CN105803497B - Novel electroplating device - Google Patents
Novel electroplating device Download PDFInfo
- Publication number
- CN105803497B CN105803497B CN201610352237.5A CN201610352237A CN105803497B CN 105803497 B CN105803497 B CN 105803497B CN 201610352237 A CN201610352237 A CN 201610352237A CN 105803497 B CN105803497 B CN 105803497B
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- CN
- China
- Prior art keywords
- electroplating
- port
- overflow
- circuitous
- liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000009713 electroplating Methods 0.000 title claims abstract description 84
- 239000007788 liquid Substances 0.000 claims abstract description 73
- 230000005484 gravity Effects 0.000 claims abstract description 11
- 238000007747 plating Methods 0.000 claims description 60
- 238000010992 reflux Methods 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 5
- 238000000034 method Methods 0.000 description 11
- 238000004519 manufacturing process Methods 0.000 description 9
- 238000007789 sealing Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000004062 sedimentation Methods 0.000 description 1
- RCIVOBGSMSSVTR-UHFFFAOYSA-L stannous sulfate Chemical compound [SnH2+2].[O-]S([O-])(=O)=O RCIVOBGSMSSVTR-UHFFFAOYSA-L 0.000 description 1
- 229910000375 tin(II) sulfate Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/30—Electroplating: Baths therefor from solutions of tin
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The present invention relates to a kind of novel electroplating device, including electroplating bath, deposit slot, return duct and circulation pipe；Wherein, the electroplating bath is for accommodating electroplate liquid, and has overflow part；The return duct includes first port and second port, and the first port is connected to the overflow part, and the second port is connected to the deposit slot；After the electroplate liquid overflow to the overflow part, the deposit slot is passed to by the return line flow under the effect of gravity；The return duct detour is bent to form rebate, which forms fluid-tight after the electroplate liquid is flowed into；The deposit slot is connected to the electroplating bath through the circulation pipe again.The novel electroplating device by the way that return duct progress detour is bent to form rebate, thus can form fluid-tight after electroplate liquid is flowed into return duct, electroplate liquid is closed, reduce the contact with air, electroplate liquid is effectively avoided to be aoxidized.
Description
Technical Field
The invention relates to the field of electroplating devices, in particular to a novel electroplating device.
Background
The present tin plating liquid generally uses stannous (stannous sulfate) as the main salt for plating, and when the stannous is contacted with air, it is easily oxidized into stannic by oxygen in the air, and the concentration of stannic in the plating liquid increases, which causes the plating liquid to gradually age and become unstable, which is unfavorable for the plating process. It is therefore desirable to minimize contact and mixing of the plating solution with air (oxygen).
Under the current technical condition, when a vertical continuous electroplating production line is adopted to carry out a tinning process, electroplating liquid is extremely easy to age and unstable, so that the acceptance of the vertical continuous electroplating production line in PCB tinning is very low.
The vertical continuous electroplating device is generally divided into an upper electroplating tank and a lower storage tank, wherein the upper electroplating tank is used for electroplating, overflowed electroplating solution flows into the lower storage tank under the action of gravity head through a return pipe, the lower storage tank is used for recovering and storing the electroplating solution overflowed by the electroplating tank, and then the electroplating solution is pumped back to the electroplating tank through a circulating pump to maintain the electroplating liquid level. In this in-process, the plating solution can't avoid basically to contact with the air, and the plating solution is at the in-process that flows into below reserve tank from the plating bath through the backflow pipeline of perpendicular setting, because the effect of gravity, the velocity of flow is very fast, and the impact force can wrap up and carry a large amount of air admission reserve tank formation foam, leads to divalent tin very easily to be oxidized in the plating solution, and then influences the electroplating process.
Disclosure of Invention
In view of this, it is necessary to provide a novel plating apparatus in which the plating solution is not easily oxidized.
A novel electroplating device comprises an electroplating bath, a storage tank, a return pipe and a circulating pipe; wherein,
the plating tank is used for containing electroplating solution and is provided with an overflow part;
the return pipe comprises a first port and a second port, the first port is communicated to the overflow part, and the second port is communicated to the reserve tank; after the electroplating solution overflows to the overflow part, the electroplating solution flows to the storage tank from the return pipe under the action of gravity;
the reflux pipe is bent to form a circuitous part, and the circuitous part forms a liquid seal after the electroplating liquid flows in;
the storage tank is communicated to the electroplating tank through the circulating pipe.
Above-mentioned novel electroplating device is through carrying out circuitous bending with the back flow and forming circuitous portion, can form the liquid seal after flowing in the back flow plating solution from this, seals the plating solution, reduces the contact with the air, avoids the plating solution by the oxidation.
In one embodiment, the first port communicates to a bottom of the overflow. The electroplating liquid in the overflow part can be conveniently and completely refluxed, and the sedimentation is avoided.
In one embodiment, the bypass is lower than the overflow in the direction of gravity. The electroplating solution can flow into the circuitous part rapidly under the action of gravity and flow back to the storage tank, so that the circulation efficiency of the electroplating solution is improved.
In one embodiment, the bypass portion is lower than the overflow portion and higher than the reserve tank in a gravity direction. The manufacturing material of the return pipe can be saved, and the production cost of the device is reduced.
In one embodiment, the return pipe extends from the bottom of the overflow part to the inside of the overflow part and bends to form the circuitous part in the overflow part, and the first port is higher than the bottom of the overflow part.
And the circuitous part is formed in the overflow part, and when the electroplating solution in the overflow part is accumulated to enter the circuitous part, the overflow part and the circuitous part can jointly form a liquid seal to seal the electroplating solution.
In one embodiment, a drain hole is provided on the bypass portion at a position close to the bottom of the overflow portion, and the drain hole has an opening area such that the maximum flow rate thereof is smaller than the flow rate of the plating solution flowing through the return pipe.
The area of the drain hole can be reasonably designed according to the size of the novel electroplating device and the electroplating process; the maximum flow rate of the drain hole is the maximum volume or mass of plating solution allowed to pass through the open area of the drain hole per unit time at atmospheric pressure.
When the overflow part and the bypass part are used together to form a liquid seal, plating solution remains in the overflow part after the plating is stopped. By arranging the drain hole, the electroplating solution is difficult to flow out of the drain hole when the electroplating solution in the overflow part and the return pipe normally circulates in the electroplating process, so that the liquid seal is not influenced; when the electroplating is stopped, the electroplating solution can flow out from the drain hole, so that the electroplating solution is prevented from remaining in the overflow part.
In one embodiment, the detour part is provided with an anti-siphon hole; the anti-siphon hole is positioned below the liquid level of a liquid seal formed by the circuitous part after the electroplating liquid flows in, is higher than the first port, and is used for conducting air in the overflow part to the circuitous part after the liquid level of the liquid seal descends, so that no pressure difference exists between the overflow part and the circuitous part.
When the flow rate of the plating liquid in the return pipe is too high, a siphon is easily formed to evacuate the plating liquid in the liquid seal, thereby losing the sealing effect. Through setting up this anti-siphon hole, when the siphon formed, the suction effect made the liquid level decline of liquid seal, exposed this anti-siphon hole after, can make the air get into the back flow, broken the airtight environment that the siphon formed, avoided the plating solution in the liquid seal to be managed to find time, and then guaranteed its sealing action in electroplating process.
In one embodiment, the second port communicates to the bottom of the holding tank.
Therefore, the liquid level of the electroplating solution in the storage tank is higher than the second port, so that the phenomenon that the electroplating solution forms impact force when flowing out of the return pipe and brings air in the storage tank into the electroplating solution is avoided.
In one embodiment, the circulation pipe is provided with a circulation pump.
So as to accelerate the circulation of the electroplating solution and improve the electroplating efficiency.
In one embodiment, the circuitous portion is U-shaped or V-shaped.
The shape can save the manufacturing material of the circuitous part and reduce the production cost of the device.
Compared with the prior art, the invention has the following beneficial effects:
according to the novel electroplating device, the return pipe is bent in a circuitous way to form the circuitous part, so that a liquid seal can be formed after electroplating liquid flows into the return pipe, the electroplating liquid is sealed, the contact with air is reduced, and the electroplating liquid is effectively prevented from being oxidized.
Further rationally set up the structure of circuitous portion and increase the setting of discharge orifice and anti-siphon hole, can guarantee the stability of above-mentioned liquid seal in electroplating process to avoid electroplating solution to remain at the overflow portion after the electroplating.
The novel electroplating device is reasonable in structure setting and low in manufacturing cost.
Drawings
FIG. 1 is a schematic structural diagram of a novel electroplating apparatus according to an embodiment of the present invention;
FIG. 2 is a schematic structural view of a novel electroplating apparatus according to another embodiment of the present invention;
FIG. 3 is a schematic view of a circuitous part of the electroplating apparatus shown in FIG. 2, wherein,
11-an electroplating bath; 12-a storage tank; 13-a return pipe; 14-a circulation pipe; 111-an overflow; 131-a first port; 132-a second port; 133-detour part; 134-a drain hole; 135-anti-siphon hole; 141-circulating pump.
Detailed Description
To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
A novel electroplating apparatus 10 of the present embodiment is constructed as shown in FIG. 1, and includes an electroplating tank 11, a reserve tank 12, a return pipe 13 and a circulation pipe 14; the plating tank 11 is used for accommodating a plating solution and has an overflow portion 111, the return pipe 13 includes a first port 131 and a second port 132, the first port 131 is communicated to the overflow portion 111, and the second port 132 is communicated to the reserve tank 12; after the plating liquid overflows to the overflow part 111, the plating liquid flows to the reserve tank 12 from the return pipe 13 under the action of gravity; the reserve tank 12 is communicated to the plating tank 11 via a circulation pipe 14, thereby forming a loop between the plating tank 11 and the reserve tank 12, wherein,
the return pipe 13 is bent to form a U-shaped bent portion 133, and the bent portion 133 forms a liquid seal after the plating solution flows in.
During the plating operation, the plating liquid in the plating vessel 11 overflows to the overflow portion 111, and then flows into the bypass portion 133 through the first port 131 to form a liquid seal at the bypass portion 133, thereby sealing the plating liquid, reducing the contact between the plating liquid and air, and preventing the plating liquid from being oxidized.
The first port 131 is disposed at the bottom of the overflow portion 111, and the detour portion 133 is lower than the overflow portion 111 and higher than the reserve tank 12 in the gravity direction, so that the plating solution can flow into the detour portion rapidly under the action of gravity and flow back to the reserve tank, thereby improving the circulation efficiency of the plating solution, saving the manufacturing material of the return pipe, and reducing the production cost of the device. Further, when the plating is stopped, the plating liquid in the overflow portion 111 can be completely returned to the detour portion 133 or the stock tank 12, avoiding direct contact with air. It is understood that in other embodiments, the detour 133 may be located at other height positions.
The second port 132 is provided at the bottom of the storage tank 12 or on a side surface near the bottom of the storage tank 12, so that the level of the plating solution in the storage tank 12 is higher than the second port 132, thereby preventing the plating solution from being impacted when flowing out from the return pipe 13 and bringing air in the storage tank 12 into the plating solution. It is understood that in other embodiments, the second port 132 may not be disposed at the bottom of the reserve tank 12.
The circulation pipe 14 is provided with a circulation pump 141 for accelerating circulation of the plating solution and improving the plating efficiency.
The structure of the novel electroplating device 20 of the present embodiment is shown in fig. 2, and each structure is similar to the novel electroplating device 10, except that: the return pipe 13 extends from the bottom of the overflow part 111 to the overflow part 111, and forms a U-shaped detour 133 in the overflow part 111, and the first port 131 is higher than the bottom of the overflow part 111. Thus, when the plating liquid in the overflow portion 111 has accumulated and has entered the bypass portion 133, the overflow portion 111 and the bypass portion 133 form a liquid seal together, thereby sealing the plating liquid.
When the above-mentioned liquid seal is formed, when the flow speed of the plating liquid in the return pipe is too high, siphon is easily formed to evacuate the plating liquid in the liquid seal, thereby losing the sealing effect. Therefore, as shown in fig. 3, the novel electroplating device 20 is provided with the siphon-proof hole 135 on the detour portion 133, which is located below the liquid level of the liquid seal formed by the detour portion 133 after the plating liquid flows in, and is higher than the first port 131.
Therefore, when the siphon is formed, the liquid level of the liquid seal is lowered by the suction action until the siphon-proof hole 135 is exposed, then the air of the overflow part 111 enters the detour part 133, so that no pressure difference exists between the overflow part 111 and the detour part 133, the closed environment formed by the siphon is broken, the electroplating liquid in the liquid seal is prevented from being pumped out, the sealing action of the electroplating liquid in the electroplating process is further ensured, and the liquid seal is preferably 2cm below the liquid level.
As further shown in fig. 3, the novel electroplating apparatus 20 is further provided with a drain hole 134 on the detour portion 133 near the bottom of the overflow portion 111, and the maximum flow rate of the drain hole 134 is smaller than the flow rate of the electroplating solution flowing through the return pipe 13 due to the opening area of the drain hole 134, which can be specifically designed according to the specific size of the electroplating apparatus.
By providing the drain hole 134, the plating liquid is hard to flow out through the drain hole 134 when the plating liquid circulates normally in the overflow portion 111 and the return pipe 13 during the plating process, and therefore, the liquid seal is not affected; when the plating is stopped, the plating liquid can flow out through the drain hole 134, and the plating liquid is prevented from remaining in the overflow portion 111.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (4)
1. An electroplating device is characterized by comprising an electroplating bath, a reserve tank, a return pipe and a circulating pipe; wherein,
the plating tank is used for containing electroplating solution and is provided with an overflow part;
the return pipe comprises a first port and a second port, the first port is communicated to the overflow part, and the second port is communicated to the reserve tank; after the electroplating solution overflows to the overflow part, the electroplating solution flows to the storage tank from the return pipe under the action of gravity;
the reflux pipe is bent to form a circuitous part, and the circuitous part forms a liquid seal after the electroplating liquid flows in;
the storage tank is communicated to the electroplating tank through the circulating pipe;
the return pipe extends from the bottom of the overflow part into the overflow part and is bent in the overflow part to form the circuitous part, and the first port is higher than the bottom of the overflow part;
the circuitous part is provided with an anti-siphon hole; the anti-siphon hole is positioned below the liquid level of a liquid seal formed by the circuitous part after the electroplating liquid flows in, is higher than the first port, and is used for conducting air in the overflow part to the circuitous part after the liquid level of the liquid seal drops, so that no pressure difference exists between the overflow part and the circuitous part;
and a drain hole is arranged at a position, close to the bottom of the overflow part, on the circuitous part, and the opening area of the drain hole enables the maximum flow of the drain hole to be smaller than the flow of the electroplating solution when the electroplating solution circulates through the return pipe.
2. The plating apparatus as recited in claim 1, wherein said second port communicates to a bottom of said stock tank.
3. The plating apparatus as recited in claim 1, wherein a circulation pump is provided on said circulation pipe.
4. The plating apparatus as recited in claim 1, wherein said detour portion is U-shaped or V-shaped.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610352237.5A CN105803497B (en) | 2016-05-24 | 2016-05-24 | Novel electroplating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610352237.5A CN105803497B (en) | 2016-05-24 | 2016-05-24 | Novel electroplating device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105803497A CN105803497A (en) | 2016-07-27 |
| CN105803497B true CN105803497B (en) | 2018-05-18 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201610352237.5A Expired - Fee Related CN105803497B (en) | 2016-05-24 | 2016-05-24 | Novel electroplating device |
Country Status (1)
| Country | Link |
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| CN (1) | CN105803497B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106119892B (en) * | 2016-08-31 | 2018-07-13 | 铜陵有色金属集团股份有限公司金冠铜业分公司 | The overflow mechanism of electrolyte |
| CN108048884A (en) * | 2018-02-07 | 2018-05-18 | 佛山市南海台冠金属制品有限公司 | Zinc-plated automatic barrel plating production line |
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| JPH05171500A (en) * | 1991-12-26 | 1993-07-09 | Fujitsu Ltd | Method and device for plating |
| CN1326015A (en) * | 2000-03-31 | 2001-12-12 | 希普雷公司 | Tin electrolyte |
| CN2937161Y (en) * | 2006-08-14 | 2007-08-22 | 中国铝业股份有限公司 | Electroplating liquid circulation device for electroplating production |
| CN101255594A (en) * | 2007-12-07 | 2008-09-03 | 东莞洲亮电镀设备有限公司 | Environment-protection electroplating production technique and equipment |
| CN102011169A (en) * | 2009-09-08 | 2011-04-13 | 上村工业株式会社 | Electroplating apparatus and electroplating method |
| CN103789806A (en) * | 2013-12-12 | 2014-05-14 | 深圳首创光伏有限公司 | Electroplating bath |
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Family Cites Families (1)
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|---|---|---|---|---|
| SG96641A1 (en) * | 2001-09-06 | 2003-06-16 | Seiko Epson Corp | Method of electro-coating an article |
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2016
- 2016-05-24 CN CN201610352237.5A patent/CN105803497B/en not_active Expired - Fee Related
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| JPH05171500A (en) * | 1991-12-26 | 1993-07-09 | Fujitsu Ltd | Method and device for plating |
| CN1326015A (en) * | 2000-03-31 | 2001-12-12 | 希普雷公司 | Tin electrolyte |
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| CN101255594A (en) * | 2007-12-07 | 2008-09-03 | 东莞洲亮电镀设备有限公司 | Environment-protection electroplating production technique and equipment |
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Granted publication date: 20180518 |