KR101699777B1 - 전기 도금 장치 및 전기 도금 방법 - Google Patents

전기 도금 장치 및 전기 도금 방법 Download PDF

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Publication number
KR101699777B1
KR101699777B1 KR1020100086865A KR20100086865A KR101699777B1 KR 101699777 B1 KR101699777 B1 KR 101699777B1 KR 1020100086865 A KR1020100086865 A KR 1020100086865A KR 20100086865 A KR20100086865 A KR 20100086865A KR 101699777 B1 KR101699777 B1 KR 101699777B1
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KR
South Korea
Prior art keywords
space
plating
plating liquid
bath
separate
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KR1020100086865A
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English (en)
Korean (ko)
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KR20110027585A (ko
Inventor
토시히사 이소노
신지 타치바나
나오유키 오무라
?사쿠 호시
šœ사쿠 호시
카나코 마쯔다
코지 시미즈
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우에무라 고교 가부시키가이샤
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Publication of KR20110027585A publication Critical patent/KR20110027585A/ko
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Publication of KR101699777B1 publication Critical patent/KR101699777B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/02—Tanks; Installations therefor
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/04—Removal of gases or vapours ; Gas or pressure control
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/16—Regeneration of process solutions
    • C25D21/18—Regeneration of process solutions of electrolytes
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
KR1020100086865A 2009-09-08 2010-09-06 전기 도금 장치 및 전기 도금 방법 KR101699777B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2009-207286 2009-09-08
JP2009207286A JP5650899B2 (ja) 2009-09-08 2009-09-08 電気めっき装置

Publications (2)

Publication Number Publication Date
KR20110027585A KR20110027585A (ko) 2011-03-16
KR101699777B1 true KR101699777B1 (ko) 2017-01-25

Family

ID=43646854

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020100086865A KR101699777B1 (ko) 2009-09-08 2010-09-06 전기 도금 장치 및 전기 도금 방법

Country Status (5)

Country Link
US (1) US20110056840A1 (ja)
JP (1) JP5650899B2 (ja)
KR (1) KR101699777B1 (ja)
CN (1) CN102011169B (ja)
TW (1) TWI503455B (ja)

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KR20230060383A (ko) * 2021-10-27 2023-05-04 주식회사 에스이에이 첨두가 돌출된 패들을 포함하는 도금장치

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US20120234682A1 (en) * 2011-03-18 2012-09-20 E.I. Du Pont De Nemours And Company Process For Copper Plating Of Polyamide Articles
JP5795514B2 (ja) * 2011-09-29 2015-10-14 アルメックスＰｅ株式会社 連続メッキ装置
US9816196B2 (en) * 2012-04-27 2017-11-14 Novellus Systems, Inc. Method and apparatus for electroplating semiconductor wafer when controlling cations in electrolyte
US9359688B1 (en) 2012-12-05 2016-06-07 Novellus Systems, Inc. Apparatuses and methods for controlling PH in electroplating baths
KR101335271B1 (ko) * 2013-02-21 2013-11-29 주식회사 에스아이 플렉스 Ｖｉａ ｆｉｌｌ 동도금을 이용한 ｂｖｈ도포 ｐｓｒ 인쇄공법
US10190232B2 (en) 2013-08-06 2019-01-29 Lam Research Corporation Apparatuses and methods for maintaining pH in nickel electroplating baths
WO2015055537A1 (de) * 2013-10-17 2015-04-23 Damm Oberflächentechnik Gmbh & Co. Kg Verfahren und vorrichtung zum beschichten von kopfstützbügeln oder kopfstützstangen
US9732434B2 (en) 2014-04-18 2017-08-15 Lam Research Corporation Methods and apparatuses for electroplating nickel using sulfur-free nickel anodes
CN104005077B (zh) * 2014-05-14 2016-11-09 上海交通大学 优化温度场分布的电镀装置及其电镀方法
JP6585434B2 (ja) * 2014-10-06 2019-10-02 株式会社荏原製作所 めっき方法
US9777388B2 (en) * 2014-10-24 2017-10-03 Globalfoundries Inc. Electroplating system and method of using electroplating system for controlling concentration of organic additives in electroplating solution
US10450667B2 (en) * 2014-10-27 2019-10-22 International Business Machines Corporation System for treating solution for use in electroplating application and method for treating solution for use in electroplating application
CN104947091A (zh) * 2015-05-11 2015-09-30 深圳崇达多层线路板有限公司 一种印制电路板沉金工序活化缸循环管路
TWI615511B (zh) * 2015-05-20 2018-02-21 台灣先進系統股份有限公司 電鍍槽裝置
WO2017198722A1 (en) * 2016-05-19 2017-11-23 Atotech Deutschland Gmbh Method for monitoring the total amount of brighteners in an acidic copper/copper alloy plating bath and controlled process for plating
CN105803497B (zh) * 2016-05-24 2018-05-18 广州杰赛科技股份有限公司 新型电镀装置
KR102318603B1 (ko) * 2016-08-23 2021-10-27 에스케이넥실리스 주식회사 이차전지의 용량 유지율을 향상시킬 수 있는 전해동박, 그것을 포함하는 전극, 그것을 포함하는 이차전지, 및 그것의 제조방법
US20180202060A1 (en) * 2017-01-18 2018-07-19 Eci Technology, Inc. Measurement of total accelerator in an electrodeposition solution
WO2018189901A1 (ja) * 2017-04-14 2018-10-18 Ykk株式会社 めっき材及びその製造方法
TWI774797B (zh) * 2017-07-10 2022-08-21 美商應用材料股份有限公司 具有減少的夾帶空氣的電鍍系統
JP6653799B2 (ja) * 2017-07-31 2020-02-26 メルテックス株式会社 電解銅めっき用陽極、及びそれを用いた電解銅めっき装置
KR20200073243A (ko) * 2017-10-20 2020-06-23 아루멕쿠스 피이 가부시키가이샤 표면처리 장치
TWI663294B (zh) * 2017-12-15 2019-06-21 Chipbond Technology Corporation 電鍍裝置及其壓力艙
TWI662159B (zh) * 2018-03-21 2019-06-11 姜力 Plating tank structure
KR20210035833A (ko) * 2018-07-30 2021-04-01 레나 테크놀로지스 게엠베하 유량 발생기, 증착 디바이스 및 재료의 증착을 위한 방법
US11352710B2 (en) * 2019-09-30 2022-06-07 Abdurrahman Ildeniz Leak free brush electroplating system
EP3825445A1 (en) * 2019-11-22 2021-05-26 Semsysco GmbH Distribution body for a process fluid for chemical and/or electrolytic surface treatment of a substrate
US11697887B2 (en) 2020-10-23 2023-07-11 Applied Materials, Inc. Multi-compartment electrochemical replenishment cell
KR102283426B1 (ko) 2020-12-30 2021-07-29 (주) 탑스 복합 분사 장치 및 이를 포함하는 전기 도금 장치
CN112941513B (zh) * 2021-01-29 2022-11-29 广西隆林利通线缆科技有限公司 无氰电镀铜包铝线的生产方法
KR102419332B1 (ko) * 2022-04-29 2022-07-12 주식회사 이피코리아 전기도금장치

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230060383A (ko) * 2021-10-27 2023-05-04 주식회사 에스이에이 첨두가 돌출된 패들을 포함하는 도금장치
KR102558375B1 (ko) 2021-10-27 2023-07-21 주식회사 에스이에이 첨두가 돌출된 패들을 포함하는 도금장치

Also Published As

Publication number Publication date
TW201109478A (en) 2011-03-16
JP2011058034A (ja) 2011-03-24
US20110056840A1 (en) 2011-03-10
CN102011169A (zh) 2011-04-13
JP5650899B2 (ja) 2015-01-07
CN102011169B (zh) 2014-10-08
TWI503455B (zh) 2015-10-11
KR20110027585A (ko) 2011-03-16

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