KR101734547B1 - 스위치 구조체 및 방법 - Google Patents
스위치 구조체 및 방법 Download PDFInfo
- Publication number
- KR101734547B1 KR101734547B1 KR1020100091557A KR20100091557A KR101734547B1 KR 101734547 B1 KR101734547 B1 KR 101734547B1 KR 1020100091557 A KR1020100091557 A KR 1020100091557A KR 20100091557 A KR20100091557 A KR 20100091557A KR 101734547 B1 KR101734547 B1 KR 101734547B1
- Authority
- KR
- South Korea
- Prior art keywords
- contact
- conductive element
- metal material
- less
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/0036—Switches making use of microelectromechanical systems [MEMS]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H59/00—Electrostatic relays; Electro-adhesion relays
- H01H59/0009—Electrostatic relays; Electro-adhesion relays making use of micromechanics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/0036—Switches making use of microelectromechanical systems [MEMS]
- H01H2001/0052—Special contact materials used for MEMS
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/0036—Switches making use of microelectromechanical systems [MEMS]
- H01H2001/0084—Switches making use of microelectromechanical systems [MEMS] with perpendicular movement of the movable contact relative to the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H2237/00—Mechanism between key and laykey
- H01H2237/004—Cantilever
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49105—Switch making
Landscapes
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Micromachines (AREA)
- Contacts (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/565,127 US8354899B2 (en) | 2009-09-23 | 2009-09-23 | Switch structure and method |
| US12/565,127 | 2009-09-23 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20110033055A KR20110033055A (ko) | 2011-03-30 |
| KR101734547B1 true KR101734547B1 (ko) | 2017-05-11 |
Family
ID=43303797
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020100091557A Active KR101734547B1 (ko) | 2009-09-23 | 2010-09-17 | 스위치 구조체 및 방법 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US8354899B2 (enExample) |
| EP (1) | EP2315221B1 (enExample) |
| JP (1) | JP2011091029A (enExample) |
| KR (1) | KR101734547B1 (enExample) |
| CN (1) | CN102034648B (enExample) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8779886B2 (en) * | 2009-11-30 | 2014-07-15 | General Electric Company | Switch structures |
| EP3160897A4 (en) * | 2014-06-27 | 2018-01-24 | Intel Corporation | Magnetic nanomechanical devices for stiction compensation |
| FR3027448B1 (fr) * | 2014-10-21 | 2016-10-28 | Airmems | Commutateur microelectromecanique robuste |
| US9362608B1 (en) | 2014-12-03 | 2016-06-07 | General Electric Company | Multichannel relay assembly with in line MEMS switches |
| US9663347B2 (en) * | 2015-03-02 | 2017-05-30 | General Electric Company | Electromechanical system substrate attachment for reduced thermal deformation |
| US9466452B1 (en) | 2015-03-31 | 2016-10-11 | Stmicroelectronics, Inc. | Integrated cantilever switch |
| FR3034567B1 (fr) | 2015-03-31 | 2017-04-28 | St Microelectronics Rousset | Dispositif metallique a piece(s) mobile(s) ameliore loge dans une cavite de la partie d'interconnexion (" beol ") d'un circuit integre |
| US9845235B2 (en) * | 2015-09-03 | 2017-12-19 | General Electric Company | Refractory seed metal for electroplated MEMS structures |
| KR101885996B1 (ko) * | 2017-04-18 | 2018-08-07 | 국민대학교산학협력단 | 3-d 프린터로 제작되는 mems 칸틸레버 스위치의 제조방법 |
| GB2564434B (en) | 2017-07-10 | 2020-08-26 | Ge Aviat Systems Ltd | Power distribution switch for a power distribution system |
| DE102022200337A1 (de) * | 2022-01-13 | 2023-07-13 | Robert Bosch Gesellschaft mit beschränkter Haftung | MEMS-Relais |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007516097A (ja) * | 2003-10-31 | 2007-06-21 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 高周波マイクロマシン技術及びそのような技術の製造方法 |
Family Cites Families (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5258591A (en) * | 1991-10-18 | 1993-11-02 | Westinghouse Electric Corp. | Low inductance cantilever switch |
| JP3612081B2 (ja) * | 1992-01-31 | 2005-01-19 | 株式会社東芝 | 導電コネクタ及び高強度ばね |
| EP0685109B1 (de) * | 1993-02-18 | 1997-08-13 | Siemens Aktiengesellschaft | Mikromechanisches relais mit hybridantrieb |
| US6153839A (en) * | 1998-10-22 | 2000-11-28 | Northeastern University | Micromechanical switching devices |
| US7137830B2 (en) * | 2002-03-18 | 2006-11-21 | Nanonexus, Inc. | Miniaturized contact spring |
| US7247035B2 (en) * | 2000-06-20 | 2007-07-24 | Nanonexus, Inc. | Enhanced stress metal spring contactor |
| US20030016417A1 (en) * | 2001-07-17 | 2003-01-23 | Cruise Lee | Wireless pointing and remote-controlling device for briefing |
| EP1454349B1 (en) | 2001-11-09 | 2006-09-27 | WiSpry, Inc. | Trilayered beam mems device and related methods |
| US6624003B1 (en) * | 2002-02-06 | 2003-09-23 | Teravicta Technologies, Inc. | Integrated MEMS device and package |
| US6686820B1 (en) * | 2002-07-11 | 2004-02-03 | Intel Corporation | Microelectromechanical (MEMS) switching apparatus |
| WO2004015729A1 (en) * | 2002-08-08 | 2004-02-19 | Xcom Wireless, Inc. | Microfabricated relay with multimorph actuator and electrostatic latch mechanism |
| US6699379B1 (en) * | 2002-11-25 | 2004-03-02 | Industrial Technology Research Institute | Method for reducing stress in nickel-based alloy plating |
| US20040154925A1 (en) * | 2003-02-11 | 2004-08-12 | Podlaha Elizabeth J. | Composite metal and composite metal alloy microstructures |
| JP2005113189A (ja) * | 2003-10-07 | 2005-04-28 | Yoshihiko Yokoyama | ナノ組織化合金 |
| JP2005146405A (ja) * | 2003-11-14 | 2005-06-09 | Toru Yamazaki | 電析積層合金薄板とその製造方法 |
| JP4366310B2 (ja) * | 2004-12-24 | 2009-11-18 | シャープ株式会社 | マイクロ接点開閉器および無線通信機器 |
| EP1705676B9 (en) * | 2005-03-21 | 2010-08-11 | Delfmems | RF MEMS switch with a flexible and free switch membrane |
| US7663456B2 (en) * | 2005-12-15 | 2010-02-16 | General Electric Company | Micro-electromechanical system (MEMS) switch arrays |
| US7872432B2 (en) * | 2006-03-20 | 2011-01-18 | Innovative Micro Technology | MEMS thermal device with slideably engaged tether and method of manufacture |
| US7812703B2 (en) * | 2006-03-23 | 2010-10-12 | Innovative Micro Technology | MEMS device using NiMn alloy and method of manufacture |
| US7688167B2 (en) * | 2006-10-12 | 2010-03-30 | Innovative Micro Technology | Contact electrode for microdevices and etch method of manufacture |
| US8274200B2 (en) * | 2007-11-19 | 2012-09-25 | Xcom Wireless, Inc. | Microfabricated cantilever slider with asymmetric spring constant |
| US7609136B2 (en) * | 2007-12-20 | 2009-10-27 | General Electric Company | MEMS microswitch having a conductive mechanical stop |
-
2009
- 2009-09-23 US US12/565,127 patent/US8354899B2/en active Active
-
2010
- 2010-09-09 JP JP2010201497A patent/JP2011091029A/ja active Pending
- 2010-09-17 EP EP10177345A patent/EP2315221B1/en active Active
- 2010-09-17 KR KR1020100091557A patent/KR101734547B1/ko active Active
- 2010-09-21 CN CN201010500702.8A patent/CN102034648B/zh active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007516097A (ja) * | 2003-10-31 | 2007-06-21 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 高周波マイクロマシン技術及びそのような技術の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP2315221B1 (en) | 2012-11-14 |
| CN102034648A (zh) | 2011-04-27 |
| US8354899B2 (en) | 2013-01-15 |
| US20110067983A1 (en) | 2011-03-24 |
| JP2011091029A (ja) | 2011-05-06 |
| EP2315221A1 (en) | 2011-04-27 |
| KR20110033055A (ko) | 2011-03-30 |
| CN102034648B (zh) | 2014-06-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101734547B1 (ko) | 스위치 구조체 및 방법 | |
| KR101983854B1 (ko) | 마이크로 전기 기계 시스템(mems) 장치 형성 방법 | |
| JP5829804B2 (ja) | スイッチ構造体 | |
| US8054148B2 (en) | Contact material, device including contact material, and method of making | |
| US20060274470A1 (en) | Contact material, device including contact material, and method of making | |
| EP1876614A2 (en) | Contact material, device including contact material, and method of making | |
| JP6854769B2 (ja) | 熱変形低減用の電気機械システム基板アタッチメント | |
| Lee et al. | Micro-electro-mechanical relays-design concepts and process demonstrations | |
| JP2018527206A (ja) | 電気めっきmems構造の高融点シード金属 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0109 | Patent application |
Patent event code: PA01091R01D Comment text: Patent Application Patent event date: 20100917 |
|
| PG1501 | Laying open of application | ||
| A201 | Request for examination | ||
| PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 20150716 Comment text: Request for Examination of Application Patent event code: PA02011R01I Patent event date: 20100917 Comment text: Patent Application |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20160822 Patent event code: PE09021S01D |
|
| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
Patent event code: PE07011S01D Comment text: Decision to Grant Registration Patent event date: 20170227 |
|
| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
Comment text: Registration of Establishment Patent event date: 20170502 Patent event code: PR07011E01D |
|
| PR1002 | Payment of registration fee |
Payment date: 20170502 End annual number: 3 Start annual number: 1 |
|
| PG1601 | Publication of registration | ||
| PR1001 | Payment of annual fee |
Payment date: 20200504 Start annual number: 4 End annual number: 4 |
|
| PR1001 | Payment of annual fee |
Payment date: 20210426 Start annual number: 5 End annual number: 5 |
|
| PR1001 | Payment of annual fee |
Payment date: 20240424 Start annual number: 8 End annual number: 8 |