KR101734547B1 - 스위치 구조체 및 방법 - Google Patents

스위치 구조체 및 방법 Download PDF

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Publication number
KR101734547B1
KR101734547B1 KR1020100091557A KR20100091557A KR101734547B1 KR 101734547 B1 KR101734547 B1 KR 101734547B1 KR 1020100091557 A KR1020100091557 A KR 1020100091557A KR 20100091557 A KR20100091557 A KR 20100091557A KR 101734547 B1 KR101734547 B1 KR 101734547B1
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South Korea
Prior art keywords
contact
conductive element
metal material
less
temperature
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Korean (ko)
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KR20110033055A (ko
Inventor
크리스토퍼 프레드 키멜
마르코 프란시스코 에이미
슈브라 반살
리드 로이더 코더만
쿠나 벤카트 사티야 라마 키셔
에듈라 수드하카르 레디
아타누 사하
카나카사바파시 수브라마니안
파라그 타크레
알렉스 데이비드 코윈
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제너럴 일렉트릭 캄파니
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00Contacts
    • H01H1/0036Switches making use of microelectromechanical systems [MEMS]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H59/00Electrostatic relays; Electro-adhesion relays
    • H01H59/0009Electrostatic relays; Electro-adhesion relays making use of micromechanics
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00Contacts
    • H01H1/0036Switches making use of microelectromechanical systems [MEMS]
    • H01H2001/0052Special contact materials used for MEMS
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00Contacts
    • H01H1/0036Switches making use of microelectromechanical systems [MEMS]
    • H01H2001/0084Switches making use of microelectromechanical systems [MEMS] with perpendicular movement of the movable contact relative to the substrate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H2237/00Mechanism between key and laykey
    • H01H2237/004Cantilever
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49105Switch making

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  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Micromachines (AREA)
  • Contacts (AREA)
KR1020100091557A 2009-09-23 2010-09-17 스위치 구조체 및 방법 Active KR101734547B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/565,127 US8354899B2 (en) 2009-09-23 2009-09-23 Switch structure and method
US12/565,127 2009-09-23

Publications (2)

Publication Number Publication Date
KR20110033055A KR20110033055A (ko) 2011-03-30
KR101734547B1 true KR101734547B1 (ko) 2017-05-11

Family

ID=43303797

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KR1020100091557A Active KR101734547B1 (ko) 2009-09-23 2010-09-17 스위치 구조체 및 방법

Country Status (5)

Country Link
US (1) US8354899B2 (enExample)
EP (1) EP2315221B1 (enExample)
JP (1) JP2011091029A (enExample)
KR (1) KR101734547B1 (enExample)
CN (1) CN102034648B (enExample)

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US8779886B2 (en) * 2009-11-30 2014-07-15 General Electric Company Switch structures
EP3160897A4 (en) * 2014-06-27 2018-01-24 Intel Corporation Magnetic nanomechanical devices for stiction compensation
FR3027448B1 (fr) * 2014-10-21 2016-10-28 Airmems Commutateur microelectromecanique robuste
US9362608B1 (en) 2014-12-03 2016-06-07 General Electric Company Multichannel relay assembly with in line MEMS switches
US9663347B2 (en) * 2015-03-02 2017-05-30 General Electric Company Electromechanical system substrate attachment for reduced thermal deformation
US9466452B1 (en) 2015-03-31 2016-10-11 Stmicroelectronics, Inc. Integrated cantilever switch
FR3034567B1 (fr) 2015-03-31 2017-04-28 St Microelectronics Rousset Dispositif metallique a piece(s) mobile(s) ameliore loge dans une cavite de la partie d'interconnexion (" beol ") d'un circuit integre
US9845235B2 (en) * 2015-09-03 2017-12-19 General Electric Company Refractory seed metal for electroplated MEMS structures
KR101885996B1 (ko) * 2017-04-18 2018-08-07 국민대학교산학협력단 3-d 프린터로 제작되는 mems 칸틸레버 스위치의 제조방법
GB2564434B (en) 2017-07-10 2020-08-26 Ge Aviat Systems Ltd Power distribution switch for a power distribution system
DE102022200337A1 (de) * 2022-01-13 2023-07-13 Robert Bosch Gesellschaft mit beschränkter Haftung MEMS-Relais

Citations (1)

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Publication number Priority date Publication date Assignee Title
JP2007516097A (ja) * 2003-10-31 2007-06-21 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 高周波マイクロマシン技術及びそのような技術の製造方法

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US5258591A (en) * 1991-10-18 1993-11-02 Westinghouse Electric Corp. Low inductance cantilever switch
JP3612081B2 (ja) * 1992-01-31 2005-01-19 株式会社東芝 導電コネクタ及び高強度ばね
EP0685109B1 (de) * 1993-02-18 1997-08-13 Siemens Aktiengesellschaft Mikromechanisches relais mit hybridantrieb
US6153839A (en) * 1998-10-22 2000-11-28 Northeastern University Micromechanical switching devices
US7137830B2 (en) * 2002-03-18 2006-11-21 Nanonexus, Inc. Miniaturized contact spring
US7247035B2 (en) * 2000-06-20 2007-07-24 Nanonexus, Inc. Enhanced stress metal spring contactor
US20030016417A1 (en) * 2001-07-17 2003-01-23 Cruise Lee Wireless pointing and remote-controlling device for briefing
EP1454349B1 (en) 2001-11-09 2006-09-27 WiSpry, Inc. Trilayered beam mems device and related methods
US6624003B1 (en) * 2002-02-06 2003-09-23 Teravicta Technologies, Inc. Integrated MEMS device and package
US6686820B1 (en) * 2002-07-11 2004-02-03 Intel Corporation Microelectromechanical (MEMS) switching apparatus
WO2004015729A1 (en) * 2002-08-08 2004-02-19 Xcom Wireless, Inc. Microfabricated relay with multimorph actuator and electrostatic latch mechanism
US6699379B1 (en) * 2002-11-25 2004-03-02 Industrial Technology Research Institute Method for reducing stress in nickel-based alloy plating
US20040154925A1 (en) * 2003-02-11 2004-08-12 Podlaha Elizabeth J. Composite metal and composite metal alloy microstructures
JP2005113189A (ja) * 2003-10-07 2005-04-28 Yoshihiko Yokoyama ナノ組織化合金
JP2005146405A (ja) * 2003-11-14 2005-06-09 Toru Yamazaki 電析積層合金薄板とその製造方法
JP4366310B2 (ja) * 2004-12-24 2009-11-18 シャープ株式会社 マイクロ接点開閉器および無線通信機器
EP1705676B9 (en) * 2005-03-21 2010-08-11 Delfmems RF MEMS switch with a flexible and free switch membrane
US7663456B2 (en) * 2005-12-15 2010-02-16 General Electric Company Micro-electromechanical system (MEMS) switch arrays
US7872432B2 (en) * 2006-03-20 2011-01-18 Innovative Micro Technology MEMS thermal device with slideably engaged tether and method of manufacture
US7812703B2 (en) * 2006-03-23 2010-10-12 Innovative Micro Technology MEMS device using NiMn alloy and method of manufacture
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Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007516097A (ja) * 2003-10-31 2007-06-21 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 高周波マイクロマシン技術及びそのような技術の製造方法

Also Published As

Publication number Publication date
EP2315221B1 (en) 2012-11-14
CN102034648A (zh) 2011-04-27
US8354899B2 (en) 2013-01-15
US20110067983A1 (en) 2011-03-24
JP2011091029A (ja) 2011-05-06
EP2315221A1 (en) 2011-04-27
KR20110033055A (ko) 2011-03-30
CN102034648B (zh) 2014-06-25

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