US3712329A - Plating solution pickup unit - Google Patents

Plating solution pickup unit Download PDF

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US3712329A
US3712329A US3712329DA US3712329A US 3712329 A US3712329 A US 3712329A US 3712329D A US3712329D A US 3712329DA US 3712329 A US3712329 A US 3712329A
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plating
tank
plating solution
reservoir
effluent
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B Streeter
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Dean Brothers Pumps Inc
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Dean Brothers Pumps Inc
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    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00Processes for servicing or operating cells for electrolytic coating
    • C25D21/16Regeneration of process solutions
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00Fluid handling
    • Y10T137/4673Plural tanks or compartments with parallel flow
    • Y10T137/4807Tank type manifold [i.e., one tank supplies or receives from at least two others]
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00Fluid handling
    • Y10T137/7287Liquid level responsive or maintaining systems
    • Y10T137/7313Control of outflow from tank
    • Y10T137/7323By float

Definitions

  • the dragout effect in metal electroplating machines results in the removal ofa portion of each liquid bath in which the parts to be plated are immersed and its conveyance into the subsequent liquid bath into which the parts are immersed due to the liquids adhering to and being entrapped by the parts and the conveying apparatus of the plating machine.
  • the dragout effect results in substantially equal volumes of liquid being carried into and out of each successive bath as the parts and conveying apparatus are sequentially immersed therein.
  • preplating solution is carried into the plating solution, and plating solution is carried out of the plating tank into the rinse water of the first rinse tank.
  • the effect is to dilute the concentration of plating solution in the plating tank without decreasing the volume of liquid in the plating tank, except as the volume may be reduced by evaporating to the atmosphere.
  • the present invention provides an apparatus for removing plating solution from the plating tank as concentrate is added thereto, and does so in a manner that precludes accidentally removing an excess of plating solution from the plating tank.
  • the apparatus is adapted to mix the flow of plating solution removed from the plating tank with the flow of rinse system effluent to the reclaiming unit, and may be adapted to deliver plating solution to the reclaiming unit, when because of surges in the rinse system and intermittent plating machine operation, there may be no effluent flow for varying periods of time.
  • the present invention also provides a great amount of versatility in the operation of a reclaiming unit by providing a means whereby a plurality of electroplating machines plating the same metal at the same or different plating solution concentrations and having different rinse system flow rates may be serviced by a single reclaiming unit.
  • This improvement heretofore believed unattainable, results not only in versatility, but also achieves additional economies both in equipment cost and in operating expenses.
  • the apparatus of the present invention may include a first reservoir arranged to receive the overflow of effluent from the rinse system, a second reservoir for receiving plating solution from the plating tank and adapted to overflow into a third reservoir that drains into the first reservoir, thereby limiting the volume of plating solution that may be taken from the plating tank.
  • a first conduit leads from near the bottom of the first reservoir to the reclaiming unit.
  • a float operated valve in the first conduit is adapted to open as the liquid level in the first reservoir rises and to close as it falls, going fully closed at a liquid level above the top of the float operated valve.
  • the pickup unit may also include a fourth reservoir between the rinse system and the first reservoir, which may overflow into the first reservoir via a weir notch that may be used to measure the effluent flow rate.
  • a second float operated valve may be added to the pickup unit to admit makeup water to the system when it is needed.
  • a concentration measuring device in connection with a pickup unit permits the use of a single plating solution reclaiming unit with a plurality of plating machines plating the same metal in different concentration plating solutions. Also, the rinse systems of the different plating machines served by the one reclaiming unit may have different flow rates.
  • lt is another object of the present invention to provide a'piekup unit adapted to receive effluent and plating solution from a plating machine, mix the two, and control the flow thereof to a reclaiming unit.
  • Still another object of the present invention is to provide a pickup unit that will automatically add makeup water to the effluent when it is required.
  • Yet another object of the present invention is to provide a method or process for use with plating machines and reclaiming units whereby greater control and versatility may be achieved.
  • Another object ofthe present invention is to provide a method and apparatus whereby a plurality of plating machines may be served by a single reclaiming unit, and wherein the plurality of plating machines may be operated with different effluent flow rates and plating solution concentrations.
  • FIG. 1 is a diagrammatic plan view showing a portion of the tanks of a plating machine and the general relationship thereto of the pickup unit of the present invention.
  • FIG. 2 is a somewhat diagrammatic cross-sectional elevation view showing the hydraulic relationship of the pickup unit of the present invention to the plating tank and a rinse tank of an electroplating machine.
  • FIG. 3 is a generally perspective view of one assembly of the pickup unit of the present invention.
  • FIG. 4 is a diagrammatic illustration showing how the pickup unit of the present invention permits one reclaiming unit to serve a plurality of plating machines.
  • FIG. 5 is an electrical schematic diagram showing one control circuit which may be used with the arrangement illustrated in FIG. 4.
  • FIG. 6 is a generally diagrammatic cross-sectional view of another embodiment of the pickup unit of the present invention.
  • FIG. 1 there is shown diagrammatically a plan view ofa portion of the tanks ofa plating machine.
  • the tanks may include a preplating tank 11, a plating tank 12 which may have stations l3, l4 and 15 and a counterflow rinse system 21, having tanks 22, 23 and 24.
  • the parts to be plated are conveyed by a conveying means (not shown) sequentially through the tanks and stations from left to right.
  • preplating solution from tank 11 is carried into the plating tank 12 and plating solution is carried out of the plating tank 12 into the rinse tank 22.
  • the volumes carried into and out of the plating tank by the dragout effect are substantially equal, thereby substantially maintaining the liquid level in the plating tank constant while at the same time diluting the concentration of the plating solution with preplating solution.
  • tank 24 In the counterflow rinse system 21, fresh water is admitted to tank 24, tank 24 overflows into tank 23, tank 23 overflows into tank 22, and the contaminated rinse water (effluent) is removed from tank 22. It will be seen that tank 22 will contain the highest concentration of plating solution and tank 24 will contain the lowest.
  • the effluent withdrawn from tank 22 may be run through a plating solution reclaiming unit where the plating solution is reclaimed and distilled water or distillate made available to be reused in the rinse system.
  • the reclaimed plating solution or concentrate may be returned to the plating tank.
  • Processes have been used in the past wherein a volume of plating solution is withdrawn from the plating tank, placed in a heated vessel, and water evaporated therefrom.
  • the equipment used in these processes has taken its suction directly from the plating tank, and has on occasion withdrawn an excess of plating solution from the plating tank. This has two possible deleterious effects.
  • the plating solution may escape through an overflow pipe from the heated vessel and be drained to a sewer or stream.
  • the level of plating solution in the plating tank may be lowered below the minimum operating level so that the plating machine must be shut down until the plating solution level is raised.
  • the pickup unit of the present invention solves each of these problems by providing automatic withdrawal of the proper amount of plating solution from the plating tank, and does so by overflow means that prevent lowering the level in the plating tank below the minimum operating level.
  • FIG. 2 shows one embodiment of the pickup unit of the present invention, indicated generally at 30, located adjacent the last station 15 of the plating tank 12 and the first rinse tank 22.
  • the pickup unit 30 may have three reservoirs 31, 32 and 33.
  • the reservoirs 32 and 33 may be formed by an assembly 36 having a generally cylindrical sidewall 37, a bottom 38 and a partition 39 that generally vertically bisects the assembly 36.
  • a conduit 41 connects reservoir 32 to the plating tank 12 at a point below the minimum normal operating level 42 of the plating solution. Conduit 41 preferably slopes so that it may be rodded out easily when sludge or precipitates collect in it.
  • FIG. 3 shows a generally perspective view of the assembly 36 wherein the partition 39 has a V-notch weir located in its upper margin.
  • the bottom of the V-notch is located at the same elevation as the minimum normal operating level 42 of the plating solution in the plating tank 12. It will be seen from the arrangement of the reservoirs 32 and 33 that when plating solution is above the level 42 it will flow through conduit 41 into reservoir 32 and overflow into reservoir 33. Because of the characteristic of the V-notch, the higher the level above level 42, the greater the flow rate from reservoir 32 to reservoir 33. Standard weir formulas may be used to calculate the flow rate of plating solution through the V-notch.
  • Reservoir 31 is formed by an open top vessel 43 which may be supported by legs 44.
  • a conduit 45 which is preferably formed of flexible tubing or hose to facilitate breaking up any sludge or plating solution chemical precipitates that may collect therein, connects the bottom of reservoir 33 to reservoir 31.
  • Another conduit 46 connects rinse tank 22 to reservoir 31 as shown in FIG. 2.
  • the connection of conduit 46 to tank 22 is located at the desired liquid level 48 so that effluent will overflow from tank 22 into reservoir 31
  • conduit 46 provides an overflow type of connection, thereby eliminating the possibility of drawing the level of rinse water in tank 22 down too low. If no measure of the plating solution flow rate is desired, the vessel 36 and reservoirs 32 and 33 could be omitted, the connection to the plating tank being made, in a manner similar to the connection to the rinse tank, at the normal minimum operating level.
  • the upper margins of reservoirs 31, 32 and 33 should be made substantially the same height as the plating tank 12 and the rinse tank 22. This is because the volumes of the reservoirs are comparatively small in relation to the volumes of the plating and rinse tanks. When a load of parts being plated or rinsed is lowered into the plating or rinse tanks, the liquid displaced could cause the reservoirs to overflow onto the floor if their margins were not high enough.
  • a conduit 51 extends downwardly into reservoir 31 to a point near the bottom. At its lower end is a strainer 52. Its other end is connected to a plating solution reclaiming unit, to be more fully described subsequently.
  • a valve 53 that is operated through a linkage 54 by a float 55. The valve 53 is adapted to open as the liquid level in reservoir 31 rises and to close as it falls, the valve 53 going fully closed before it is exposed to the air. In this manner, should the operating stem of valve 53 leak, no air would be permitted to enter the conduit 51 and be admitted to the reclaiming unit.
  • the assembly 36 may be mounted directly on the side of the plating tank by suitable mounting means.
  • the conduits 45 and 46 may be formed of flexible hose or tubing for ease of handling and routing, as well as for ease of cleaning as noted above.
  • rinse system effluent flows from rinse tank 22 through conduit 46 into reservoir 31, where, so long as the liquid level is sufficiently high to maintain valve 53 open, it is drawn into conduit 51 and conveyed to the reclaiming unit.
  • This flow is generally continuous, except for momentary surges when parts are immersed in the rinse tanks and momentary stoppages when the parts are withdrawn from the rinse tanks.
  • the flow of plating solution from the plating tank 12 through conduit 4land reservoir 32 and over the partition 39 into reservoir 33 and into reservoir 31 via conduit 45 is somewhat intermittent. As stated earlier, the dragout effect does not substantially change the volume of plating solution in the plating tank, but merely dilutes it.
  • a pickup unit 30 may be used advantageously to receive the rinse system effluent and plating solution from their respective tanks, providing a measurement of the flow rates if desired, and controlling their flow to the reclaiming unit.
  • the pickup unit and method of the present invention makes such operation possible.
  • FIG. 4 there is shown a partial diagrammatic plan view of three plating machines, indicated at A, B and C.
  • Each plating machine has a plating tank 12, with stations 13, 14 and 15, rinse tanks 22, 23 and 24, and a pickup unit 30, lower case letters being used to identify each element to its particular plating machine.
  • Also associated with each plating machine is a distillate valve 56, a concentrate valve 57, and a concentration measuring device 58, which may be arranged to measure the concentration of plating solution in the plating tank 12. All three plating machines are served by a single reclaiming unit 65.
  • a conduit 66 carries distillate from the reclaiming unit to the rinse systems and a conduit 67 carries concentrate from the reclaiming unit to the plating tanks.
  • the concentration measuring device 58 may be of any of the types known to the art, however, one form that has been found to work quite satisfactorily is shown in FIG. 2, and includes a bob 71 supported -by a line 72 affixed to one end of a lever arm 73, the other end of which is adapted to receive weights 74 in much the same manner as a beam balance.
  • the bob 71 which is preferably conical at its upper end to help prevent any buildup thereon of sludge or precipitate that would alter its overall specific gravity, is provided with a specific gravity somewhat heavier than the specific gravity of the plating solution at the desired concentration.
  • the weights 74 are then chosen to partially counterbalance the bob 71 so that when the concentration of the plating solution is at the desired value the lever arm 73 is balanced. When the concentration falls below or rises above the desired value, the bob 71 descends and rises respectively.
  • the arm 73 is affixed near its center to a shaft 75 that operates an electrical switch 76. To protect the bob 71, it may be suspended within a perforated plastic tube 77.
  • valves 56 are adjusted to proportion the flow of distillate to each of the rinse systems as desired.
  • Each tank 24 overflows into tank 23, which overflows into tank 22, which overflows into reservoir 31 of pickup unit 30.
  • the flow of distillate to each rinse system is substantially constant, however, the flow of effluent to each reservoir 31 is not constant as a result of the conveying apparatus and parts being rinsed being periodically immersed in and removed from the rinse tanks, causing surges of effluent flow separated by periods of substantially no flow.
  • the flow of concentrate to the plating tank is not constant, but varies with the concentration of the plating solution in the plating tank.
  • valve 57 When the concentration of the plating solution in the plating tank falls below the desired concentration, bob 71 will descend, operating switch 76, which in turn opens valve 57 to admit concentrate to the plating tank. As concentrate is added to the plating tank to increase the concentration of the plating solution therein to the desired concentration, the liquid level in the plating tank rises. This causes plating solution to flow into reservoir 32 and overflow into reservoir 33 from which it drains into reservoir 31 and mixes with the effluent. Valve 53 controls the flow of mixture to the reclaiming unit and prevents any air from entering the line 51.
  • the reclaiming unit 65 may be provided with a concentrate storage tank wherein concentrate is stored until needed.
  • a concentration measuring device 78 on the reclaiming unit which may be similar to the devices 58,maintains the concentration of the concentrate in the storage tank at a higher value than that of the highest desired concentration plating solution.
  • plating machine A which may be a barrel type machine
  • plating machine C which may be a rack type machine
  • the concentrate produced by the reclaiming unit must have a concentration higher than that of the plating solution in plating machine A.
  • concentration measuring device 78 is connected to the concentrate valve 57 of the plating line having the highest concentration plating solution, in the present illustration, valve 57a. When this is done, concentration measuring device 580 may be dispensed with.
  • the electrical connections shown in FIG. may be used to interconnect the concentration measuring devices 58 and 78 and the valves 57, where each valve 57 has an operating coil 81 and concentration measuring device 78 operates a switch 82.
  • a conductor 84 and a conductor 85 are connected to a power supply 86.
  • Switch 82 has one side connected to conductor 84 and the other side connected to one side of coil 81a, one side of switch 76b and one side of switch 76c.
  • the other side of switch 76b is connected to one side of coil 81b and the other side of switch 76c is connected to one side of coil 810.
  • the other sides of coils 81a, 81b and 810 are connected to conductor 85.
  • concentration measuring device 78 closes switch 82 to energize coil 81a and open valve 57a to admit concentrate to plating tank 12a.
  • switch 76b or 76c respectively will close to energize its respective coil 81b or 810, providing that concentrate is presently available from the reclaiming unit 65, in.
  • each switch 82 will be closed.
  • each switch 76 will open, causing its respective valve 57 to close.
  • FIG. 6 there is shown another em bodiment of the pickup unit of the present invention wherein there is an assembly having reservoirs 31', 32, 33' and 94.
  • the reservoirs are connected in relation to the plating tank 12 and rinse tank 22 in the same relationship as the correspondingly numbered reservoirs in FIG. 2.
  • Reservoir 94 with its partition 96 may be used to provide a weir for measuring the flow of effluent to the pickup unit.
  • the pickup unit of FIG. 6 receives plating solution into reservoir 32" from the plating tank 12. The plating solution overflows the partition between reservoir 32 and 33' into reservoir 33'.
  • This partition mayhave its upper margin, or the bottom ofa weir notch in its upper margin, located at the same elevation as the minimum normal operating level 42 of plating solution in the plating tank I2.
  • a partition between reservoirs 33 and 31' may have its upper margin at the average normal operating level 95 of plating solution in the plating tank 12.
  • the partition 96 has its upper margin at the desired overflow level 48 of rinse water in rinse tank 22, and permits effluent to overflow into reservoir 31.
  • a float operated valve 53 in reservoir 31 operates in substantially the same manner as valve 53 of FIG. 2, to control the flow of plating solution and effluent through the conduit 51.
  • a conduit 97 may be provided between a point near the bottom of compartment 33' and conduit 51 and having therein a remotely operated valve 98.
  • the pickup unit of FIG. 6 will normally have plating solution filling reservoirs 32' and 33' and overflowing into reservoir 31. Effluent will be overflowing partition 96 into reservoir 31'.
  • the liquid level in reservoir 31 will be between its upper and lower limits, the lower limit being determined by the level at which valve 53' is fully closed. If the flow of effluent should cease, and the liquid level in reservoir 31 be drawn down to the minimum, closing valve 53', no liquid would be available to the reclaiming unit through conduit 51. If, during such a condition, liquid were required by the reclaiming unit for its proper operation, a liquid level control device on the reclaiming unit could open valve 98 to admit plating solution to conduit 51' to satisfy the reclaiming units liquid requirements.
  • a check valve 100 may be installed at the outlet of conduit 46 to prevent plating solution from flowing into the rinse tank should the reclaiming unit stop taking liquid through conduit 51 and reservoir 31 become filled with plating solution.
  • a pickup unit for use with a plating solution reclaiming unit and a plating machine having a plating tank and at least one rinse tank, said pickup unit comprising receiving means for receiving effluent from the rinse tank and for receiving plating solution from the plating tank, first control means for controlling the flow of effluent from the rinse tank to the receiving means, second control means for controlling the flow of plating solution from the plating tank to the receiving means, and third control means for controlling the flow of effluent and plating solution from the receiving means to the reclaiming unit, said first control means comprising effluent overflow means for permitting a flow of effluent to the receiving means only when the level of rinse water in the rinse tank is above a predetermined rinse water level.
  • a pickup unit for use with a plating solution reclaiming unit and a plating machine having a plating tank and at least one rinse tank, said pickup unit comprising receiving means for receiving effluent from the rinse tank and for receiving plating solution from the plating tank, first control means for controlling the flow of effluent from the rinse tank to the receiving means, second control means for controlling the flow of plating solution from the plating tank to the receiving means, and third control means for controlling the flow of effluent and plating solution from the receiving means to the reclaiming unit, said second control means being adapted to permit a flow of plating solution from the plating tank to the receiving means only when the level of plating solution in the plating tank is above a predetermined plating solution level.
  • the second control means comprises an assembly having two reservoirs separated by a partition, means for connecting one of the reservoir to the plating tank to maintain plating solution in said one reservoir at the same level as the plating solution in the plating tank, the other reservoir being connected to the receiving means, and the upper margin of the partition being adapted to permit plating solution to overflow from the one reservoir to the other reservoir when the level of plating solution in the plating tank and in the one reservoir is above the predetermined plating solution level.
  • a pickup unit for use with a plating solution reclaiming unit and a plating machine having a plating tank and at least one rinse tank, said pickup unit comprising receiving means for receiving effluent from the rinse tank and for receiving plating solution from the plating tank, first control means for controlling the flow of effluent from the rinse tank to the receiving means, second control means for controlling the flow of plating solution from the plating tank to the receiving means, and third control means for controlling the flow of effluent and plating solution from the receiving means to the reclaiming unit, and wherein the receiving means comprises a first reservoir; the first control means comprises overflow means for permitting a flow of effluent to the first reservoir when the level of rinse water in the rinse tank is above a predetermined rinse water level; the second control means comprises a second reservoir and a third reservoir separated by a partition adapted to permit plating solution to overflow from the second reservoir to the third reservoir when the level of plating solution in the plating tank and in the second reservoir is above a predetermined plating solution level; and the
  • said first control means comprises a fourth reservoir for receiving effluent from the rinse tank, said fourth reservoir being separated from the first reservoir by a second partition for permitting effluent to overflow from the fourth reservoir to the first reservoir when the level of rinse water in the rinse tank and in the fourth reservoir is above the predetermined rinse water level.
  • a pickup unit for use with a plating solution reclaiming unit and a plating machine having a plating tank and at least one rinse tank, said pickup unit comprising receiving means for receiving effluent from the rinse tank and for receiving plating solution from the plating tank, first control means for controlling the flow of effluent from the rinse tank to the receiving means, second control means for controlling the flow of plating solution from the plating tank to the receiving means, and third control means for controlling the flow of effluent and plating solution from the receiving means to the reclaiming unit, and means for supplying the reclaiming unit with plating solution when no effluent is available.
  • the invention according to claim 8 further comprising means for automatically adding makeup water to the pickup unit when no effluent is available and no plating solution is available.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
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Abstract

Apparatus for use with an electroplating machine and a plating solution reclaiming unit having a plurality of reservoirs for receiving rinse system effluent and plating solution from the plating machine and controlling their flow to the reclaiming unit.

Description

United States Patent Streeter 1 1 Jan. 23, 1973 [541 PLATING SOLUTION PICKUP UNIT 3,358,706 l2/l967 Tischbein ..l37/263 l,866,472 7/1932 Knowles Hl37/263 X [75] Inventor streete" lnd'anapohs 2,250,130 7 1941 May ..137/398 x [73] Assignee: Dean Brothers Pumps, Inc., Indianapolis, FOREIGN PATENTS OR APPLICATIONS Oct. l,l78,727 7/l957 France ..l37/263 PP 765,919 Primary Examiner-M. Cary Nelson Assistant ExaminerRobert J. Miller 52 us. 01 ..l37/263, 137/398 Atwmekwilliam Streeter 51 1111.01. ..B0lf 5/00, GOlg 5/00 581 Field of Search ..137/101.27, 263, 265, 571, ABSTRACT 137/574 398 Apparatus for use with an electroplating machine and a plating solution reclaiming unit having a plurality of [56] References cued reservoirs for receiving rinse system effluent and plat- UNITED STATES PATENTS ing solution from the plating machine and controlling their flow to the reclaiming unit. 2,626,446 1/1953 Moore ..l37/263 X 3,135,288 6/1964 Leisenheimer ..l3l/263 X 10 Claims, 6 Drawing Figures l- L Z2 23 a PATENTEDJAH23 1975 3,712,329
B ERT STE EETER PLATING SOLUTION PICKUP UNIT BACKGROUND OF THE INVENTION The dragout effect in metal electroplating machines results in the removal ofa portion of each liquid bath in which the parts to be plated are immersed and its conveyance into the subsequent liquid bath into which the parts are immersed due to the liquids adhering to and being entrapped by the parts and the conveying apparatus of the plating machine. The dragout effect results in substantially equal volumes of liquid being carried into and out of each successive bath as the parts and conveying apparatus are sequentially immersed therein. In the plating tank, for example, preplating solution is carried into the plating solution, and plating solution is carried out of the plating tank into the rinse water of the first rinse tank. The effect is to dilute the concentration of plating solution in the plating tank without decreasing the volume of liquid in the plating tank, except as the volume may be reduced by evaporating to the atmosphere.
In plating operations where the dragout rate exceeds the evaporation rate, for example in a barrel type plating machine plating zinc or cadmium, returning reclaimed plating solution (concentrate) to the plating tank at the same concentration as that desired in the plating tank would cause a net increase in the volume of liquid in the plating tank, because the volume of concentrate which would have to be added is larger than the volume of water that is evaporated from the plating tank. This is especially true in plating solutions where the operating temperature is generally below 130 F. The return of concentrate without removal of some of the plating solution from the tank would eventually result in overflowing the sidewalls ofthe plating tank.
It is practicable to reduce the liquid volume of the concentrate returned to the plating tank by increasing its concentration, but only to a limited extent, because at high concentrations the plating solution chemicals tend to crystallize and clog pipes and valves. It is further practicable and desirable to remove plating solution from the plating tank while returning concentrate thereto in order to maintain both the desired concentration and liquid level in the plating tank.
The present invention provides an apparatus for removing plating solution from the plating tank as concentrate is added thereto, and does so in a manner that precludes accidentally removing an excess of plating solution from the plating tank. The apparatus is adapted to mix the flow of plating solution removed from the plating tank with the flow of rinse system effluent to the reclaiming unit, and may be adapted to deliver plating solution to the reclaiming unit, when because of surges in the rinse system and intermittent plating machine operation, there may be no effluent flow for varying periods of time.
The present invention also provides a great amount of versatility in the operation of a reclaiming unit by providing a means whereby a plurality of electroplating machines plating the same metal at the same or different plating solution concentrations and having different rinse system flow rates may be serviced by a single reclaiming unit. This improvement, heretofore believed unattainable, results not only in versatility, but also achieves additional economies both in equipment cost and in operating expenses.
SUMMARY OF THE INVENTION The apparatus of the present invention, hereinafter referred was a pickup unit, may include a first reservoir arranged to receive the overflow of effluent from the rinse system, a second reservoir for receiving plating solution from the plating tank and adapted to overflow into a third reservoir that drains into the first reservoir, thereby limiting the volume of plating solution that may be taken from the plating tank. A first conduit leads from near the bottom of the first reservoir to the reclaiming unit. A float operated valve in the first conduit is adapted to open as the liquid level in the first reservoir rises and to close as it falls, going fully closed at a liquid level above the top of the float operated valve. This prevents any air from entering the first conduit and being carried to the reclaiming unit should there be a leak around the operating stem of the float operated valve, It is highly undesirable to admit any uncondensible gasses, are contained in air, to a reclaiming unit, such as that described in my copending application, Ser. No. 621,604, filed Mar. 8, 1967 now abandoned.
The pickup unit may also include a fourth reservoir between the rinse system and the first reservoir, which may overflow into the first reservoir via a weir notch that may be used to measure the effluent flow rate. A second float operated valve may be added to the pickup unit to admit makeup water to the system when it is needed.
The addition of a concentration measuring device in connection with a pickup unit permits the use of a single plating solution reclaiming unit with a plurality of plating machines plating the same metal in different concentration plating solutions. Also, the rinse systems of the different plating machines served by the one reclaiming unit may have different flow rates.
It is therefore an object of the present invention to provide an improved apparatus for use with plating solution reclaiming units.
lt is another object of the present invention to provide a'piekup unit adapted to receive effluent and plating solution from a plating machine, mix the two, and control the flow thereof to a reclaiming unit.
It is still another object of the present invention to provide a fully automatic pickup unit which will meet the liquid requirements of a reclaiming unit without permitting air to enter the pickup unit.
Still another object of the present invention is to provide a pickup unit that will automatically add makeup water to the effluent when it is required.
Yet another object of the present invention is to provide a method or process for use with plating machines and reclaiming units whereby greater control and versatility may be achieved.
Another object ofthe present invention is to provide a method and apparatus whereby a plurality of plating machines may be served by a single reclaiming unit, and wherein the plurality of plating machines may be operated with different effluent flow rates and plating solution concentrations.
These and other objects and advantages will become apparent as the description proceeds, reference being had to the attached drawings and appended claims.
BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a diagrammatic plan view showing a portion of the tanks of a plating machine and the general relationship thereto of the pickup unit of the present invention.
FIG. 2 is a somewhat diagrammatic cross-sectional elevation view showing the hydraulic relationship of the pickup unit of the present invention to the plating tank and a rinse tank of an electroplating machine.
FIG. 3 is a generally perspective view of one assembly of the pickup unit of the present invention.
FIG. 4 is a diagrammatic illustration showing how the pickup unit of the present invention permits one reclaiming unit to serve a plurality of plating machines.
FIG. 5 is an electrical schematic diagram showing one control circuit which may be used with the arrangement illustrated in FIG. 4.
FIG. 6 is a generally diagrammatic cross-sectional view of another embodiment of the pickup unit of the present invention.
DESCRIPTION OF THE PREFERRED EMBODIMENTS Referring now to FIG. 1, there is shown diagrammatically a plan view ofa portion of the tanks ofa plating machine. The tanks may include a preplating tank 11, a plating tank 12 which may have stations l3, l4 and 15 and a counterflow rinse system 21, having tanks 22, 23 and 24. The parts to be plated are conveyed by a conveying means (not shown) sequentially through the tanks and stations from left to right.
Because of the dragout effect, preplating solution from tank 11 is carried into the plating tank 12 and plating solution is carried out of the plating tank 12 into the rinse tank 22. The volumes carried into and out of the plating tank by the dragout effect are substantially equal, thereby substantially maintaining the liquid level in the plating tank constant while at the same time diluting the concentration of the plating solution with preplating solution.
In the counterflow rinse system 21, fresh water is admitted to tank 24, tank 24 overflows into tank 23, tank 23 overflows into tank 22, and the contaminated rinse water (effluent) is removed from tank 22. It will be seen that tank 22 will contain the highest concentration of plating solution and tank 24 will contain the lowest.
As disclosed in my copending application, Ser. No. 621,604, filed Mar. 8, 1967, now abandoned the effluent withdrawn from tank 22 may be run through a plating solution reclaiming unit where the plating solution is reclaimed and distilled water or distillate made available to be reused in the rinse system. The reclaimed plating solution or concentrate may be returned to the plating tank.
Because the dragout effect does not reduce the volume of plating solution in the plating tank, but
merely dilutes it, if the rate of evaporation is small, as it generally is in cyanide plating solutions, the addition of concentrate to the plating tank tends to increase the volume of liquid in the plating tank. Thus, it is necessary to remove plating solution from the plating tank to make room for the reclaimed plating solution so that the plating tank will not overflow.
Processes have been used in the past wherein a volume of plating solution is withdrawn from the plating tank, placed in a heated vessel, and water evaporated therefrom. The equipment used in these processeshas taken its suction directly from the plating tank, and has on occasion withdrawn an excess of plating solution from the plating tank. This has two possible deleterious effects. First, the plating solution may escape through an overflow pipe from the heated vessel and be drained to a sewer or stream. Second, the level of plating solution in the plating tank may be lowered below the minimum operating level so that the plating machine must be shut down until the plating solution level is raised.
The pickup unit of the present invention solves each of these problems by providing automatic withdrawal of the proper amount of plating solution from the plating tank, and does so by overflow means that prevent lowering the level in the plating tank below the minimum operating level.
FIG. 2 shows one embodiment of the pickup unit of the present invention, indicated generally at 30, located adjacent the last station 15 of the plating tank 12 and the first rinse tank 22. The pickup unit 30 may have three reservoirs 31, 32 and 33. The reservoirs 32 and 33 may be formed by an assembly 36 having a generally cylindrical sidewall 37, a bottom 38 and a partition 39 that generally vertically bisects the assembly 36. A conduit 41 connects reservoir 32 to the plating tank 12 at a point below the minimum normal operating level 42 of the plating solution. Conduit 41 preferably slopes so that it may be rodded out easily when sludge or precipitates collect in it.
FIG. 3 shows a generally perspective view of the assembly 36 wherein the partition 39 has a V-notch weir located in its upper margin. The bottom of the V-notch is located at the same elevation as the minimum normal operating level 42 of the plating solution in the plating tank 12. It will be seen from the arrangement of the reservoirs 32 and 33 that when plating solution is above the level 42 it will flow through conduit 41 into reservoir 32 and overflow into reservoir 33. Because of the characteristic of the V-notch, the higher the level above level 42, the greater the flow rate from reservoir 32 to reservoir 33. Standard weir formulas may be used to calculate the flow rate of plating solution through the V-notch.
Reservoir 31 is formed by an open top vessel 43 which may be supported by legs 44. A conduit 45, which is preferably formed of flexible tubing or hose to facilitate breaking up any sludge or plating solution chemical precipitates that may collect therein, connects the bottom of reservoir 33 to reservoir 31. Another conduit 46 connects rinse tank 22 to reservoir 31 as shown in FIG. 2. The connection of conduit 46 to tank 22 is located at the desired liquid level 48 so that effluent will overflow from tank 22 into reservoir 31 As with the connection to the plating tank, conduit 46 provides an overflow type of connection, thereby eliminating the possibility of drawing the level of rinse water in tank 22 down too low. If no measure of the plating solution flow rate is desired, the vessel 36 and reservoirs 32 and 33 could be omitted, the connection to the plating tank being made, in a manner similar to the connection to the rinse tank, at the normal minimum operating level.
As a safety precaution, the upper margins of reservoirs 31, 32 and 33 should be made substantially the same height as the plating tank 12 and the rinse tank 22. This is because the volumes of the reservoirs are comparatively small in relation to the volumes of the plating and rinse tanks. When a load of parts being plated or rinsed is lowered into the plating or rinse tanks, the liquid displaced could cause the reservoirs to overflow onto the floor if their margins were not high enough.
A conduit 51 extends downwardly into reservoir 31 to a point near the bottom. At its lower end is a strainer 52. Its other end is connected to a plating solution reclaiming unit, to be more fully described subsequently. Just above the strainer 52 is a valve 53 that is operated through a linkage 54 by a float 55. The valve 53 is adapted to open as the liquid level in reservoir 31 rises and to close as it falls, the valve 53 going fully closed before it is exposed to the air. In this manner, should the operating stem of valve 53 leak, no air would be permitted to enter the conduit 51 and be admitted to the reclaiming unit.
Because of space limitations immediately adjacent the plating and rinse tanks of many plating machines, it is impossible to locate all the reservoirs of the pickup unit in close proximity to the plating and rinse tanks. In such cases, the assembly 36 may be mounted directly on the side of the plating tank by suitable mounting means. The conduits 45 and 46 may be formed of flexible hose or tubing for ease of handling and routing, as well as for ease of cleaning as noted above.
In operation, rinse system effluent flows from rinse tank 22 through conduit 46 into reservoir 31, where, so long as the liquid level is sufficiently high to maintain valve 53 open, it is drawn into conduit 51 and conveyed to the reclaiming unit. This flow is generally continuous, except for momentary surges when parts are immersed in the rinse tanks and momentary stoppages when the parts are withdrawn from the rinse tanks. The flow of plating solution from the plating tank 12 through conduit 4land reservoir 32 and over the partition 39 into reservoir 33 and into reservoir 31 via conduit 45 is somewhat intermittent. As stated earlier, the dragout effect does not substantially change the volume of plating solution in the plating tank, but merely dilutes it. The alternate immersion and withdrawal of parts to be plated as they are moved from station to station through the plating tank, does, however, cause the liquid level of plating solution in the plating tank to change rather abruptly. This can result in surges of plating solution tending to flow through assembly 36 to reservoir 3!, and may on occasion, substantially raise the liquid level in reservoir 31. The action of the weir notch in partition 39, however, tends to reduce the effect of surges from the plating tank and cause a generally more even flow of plating solution to the reservoir 31.
When only one plating machine is connected to a reclaiming unit, as is fully disclosed in my copending application, Ser. No. 621,604, filed Mar. 8, 1967, now abandoned a pickup unit 30 may be used advantageously to receive the rinse system effluent and plating solution from their respective tanks, providing a measurement of the flow rates if desired, and controlling their flow to the reclaiming unit. When it is desired to use a single reclaiming unit with two or more plating machines, the pickup unit and method of the present invention makes such operation possible.
Referring now to FIG. 4, there is shown a partial diagrammatic plan view of three plating machines, indicated at A, B and C. Each plating machine has a plating tank 12, with stations 13, 14 and 15, rinse tanks 22, 23 and 24, and a pickup unit 30, lower case letters being used to identify each element to its particular plating machine. Also associated with each plating machine is a distillate valve 56, a concentrate valve 57, and a concentration measuring device 58, which may be arranged to measure the concentration of plating solution in the plating tank 12. All three plating machines are served by a single reclaiming unit 65. A conduit 66 carries distillate from the reclaiming unit to the rinse systems and a conduit 67 carries concentrate from the reclaiming unit to the plating tanks.
The concentration measuring device 58 may be of any of the types known to the art, however, one form that has been found to work quite satisfactorily is shown in FIG. 2, and includes a bob 71 supported -by a line 72 affixed to one end of a lever arm 73, the other end of which is adapted to receive weights 74 in much the same manner as a beam balance. The bob 71, which is preferably conical at its upper end to help prevent any buildup thereon of sludge or precipitate that would alter its overall specific gravity, is provided with a specific gravity somewhat heavier than the specific gravity of the plating solution at the desired concentration. The weights 74 are then chosen to partially counterbalance the bob 71 so that when the concentration of the plating solution is at the desired value the lever arm 73 is balanced. When the concentration falls below or rises above the desired value, the bob 71 descends and rises respectively. The arm 73 is affixed near its center to a shaft 75 that operates an electrical switch 76. To protect the bob 71, it may be suspended within a perforated plastic tube 77.
In operation, the valves 56 are adjusted to proportion the flow of distillate to each of the rinse systems as desired. Each tank 24 overflows into tank 23, which overflows into tank 22, which overflows into reservoir 31 of pickup unit 30. The flow of distillate to each rinse system is substantially constant, however, the flow of effluent to each reservoir 31 is not constant as a result of the conveying apparatus and parts being rinsed being periodically immersed in and removed from the rinse tanks, causing surges of effluent flow separated by periods of substantially no flow. The flow of concentrate to the plating tank, on the other hand, is not constant, but varies with the concentration of the plating solution in the plating tank. When the concentration of the plating solution in the plating tank falls below the desired concentration, bob 71 will descend, operating switch 76, which in turn opens valve 57 to admit concentrate to the plating tank. As concentrate is added to the plating tank to increase the concentration of the plating solution therein to the desired concentration, the liquid level in the plating tank rises. This causes plating solution to flow into reservoir 32 and overflow into reservoir 33 from which it drains into reservoir 31 and mixes with the effluent. Valve 53 controls the flow of mixture to the reclaiming unit and prevents any air from entering the line 51.
In the arrangement of FIG. 4, the reclaiming unit 65 may be provided with a concentrate storage tank wherein concentrate is stored until needed. A concentration measuring device 78 on the reclaiming unit, which may be similar to the devices 58,maintains the concentration of the concentrate in the storage tank at a higher value than that of the highest desired concentration plating solution. By way of illustration, assume that plating machine A, which may be a barrel type machine, has the highest desired concentration plating solution and plating machine C, which may be a rack type machine, has the lowest. Then the concentrate produced by the reclaiming unit must have a concentration higher than that of the plating solution in plating machine A.
It will be seen that when the concentration of the plating solution in plating machine C (lowest concentration) falls below its desired value, only a relatively small volume of concentrate need be added to bring the concentration up to the desired value. On-the other hand, when the concentration of the plating solution in line A falls below its desired value, a somewhat larger volume of concentrate must be added to bring the concentration up to the desired value. This fact makes it generally possible and desirable to use the highest concentration plating tank as the storage tank, eliminating any need for a separate storage tank associated with the reclaiming unit. In this case, concentration measuring device 78 is connected to the concentrate valve 57 of the plating line having the highest concentration plating solution, in the present illustration, valve 57a. When this is done, concentration measuring device 580 may be dispensed with.
In .such an arrangement, the electrical connections shown in FIG. may be used to interconnect the concentration measuring devices 58 and 78 and the valves 57, where each valve 57 has an operating coil 81 and concentration measuring device 78 operates a switch 82. A conductor 84 and a conductor 85 are connected to a power supply 86. Switch 82 has one side connected to conductor 84 and the other side connected to one side of coil 81a, one side of switch 76b and one side of switch 76c. The other side of switch 76b is connected to one side of coil 81b and the other side of switch 76c is connected to one side of coil 810. The other sides of coils 81a, 81b and 810 are connected to conductor 85. Thus, whenever the reclaiming unit 65 has concentrate available, concentration measuring device 78 closes switch 82 to energize coil 81a and open valve 57a to admit concentrate to plating tank 12a. When the concentration of plating solution in the plating tanks of plating machines B or C falls below the desired value, switch 76b or 76c respectively will close to energize its respective coil 81b or 810, providing that concentrate is presently available from the reclaiming unit 65, in.
which case switch 82 will be closed. As soon as each plating solution concentration is brought up to the desired value, each switch 76 will open, causing its respective valve 57 to close.
Thus, it will be seen that the desired concentrations of plating solution are maintained in each of the plating machines A, B and C, all served by one reclaiming unit 65.
Referring now to FIG. 6, there is shown another em bodiment of the pickup unit of the present invention wherein there is an assembly having reservoirs 31', 32, 33' and 94. The reservoirs are connected in relation to the plating tank 12 and rinse tank 22 in the same relationship as the correspondingly numbered reservoirs in FIG. 2. Reservoir 94 with its partition 96 may be used to provide a weir for measuring the flow of effluent to the pickup unit. In operation, the pickup unit of FIG. 6 receives plating solution into reservoir 32" from the plating tank 12. The plating solution overflows the partition between reservoir 32 and 33' into reservoir 33'. This partition mayhave its upper margin, or the bottom ofa weir notch in its upper margin, located at the same elevation as the minimum normal operating level 42 of plating solution in the plating tank I2. A partition between reservoirs 33 and 31' may have its upper margin at the average normal operating level 95 of plating solution in the plating tank 12. The partition 96 has its upper margin at the desired overflow level 48 of rinse water in rinse tank 22, and permits effluent to overflow into reservoir 31. A float operated valve 53 in reservoir 31 operates in substantially the same manner as valve 53 of FIG. 2, to control the flow of plating solution and effluent through the conduit 51. A conduit 97 may be provided between a point near the bottom of compartment 33' and conduit 51 and having therein a remotely operated valve 98.
In operation, the pickup unit of FIG. 6 will normally have plating solution filling reservoirs 32' and 33' and overflowing into reservoir 31. Effluent will be overflowing partition 96 into reservoir 31'. The liquid level in reservoir 31 will be between its upper and lower limits, the lower limit being determined by the level at which valve 53' is fully closed. If the flow of effluent should cease, and the liquid level in reservoir 31 be drawn down to the minimum, closing valve 53', no liquid would be available to the reclaiming unit through conduit 51. If, during such a condition, liquid were required by the reclaiming unit for its proper operation, a liquid level control device on the reclaiming unit could open valve 98 to admit plating solution to conduit 51' to satisfy the reclaiming units liquid requirements. In the event that the volume of plating solution above the minimum normal operating level was in-v adequate to fully supply the reclaiming units liquid requirements before additional effluent from the rinse system were available, it would be desirable to add makeup water to the system. This may easily be accomplished by a float operated valve 99 located in reservoir 33' and adapted to close as the liquid level in reservoir 33' rises and to open as the liquid level falls. To prevent air from entering the conduit 51' and being admitted to the reclaiming unit, the valve 99 should be connected to a makeup water supply capable of supplying makeup water faster than the reclaiming unit can receive liquid through conduit Slso that the lower end of conduit 97 is never exposed to the air.
It will be seen that themethod and apparatus of the present invention accomplish all of the objects set forth above and while the invention has been illustrated and described in detail in the drawings and foregoing description, the same is to be considered as illustrative and not restrictive in character, it being understood that only the preferred embodiments have been shown and described and that all changes and modifications that come within the spirit of the invention and the scope of the claims are also desired to be protected.
For example, where the normal operating level of plating solution in the plating tank is higher than the normal operating level of rinse water in the adjacent rinse tank, a check valve 100 may be installed at the outlet of conduit 46 to prevent plating solution from flowing into the rinse tank should the reclaiming unit stop taking liquid through conduit 51 and reservoir 31 become filled with plating solution.
The invention claimed is:
1. A pickup unit for use with a plating solution reclaiming unit and a plating machine having a plating tank and at least one rinse tank, said pickup unit comprising receiving means for receiving effluent from the rinse tank and for receiving plating solution from the plating tank, first control means for controlling the flow of effluent from the rinse tank to the receiving means, second control means for controlling the flow of plating solution from the plating tank to the receiving means, and third control means for controlling the flow of effluent and plating solution from the receiving means to the reclaiming unit, said first control means comprising effluent overflow means for permitting a flow of effluent to the receiving means only when the level of rinse water in the rinse tank is above a predetermined rinse water level.
2. A pickup unit for use with a plating solution reclaiming unit and a plating machine having a plating tank and at least one rinse tank, said pickup unit comprising receiving means for receiving effluent from the rinse tank and for receiving plating solution from the plating tank, first control means for controlling the flow of effluent from the rinse tank to the receiving means, second control means for controlling the flow of plating solution from the plating tank to the receiving means, and third control means for controlling the flow of effluent and plating solution from the receiving means to the reclaiming unit, said second control means being adapted to permit a flow of plating solution from the plating tank to the receiving means only when the level of plating solution in the plating tank is above a predetermined plating solution level.
3. The invention according to claim 2 wherein the second control means comprises an assembly having two reservoirs separated by a partition, means for connecting one of the reservoir to the plating tank to maintain plating solution in said one reservoir at the same level as the plating solution in the plating tank, the other reservoir being connected to the receiving means, and the upper margin of the partition being adapted to permit plating solution to overflow from the one reservoir to the other reservoir when the level of plating solution in the plating tank and in the one reservoir is above the predetermined plating solution level.
4. The invention according to claim 3 wherein the upper margin of the partition has therein a weir notch, the bottom of the notch being at the predetermined plating solution level.
5. A pickup unit for use with a plating solution reclaiming unit and a plating machine having a plating tank and at least one rinse tank, said pickup unit comprising receiving means for receiving effluent from the rinse tank and for receiving plating solution from the plating tank, first control means for controlling the flow of effluent from the rinse tank to the receiving means, second control means for controlling the flow of plating solution from the plating tank to the receiving means, and third control means for controlling the flow of effluent and plating solution from the receiving means to the reclaiming unit, and wherein the receiving means comprises a first reservoir; the first control means comprises overflow means for permitting a flow of effluent to the first reservoir when the level of rinse water in the rinse tank is above a predetermined rinse water level; the second control means comprises a second reservoir and a third reservoir separated by a partition adapted to permit plating solution to overflow from the second reservoir to the third reservoir when the level of plating solution in the plating tank and in the second reservoir is above a predetermined plating solution level; and the third control means comprises a valve responsive to the liquid level in the first reservoir, the valve being adapted to open as the liquid level rises and to close as the liquid level falls.
6. The invention according to claim 5 wherein said first control means comprises a fourth reservoir for receiving effluent from the rinse tank, said fourth reservoir being separated from the first reservoir by a second partition for permitting effluent to overflow from the fourth reservoir to the first reservoir when the level of rinse water in the rinse tank and in the fourth reservoir is above the predetermined rinse water level.
7. The invention according to claim 5 wherein the third reservoir is separated from the first reservoir by a third partition adapted to permit plating solution to overflow from the third reservoir to the first reservoir when the level of plating solution in the plating tank and in the second and third reservoirs is above a second predetermined plating solution level.
8. A pickup unit for use with a plating solution reclaiming unit and a plating machine having a plating tank and at least one rinse tank, said pickup unit comprising receiving means for receiving effluent from the rinse tank and for receiving plating solution from the plating tank, first control means for controlling the flow of effluent from the rinse tank to the receiving means, second control means for controlling the flow of plating solution from the plating tank to the receiving means, and third control means for controlling the flow of effluent and plating solution from the receiving means to the reclaiming unit, and means for supplying the reclaiming unit with plating solution when no effluent is available.
9. The invention according to claim 8 further comprising means for automatically adding makeup water to the pickup unit when no effluent is available and no plating solution is available.
10. The invention according to claim 1 further comprising check valve means for preventing the flow of any liquids from the receiving means to the rinse tank.

Claims (10)

1. A pickup unit for use with a plating solution reclaiming unit and a plating machine having a plating tank and at least one rinse tank, said pickup unit comprising receiving means for receiving effluent from the rinse tank and for receiving plating solution from the plating tank, first control means for controlling the flow of effluent from the rinse tank to the receiving means, second control means for controlling the flow of plating solution from the plating tank to the receiving means, and third control means for controlling the flow of effluent and plating solution from the receiving means to the reclaiming unit, said first control means comprising effluent overflow means for permitting a flow of effluent to the receiving means only when the level of rinse water in the rinse tank is above a predetermined rinse water level.
2. A pickup unit for use with a plating solution reclaiming unit and a plating machine having a plating tank and at least one rinse tank, said pickup unit comprising receiving means for receiving effluent from the rinse tank and for receiving plating solution from the plating tank, first control means for controlling the flow of effluent from the rinse tank to the receiving means, second control means for controlling the flow of plating solution from the plating tank to the receiving means, and third control means for controlling the flow of effluent and plating solution from the receiving means to the reclaiming unit, said second control means being adapted to permit a flow of plating solution from the plating tank to the receiving means only when the level of plating solution in the plating tank is above a predetermined plating solution level.
3. The invention according to claim 2 wherein the second control means comprises an assembly having two reservoirs separated by a partition, means for connecting one of the reservoir to the plating tank to maintain plating solution in said one reservoir at the same level as the plating solution in the plating tank, the other reservoir being connected to the receiving means, and the upper margin of the partition being adapted to permit plating solution to overflow from the one reservoir to the other reservoir when the level of plating solution in the plating tank and in the one reservoir is above the predetermined plating solution level.
4. The invention according to claim 3 wherein the upper margin of the partition has therein a weir notch, the bottom of the notch being at the predetermined plating solution level.
5. A pickup unit for use with a plating solution reclaiming unit and a plating machine having a plating tank and at least one rinse tank, said pickup unit comprising receiving means for receiving effluent from the rinse tank and for receiving plating solution from the plating tank, first control means for controlling the flow of effluent from the rinse tank to the receiving means, second control means for controlling the flow of plating solution from the plating tank to the receiving means, and third control means for controlling the flow of effluent and plating solution from the receiving means to the reclaiming unit, and wherein the receiving means comprises a first reservoir; the first control means comprises overflow means for permitting a flow of effluent to the first reservoir when the level of rinse water in the rinse tank is above a predetermined rinse water level; the second control means comprises a second reservoir and a third reservoir separated by a partition adapted to permit plating solution to overflow from the second reservoir to the third reservoir when the level of plating solution in the plating tank and in the second reservoir is above a predetermined plating solution level; and the third control means comprises a valve responsive to the liquid level in the first reservoir, the valve being adapted to open as the liquid level rises and to close as the liquid level falls.
6. The invention according to claim 5 wherein said first control means comprises a fourth reservoir for receiving effluent from the rinse tank, said fourth reservoir being separated from the first reservoir by a second partition for permitting effluent to overflow from the fourth reservoir to the first reservoir when the level of rinse water in the rinse tank and in the fourth reservoir is above the predetermined rinse water level.
7. The invention according to claim 5 wherein the third reservoir is separated from the first reservoir by a third partition adapted to permit plating solution to overflow from the third reservoir to the first reservoir when the level of plating solution in the plating tank and in the second and third reservoirs is above a second predetermined plating solution level.
8. A pickup unit for use with a plating solution reclaiming unit and a plating machine having a plating tank and at least one rinse tank, said pickup unit comprising receiving means for receiving effluent from the rinse tank and for receiving plating solution from the plating tank, first control means for controlling the flow of effluent from the rinse tank to the receiving means, second control means for controlling the flow of plating solution from the plating tank to the receiving means, and third control means for controlling the flow of effluent and plating solution from the receiving means to the reclaiming unit, and means for supplying the reclaiming unit with plating solution when no effluent is available.
9. The invention according to claim 8 further comprising means for automatically adding makeup water to the pickup unit when no effluent is available and no plating solution is available.
10. The invention according to claim 1 further comprising check valve means for preventing the flow of any liquids from the receiving means to the rinse tank.
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