KR101726899B1 - 기판의 접합 장치, 기판의 접합 방법 및 기판 접합 헤드 - Google Patents

기판의 접합 장치, 기판의 접합 방법 및 기판 접합 헤드 Download PDF

Info

Publication number
KR101726899B1
KR101726899B1 KR1020127004711A KR20127004711A KR101726899B1 KR 101726899 B1 KR101726899 B1 KR 101726899B1 KR 1020127004711 A KR1020127004711 A KR 1020127004711A KR 20127004711 A KR20127004711 A KR 20127004711A KR 101726899 B1 KR101726899 B1 KR 101726899B1
Authority
KR
South Korea
Prior art keywords
substrate
head portion
elastic body
air chamber
holding
Prior art date
Application number
KR1020127004711A
Other languages
English (en)
Korean (ko)
Other versions
KR20120037500A (ko
Inventor
가쯔미 데라다
Original Assignee
토레이 엔지니어링 컴퍼니, 리미티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 토레이 엔지니어링 컴퍼니, 리미티드 filed Critical 토레이 엔지니어링 컴퍼니, 리미티드
Publication of KR20120037500A publication Critical patent/KR20120037500A/ko
Application granted granted Critical
Publication of KR101726899B1 publication Critical patent/KR101726899B1/ko

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/0007—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality
    • B32B37/0015—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality to avoid warp or curl
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K3/00—Circuits for generating electric pulses; Monostable, bistable or multistable circuits
    • H03K3/02—Generators characterised by the type of circuit or by the means used for producing pulses
    • H03K3/36—Generators characterised by the type of circuit or by the means used for producing pulses by the use, as active elements, of semiconductors, not otherwise provided for
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2310/00—Treatment by energy or chemical effects
    • B32B2310/08—Treatment by energy or chemical effects by wave energy or particle radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B32B37/1207—Heat-activated adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Quality & Reliability (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Combinations Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Wire Bonding (AREA)
KR1020127004711A 2009-07-24 2010-07-23 기판의 접합 장치, 기판의 접합 방법 및 기판 접합 헤드 KR101726899B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2009-173003 2009-07-24
JP2009173003A JP5314523B2 (ja) 2009-07-24 2009-07-24 基板の貼合せ装置及び方法、並びに、基板貼合せヘッド
PCT/JP2010/062453 WO2011010729A1 (ja) 2009-07-24 2010-07-23 基板の貼合せ装置、基板の貼合せ方法、及び、基板貼合せヘッド

Publications (2)

Publication Number Publication Date
KR20120037500A KR20120037500A (ko) 2012-04-19
KR101726899B1 true KR101726899B1 (ko) 2017-04-13

Family

ID=43499201

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020127004711A KR101726899B1 (ko) 2009-07-24 2010-07-23 기판의 접합 장치, 기판의 접합 방법 및 기판 접합 헤드

Country Status (5)

Country Link
JP (1) JP5314523B2 (ja)
KR (1) KR101726899B1 (ja)
CN (1) CN102474991B (ja)
TW (1) TWI494220B (ja)
WO (1) WO2011010729A1 (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101367668B1 (ko) * 2011-11-23 2014-02-28 엘아이지에이디피 주식회사 기판 합착 장치 및 기판 합착 방법
JP6188123B2 (ja) 2012-12-28 2017-08-30 芝浦メカトロニクス株式会社 貼合装置および貼合処理方法
CN108664171A (zh) * 2018-05-22 2018-10-16 新辉开科技（深圳）有限公司 一种塑料盖板与玻璃贴合的方法
CN109633945A (zh) * 2019-01-21 2019-04-16 信利半导体有限公司 一种显示模组的全贴合方法
CN112670215B (zh) * 2020-12-31 2023-06-20 北京中电科电子装备有限公司 用于晶圆键合和解键合的装置及晶圆键合和解键合方法
TWI823702B (zh) * 2022-12-05 2023-11-21 斯託克精密科技股份有限公司 用以頂推電子基板之裝置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004273980A (ja) 2003-03-12 2004-09-30 Canon Inc 基板間配線電極接合の方法及び構造体
JP2005209704A (ja) 2004-01-20 2005-08-04 Fujikura Ltd 回路基板の接合構造及び接合方法
JP2005317273A (ja) 2004-04-27 2005-11-10 Seiko Epson Corp 有機ｅｌ装置の製造方法及び電子機器

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61500311A (ja) * 1983-11-02 1986-02-27 ベツク，ジヨゼフ 箔のプレス加工の方法と装置、ならびにその方法で生産されるキーボード
JP3069511B2 (ja) * 1995-07-14 2000-07-24 松下電工株式会社 積層板製造用の積層物の積載装置
JP3997585B2 (ja) * 1998-01-26 2007-10-24 松下電工株式会社 多層板の製造方法
JP3932660B2 (ja) * 1998-03-30 2007-06-20 株式会社デンソー Ｅｌ表示装置の製造方法
JP2004296139A (ja) * 2003-03-25 2004-10-21 Sony Corp 貼合装置および貼合方法、ならびに表示装置の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004273980A (ja) 2003-03-12 2004-09-30 Canon Inc 基板間配線電極接合の方法及び構造体
JP2005209704A (ja) 2004-01-20 2005-08-04 Fujikura Ltd 回路基板の接合構造及び接合方法
JP2005317273A (ja) 2004-04-27 2005-11-10 Seiko Epson Corp 有機ｅｌ装置の製造方法及び電子機器

Also Published As

Publication number Publication date
KR20120037500A (ko) 2012-04-19
CN102474991B (zh) 2015-07-08
JP5314523B2 (ja) 2013-10-16
WO2011010729A1 (ja) 2011-01-27
CN102474991A (zh) 2012-05-23
TWI494220B (zh) 2015-08-01
JP2011029368A (ja) 2011-02-10
TW201107138A (en) 2011-03-01

Similar Documents

Publication Publication Date Title
KR101726899B1 (ko) 기판의 접합 장치, 기판의 접합 방법 및 기판 접합 헤드
JP7309231B2 (ja) 樹脂成形装置および樹脂成形方法
JP6491120B2 (ja) 樹脂封止装置、樹脂封止方法及び樹脂成形品の製造方法
KR20190132336A (ko) 수지몰드장치
JP6430342B2 (ja) 樹脂成形装置及び樹脂成形方法並びに成形型
US10483228B2 (en) Apparatus for bonding semiconductor chip and method for bonding semiconductor chip
US20080202677A1 (en) Chip bonding tool and related apparatus and method
WO2016140124A1 (ja) 実装装置および実装方法
US20150053350A1 (en) Bonding method, bonding apparatus, and method for manufacturing substrate
WO2011089863A1 (ja) 加熱装置および実装体の製造方法
JP2019054209A (ja) 半導体製造装置、半導体装置の製造方法およびコレット
KR101930742B1 (ko) 휨 감소 장치 및 휨 감소 방법
WO2022004170A1 (ja) 物品の製造装置、物品の製造方法、プログラム、記録媒体
KR20180015568A (ko) 성형 형, 수지 성형 장치 및 수지 성형품의 제조 방법
KR20220048018A (ko) 접합 장치, 접합 시스템 및 접합 방법
JP6412376B2 (ja) チップと基板との接合方法、チップと基板との仮接合装置、チップ実装システム
WO2019065394A1 (ja) 実装装置
JP6799125B1 (ja) ボンディング装置およびボンディング方法
JP6966845B2 (ja) 温調装置、リソグラフィ装置、および物品の製造方法
CN116313850A (zh) 晶片转移方法
TW202316532A (zh) 壓縮成形裝置
KR20240140843A (ko) Fpcb 접합 장치

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant