TWI503455B - Electroplating device and electroplating method - Google Patents

Description

Electroplating device and plating method

The present invention relates to a plating apparatus and a plating method.

The plating is used for, for example, a purpose of forming a wiring pattern on a printed circuit board. For example, in the copper sulfate plating, a coating agent called a brightener, a softener, a leveling agent, etc. is added to the plating solution for the purpose of glossiness, film property, drape property, filling property to a via hole, and the like. Or various additives such as inhibitors.

The additives act effectively on the surface of the circuit board and act to promote the coating of the through holes or the filling of the via holes by the effective action of the promoter in the through holes and the via holes. However, when the accelerator is excessive in the plating solution, the effect of suppressing the growth of the active nucleus by the inhibitor is lowered, and a dense film is not obtained, and the physical properties of the film are lowered. Further, the effect of suppressing precipitation on the surface of the board is lowered, and the coverage of the via hole is deteriorated, and the hole filling property of the via hole is deteriorated. On the other hand, if the accelerator in the plating solution is insufficient, the effect of promoting the production of the active nucleus is lowered, and a dense film is not obtained, and the physical properties of the film are lowered. Further, the effect of promoting the inside of the through hole or the via hole is insufficient, and the coverage of the through hole is deteriorated, and the hole filling property of the via hole is deteriorated. Therefore, it is very important that the various additives in the plating solution are added in an appropriate balance.

In addition, the concentration of dissolved oxygen in the plating solution is known to be one of the main factors affecting the performance of the plating film. The reason for this is described by way of an example of a bis(3-thiopropyl) disulfide (SPS) of a general brightener which is plated with copper sulfate. That is, the following series of redox reactions occur in the plating treatment. The surface SPS on the cathode was reduced to 3-mercaptopropane-1-sulfuric acid (MPS). SPS acts as a promoter by reducing copper ions when two MPSs are returned to one SPS near the cathode. MPS that does not participate in this reaction is oxidized by dissolved oxygen to return to SPS. However, if the dissolved oxygen is insufficient, the MPS and Cu ⁺ bonds are accumulated in Cu ⁺ -MPS. When Cu ⁺ -MPS is accumulated, the concentration of the brightener becomes excessive, and the target film performance cannot be sufficiently obtained. When the oxygen concentration is excessive, the amount of MPS oxidized by oxygen is increased, and the amount of MPS for reducing copper ions is lowered, so that the effect of promoting is insufficient, and the target film performance cannot be sufficiently obtained.

In this case, it is necessary to adjust the dissolved oxygen concentration in the plating solution to a proper range. However, when a soluble anode is used as the anode, dissolved oxygen is consumed due to dissolution of metallic copper, and the dissolved oxygen concentration in the plating solution is easily lowered. When an insoluble anode is used as the anode, the concentration of dissolved oxygen in the solid plating solution tends to be high because oxygen is generated from the anode. Therefore, various techniques for adjusting the dissolved oxygen concentration in the plating solution to a predetermined range have been proposed.

For example, Japanese Laid-Open Patent Publication No. 2004-143478 discloses a plating apparatus using a soluble anode as an anode. The device comprises: a plating tank for storing the plating solution; and a groove which is separate from the plating tank, and has a plating circulation structure between the plating tank and the other tank. In this apparatus, air is blown into the plating solution through the air blowing pipe in the tank, and the dissolved oxygen concentration of the plating solution can be maintained at 5 ppm or more to solve the deterioration of the quality of the film.

Further, Japanese Laid-Open Patent Publication No. 2007-169700 discloses a plating method using an insoluble anode as an anode. In this method, the plating bath is stirred with air or an inert gas to maintain the dissolved oxygen concentration of the plating solution at 30 mg/liter or less, and the inside of the non-through hole of the object to be plated can be stably filled for a long period of time.

However, in recent years, in wirings such as printed circuit boards, the quality required for plating has been improved due to the miniaturization of through holes and via holes. For example, if there is foreign matter floating in the plating solution, the foreign matter nucleates and a part of the plating film is formed in a plated portion (tumor-like portion), and in the plating device, the plating solution is separated from the plating solution. Foreign body filter. The filter filters the plating solution to separate various foreign matters in the plating solution from the plating solution.

However, if a large amount of metal particles such as copper particles adhere to the filter, the metal particles may dissolve the dissolved oxygen in the plating solution, and the additive (for example, a sulfur-based additive) contained in the plating solution may be deteriorated. Therefore, in order to suppress the deterioration of the quality of the plating film, it is necessary to frequently exchange the filter.

It is an object of the present invention to provide a plating apparatus and a plating method which can reduce the concentration of dissolved oxygen in a plating solution while reducing the cost of the exchange filter.

The plating apparatus of the present invention comprises: a plating tank for storing the plating solution; and a groove which is a groove of the plating tank, wherein the plating solution circulates between the plating tank and the plating tank a first space in the interior of the first space and a second space on the downstream side of the first space, and a portion of the plating solution in the first space that exceeds a predetermined height flows in from the first space In the second space, the plating solution is a structure in which the second space flows down in the air.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In each of the following embodiments, a case where copper plating is performed on a material to be plated will be described as an example.

<First embodiment>

As shown in Fig. 1, a plating apparatus 11 according to a first embodiment of the present invention includes a plating tank 13; a tank 15 which is a separate body from the plating tank 13; and a plating solution 13 to transport the plating solution to the tank The conveying side piping 29 of 15; the plating liquid is returned from the other tank 15 to the returning side piping 41 of the plating tank 13.

The plating tank 13 has a groove main body 47 having a substantially rectangular parallelepiped shape with an upper opening, and an overflow groove 49 integrally provided with the groove main body 47. An anode 55 is disposed inside the tank body 47. Further, the groove body 47 constitutes a cathode 57 on which a plated object can be placed.

The anodes 55 are disposed on both sides of the cathode 57, respectively. As the anode 55, a soluble anode or an insoluble anode is used. As the soluble anode, for example, a copper plate can be used. Further, as the soluble anode, for example, a cage in which a spherical copper (copper ball) is formed of titanium or the like can be used. The copper plate or the copper ball may be formed, for example, of phosphorus-containing copper containing phosphorus. As the insoluble anode, for example, an indium oxide coated with Ti-Pt can be used.

Each of the anodes 55 is disposed inside the anode bag 59 through which the plating solution can flow without passing the anode sludge. The anode bag 59 is formed of, for example, a material such as polypropylene or polyethylene.

A nozzle 61 is disposed between the cathode 57 and each of the anodes 55 in the height direction of the cathode 57. Each of the nozzles 61 is provided with a plurality of discharge ports (not shown) that eject the plating liquid conveyed from the other grooves 15 through the return-side piping 41 toward the cathode 57 side. By such a jet flow of the nozzle 61, the plating solution around the cathode 57 can be stirred. Further, in addition to the stirring of the jet flow as described above, the stirring of the plating solution around the cathode 57 may omit mechanical stirring of a mechanical agitator such as a stirring blade or a stirring blade as shown. In addition, it can also be used for mixing and mechanical stirring of jet flow.

A voltage is applied between the anode 55 and the cathode 57 by a power supply device (not shown). Thereby, the cathode 57 as a material to be plated can be plated.

The overflow groove 49 is integrally attached to the side of the groove body 47. In the overflow tank 49, the plating solution in the tank body 47 flows in beyond the upper edge portion 53 of the side wall 51 of the tank body 47. The overflow tank 49 is provided with a liquid level sensor (not shown) that senses the liquid level in the tank. The liquid level of the overflow tank 49 can be adjusted by controlling the driving or stopping of the pump 63 according to the sensing result of the liquid level sensor.

The groove 15 has a groove body 20 having a slightly rectangular parallelepiped shape with an upper opening, and a first partition wall 21 dividing the internal space of the other groove body 20 into two. The first partition wall 21 has a substantially rectangular shape and is erected upward from the bottom side of the tank body 20. The inside of the other tank 15 is divided into a first space 17 and a second space 19 located on the downstream side of the first space 17 by the first partition wall 21. As shown in FIG. 1 and FIG. 2A, the first partition wall 21 has a partition main body 25 extending upward from the bottom side of the other groove 15, and a protruding piece 27 extending from the upper end of the partition main body 25 toward the second space 19 side.

The upper edge portion 23 of the first partition wall 21 is set to a predetermined height lower than the upper edge portion of the other groove main body 20. In other words, the groove 15 has a structure in which the portion exceeding the predetermined height in the plating liquid in the first space 17 overflows the upper edge portion 23 and flows into the second space 19 from the first space 17. In the other groove 15, the space above the upper edge portion 23 of the first partition wall 21 is the upper space, and the first space 17 communicates with the second space 19. Further, the groove 15 has a structure in which the first space 17 and the second space 19 are separated from each other by the lower edge portion 23 so as to prevent the plating solution from moving between the first space 17 and the second space 19.

The plating solution that has flowed into the second space 19 is that the second space 19 flows down in the air. In order to allow the plating solution to flow in the air in the second space 19, the liquid level of the plating solution in the second space 19 is adjusted to be lower than the predetermined height of the upper edge portion 23 of the first partition wall 21.

The liquid level of the plating solution in the second space 19 can be adjusted by, for example, controlling the driving or stopping of the pump 64 provided on the return-side pipe 41. Further, in the second space 19, a liquid level sensor (not shown) that senses the level of the liquid in the space may be provided. The level of the liquid level of the second space 19 can be adjusted by controlling the driving or stopping of the pump 64 based on the sensing result of the liquid level sensor.

The protruding piece 27 is extended from the upper end of the partition main body 25 toward the second space 19 side, and the tip end thereof is separated from the side surface of the partition main body 25 on the second space 19 side. By providing such a protruding piece 27, the plating liquid that has flowed into the second space 19 from the first space 17 is guided to the leading end portion along the protruding piece 27, and is separated from the front surface of the leading end portion by the protruding piece 27 to be released to the air. in. Since the tip end portion of the protruding piece 27 is spaced apart from the side surface of the partition wall main body 25, the plating solution can be prevented from flowing down along the side surface of the partition wall main body 25.

In the present embodiment, the first partition wall 21 has a protruding piece 27 as shown in FIG. 2A as an example, but may be a protruding piece 27 having a modification as shown in FIGS. 2B to 2D. The form may be in the form of a protruding piece having a modification as shown in FIGS. 2E and 2F.

In the modification of FIG. 2B, the protruding piece 27 is extended from the upper end of the partition main body 25 toward the second space 19 side and obliquely upward. Also in the case of this modification, the tip end portion of the protruding piece 27 is spaced apart from the side surface of the partition wall main body 25, similarly to the embodiment of Fig. 2A. Therefore, it is possible to prevent the plating solution from flowing down along the side surface of the partition main body 25, but the plating liquid tends to flow down along the surface (lower surface) on the second space 19 side of the protruding piece 27 as compared with the embodiment of FIG. 2A.

In the modification of FIG. 2C, the protruding piece 27 is extended from the upper end of the partition main body 25 toward the second space 19 side and obliquely downward. Also in the case of this modification, as in the embodiment of FIG. 2A, since the tip end portion of the protruding piece 27 is spaced apart from the side surface of the partition wall main body 25, the plating solution can be prevented from flowing down along the side surface of the partition wall main body 25. Further, since the protruding piece 27 is inclined obliquely downward, the plating solution can be substantially prevented from flowing into the lower surface (inner surface) of the protruding piece 27. At this point, the modification of FIG. 2C is better than the embodiment of FIG. 2A.

In the modification of FIG. 2D, the protruding piece 27 has a lateral portion 27a extending in the lateral direction from the upper end of the partition main body 25 toward the second space 19, and a vertical portion 27b extending downward from the tip end of the lateral portion 27a. The tip end of the vertical portion 27b is separated from the side surface of the partition main body 25. Also in the case of this modification, as in the embodiment of FIG. 2A, since the tip end portion of the protruding piece 27 is spaced apart from the side surface of the partition wall main body 25, the plating solution can be prevented from flowing down along the side surface of the partition wall main body 25.

In this embodiment, the plating solution that has flowed into the second space 19 from the first space 17 is guided to the tip end portion along the lateral portion 27a, and then flows downward along the vertical portion 27b. The tip end portion has a large distance from the side surface of the partition main body 25. Therefore, it is possible to substantially prevent the plating solution from flowing into the inner surface of the protruding piece 27. At this point, the modification of FIG. 2D is better than the embodiment of FIG. 2A.

In the modification of FIGS. 2E and 2F, the first partition wall 21 does not have a protruding piece. In the modification of FIG. 2E, the first partition walls 21 are arranged along the vertical direction. In the modification of FIG. 2F, the first partition wall 21 is disposed to be inclined in the vertical direction. The first partition wall 21 of this modification is inclined on the downstream side from the upper direction to the lower side.

The conveying-side pipe 29 is connected to the bottom of the overflow groove 49 and the lower portion of the side wall 51 of the groove body 47, and communicates with the overflow groove 49 and the groove body 47. On the downstream side of the conveying-side pipe 29, a supply port 29a for supplying plating liquid to the other tank 15 is provided.

As shown in FIG. 1 and FIG. 3A, the supply port 29a is located higher than the liquid level of the plating solution in the first space 17, and is not in contact with the plating solution. Therefore, the plating solution discharged from the supply port 29a flows downward from the supply port 29a and comes into contact with the plating solution stored in the first space 17, and the plating solution is somewhat impacted. Thereby, the plating solution in the first space 17 is caused to flow somewhat.

In the modification shown in FIG. 3B to FIG. 3E, the supply port 29a of the return-side pipe 29 is located below the predetermined height. In other words, the supply port 29a may be immersed in the plating solution at a position below the liquid level of the plating solution in the first space 17. In the above-described modifications, the plating solution discharged from the supply port 29a is directly supplied to the liquid stored in the plating solution in the first space 17. Thereby, the impact on the plating solution of the first space 17 can be reduced as compared with the embodiment of FIG. 3A in which the plating liquid discharged into the air from the supply port 29a falls into the plating liquid surface stored in the first space 17.

In the modification of FIG. 3C, the downstream end portion of the return-side pipe 29 is bent so that the plating liquid is discharged from the supply port 29a toward the inner side surface 20a of the other groove body 20. In this modification, in the form of FIG. 3B in which the discharge direction of the plating solution is downward, the flow of the plating solution stored in the first space 17 can be suppressed, in particular, the flow of the plating solution located on the lower side.

In the modification of Fig. 3D, the end portion on the downstream side of the conveying-side pipe 29 is plural (six in the modification), and the conveying-side pipe 29 has a plurality of supply ports 29a for discharging the plating solution. Thereby, the discharge speed of the plating solution discharged from each supply port 29a becomes smaller than the modification of FIG. 3B. Therefore, the flow of the plating solution stored in the first space 17 can be suppressed, in particular, the flow of the plating solution located on the lower side.

In the modification of FIG. 3E, the return-side piping 29 has a structure in which the inner diameter on the downstream side is larger than the other portions. Thereby, the discharge speed of the plating solution discharged from the supply port 29a becomes smaller than the modification of FIG. 3B. Therefore, the flow of the plating solution stored in the first space 17 can be suppressed, in particular, the flow of the plating solution located on the lower side.

As shown in FIG. 1, the return-side pipe 41 has its upstream end connected to the side of the groove body 20 and communicates with the second space 19. The end portion on the downstream side of the return-side pipe 41 is divided into plural numbers (three in the present embodiment). Two of the end portions 41a and 41b of the plurality of pipe end portions are connected to the pair of nozzles 61 and communicate with the respective nozzles 61. The remaining end portion 41c of the end portion of the plurality of pipes is connected to the bottom of the groove body 47 to communicate with the inside of the groove body 47. The end portion 41c is disposed on the side surface of the groove body 47 on the side opposite to the overflow groove 49.

The return-side pipe 41 on the upstream side of the branch is provided with a filter 65. A pump 64 is provided on the return-side pipe 41 on the upstream side of the filter 65. The plating solution circulates between the plating tank 13 and the other tank 15 by driving the pump 64 and the above-described pump 63. The filter 65 filters the plating solution to separate various foreign matters in the plating solution from the plating solution.

The bath ratio of the plating tank 13 to the tank 15 (the volume of the plating tank 13: the volume of the tank 15) is preferably 0.1:1 to 30:1, more preferably 0.3:1 to 10:1. When the volume of the plating tank 13 is less than 0.1 times the volume of the groove 15, the size of the groove 15 becomes too large to be practical. On the other hand, if the volume of the plating tank 13 exceeds the volume of the tank 15 by more than 30 times, there is a case where the dissolved oxygen is insufficient in the adjustment ability of the tank 15.

The circulation amount (rotation) is calculated by the circulation speed (liters/min) × 60 (minutes/time) ÷ the total bath amount (liters), and the total bath amount (the total amount of the plating solution of the circulating plating apparatus) is 5 to 100. Turn, 10 to 80 turns better. If the circulation amount is less than 10 revolutions, there is a case where the dissolved oxygen is insufficient in the adjustment ability of the tank 15. On the other hand, the circulation amount exceeds 100 rpm, which requires a large circulation pump or a lot of cycle pumps and is not practical.

As the plating solution, for example, a copper sulfate plating solution or the like is used. The copper sulfate plating solution is a method in which copper sulfate which is a copper source is added to a predetermined amount of sulfuric acid. For the copper sulfate plating solution, various additives may be added as necessary. The additive may, for example, be an organic additive such as a brightener, a leveling agent, a promoter of a softening agent, or an inhibitor. Examples of the organic additive include a nitrogen-containing organic compound, a sulfur-containing organic compound, and an oxygen-containing organic compound. Specifically, the sulfur-containing organic compound is, for example, a sulfur-based compound selected from the following general formulae (1) to (4).

H─S─(CH ₂ ) _a ─(O) _b ─SO ₃ M (1)

(wherein R ₁ , R ₂ and R ₃ each represent an alkyl group having 1 to 5 carbon atoms; M represents a hydrogen atom or an alkali metal; a represents an integer of 1 to 8, and b, c and d represent 0, respectively. Or 1.)

Further, as the nitrogen-containing organic compound, a conventional one may be used, and examples thereof include a tertiary amine compound and a tertiary ammonium compound. As the oxygen-containing organic compound, a conventional one may be used, and examples thereof include a polyether compound such as polyethylene glycol.

Each component of the copper sulfate plating solution may be supplemented by adding a replenishing liquid or the like as needed by continuously performing electroplating of copper. Thereby, copper plating can be continuously performed. In addition, when a soluble anode is used, copper ions can also be supplemented by the soluble anode. Further, when an insoluble anode is used, a groove for supplying copper ions may be additionally provided in addition to the plating tank 13, and the plating tank may be supplemented with copper ions.

Next, the operation of the plating apparatus 11 of the present embodiment will be described. First, at the time of the bath construction, a predetermined amount of plating solution is stored in the tank main body 47 and the overflow tank 49 of the plating tank 13, and the first space 17 and the second space 19 of the other tank 15.

Next, the pump 63 and the pump 64 are driven to circulate the plating solution between the plating tank 13 and the tank 15. The liquid level of the overflow tank 49 and the second space 19 can be adjusted by controlling the driving or stopping of the pump 63 and the pump 64. In this state, the substrate cathode 57 is immersed in the plating bath of the tank body 47, and is energized between the anode 55 and the cathode 57. Thereby, copper is electroplated on the object to be plated. When the plating is finished, the other ones exchange the copper plating in sequence.

Next, the flow direction of the plating solution will be described. When the pump 64 is driven, the plating liquid is supplied into the tank body 47 through the return-side piping 41. When the plating liquid is supplied to the tank main body 47, the plating liquid having the same amount as the supplied liquid amount flows into the overflow tank 49 beyond the upper edge portion 53 of the side wall 51 of the tank body 47.

Further, when the pump 63 is driven, the plating liquid in the overflow tank 49 and the tank body 47 is supplied to the first space 17 of the tank 15 through the transport-side piping 29. In the plating solution, foreign matter floating due to, for example, copper particles generated by the cathode 57 falling off or the residue generated in the soluble anode may occur. In the first space 17 of the groove 15, the copper particles having a higher density than the plating solution settle and settle in the bottom of the first space 17.

On the other hand, when the plating solution is supplied to the first space 17 through the delivery-side piping 29, the plating solution having the same amount as the supplied liquid amount flows into the second space 19 beyond the upper edge portion 23 of the first partition wall 21. The plating solution that has flowed into the second space 19 flows into the air in the second space 19, and then reaches the liquid surface of the plating solution stored in the second space 19. The concentration of dissolved oxygen in the plating solution is adjusted by exposure to air when the plating solution flows down in this manner. Specifically, when the soluble anode 55 is used as the anode, oxygen in the air is taken into the plating solution by plating, and the decrease in the dissolved oxygen concentration of the plating solution can be suppressed. On the other hand, when an insoluble anode is used as the anode, oxygen is appropriately released from the plating solution into the air during plating, and an increase in the dissolved oxygen concentration of the plating solution can be suppressed.

The dissolved oxygen concentration can be adjusted by changing the time in which the plating solution flows down the air, and the surface area of contact with the air when flowing down the air. The time during which the plating solution flows down the air and the surface area of contact with the air when flowing down the air can change the plating solution overflow by changing, for example, the distance between the upper edge portion 23 of the first partition wall 21 and the liquid level in the second space 19. The width of the upper edge portion 23 is adjusted.

The concentration of dissolved oxygen in the plating solution of the tank body 47 of the plating tank 13 is preferably 4 to 20 mg/liter. When the dissolved oxygen concentration is less than 4 mg/liter or exceeds 20 mg/liter, the plating quality is lowered. Specifically, for example, the coating properties such as the elongation of the plating film and the tensile strength are lowered, or the uniformity (TP) of the through holes of the printed circuit board is lowered, and the hole filling property of the via hole is decreased (the amount of the depression is increased) The situation.

In the present embodiment, since the plating solution in the first space 17 overflows and flows into the second space 19 as described above, air is entangled in the plating solution by the flow of the plating liquid thus overflowed. Thereby, the dissolved oxygen concentration in the plating solution can be made close to the saturated dissolved oxygen concentration. Air is mainly composed of oxygen (about 20%) and nitrogen (about 80%). Further, as a reference, for example, a saturated dissolved oxygen concentration of water at 25 ° C is about 8.1 mg / liter. When the concentration of dissolved oxygen in the plating solution is smaller than the above preferred range (4 to 20 mg/liter), the oxygen in the air is dissolved in the plating solution by overflowing the plating solution, so that the dissolved oxygen concentration in the plating solution is close to Saturated dissolved oxygen concentration. Thereby, the dissolved oxygen concentration in the plating solution can be easily adjusted to the above preferred range. On the other hand, when the dissolved oxygen concentration in the plating solution is larger than the above preferred range, a part of the oxygen dissolved in the plating solution is caused to flow down by the overflow of the plating solution, and is appropriately released by the influence of nitrogen in the air. In the air, the dissolved oxygen concentration in the plating solution is close to the saturated dissolved oxygen concentration. Thereby, the dissolved oxygen concentration in the plating solution can be adjusted to the above preferred range.

The distance (difference) between the upper edge portion 23 of the first partition wall 21 and the plating liquid surface in the second space 19 is not particularly limited, and the concentration of dissolved oxygen concentration can be effectively adjusted, preferably 10 cm or more, and 15 cm or more. Better. Further, in order to avoid an excessively large difference in the size of the groove 15 thereof, it is preferably 100 cm or less.

Further, in the present embodiment, a partition wall is provided in the other groove 15 and only the plating solution is once overflowed. However, a plurality of partition walls may be provided in the tank body as will be described later. The number of overflows is plural. In order to increase the adjustment efficiency of the dissolved oxygen concentration, it is preferable that the number of overflows of the tank 15 is two or more. Further, in order to prevent the size of the groove 15 from becoming too large, the number of overflows is preferably 5 or less.

As described above, in the first embodiment, the portion of the plating solution that exceeds the predetermined height flows into the second space 19 from the first space 17, and the portion below the predetermined height stays in the first space 17. . Therefore, the metal particles remaining in the plating solution in the first space 17 can be settled below the first space 17. As long as the metal particles are concentrated and settled below the first space 17, the metal particles can be periodically removed by performing a recovery means, and the metal particles in the plating solution can be effectively removed. Thereby, in the plating apparatus 11, the frequency of exchange of the filter 65 can be lowered, and the filter 65 can be omitted even in the case. Further, a portion of the plating solution in the first space 17 that exceeds the predetermined height flows into the second space 19 so that the second space 19 flows down in the air, that is, by exposing the plating solution in a flowing state to the air. Adjust the dissolved oxygen concentration of the plating solution. Therefore, according to the first embodiment, the dissolved oxygen concentration of the plating solution can be adjusted, and the cost due to the exchange filter can be reduced.

Specifically, when a soluble anode is used as the anode, since oxygen in the air is taken into the plating solution during plating, a decrease in the dissolved oxygen concentration of the plating solution can be suppressed. On the other hand, when an insoluble anode is used as the anode, since oxygen is released into the air by the plating solution during plating, an increase in the dissolved oxygen concentration of the plating solution can be suppressed.

Further, in the first embodiment, the edge portion 23 is extended only toward the second space 19 side, and the tip end portion has the protruding piece 27 spaced apart from the side surface of the first partition wall 21. Therefore, the plating solution that has flowed into the second space 19 from the first space 17 is guided to the tip end portion along the protruding piece 27, and the front end portion of the tip end portion is opened and released into the air by the protruding piece 27. Therefore, in the first embodiment, it is possible to suppress the plating solution from flowing down along the side surface of the first partition wall 21. Thereby, since the contact area with air at the time of the plating liquid flow can be increased, the adjustment of the dissolved oxygen concentration of the plating liquid can be performed more effectively.

<Second embodiment>

Fig. 4 is a view showing the configuration of the other groove 15 of the plating apparatus 11 according to the second embodiment of the present invention. In the second embodiment, the structure of the first space 17 of the groove 15 is different from that of the first embodiment. The same components as those in the first embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted.

As shown in FIG. 4, the other groove 15 is provided with the groove main body 20 and the first partition wall 21, and further has a second partition wall 35. The second partition wall 35 has a substantially rectangular shape and is erected upward from the bottom surface of the groove main body 20. The second partition wall 35 divides the inside of the first space 17 into two spaces. The space on one side is supplied to the supply space 33 of the plating solution by the supply port 29a of the delivery-side pipe 29, and the space on the other side is located on the downstream side of the supply space 33, and the sedimentation space 31 in which the metal particles 32 in the plating solution are settled.

The second partition wall 35 has a plurality of communication ports that communicate the settling space 31 and the supply space 33. The communication ports are provided below the predetermined height, that is, the height of the upper edge portion 23 of the first partition wall 21 is below. In the first space 17, the plating solution can be moved from the supply space 33 to the settling space 31 through the plurality of communication ports. As the second partition wall 35, for example, a metal plate or a resin plate in which a plurality of through holes are arranged at substantially regular intervals can be used. The communication port is adjusted to a size at which the metal particles can be transmitted.

In the second embodiment, the first space 17 is divided into the sedimentation space 31 and the supply space 33 by the second partition wall 35, and the plating solution is supplied to the supply space 33 by the supply port 29a of the transport-side pipe 29. Therefore, even if the plating solution stored in the supply space 33 flows while the plating solution is supplied, the flow is not easily transmitted to the settling space 31. Therefore, the metal particles 32 can be more effectively settled than in the case where the second partition wall 35 is not provided in the first space 17.

Further, in the second embodiment, the second partition wall 35 has a plurality of communication ports that are provided below the predetermined height and that communicate the settling space 31 and the supply space 33. Therefore, the plating solution supplied to the supply space 33 can be dispersed and moved to the sedimentation space 31 through the plurality of communication ports of the second partition wall 35. By allowing the plating solution to be dispersed into the sedimentation space 31 through the plurality of communication ports, the flow of the plating solution stored in the sedimentation space 31 can be suppressed.

In addition, the other configurations, operations, and effects will be omitted, but they are the same as those in the first embodiment.

<Third embodiment>

Fig. 5 is a view showing the configuration of the other tank 15 of the plating apparatus 11 according to the third embodiment of the present invention. In the third embodiment, the structure of the first space 17 of the groove 15 is different from that of the first embodiment and the second embodiment. The same components as those in the first embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted.

As shown in FIG. 5, the groove 15 is provided with the groove main body 20 and the first partition wall 21, and further has a second partition wall 35. The second partition wall 35 has a substantially rectangular shape, and is vertically erected from the bottom surface of the groove main body 20 as in the second embodiment. The second partition wall 35 divides the inside of the first space 17 into the supply space 33 and the settling space 31. The difference from the second embodiment is that the second partition wall 35 of the third embodiment does not have a plurality of communication ports.

In the third embodiment, since the upper edge portion 35a of the second partition wall 35 is located below the predetermined height, the height of the upper edge portion 35a of the second partition wall 35 is located in the plating solution stored in the settling space 31. Below the liquid level. Thereby, the plating liquid in the first space 17 can be moved from the supply space 33 to the sedimentation space 31 beyond the upper edge portion 35a of the second partition wall 35.

Therefore, in the third embodiment, since the second partition wall 35 is provided, the flow of the plating solution when it is supplied to the supply space 33 by the supply port 29a is less likely to be transmitted to the settling space 31. Further, since the plating solution flows into the sedimentation space 31 from the supply space 33 beyond the upper edge portion 35a of the second partition wall 35, it is possible to suppress the rolling up of the metal particles 32 that have settled under the sedimentation space.

In addition, the other configurations, operations, and effects will be omitted, but they are the same as those in the first embodiment.

<Fourth embodiment>

Fig. 6 is a view showing the configuration of a plating apparatus 11 according to a fourth embodiment of the present invention. In the fourth embodiment, the point at which the resupply pipe 43 is provided is different from that of the first embodiment. The same components as those in the first embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted.

As shown in Fig. 6, in the fourth embodiment, the plating apparatus 11 further includes a resupply pipe 43 for returning the plating liquid discharged from the tank 15 to the first space 17. One end 43a of the resupply pipe 43 communicates with the second space 19 connected to the lower portion of the side portion of the tank body 20. The other end 43b is disposed at an upper portion of the first space 17. A pump 66 and a filter 68 are provided in the resupply pipe 43.

Therefore, in the fourth embodiment, a part of the plating solution in the second space 19 of the other tank 15 is returned to the plating tank 13 and can be supplied to the first space 17 again through the resupply pipe 43. The foreign matter in the plating solution can be further effectively removed.

In addition, the other configurations, operations, and effects will be omitted, but they are the same as those in the first embodiment.

<Fifth Embodiment>

Fig. 7 is a view showing the configuration of a plating apparatus 11 according to a fifth embodiment of the present invention. In the fifth embodiment, the point at which the underflow partition 45 is disposed in the second space 19 is different from that of the first embodiment. The same components as those in the first embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted.

As shown in FIG. 7, in the fifth embodiment, the second space 19 on the downstream side of the first space 17 further includes a partition plate 45. The partition plate 45 is disposed in the second space 19, and is provided with a gap between the lower end side of the partition plate 45 and the bottom side of the groove main body 20, and the second space 19 is vertically formed above the slit. A plate-like body disposed in two regions of the side region and the downstream region. Therefore, the plating solution that has flowed into the second space 19 from the first space 17 passes through the slit when the upstream space is moved to the downstream side region in the second space 19. Therefore, the plating solution in the second space 19 can be more uniformly stirred.

In addition, the other configurations, operations, and effects will be omitted, but they are the same as those in the first embodiment.

<Sixth embodiment>

8A and 8B are views showing a part of the plating tank 13 of the plating apparatus 11 according to the sixth embodiment of the present invention, and Fig. 8A is a view showing a part of the plating tank 13 from the side, and Fig. 8B is a view. Take this picture from the top. In the sixth embodiment, the structure of the overflow groove 49 of the plating tank 13 is different from that of the first embodiment. The same components as those in the first embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted.

As shown in FIG. 8A and FIG. 8B, in the sixth embodiment, the overflow groove 49 of the plating tank 13 has an upstream side space 71 and a downstream side space 73 located on the downstream side of the upstream side space 71. The overflow tank 49 is composed of two grooves (the first groove 75 and the second groove 77). The upstream side space 71 is a space surrounded by the first groove 75 and the side wall 51 of the groove body 47, and the downstream side space 73 is a space surrounded by the second groove 77 and the side wall 51 of the groove body 47.

Among the upper edge portion 53 of the side wall 51 of the groove body 47, the upper edge portion of the first groove 75, and the upper edge portion of the second groove 77, the second groove 77 is the highest, and the first groove 75 is the lowest. As shown in FIG. 8B, a pair of overflow portions 81 are provided at the upper edge portion of the first groove 75. The overflow portion 81 is made to flow into the second groove 77 from the first groove 75 so that the plating solution overflows, which is lower than other portions. A through port 79 that connects the delivery-side pipe 29 is provided on the bottom side of the second groove 77.

As a result, the plating solution flows into the upstream side space 71 of the first groove 75 in the upper edge portion 53 of the side wall 51 of the overflow tank body 47, and further overflows the upper edge portion of the first groove 75 into the downstream side space 73 of the second groove 77. The through-port 79 flows into the transport-side pipe 29 . As described above, in the sixth embodiment, the plating solution is allowed to flow twice in the air. Therefore, not only in the tank 15, but also in the overflow tank 49 of the plating tank 13, the concentration of dissolved oxygen in the plating solution can be adjusted.

In particular, in the sixth embodiment, the plating liquid is caused to flow from the upstream side space 71 into the downstream side space 73 in the air by making the liquid level difference between the upper edge portion of the first groove 75 and the second groove 77 larger than 10 cm. The dissolved oxygen concentration is more effectively adjusted when flowing down.

Further, it is preferable that the upper edge portion 53 of the side wall 51 of the groove body 47 has the same protruding piece as that shown in Fig. 2 . Similarly, the upper edge portion of the first groove 75 preferably has the same protruding piece as that shown in Fig. 2 . When the upper edge portion has the protruding piece, the plating liquid that has flowed into the first groove 75 from the groove body 47 and the plating liquid that has flowed into the second groove 77 from the first groove 75 are guided to the tip end portion along the protruding piece, and the tip end is The front end of the portion is separated from the air by the protruding piece 27. Therefore, it is possible to suppress the plating solution from flowing down along the side surface of the groove body or the side surface of the first groove 75. Thereby, since the contact area with the air at the time of flowing the plating liquid can be increased, the adjustment of the dissolved oxygen concentration in the plating solution can be performed more effectively.

In addition, the other configurations, operations, and effects will be omitted, but they are the same as those in the first embodiment.

<Seventh embodiment>

9A and 9B are views showing a configuration of a portion of the plating tank 13 of the plating apparatus 11 according to the seventh embodiment of the present invention, and Fig. 9A is a view of a portion of the plating tank 13 as viewed from the side, and Fig. 9B is a view. Take this picture from the top. In the seventh embodiment, the structure of the overflow groove 49 of the plating tank 13 is different from that of the first embodiment, and the structure of the first groove 75 is different from that of the sixth embodiment. The same components as those in the first embodiment and the sixth embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted.

As shown in FIG. 9A and FIG. 9B, in the seventh embodiment, the first groove 75 has a through hole 85 at its bottom surface, and the discharge pipe 83 is connected to each of the through holes 85. The plating solution in the upstream side space 71 passes through the discharge pipes 83, and flows into the downstream side space 73 through the flowing air. The bottom of the first groove 75 is disposed above the bottom of the second groove 77. The discharge tube 83 can be omitted.

The other configurations, operations, and effects are omitted, but are the same as those in the first embodiment.

<Eighth Embodiment>

Fig. 10 is a view showing the configuration of a plating apparatus 11 according to an eighth embodiment of the present invention. In the eighth embodiment, the number of overflows of the groove 15 is two, which is different from the first embodiment. The same components as those in the first embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted.

As shown in Fig. 10, in the eighth embodiment, the groove 15 further has a third partition wall 91. The third partition wall 91 has a substantially rectangular shape and is erected upward from the bottom surface of the groove main body 20. The inside of the groove 15 is divided into a second space 19 and a third space 93 located on the downstream side of the second space 19 by the third partition wall 91. Thereby, the dissolved oxygen concentration of the plating solution can be more effectively adjusted.

Further, in the eighth embodiment, the second space 19 and the third space 93 on the downstream side of the first space 17 in which the metal particles have settled further include the underflow partition plate 45. Similarly to the fifth embodiment of Fig. 7, the partition plates 45 are provided in the second space 19 and the third space 93, and gaps are provided between the lower end of the partition plate 45 and the bottom surface of the groove body 20, respectively. At the same time, the second space 19 is partitioned into two regions of the upstream side and the downstream side, and the third space 93 is partitioned into the upstream side and the downstream side. The plate body is arranged regionally. Therefore, the plating solution that has flowed into the second space 19 from the first space 17 passes through the slit when the upstream side region is moved to the downstream side region in the second space 19. The plating solution that has flowed into the third space 93 from the second space 19 passes through the slit when moving from the upstream side region to the downstream side region in the third space 93, so that the second space 19 and the third space 93 can be provided. The plating solution is stirred more uniformly.

The upper edge portion 24 of the third partition wall 91 has the same structure as the upper edge portion 23 of the first partition wall 21. In other words, since the upper edge portion 24 of the third partition wall 91 has the protruding piece 27 as the upper edge portion 23 of the first partition wall 21, the plating liquid that has flowed into the third space 93 from the second space 19 is guided along the protruding piece 27. To the tip end portion, the front end portion of the tip end portion is separated from the protruding piece 27 and placed in the air. Therefore, it is possible to suppress the plating solution from flowing down along the side surface of the third partition wall 91. Thereby, since the contact area with the air at the time of the plating liquid flow can be increased, the dissolved oxygen concentration of the plating solution can be more effectively adjusted.

In addition, the other configurations, operations, and effects will be omitted, but they are the same as those in the first embodiment.

<Ninth Embodiment>

Figs. 11A and 11B are views showing the first partition wall 21 of the other tank of the plating apparatus according to the ninth embodiment. In the ninth embodiment, the plating solution does not overflow the upper edge portion 23 of the first partition wall 21 as described above, but the plating solution passes through the through hole 95 provided at the predetermined height of the first partition wall 21, and the first space is provided. 17 is configured to flow into the second space 19.

In the ninth embodiment, when the plating solution flows into the second space 19 from the first space 17, it may flow down along the side surface of the first partition wall 21, but it is preferable not to flow down the side surface of the first partition wall 21. For example, as shown in FIG. 11B, the first partition wall 21 preferably has a protruding piece 95a that protrudes in the lateral direction from the lower edge portion of the through hole 95 on the side surface on the side of the second space 19. At this time, the plating solution that has flowed into the second space 19 from the first space 17 is guided to the tip end portion along the protruding piece 95a, and is discharged from the front end portion of the tip end portion away from the protruding piece 95a into the air. Therefore, it is possible to suppress the plating solution from flowing down along the side surface of the first partition wall 21. Thereby, since the contact area with the air at the time of the plating liquid flow can be increased, the dissolved oxygen concentration of the plating solution can be more effectively adjusted.

In addition, the other configurations, operations, and effects will be omitted, but they are the same as those in the first embodiment.

<Other Embodiments>

In addition, the present invention is not limited to the above-described embodiments, and various modifications and improvements can be made without departing from the scope of the invention.

For example, in the above embodiments, the case where the object to be plated is plated with copper is described as an example. The present invention may be used for other plating such as electroplating of nickel or electroplating of gold in addition to electroplating of copper.

Further, in the above embodiment, the case where the other groove 15 is divided into two or three spaces by the partition wall will be described as an example, but the groove 15 may be divided into four or more spaces.

Further, the resupply pipe according to the fourth embodiment may be provided in the plating apparatus of another embodiment.

The plating apparatus and the plating method using the above embodiments are suitable for use in forming a wiring pattern or the like on a substrate to be plated, for example, a printed circuit board or a wafer, but are not limited to such applications.

The above embodiments are organized as follows.

The plating apparatus according to the above embodiment includes: a plating tank for storing the plating solution; and the plating tank is a groove of the other body, and the plating solution circulates between the plating tank and the plating tank. The other groove has a first space therein and a second space located downstream of the first space, and a portion exceeding the predetermined height of the plating solution in the first space is the first portion The space flows into the second space, and the plating solution has a structure in which air flows in the second space.

According to this configuration, since the portion of the plating solution that exceeds the predetermined height flows into the second space from the first space, and the portion below the predetermined height stays in the first space, the plating solution that stays in the first space can be left. The metal particles in the solution settle below the first space. When the metal particles are deposited in the lower portion of the first space as described above, the metal particles can be periodically recovered by performing a recovery means, and the metal particles in the plating solution can be effectively removed. Thereby, in the electroplating apparatus, the frequency of exchange of the filter can be reduced, and the filter can be omitted depending on the situation.

Further, a portion of the plating liquid in the first space that exceeds the predetermined height flows into the second space, and the plating liquid can be adjusted by exposing the plating solution in the flowing state to the air in the second space. Dissolved oxygen concentration.

As described above, according to this configuration, the dissolved oxygen concentration of the plating solution can be adjusted, and the cost due to the exchange of the filter can be reduced.

Specifically, the above-described structure of the above-described other groove includes a partition wall extending in the vertical direction so as to partition the first space and the second space, and the plating solution in the first space overflows in the partition wall. The structure in which the edge of the predetermined height is above the edge and flows into the second space.

In the above plating apparatus, the upper edge portion of the partition wall has a protruding piece extending toward the second space side, and the protruding piece preferably has a tip end separated from a side surface of the partition wall.

With this configuration, the plating solution that has flowed into the second space from the first space is guided to the tip end along the protruding piece, and is released from the protruding piece by the front end of the tip end and released into the air. In other words, when the protruding piece is not provided at the upper edge portion, the plating solution that has flowed into the second space from the first space easily contacts the side surface of the partition wall and flows down along the side surface. However, in this configuration, the plating solution can be prevented from passing along the partition wall. The side is flowing down. Thereby, since the contact area with the air at the time of flowing the plating liquid can be increased, the dissolved oxygen concentration of the plating solution can be more effectively adjusted.

Further, in the above-described plating apparatus, the protruding piece has a lateral portion extending in the lateral direction from the second space side and a vertical portion extending downward from the tip end of the lateral portion, the leading end of the vertical portion and the side surface of the partition wall The structure of the separation is better.

With this configuration, the plating solution that has flowed into the second space from the first space is guided to the tip end portion along the lateral portion, and the distance from the side surface of the partition wall increases, and then flows downward in the downward direction along the vertical portion. It is possible to further suppress the plating liquid from flowing down along the side of the partition wall.

Further, in the above-described plating apparatus, for example, the plating solution in the first space may have a structure in which the plating solution flows into the second space through a through opening located at the predetermined height of the partition wall.

Further, the plating apparatus further includes a transport-side pipe that transports the plating solution from the plating tank to the other tank, and the transport-side pipe has a supply port for supplying the plating solution in the first space, and the supply port It is better to be below the above-mentioned predetermined height.

According to this configuration, when the supply port of the transport-side pipe is located below the predetermined height, that is, below the liquid level of the plating solution stored in the first space, the plating solution is supplied to the first space by the supply port. It can be directly supplied to the liquid stored in the plating solution in the first space. In this way, the case where the plating solution is directly supplied to the plating solution in the first space can be reduced as compared with the case where the plating solution discharged from the supply port into the air is deposited in the liquid level of the plating liquid stored in the first space. Impact on the plating solution in the first space. Thereby, the flow of the plating solution stored in the first space can be suppressed, and the metal particles can be more effectively settled in the first space.

Further, when the discharge direction of the plating solution of the supply port is directed toward the inner side surface of the other groove, for example, the flow of the plating solution stored in the first space can be suppressed, in particular, compared with the case where the protruding direction is downward. It is the flow of the plating solution on the lower side. Thereby, since the metal particles which settled in the first space can be suppressed from being rolled up again, it is possible to suppress the sedimentation of the metal particles in the first space from being hindered.

Further, the plating apparatus may further include a transport side pipe that transports the plating solution to the other tank by the plating tank, wherein the partition wall is a first partition wall, and the other tank has a second partition wall The inside of the space is divided into a sedimentation space for sedimenting the metal particles in the plating solution, and is located upstream of the sedimentation space, and the supply space of the plating solution is supplied from the supply port of the transport-side pipe, and is extended in the vertical direction. The composition.

According to this configuration, the first space can be divided into the sedimentation space and the supply space by the second partition wall, and the plating liquid is supplied from the supply port of the transport-side pipe to the supply space, so that the plating solution stored in the supply space is supplied even when the plating solution is supplied. This flow is not easily transmitted to the settlement space. Therefore, the metal particles can be more effectively settled than in the case where the second partition wall is not provided in the first space.

Further, when the second partition wall is provided below the predetermined height and has a plurality of communication ports that communicate with the settling space and the supply space, the plating solution supplied to the supply space is dispersed and transferred to the plurality of communication ports of the second partition wall. Settling space. By dispersing the plating solution into the sedimentation space through the plurality of communication ports as described above, the flow of the plating solution stored in the sedimentation space can be suppressed.

Further, when the upper edge portion of the second partition wall is located at the predetermined height or lower than the predetermined height, the height of the upper edge portion of the second partition wall is the same as or lower than the liquid level of the plating solution stored in the settling space. . Therefore, since the liquid level of the plating solution in the settling space is substantially the same height as the liquid level of the plating solution in the supply space, the plating solution flowing into the settling space from the supply space can alleviate the impact during the inflow. Since the metal particles in the settling space can be suppressed from being rolled up again, it is possible to suppress the sedimentation of the metal particles in the sedimentation space from being hindered.

Further, the plating apparatus includes: a return-side pipe for returning the plating solution to the plating tank by the other tank, and a resupply pipe for returning the plating solution discharged from the other tank to the first space; The first space can be re-supplied to the plating tank by returning one of the plating solutions in the tank to the plating tank. Thereby, the foreign matter in the plating solution can be separated more effectively.

Further, when the mechanical agitator is provided in the space on the downstream side of the first space, the metal particles are sedimented in the first space, and then the plating solution is stirred by the mechanical agitator in the space on the downstream side. Thereby, fine adjustment of the dissolved oxygen concentration of the plating solution can be performed.

Further, the plating tank may be a tank body having a plating solution for storing the plating solution, and an overflow tank integrally provided with the tank body, wherein the plating solution of the tank body overflows the upper edge portion of the side wall of the tank body In the meantime, the overflow tank has an upstream side space therein and a downstream side space which is located downstream of the upstream side space, and the plating solution flows into the downstream side space from the upstream side space and flows down in the air.

In this configuration, not only the groove but also the overflow groove of the plating tank can also adjust the oxygen concentration of the plating solution. In the overflow tank, the plating solution adjusts the dissolved oxygen concentration between when the upstream side space flows into the downstream side space and flows down in the air.

Further, the upper edge portion of the groove main body has a protruding piece extending toward the overflow groove side, and the protruding piece has a plating liquid flowing into the overflow groove from the groove main body when the front end of the groove main body is separated from the side surface of the groove main body. The above-mentioned protruding piece is guided to the tip end portion thereof, and is separated from the protruding piece by the front end of the leading end portion and discharged into the air. Therefore, with this configuration, it is possible to suppress the plating solution from flowing down along the side surface of the groove body. Thereby, since the contact area with the air at the time of flowing the plating liquid can be increased, the adjustment of the dissolved oxygen concentration in the plating solution can be performed more effectively.

In the second space, the drop in the air flowing through the plating solution is preferably 10 cm or more. By adjusting the above-described drop to 10 cm or more, the concentration of dissolved oxygen in the plating solution in the other bath can be more effectively performed.

In the plating method according to the above embodiment, a plating tank including a plating bath is used, and a plating apparatus for circulating the plating solution between the plating tank and the plating tank is used. The other groove has a first space therein and a second space located downstream of the first space. In this method, the plating solution is stored in a predetermined height in the first space, and metal particles in the plating solution are deposited below the first space. Further, in this method, a portion of the plating solution in the first space that exceeds the predetermined height flows into the second space, and the dissolved oxygen concentration of the plating solution is adjusted by the air in the second space. Thereby, the concentration of dissolved oxygen in the plating solution can be adjusted, and the metal particles in the plating solution can be effectively removed.

In the plating apparatus and the plating method according to the above embodiment, the plating solution is used for copper plating, and it is particularly preferable to use a sulfur-containing organic compound as a brightener.

Hereinafter, the present invention will be specifically described by way of examples, but the present invention is not limited to the following examples.

<Example 1>

The object to be plated (sample No. 1 to 8) was subjected to electroplating using the plating apparatus under the following conditions. For the sample Nos. 2 to 4, the plating apparatus 11 shown in Fig. 12 was used. In the plating apparatus 11, the plating tank 13 is the same as the structure shown in FIG. 1, and the groove 15 is divided into the first space 17, the second space 19, and the first partition 21 and the third partition 91 in the tank body 20. 3 The structure of the three spaces of space 93. The plating solution overflows the upper edge portion of the first partition wall 21, flows into the second space 19 from the first space 17, overflows the upper edge portion of the third partition wall 91, and flows into the third space 93 from the second space 19. An underflow partition 45 is disposed in the second space 19.

Further, in Sample Nos. 1, 5 to 8, the partition walls 21 and 91 were removed by using the other grooves 15 of the plating apparatus 11 shown in Fig. 12.

The structure of the upper edge portion of the first partition wall 21 and the third partition wall 91 is as shown in Table 2 to be described later, the sample No. 4 is the structure A (the structure shown in FIG. 2D), and the sample Nos. 2 and 3 are the structure B. (shown in the construction of Figure 2E).

The difference between the upper edge portion of the first partition wall 21 and the third partition wall 91 to the liquid surface of the plating solution is three conditions of 5 cm, 10 cm, and 20 cm as shown in Table 2 below.

The object to be plated (cathode) uses a stainless steel plate and a substrate having a via hole (a printed circuit board having a blind via hole). The via diameter of the via hole of the substrate was set to 100 μm, and the depth of the via hole was 75 μm.

Other copper plating conditions are as follows.

The amount of bath of the plating tank 13 (total of the bath volume of the tank body 47 and the overflow tank 49): 4,300 liters

The amount of bath in the tank 15 (the total amount of baths in the first space 17, the second space 19, and the third space 93): 800 liters

Bath volume: 5100 liters

Plating solution: copper sulfate plating solution (including copper sulfate pentahydrate and 200g/L, sulfuric acid 50g/L, and chloride ion 50mg/L)

Additive added to plating solution: "THRU-CUP EVF-T" manufactured by Uemura Industrial Co., Ltd.

The circulation speed of the plating solution: 860 liters / minute

Anode: Soluble anode (containing titanium phosphate in titanium box, this is packed in polypropylene anode bag)

The object to be plated was subjected to electroplating copper under the above conditions, and the dissolved oxygen concentration, the physical property of the film, and the amount of depression of the via hole at this time were evaluated. The evaluation of the physical properties (elongation and tensile strength) of the film was carried out by applying a 50 μm copper plate to the above-mentioned stainless steel plate of the object to be plated. For the evaluation of the amount of depression of the via hole, a copper plate of 20 μm was applied to the above-mentioned circuit board with the via hole of the object to be plated.

In the first embodiment, the stainless steel sheets were subjected to the prior treatment, the electroplating copper treatment, and the post treatment in the order of the following steps 1 to 8.

Step 1: Pickling Cleaner (MSC-3-A, manufactured by Uemura Industrial Co., Ltd.)

Step 2: Soup wash

Step 3: Washing

Step 4: Pickling

Step 5: Washing

Step 6: Electroplating copper

Step 7: Washing

Step 8: Dry

Further, for the substrate with the via hole, the conventional desmear treatment and the electroless copper plating (0.3 μm) are performed, and the pretreatment, the electroplating copper treatment, and the subsequent steps are performed in the same steps as the above-mentioned steps 1 to 8. deal with.

Further, the conditions for electroplating copper in Example 1 are shown in Table 1. The processing temperature of the electroplated copper (temperature of the plating solution) was 25 °C. Further, the unit of the cathode current density in Table 1 is A/dm ² .

The results are shown in Table 2. In addition, the test procedure of each sample is shown in Table 3. In addition, in Table 4, after the completion of the plating treatment of Sample No. 1, the partition walls 21 and 91 shown in Fig. 12 were attached as the other tanks, and the dissolved oxygen concentration was electrolyzed for 30 minutes, 60 minutes, and 90 minutes. In addition, a portion of the plating liquid supplied to the tank main body 47 through the return-side piping 41 is supplied through the piping end portion 41c so that the flow rate of the plating liquid to the object to be plated (cathode 57) is substantially constant. The dissolved oxygen concentration is measured by the dissolved oxygen of the plating solution of the valve which is omitted from the piping attached to the pipe end portion 41c of Fig. 12 .

The amount of recess of the via hole is the lowest in the surface of the copper plating 103 formed in the via hole 101c after the copper plating 103 shown in FIG. 15B is applied to the substrate 101 with the via hole shown in FIG. 15A. The portion Δh of the height (the dimension in the thickness direction) of the surface of the copper plating 103 formed on the peripheral portion of the via hole 101c is obtained (Fig. 15B). Further, the base 101 to which the via hole is attached in FIG. 15A includes a resin layer 101a and a copper layer 101b formed on the surface of the resin layer 101a, and the via hole 101c is formed therewith.

Further, the elongation and the tensile strength were measured by using the test piece shown in Fig. 16 as follows. Namely, first, the stainless steel plate was subjected to copper plating of 50 μ ± 5 μm, and then the copper plating layer (copper foil) was carefully peeled off from the stainless steel plate without wrinkles or scratches. After the copper foil was heat-treated at 120 ° C for 2 hours, a test piece having the shape shown in Fig. 16 was produced by punching. The film thickness of the center portion of the test piece was measured by a fluorescent X-ray film thickness meter, and the measured value was defined as the film thickness d (mm) of the test piece. Next, the distance between the chucks of the tensile tester was set to 40 mm, the inner round portion of the test piece was exposed by the chuck, and the test piece was fixed by a chuck, and the test was performed at a tensile speed of 4 mm/min. Next, the maximum tensile stress F (kgf) was read from the chart obtained by the test, and the value was divided by the cross-sectional area of the test piece at F (kgf) to obtain the tensile strength shown in Tables 2, 6, and 9 (kgf/mm ^{2 ).} ). The cross-sectional area of the test piece was the product of the width of the central portion of the test piece of 10 mm and the film thickness dmm. The elongation E (%) is a measure of the dimension ΔL (mm) at which the test piece is stretched until the test piece is broken, and the ΔL (mm) is the size of the straight portion of the central portion of the test piece for stretching the money. (20mm) is calculated by dividing.

As a result of the sample No. 1 of Table 2, it was found that when the other grooves in which the partition walls 21 and 91 were not provided, the dissolved oxygen concentration of the plating solution was low, and the amount of the via hole depression was increased.

As a result of the sample Nos. 2 to 4, it is understood that the dissolved oxygen concentration can be increased by overflowing the plating solution by providing the partition walls 21 and 91 in the groove 15. Further, in Sample Nos. 3 and 4, the concentration of dissolved oxygen was remarkably increased by making the difference in plating solution at the time of overflow of 10 cm or more. In these sample Nos. 3 and 4, even if electrolysis was performed for a long period of time, the dissolved oxygen concentration did not decrease.

After the plating treatment of the sample No. 4, the results of the sample Nos. 5 to 8 which were successively carried out, it was found that the partition walls 21 and 91 were removed from the other grooves 15, and the dissolved oxygen concentration decreased as the electrolysis time became longer. The tendency of the amount of large via holes to be recessed.

Further, as shown in Table 4, after the plating treatment of the sample No. 1, the electrolysis was performed by the partition walls 21 and 91 in the other tank, and the dissolved oxygen concentration was increased over time.

<Example 2>

The object to be plated (sample No. 9 to 14) was plated with copper under the following conditions using a plating apparatus as shown in Figs. 13A and 13B. In the sample Nos. 12 to 14, as the other groove 15, a groove having the partition walls 21, 91 which are the same as those of the device of Fig. 12 was used. Further, as shown in FIGS. 13A and 13B, the plating tank 13 includes a tank body 47 and an overflow tank 49, and the plating liquid overflowed from the tank body 47 flows into the overflow tank 49. In the tank body 47, the plate-shaped object to be plated of the cathode 57 is arranged slightly horizontally, and a plurality of anodes 55 are arranged above and below the cathode 57, respectively. Further, nozzles 61 are disposed above and below the cathode 57, respectively. Each of the nozzles 61 is provided with a plurality of discharge ports (not shown) that eject the plating liquid transported from the other grooves 15 through the return-side piping 41 toward the cathode 57 side.

Further, in Sample Nos. 9 to 11, the partition walls 21 and 91 were removed from the other grooves 15.

The difference between the upper edge portion of the first partition wall 21 and the third partition wall 91 to the plating liquid surface is three conditions of 5 cm, 10 cm, and 20 cm as shown in Table 6 to be described later.

As the object to be plated (cathode), a stainless steel plate and a substrate with a through hole were used. The inner diameter of the through hole of the substrate was 0.3 mm, and the thickness of the substrate was 1.6 mm.

Other conditions for electroplating copper are as follows.

The amount of bath of the plating tank 13 (total of the bath volume of the tank body 47 and the overflow tank 49): 1000 liters

The amount of bath in the tank 15 (the total amount of baths in the first space 17, the second space 19, and the third space 93): 1400 liters

Bath volume: 2400 liters

Plating solution: copper sulfate plating solution (including copper sulfate pentahydrate and 100g/L, sulfuric acid 200g/L, and chloride ion 50mg/L)

Additive added to plating solution: "THRU-CUP ETN" manufactured by Uemura Industrial Co., Ltd.

Plating rate of plating solution: 3000 liters / minute

Anode: Insoluble anode (coated with bismuth oxide on Ti-Pt)

In the second embodiment, the stainless steel sheets were subjected to the prior treatment, the electroplating copper treatment, and the post treatment in the same manner as in the first to the first steps.

Further, the substrate having the through holes was subjected to conventional desmearing treatment and electroless copper plating (0.3 μm) treatment in the same manner as in Example 1, and then applied in the same manner as in the first to the first steps of the first embodiment. Previous treatment, electroplating copper treatment and post treatment.

Further, the copper plating conditions in Example 2 are shown in Table 5. The electroplating copper treatment temperature (temperature of the plating solution) was 25 °C. Further, the unit of the cathode current density in Table 5 is A/dm ² .

The object to be plated was subjected to electroplating copper under the above conditions, and the dissolved oxygen concentration, the physical properties of the film, and the uniformity of the through holes (TH-TP) were evaluated. The results are shown in Table 6. In addition, the test procedure of each sample is shown in Table 7. The dissolved oxygen concentration is measured by the dissolved oxygen of the plating solution of the valve (not shown) taken from the return-side pipe 41 installed on the downstream side of the filtered gas 65 of Fig. 13 .

Uniformity, which is defined as the ratio of the thickness of the copper plated in the center of the depth direction of the through hole to the thickness of the copper plated on the surface of the substrate near the through hole. In other words, the uniformity (TH-TP) is as shown in FIG. 17, and after the copper plating 107 is applied to the substrate 105 on which the friend via hole 105a is formed, the plating in the central portion in the depth direction of the via hole is measured. The copper thicknesses e, f, and the thickness a to d of the copper plating surface on the surface of the substrate in the vicinity of the through hole are obtained by substituting each value into the following formula (5).

TH-TP(%)=2(e+f)/(a+b+c+d)×100 (5)

As a result of the sample No. 9 of Table 6, the dissolved oxygen concentration at the start of plating was 7.4 mg/liter, so that the physical properties of the film were good. However, as a result of the samples Nos. 10 and 11, it was found that as the electrolysis time became longer and the dissolved oxygen concentration increased, the physical properties of the sample No. 10 after 3 hours deteriorated, and the TH-TP became quite low, 6 hours. In the subsequent sample No. 11, the physical property of the film became worse, and the TH-TP was lowered to 65.6%.

On the other hand, in Sample Nos. 12 to 14, the plating liquid was overflowed by providing the partition walls 21 and 91 in the other tank 15, and the increase in the dissolved oxygen concentration was suppressed. In particular, when the amount of the plating solution overflowed by the sample Nos. 13 and 14 is 10 cm or more, the effect of suppressing the increase in the dissolved oxygen concentration can be remarkably enhanced. In these samples Nos. 13 and 14, the dissolved oxygen concentration was lowered to 20 mg/liter or less, and the physical properties of the film were also good, and the TH-TP was also 75% or more.

<Example 3>

The object to be plated (sample No. 15 to 18) was subjected to electroplating using the plating apparatus shown in Fig. 14 under the following conditions. In the sample Nos. 17 and 18, as the other groove 15, a groove having the partition walls 21 and 91 similar to those of the device of Fig. 12 was used. Further, as shown in FIG. 14, the plating tank 13 includes a tank body 47 and an overflow tank 49, and the plating liquid overflowed from the tank body 47 flows into the overflow tank 49.

Inside the tank body 47, the diaphragm 99 is divided into two spaces. As the ruthenium film 99, "Y-9205T" manufactured by Yuasa Membrane System Co., Ltd. was used. The object to be plated of the cathode 57 is disposed in one space, and the anode 55 is disposed in the space on the other side. A nozzle 61 is disposed in the vicinity of the cathode 57. The nozzle 61 is provided with a discharge port (not shown) that ejects the plating liquid conveyed from the other tank 15 through the return-side pipe 41 toward the cathode 57 side.

Further, in Sample Nos. 15 and 16, the partition walls 21 and 91 were removed from the other grooves 15.

The difference between the upper edge portion of the first partition wall 21 and the third partition wall 91 to the plating liquid surface is two conditions of 10 cm and 20 cm as shown in Table 9 to be described later.

As the object to be plated (cathode), a wafer having a stainless steel plate and a blind via hole is used. The via diameter of the via hole of the substrate was 15 μm, and the depth of the via hole was 25 μm.

Other conditions for electroplating copper are as follows.

The amount of bath of the plating tank 13 (total of the bath volume of the tank body 47 and the overflow tank 49): 50 liters

The amount of bath in the tank 15 (the total amount of baths in the first space 17, the second space 19, and the third space 93): 150 liters

Bath volume: 200 liters

Plating solution: copper sulfate plating solution (including copper sulfate pentahydrate and 200g/L, sulfuric acid 50g/L, and chloride ion 50mg/L)

Additive added to plating solution: "THRU-CUP ESA-21" manufactured by Uemura Industrial Co., Ltd.

The circulation speed of the plating solution: 100 liters / minute

Anode: Soluble anode (in titanium box containing phosphor bronze balls)

In the third embodiment, the pretreatment, the electroplating copper treatment, and the post treatment were applied to the stainless steel sheets in the same manner as in the first to the first steps of the first embodiment.

Further, after the barrier layer and the seed layer were applied to the wafer by a conventional method, the prior treatment, the copper plating treatment, and the post treatment were applied in the same manner as in the first to the first steps of the first embodiment.

Further, the conditions for electroplating copper in Example 3 are shown in Table 8. The temperature of the electroplating copper treatment (temperature of the plating solution) was 25 °C. Further, the unit of the cathode current density in Table 8 is A/dm ² .

The object to be plated was subjected to electroplating copper under the above conditions, and the dissolved oxygen concentration, the physical property of the film, and the amount of depression of the via hole at this time were evaluated. The results are shown in Table 9. Further, the test procedures of the respective samples are shown in Table 10. The dissolved oxygen concentration is measured by the dissolved oxygen of the plating solution of the valve (not shown) taken from the return-side piping 41 installed on the downstream side of the filtration gas 65 of Fig. 14 .

Further, in sample No. 15, the first space 17 of the other tank 15 was plated by air agitation using air agitation device 94 while supplying air to the plating solution.

The sample No. 15 of Table 9 was electrolyzed by air agitation in the first space 17 of the tank 15, and the dissolved oxygen concentration of the plating tank 13 was 3.8 mg/liter as shown in Table 9, and at this time, the tank 15 was The dissolved oxygen concentration was 7.2 mg / liter. By performing the air agitation in this manner, the dissolved oxygen concentration in the other tank can be maintained in an appropriate range. However, the air agitation hinders the sedimentation of the copper particles in the first space 17, and the filter 65 confirms that a large number of copper particles are present. Attached. Since the copper particles adhering to the filter 65 consume dissolved oxygen, the concentration of dissolved oxygen in the plating tank is lowered, and the amount of recessed via holes tends to increase.

As a result of the sample No. 16, the copper particles immediately after the exchange of the filter 65 hardly adhered, so that the dissolved oxygen concentration in the plating tank was also good, and the amount of recessed in the via hole was also small.

Sample Nos. 17 and 18 were in a state where the copper particles hardly adhered to the filter 65 (the first white state of the new product), and it was found that the copper particles effectively settled in the first space 17. Thus, the copper particles can be effectively separated from the plating solution while overflowing the plating solution by providing a partition wall in the other groove to increase the dissolved oxygen concentration. Thereby, the dissolved oxygen concentration in the plating tank can be maintained in an appropriate range, and the amount of recessed in the via hole can also be reduced.

<Reference example>

The relationship between the dissolved oxygen concentration in the plating solution, the concentration of the brightener, and the Ar value was investigated using a cyclic volt stripping method (CVS) measurement method. The method of CVS measurement is as follows.

1) Method for determining Ar value

A rotating platinum electrode as a working electrode, a copper rod serving as a counter electrode, and a silver/silver chloride double salt bridge electrode as a reference electrode are respectively immersed in the plating solution. The potential applied to the rotating platinum electrode was changed, and the plating step, the peeling step, and the cleaning step were repeated to prepare a potential-current curve (Voltammogram), and the potential-current curve was used to determine the area (Ar value) of the peeling step.

The results shown in Tables 11 and 12 below are those obtained by applying the above CVS measurement method, and the time-dependent change of the Ar value obtained by repeating the continuous scanning in the above measurement method.

2) Measuring machine for measuring Ar value, measurement conditions

Measuring machine: "QL-5" made by ECI

Measurement conditions: Rotating platinum electrode rotation number 2500 rpm, potential scanning speed 100 mV / sec, temperature 25 ° C

3) Measuring solution

The measurement solution was prepared as follows. A VMS 30 mL to be described later was placed in a container, and a mixed solution of 30 mL of a plating solution to be measured was used as the measurement liquid.

4) VMS and measuring object plating solution

The plating solution to be measured is shown in Table 11 for Sample Nos. 19 to 23, and Table 12 for Sample Nos. 24 to 28. In the plating process of the sample No. 1 of the first embodiment, the plating solution of the sample No. 19 of the first embodiment is taken by a valve (not shown) attached to the pipe near the pipe end portion 41c of Fig. 12 . In the plating solution of the sample No. 20 of the sample No. 20, the plating solution was taken from the same position in the plating treatment of the sample No. 3 of the first embodiment. In addition, in the plating process of the sample No. 11 of the second embodiment, the plating liquid of the sample No. 24 of the sample No. 24 is omitted from the return-side pipe 41 attached to the downstream side of the filter 65 of Fig. 13 . The plating solution to be used for the valve, and the plating liquid to be measured by the sample No. 25 are the plating liquids taken at the same position in the plating treatment of the sample No. 13 of the second embodiment.

In addition, the plating liquids to be measured in Sample Nos. 21 to 23 and Sample Nos. 26 to 28 were prepared in a beaker, and the dissolved oxygen concentration and the brightener concentration of the prepared measurement liquid were shown in Tables 11 and 12. The value.

The additive of the plating solution to be measured by the sample No. 19 to 23 is used as "THRU-CUP EVF-T" manufactured by Uemura Industrial Co., Ltd., and the additive of the plating solution to be measured in samples No. 24 to 28, respectively. "THRU-CUP ETN" manufactured by Uemura Industrial Co., Ltd.

As VMS (plating solution without additive), for the sample Nos. 19 to 23 of Table 11, a copper sulfate plating solution (containing copper sulfate pentahydrate and 200 g/L, sulfuric acid 50 g/L, and chloride ion 50 mg) was used. /L) For the sample Nos. 24 to 28 of Table 12, a copper sulfate plating solution (containing copper sulfate pentahydrate and 100 g/L, sulfuric acid 200 g/L, and chloride ion 50 mg/L) was used.

5) Measurement results

The measurement results are shown in Table 11 and Table 12.

The measured Ar value reflects the concentration of the brightener. From Table 11, in the case of Sample Nos. 20 and 21 with an appropriate dissolved oxygen concentration and a brightener concentration, the Ar value was about 1.14 to 1.16. In sample No. 19, even when the concentration of the brightener was insufficient and the dissolved oxygen concentration was insufficient, the initial Ar value was almost equal to the case where the brightener concentration was excessive (sample No. 22) was about 1.2. The Ar value of the sample No. 19 was reduced to approximately 1.15 as much as the sample No. 20 as time passed.

Further, from Table 12, in Sample Nos. 25 and 26, when the dissolved oxygen concentration and the brightener concentration were appropriate, the Ar value was about 1.97. In the sample No. 24, even if the concentration of the brightener was excessive and the dissolved oxygen concentration was excessive, the initial Ar value was approximately 1.91 as much as the case where the brightener concentration was insufficient (sample No. 28). The Ar value of the sample No. 24 was increased to approximately 1.96 as much as the sample No. 25 with the passage of time.

Further, as in the above-mentioned samples No. 19 and No. 24, the Ar values corresponding to the Ar values of the sample No. 20 and the sample No. 25 with the passage of time were as follows. In other words, if the scanning is repeated continuously, since the air is dissolved in the measuring liquid, the dissolved oxygen concentration changes as shown in Tables 11 and 12 and approaches an appropriate concentration. The reason why the air is dissolved in the measuring liquid is to stir with a rotating platinum electrode, and the dissolved oxygen concentration of the VMS is close to the saturated concentration of the air.

11. . . Plating device

13. . . Plating tank

15. . . He slot

17. . . First space

19. . . Second space

20. . . He slot body

twenty one. . . 1st next door

twenty three. . . Upper edge

twenty four. . . Upper edge

25. . . Next door body

27. . . Protruding piece

27a. . . Transverse

27b. . . Longitudinal

29. . . Conveying side piping

29a. . . Supply port

31. . . Settling space

32. . . Metal particles

33. . . Supply space

35. . . Second next door

35a. . . Upper edge

41. . . Return side piping

41a. . . Ends

41b. . . Ends

41c. . . Ends

43. . . Resupply piping

43a. . . One end of the supply pipe 43

43b. . . The other end of the supply pipe 43

45. . . Partition

47. . . Slot body

49. . . Overflow slot

51. . . Side wall

53. . . Upper edge

55. . . anode

57. . . cathode

59. . . Anode bag

61. . . nozzle

63. . . Pump

64. . . Pump

65. . . filter

66. . . Pump

68. . . filter

71. . . Upstream space

73. . . Downstream side space

75. . . First slot

77. . . Second slot

79. . . Through hole

83. . . Spit tube

85. . . Through hole

91. . . 3rd next door

93. . . Third space

95. . . Through hole

95a. . . Protruding piece

Fig. 1 is a view showing the configuration of a plating apparatus according to a first embodiment of the present invention.

2A to 2F are diagrams each showing a modification of the structure of the upper edge portion of the groove of the plating apparatus.

3A to 3E show modifications of the shape and arrangement state of the piping on the transport side, respectively.

Fig. 4 is a view showing the configuration of a groove of a plating apparatus according to a second embodiment of the present invention.

Fig. 5 is a view showing the configuration of a groove of a plating apparatus according to a third embodiment of the present invention.

Fig. 6 is a view showing the configuration of a plating apparatus according to a fourth embodiment of the present invention.

Fig. 7 is a view showing the configuration of a plating apparatus according to a fifth embodiment of the present invention.

8A and 8B are views showing a configuration of a plating tank of a plating apparatus according to a sixth embodiment of the present invention.

9A and 9B are views showing a configuration of a plating tank of a plating apparatus according to a seventh embodiment of the present invention.

Fig. 10 is a view showing the configuration of a plating apparatus according to an eighth embodiment of the present invention.

Fig. 11A is a view showing a first partition wall of a tank of a plating apparatus according to a ninth embodiment of the present invention, and Fig. 11B is a sectional view taken along line XIB-XIB of Fig. 11A.

Fig. 12 is a view showing the configuration of a plating apparatus used in the first embodiment.

Fig. 13A is a view showing a configuration of a plating apparatus used in the second embodiment, and Fig. 13B is a sectional view taken along line XIIIB-XIIIB of Fig. 13A.

Fig. 14 is a view showing the configuration of a plating apparatus used in the third embodiment.

15A and 15B are cross-sectional views for explaining a method of measuring the amount of depression of the via holes in the first and third embodiments.

Fig. 16 is a plan view showing the shapes of the test pieces for measuring the elongation and the tensile strength in Examples 1 to 3.

Fig. 17 is a cross-sectional view for explaining a method of evaluating the throwing power of the through hole of the second embodiment.

11. . . Plating device

13. . . Plating tank

15. . . He slot

17. . . First space

19. . . Second space

20. . . He slot body

twenty one. . . 1st next door

twenty three. . . Upper edge

29. . . Conveying side piping

29a. . . Supply port

41. . . Return side piping

41a. . . Ends

41b. . . Ends

41c. . . Ends

47. . . Slot body

49. . . Overflow slot

51. . . Side wall

53. . . Upper edge

55. . . anode

57. . . cathode

59. . . Anode bag

61. . . nozzle

63. . . Pump

64. . . Pump

65. . . filter

Claims (17)

An electroplating apparatus comprising: a plating tank for storing a plating solution; a groove which is a groove of the plating tank; the plating solution is circulated between the plating tank; and a conveying side pipe, The plating tank conveys the plating solution to the other tank; the other tank has a first space therein and a second space located downstream of the first space, and has a first space A portion of the plating solution that exceeds a predetermined height flows into the second space from the first space, and the plating solution is a structure in which the second space flows down in the air, and the other groove has a first partition wall which is separated by a partition. Opening the first space and the second space to extend in the vertical direction; and the second partition wall dividing the inside of the first space into a sedimentation space for sedimenting metal particles in the plating solution, and located in the sedimentation On the upstream side of the space, the supply space of the plating solution is supplied from the supply port of the transport-side pipe, and is extended in the vertical direction. The plating apparatus according to claim 1, wherein the plating solution having the first space overflows in a structure in which the first partition wall is located at an upper edge of the predetermined height and flows into the second space. The plating apparatus according to claim 1, wherein the plating solution having the first space is configured to flow into the second space through a through opening of the first partition wall at the predetermined height. The plating apparatus according to claim 2, wherein the upper edge portion of the first partition wall has a protruding piece extending toward the second space side, and the protruding piece has a side surface separated by the first partition wall Apex. The plating apparatus according to claim 4, wherein the protruding piece has a lateral portion extending in a lateral direction toward the second space side and a vertical portion extending downward from a distal end of the lateral portion, the vertical portion The tip end is spaced apart from the side surface of the first partition wall. The plating apparatus according to any one of claims 1 to 5, further comprising: a transport-side pipe that transports the plating solution to the other tank by the plating tank, and the transport-side pipe has the first The space is supplied to the supply port of the plating solution, and the supply port is located below the predetermined height. The plating apparatus according to claim 6, wherein the plating solution is directed from a discharge direction of the supply port toward an inner side surface of the other groove. The plating apparatus according to claim 1, wherein the second partition wall has a plurality of communication ports that are provided below the predetermined height and that communicate with the settling space and the supply space. The plating apparatus according to claim 1, wherein the upper edge of the second partition wall is located at the predetermined height or lower than the predetermined height. The electroplating apparatus according to claim 1, further comprising: returning the plating solution to the return-side pipe of the plating tank by the tank, and returning the plating solution discharged from the tank to the tank First space Re-supply piping. The plating apparatus according to claim 1, further comprising: a mechanical agitator disposed downstream of the first space. The plating apparatus according to claim 1, wherein the plating tank has: a tank body for storing the plating solution; and the tank body is integrally provided, wherein the plating liquid of the tank body overflows a side wall of the tank body An overflow tank into which the upper edge portion flows, the overflow tank having an upstream side space therein; and a downstream side space located downstream of the upstream side space, and having the plating liquid flowing into the downstream from the upstream side space The construction of the air in the side space. The plating apparatus according to claim 12, wherein the upper edge portion of the groove body has a protruding piece extending toward the overflow groove side, and the protruding piece has a tip end spaced apart from a side surface of the groove body. The plating apparatus according to claim 1, wherein the plating solution has a drop of 10 cm or more in the air in the second space. The plating apparatus according to claim 1, wherein the plating solution is used for copper plating, and contains a sulfur-containing organic compound as a brightening agent. An electroplating method comprising: a plating bath for depositing a plating solution; and a groove which is separate from the plating bath, wherein the plating solution circulates between the plating tank and the plating tank as claimed in claim 1 The plating apparatus according to any one of the preceding claims, wherein the other tank has a first space therein and a second space located downstream of the first space, and the plating is performed in the first space. The liquid is stored to a predetermined height so that The metal particles in the plating solution are deposited below the first space, and a portion of the plating solution in the first space that exceeds the predetermined height flows into the second space, and the plating solution is in the second space. An electroplating method for adjusting the dissolved oxygen concentration of the above plating solution in a space under air. The electroplating method according to claim 16, wherein the plating solution is used for copper plating, and comprises a sulfur-containing organic compound as a brightening agent.