117030162A Active KR101747688B1 (ko) 2009-05-19 2010-05-17 Led를 위한 광 산란 및 변환판

Country Status (8)

Country Link
US (3) US8721098B2 (enExample)
EP (1) EP2436047B1 (enExample)
JP (1) JP2012527763A (enExample)
KR (1) KR101747688B1 (enExample)
CN (1) CN102428583B (enExample)
BR (1) BRPI1007686B1 (enExample)
RU (1) RU2531848C2 (enExample)
WO (1) WO2010134011A2 (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012527763A (ja) * 2009-05-19 2012-11-08 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ Ledのための光散乱及び変換板
DE102011012298A1 (de) * 2010-12-28 2012-06-28 Osram Opto Semiconductors Gmbh Verbundsubstrat, Halbleiterchip mit Verbundsubstrat und Verfahren zur Herstellung von Verbundsubstraten und Halbleiterchips
EP2482350A1 (en) 2011-02-01 2012-08-01 Koninklijke Philips Electronics N.V. LED assembly comprising a light scattering layer
DE102011050450A1 (de) 2011-05-18 2012-11-22 Osram Opto Semiconductors Gmbh Optoelektronischer Halbleiterchip, optoelektronisches Halbleiterbauelement und Verfahren zur Herstellung eines optoelektronischen Halbleiterbauelements
KR20150113183A (ko) * 2013-02-06 2015-10-07 가부시키가이샤 고이토 세이사꾸쇼 발광 모듈
CN105776869A (zh) * 2014-12-17 2016-07-20 黄更生 一种激发白光led灯用玻璃陶瓷
CN107805496A (zh) * 2017-10-24 2018-03-16 彩虹集团新能源股份有限公司 一种led灯用扩散膜材料的制备方法
KR102411413B1 (ko) * 2019-06-05 2022-06-22 루미레즈 엘엘씨 인광체 변환기 방출기들의 접합
JP7170917B2 (ja) 2019-06-25 2022-11-14 ルミレッズ リミテッド ライアビリティ カンパニー マイクロled用の蛍光体層
US11362243B2 (en) 2019-10-09 2022-06-14 Lumileds Llc Optical coupling layer to improve output flux in LEDs
US11177420B2 (en) 2019-10-09 2021-11-16 Lumileds Llc Optical coupling layer to improve output flux in LEDs
US11411146B2 (en) 2020-10-08 2022-08-09 Lumileds Llc Protection layer for a light emitting diode

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007258228A (ja) * 2006-03-20 2007-10-04 Ngk Insulators Ltd 発光ダイオード素子用拡散板、発光ダイオード素子用拡散板構造および発光ダイオード装置
JP2007335798A (ja) * 2006-06-19 2007-12-27 Toyoda Gosei Co Ltd 発光装置
JP2008166740A (ja) * 2006-11-28 2008-07-17 Cree Inc 固体発光ダイの光学的プリフォーム並びにその作製および組み立ての方法及びシステム

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5695809A (en) 1995-11-14 1997-12-09 Micron Display Technology, Inc. Sol-gel phosphors
US6696703B2 (en) 1999-09-27 2004-02-24 Lumileds Lighting U.S., Llc Thin film phosphor-converted light emitting diode device
US7554258B2 (en) * 2002-10-22 2009-06-30 Osram Opto Semiconductors Gmbh Light source having an LED and a luminescence conversion body and method for producing the luminescence conversion body
DE10351349A1 (de) * 2003-10-31 2005-06-16 Osram Opto Semiconductors Gmbh Verfahren zum Hestellen eines Lumineszenzdiodenchips
US7361938B2 (en) * 2004-06-03 2008-04-22 Philips Lumileds Lighting Company Llc Luminescent ceramic for a light emitting device
US8164250B2 (en) * 2004-09-28 2012-04-24 Koninklijke Philips Electronics N.V. Light emitting device with improved conversion layer
CN1988188A (zh) 2005-12-23 2007-06-27 香港应用科技研究院有限公司 具有荧光层结构的发光二极管晶粒及其制造方法
KR100764148B1 (ko) * 2006-01-17 2007-10-05 루시미아 주식회사 시트상 형광체와 그 제조방법 및 이를 이용한 발광장치
WO2007085977A1 (en) * 2006-01-24 2007-08-02 Philips Intellectual Property & Standards Gmbh Light-emitting device
US8829779B2 (en) 2006-03-21 2014-09-09 Koninklijke Philips N.V. Electroluminescent device
US7285791B2 (en) 2006-03-24 2007-10-23 Goldeneye, Inc. Wavelength conversion chip for use in solid-state lighting and method for making same
US20090256167A1 (en) * 2006-06-08 2009-10-15 Koninklijke Philips Electronics N.V. Light-emitting device
JP2008103599A (ja) * 2006-10-20 2008-05-01 Toyoda Gosei Co Ltd 発光装置
US7521862B2 (en) * 2006-11-20 2009-04-21 Philips Lumileds Lighting Co., Llc Light emitting device including luminescent ceramic and light-scattering material
DE102006061175A1 (de) 2006-12-22 2008-06-26 Osram Opto Semiconductors Gmbh Strahlungsemittierendes Halbleiterbauelement und Verfahren
US7902564B2 (en) * 2006-12-22 2011-03-08 Koninklijke Philips Electronics N.V. Multi-grain luminescent ceramics for light emitting devices
JP5347354B2 (ja) 2007-09-18 2013-11-20 日亜化学工業株式会社 蛍光物質成形体及びその製造方法、発光装置
CN101463975A (zh) * 2007-12-19 2009-06-24 富士迈半导体精密工业(上海)有限公司 固态光源装置
CN101577297A (zh) * 2008-05-09 2009-11-11 旭丽电子(广州)有限公司 发光封装结构及其制造方法
RU84626U1 (ru) * 2008-07-23 2009-07-10 Закрытое Акционерное Общество "Протон-Импульс" (ЗАО "Протон-Импульс") Полупроводниковый излучатель
US8083364B2 (en) * 2008-12-29 2011-12-27 Osram Sylvania Inc. Remote phosphor LED illumination system
JP2012527763A (ja) * 2009-05-19 2012-11-08 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ Ledのための光散乱及び変換板
US8415692B2 (en) * 2009-07-06 2013-04-09 Cree, Inc. LED packages with scattering particle regions
US8547009B2 (en) * 2009-07-10 2013-10-01 Cree, Inc. Lighting structures including diffuser particles comprising phosphor host materials
US8723409B2 (en) * 2010-04-07 2014-05-13 Nichia Corporation Light emitting device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007258228A (ja) * 2006-03-20 2007-10-04 Ngk Insulators Ltd 発光ダイオード素子用拡散板、発光ダイオード素子用拡散板構造および発光ダイオード装置
JP2007335798A (ja) * 2006-06-19 2007-12-27 Toyoda Gosei Co Ltd 発光装置
JP2008166740A (ja) * 2006-11-28 2008-07-17 Cree Inc 固体発光ダイの光学的プリフォーム並びにその作製および組み立ての方法及びシステム

Also Published As

Publication number Publication date
US20120069546A1 (en) 2012-03-22
US8721098B2 (en) 2014-05-13
WO2010134011A2 (en) 2010-11-25
KR20120030425A (ko) 2012-03-28
BRPI1007686B1 (pt) 2019-11-05
RU2531848C2 (ru) 2014-10-27
BRPI1007686A2 (pt) 2016-12-27
RU2011151606A (ru) 2013-06-27
CN102428583A (zh) 2012-04-25
US9482411B2 (en) 2016-11-01
US20140204593A1 (en) 2014-07-24
US9966512B2 (en) 2018-05-08
WO2010134011A3 (en) 2011-01-13
JP2012527763A (ja) 2012-11-08
CN102428583B (zh) 2015-06-03
US20170047491A1 (en) 2017-02-16
EP2436047B1 (en) 2013-10-09
EP2436047A2 (en) 2012-04-04

Similar Documents

Publication Publication Date Title
US8721098B2 (en) Light scattering and conversion plate for LEDs
TWI557946B (zh) 具有圍封一光源的包封之照明裝置
JP5439365B2 (ja) 開口部を持つ支持構造体によって保持される波長変換素子を備える照明装置
US20080284329A1 (en) Led with Improve Light Emittance Profile
CN101305072B (zh) 具有改进的CaAlSiN光转换材料的发光器件
CN107304984A (zh) 波长转换部件以及投光灯
CN107109220A (zh) 具有温度稳定通量和饱和红色色点的磷光体转换led
KR20180052560A (ko) 파장 변환 부재 및 발광 디바이스
JP7117382B2 (ja) ガラス層を有する変換器
US20100181585A1 (en) Illumination system comprising a compound with low thermal expansion coefficient
WO2010063106A1 (en) Surface-emission light source with uniform illumination
EP3071876B1 (en) Light emitting device with spectral conversion element
TW201602313A (zh) 黃光螢光體及使用該黃光螢光體的發光裝置封裝
KR20240166610A (ko) 인광체 조명 시스템에 대한 반사 컬러 보정
JP5370047B2 (ja) 白色発光装置のための演色性改善方法および白色発光装置
KR101437839B1 (ko) 전계 발광 장치
CN116845687A (zh) 一种激光像素化荧光转换器、制备方法及应用
JP5107882B2 (ja) 光半導体封止用シート
JPWO2014010211A1 (ja) 発光モジュール
JP7147138B2 (ja) 発光装置、照明装置、画像表示装置及び車両表示灯
WO2025049221A1 (en) Electrophoretic deposition of converter materials onto thin non-conductive substrates
TW200928173A (en) Solid-state light source device

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

A201 Request for examination
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R11-asn-PN2301

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R14-asn-PN2301

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

FPAY Annual fee payment

Payment date: 20200527

Year of fee payment: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

FPAY Annual fee payment

Payment date: 20210524

Year of fee payment: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

FPAY Annual fee payment

Payment date: 20220520

Year of fee payment: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 9

U11 Full renewal or maintenance fee paid

Free format text: ST27 STATUS EVENT CODE: A-4-4-U10-U11-OTH-PR1001 (AS PROVIDED BY THE NATIONAL OFFICE)

Year of fee payment: 9