CN105803497A - Novel electroplating device - Google Patents
Novel electroplating device Download PDFInfo
- Publication number
- CN105803497A CN105803497A CN201610352237.5A CN201610352237A CN105803497A CN 105803497 A CN105803497 A CN 105803497A CN 201610352237 A CN201610352237 A CN 201610352237A CN 105803497 A CN105803497 A CN 105803497A
- Authority
- CN
- China
- Prior art keywords
- rebate
- overflow part
- electroplate liquid
- port
- electroplating device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 238000009713 electroplating Methods 0.000 title claims abstract description 69
- 239000007788 liquid Substances 0.000 claims abstract description 84
- 230000005484 gravity Effects 0.000 claims abstract description 12
- 230000009467 reduction Effects 0.000 claims description 3
- 230000009471 action Effects 0.000 abstract description 4
- 230000003647 oxidation Effects 0.000 abstract description 2
- 238000007254 oxidation reaction Methods 0.000 abstract description 2
- 238000005452 bending Methods 0.000 abstract 4
- 238000000034 method Methods 0.000 description 13
- 238000007747 plating Methods 0.000 description 12
- 230000008569 process Effects 0.000 description 10
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 7
- 230000000694 effects Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 238000010992 reflux Methods 0.000 description 3
- 230000032683 aging Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 229910001882 dioxygen Inorganic materials 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- RCIVOBGSMSSVTR-UHFFFAOYSA-L stannous sulfate Chemical compound [SnH2+2].[O-]S([O-])(=O)=O RCIVOBGSMSSVTR-UHFFFAOYSA-L 0.000 description 1
- 229910000375 tin(II) sulfate Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/30—Electroplating: Baths therefor from solutions of tin
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention relates to a novel electroplating device which comprises an electroplating bath, a storage tank, a return pipe and a circulating pipe, wherein the electroplating bath is used for accommodating an electroplating solution and is provided with an overflow part; the return pipe comprises a first end opening and a second end opening, the first end opening communicates with the overflow part, and the second end opening communicates with the storage tank; after overflowing to the overflow part, the electroplating solution flows into the storage tank via the return pipe under the action of gravity; the return pipe is bent to form a bending part, and a liquid seal is formed after the electroplating solution flows into the bending part; and the storage tank communicates with the electroplating bath via the circulating pipe. According to the novel electroplating device, the return pipe is bent to form the bending part, so that after the electroplating solution flows into the bending part, the liquid seal is formed to seal the electroplating solution to reduce contact between the electroplating solution and air, and accordingly, oxidation of the electroplating solution is effectively avoided.
Description
Technical field
The present invention relates to electroplanting device field, particularly relate to a kind of Novel electroplating device.
Background technology
Current plating tin plating electrolyte generally uses the Bivalent Tin (stannous sulfate) the main salt as plating, and when Bivalent Tin and air contact, easily become tetravalent tin by the dioxygen oxidation in air, in electroplate liquid, stannic concentration rises, causing that electroplate liquid is aging and unstable gradually, this is disadvantageous for electroplating work procedure.It is thus desirable to reduce contacting and mixing of electroplate liquid and air (oxygen) as far as possible.
Under current technical status, when adopting vertical continuous electroplating assembly line to carry out tin plating operation, electroplate liquid is very easily aging and unstable, causes that vertical continuous electroplating assembly line acceptance in PCB is tin plating is very low.
This is the deposit groove two parts of electroplating bath and the lower section being generally divided into top due to the design of vertical continuous electroplanting device, the electroplating bath of top carries out electroplating activity, the electroplate liquid that overflow goes out passes through return duct, enter in the deposit groove of lower section at the flows by action of gravity-head, the electroplate liquid that deposit groove reclaims and deposit electroplating bath overflow goes out of lower section, then pass through circulating pump and electroplate liquid is drawn back electroplating bath, maintain plating liquid level.In this process, substantially electroplate liquid cannot be avoided to contact with air, and electroplate liquid is flowing in the process of lower section deposit groove from electroplating bath through vertically disposed reflux line, effect due to gravity, flow velocity is very fast, impulsive force can be swept along large quantity of air to enter deposit groove and be formed foam, causes that in electroplate liquid, Bivalent Tin is very easily oxidized, and then affects electroplating work procedure.
Summary of the invention
Based on this, it is necessary to provide the Novel electroplating device that a kind of electroplate liquid is not oxidizable.
A kind of Novel electroplating device, including electroplating bath, deposit groove, return duct and circulation pipe；Wherein,
Described electroplating bath is used for holding electroplate liquid, and has overflow part；
Described return duct includes the first port and the second port, and described first port is communicated to described overflow part, and described second port is communicated to described deposit groove；Described electroplate liquid overflow, to described overflow part, is passed to described deposit groove by described return line flow under gravity；
Described return duct is roundabout is bent to form rebate, and this rebate forms fluid-tight after flowing into described electroplate liquid；
Described deposit groove is communicated to described electroplating bath then through described circulation pipe.
Above-mentioned Novel electroplating device, roundabout is bent to form rebate by being carried out by return duct, thus can form fluid-tight after flowing into electroplate liquid in return duct, electroplate liquid is closed, and reduces and the contacting of air, it is to avoid electroplate liquid is oxidized.
Wherein in an embodiment, described first port is communicated to the bottom of described overflow part.It is easy to the electroplate liquid total reflux in overflow part, it is to avoid alluvial.
Wherein in an embodiment, described rebate on gravity direction lower than described overflow part.It is easy to electroplate liquid flow rapidly into described rebate under gravity and be back in deposit groove, improves electroplate liquid cycle efficieny.
Wherein in an embodiment, described rebate on gravity direction lower than described overflow part, and higher than described deposit groove.The making material of return duct can be saved, reduce the production cost of device.
Wherein in an embodiment, described return duct is extended in described overflow part by the bottom of described overflow part, and roundabout in described overflow part is bent to form described rebate, and described first port is higher than the bottom of described overflow part.
In described overflow part, form described rebate, when the electroplate liquid of overflow part is accumulate to the described rebate of entrance, fluid-tight can be collectively forming by described overflow part and rebate, electroplate liquid is closed.
Wherein in an embodiment, in described rebate, the position of bottom near described overflow part is provided with discharge orifice, and the aperture area of described discharge orifice makes the maximum stream flow of this discharge orifice less than described electroplate liquid flow when described return duct circulates.
The area of described discharge orifice specifically can carry out appropriate design according to the size of Novel electroplating device and plating flow process；The maximum stream flow of described discharge orifice refers to, under normal pressure, is allowed maximum electroplate liquid volume or the quality of aperture area by described discharge orifice in the unit interval.
When utilizing described overflow part to be collectively forming fluid-tight with rebate, after stopping plating, in overflow part, have electroplate liquid residual.By arranging this discharge orifice, in electroplating process, overflow part and in return duct during electroplate liquid normal circulation, electroplate liquid is difficult to be flowed out by this discharge orifice, produces impact thus without on fluid-tight；And when stopping plating, electroplate liquid can be flowed out by this discharge orifice, it is to avoid electroplate liquid remains in overflow part.
Wherein in an embodiment, described rebate is provided with anti-siphon hole；Described anti-siphon hole is positioned under the liquid level of the fluid-tight that described rebate is formed after flowing into described electroplate liquid, and higher than described first port, for after the liquid level of described fluid-tight declines, air in described overflow part is conducted to described rebate, makes between described overflow part and described rebate without pressure reduction.
When electroplate liquid flowing velocity in return duct is too fast, it is easy to form siphon and evacuate the electroplate liquid in fluid-tight, thus lose the effect of closing.By arranging this anti-siphon hole, when siphon is formed, swabbing action makes the liquid level of fluid-tight decline, after exposing this anti-siphon hole, return duct can be admitted air into, break the closed environment that siphon is formed, avoid the electroplate liquid in fluid-tight to be evacuated, and then ensure its sealing process in electroplating process.
Wherein in an embodiment, described second port is communicated to the bottom of described deposit groove.
Thus make the liquid level of electroplate liquid in deposit groove be higher than described second port, it is to avoid when electroplate liquid flows out from return duct, to form impulsive force, bring the air in deposit groove into electroplate liquid.
Wherein in an embodiment, described circulation pipe is provided with circulating pump.
To accelerate the circulation of electroplate liquid, improve electroplating efficiency.
Wherein in an embodiment, described rebate is U-shaped or V-arrangement.
This shape can save the making material of rebate, reduces the production cost of device.
Compared with prior art, the method have the advantages that
Novel electroplating device of the present invention, roundabout is bent to form rebate by being carried out by return duct, thus can form fluid-tight after flowing into electroplate liquid in return duct, electroplate liquid is closed, and reduces and the contacting of air, is prevented effectively from electroplate liquid oxidized.
The structure of rebate rationally it is set further and increases discharge orifice and the setting of anti-siphon hole, it is ensured that above-mentioned fluid-tight stability in electroplating process, and avoiding plating to terminate rear electroplate liquid in overflow part residual.
Above-mentioned Novel electroplating device, structure is arranged rationally, and cost of manufacture is low.
Accompanying drawing explanation
Fig. 1 is the Novel electroplating device structural representation in one embodiment of the invention；
Fig. 2 is the Novel electroplating device structural representation in another embodiment of the present invention；
Fig. 3 is the rebate structural representation in Novel electroplating device described in Fig. 2, wherein,
11-electroplating bath；12-lays in groove；13-return duct；14-circulation pipe；111-overflow part；131-the first port；132-the second port；133-rebate；134-discharge orifice；The anti-siphon hole of 135-；141-circulating pump.
Detailed description of the invention
For the ease of understanding the present invention, below with reference to relevant drawings, the present invention is described more fully.Accompanying drawing gives presently preferred embodiments of the present invention.But, the present invention can realize in many different forms, however it is not limited to embodiment described herein.On the contrary, the purpose providing these embodiments is to make the understanding to the disclosure more thorough comprehensively.
It should be noted that be referred to as " being fixed on " another element when element, it can directly on another element or can also there is element placed in the middle.When an element is considered as " connection " another element, it can be directly to another element or may be simultaneously present centering elements.
Unless otherwise defined, all of technology used herein is identical with the implication that the those skilled in the art belonging to the present invention are generally understood that with scientific terminology.The term used in the description of the invention herein is intended merely to the purpose describing specific embodiment, it is not intended that in the restriction present invention.Term as used herein " and/or " include the arbitrary and all of combination of one or more relevant Listed Items.
The present embodiment one Novel electroplating device 10, its structure is as it is shown in figure 1, include electroplating bath 11, deposit groove 12, return duct 13 and circulation pipe 14；Electroplating bath 11 is used for holding electroplate liquid, and has overflow part 111, and return duct 13 includes the first port 131 and the second port 132, and the first port 131 is communicated to overflow part 111, and the second port 132 is communicated to deposit groove 12；Electroplate liquid overflow, to overflow part 111, is circulated to deposit groove 12 by return duct 13 under gravity；Deposit groove 12 is communicated to electroplating bath 11 then through circulation pipe 14, thus forms loop between electroplating bath 11 and deposit groove 12, wherein,
The roundabout rebate 133 being bent to form U-shaped of return duct 13, this rebate 133 forms fluid-tight after flowing into electroplate liquid.
When carrying out electroplating operations, the electroplate liquid overflow in electroplating bath 11, to overflow part 111, flows into rebate 133 then through the first port 131, fluid-tight is formed at rebate 133 place, thus electroplate liquid being closed, minimizing electroplate liquid contacts with air, it is to avoid electroplate liquid is oxidized.
First port 131 is arranged at the bottom of overflow part 111, and rebate 133 on gravity direction lower than overflow part 111, and higher than deposit groove 12, thus it is easy to electroplate liquid flow rapidly into described rebate under gravity and be back in deposit groove, improve electroplate liquid cycle efficieny, and the making material of return duct can be saved, reduce the production cost of device.Additionally, when stopping plating, the electroplate liquid in overflow part 111 can to rebate 131 or be laid in groove 12 by total reflux, it is to avoid direct and air contact.It is understood that in other embodiments, rebate 133 can also be positioned at other height and position.
Second port 132 is arranged on the bottom of deposit groove 12 or the side bottom deposit groove 12, the liquid level of electroplate liquid in deposit groove 12 is thus made to be higher than the second port 132, form impulsive force when avoiding electroplate liquid to flow out from return duct 13, bring the air in deposit groove 12 into electroplate liquid.It is understood that in other embodiments, the second port 132 can also be not provided with in the bottom of deposit groove 12.
Circulation pipe 14 is provided with circulating pump 141, in order to accelerate the circulation of electroplate liquid, improves electroplating efficiency.
The present embodiment one Novel electroplating device 20, its structure is as shown in Figure 2, each structure is similar with Novel electroplating device 10, it is distinctive in that: return duct 13 is extended to overflow part 111 by the bottom of overflow part 111, and in overflow part 111, forming the rebate 131 of U-shaped, the first port 131 is higher than the bottom of overflow part 111.Thus after the electroplate liquid of overflow part 111 is accumulate to entrance rebate 131, fluid-tight can be collectively forming by overflow part 111 and rebate 131, electroplate liquid is closed.
When forming above-mentioned fluid-tight, when electroplate liquid flowing velocity in return duct is too fast, it is easy to form siphon and evacuate the electroplate liquid in fluid-tight, thus lose the effect of closing.Therefore as it is shown on figure 3, Novel electroplating device 20 is provided with anti-siphon hole 135 in rebate 131, it is positioned under the liquid level of the fluid-tight that rebate 131 is formed after flowing into electroplate liquid, and higher than the first port 131.
Thus when siphon is formed, swabbing action makes the liquid level of fluid-tight decline, after exposing this anti-siphon hole 135, the air of overflow part 111 enters rebate 131, make between overflow part 111 and rebate 131 without pressure reduction, break the closed environment that siphon is formed, it is to avoid the electroplate liquid in fluid-tight is evacuated, and then ensure its sealing process in electroplating process, specifically can be preferably below liquid level 2cm.
Further as shown in Figure 3, Novel electroplating device 20 also in rebate 131 position of bottom near overflow part 111 be provided with discharge orifice 134, the flow when aperture area of discharge orifice 134 makes its maximum stream flow flow in return duct 13 less than electroplate liquid, specifically can carry out hole area design according to the size that electroplanting device is concrete.
By arranging this discharge orifice 134, in electroplating process, overflow part 111 and in return duct 13 during electroplate liquid normal circulation, electroplate liquid is difficult to be flowed out by discharge orifice 134, produces impact thus without on fluid-tight；And when stopping plating, electroplate liquid can be flowed out by discharge orifice 134, it is to avoid electroplate liquid remains in overflow part 111.
Each technical characteristic of embodiment described above can combine arbitrarily, for making description succinct, the all possible combination of each technical characteristic in above-described embodiment is not all described, but, as long as the combination of these technical characteristics is absent from contradiction, all it is considered to be the scope that this specification is recorded.
Embodiment described above only have expressed the several embodiments of the present invention, and it describes comparatively concrete and detailed, but can not therefore be construed as limiting the scope of the patent.It should be pointed out that, for the person of ordinary skill of the art, without departing from the inventive concept of the premise, it is also possible to making some deformation and improvement, these broadly fall into protection scope of the present invention.Therefore, the protection domain of patent of the present invention should be as the criterion with claims.
Claims (10)
1. a Novel electroplating device, it is characterised in that include electroplating bath, deposit groove, return duct and circulation pipe；Wherein,
Described electroplating bath is used for holding electroplate liquid, and has overflow part；
Described return duct includes the first port and the second port, and described first port is communicated to described overflow part, and described second port is communicated to described deposit groove；Described electroplate liquid overflow, to described overflow part, is passed to described deposit groove by described return line flow under gravity；
Described return duct is roundabout is bent to form rebate, and this rebate forms fluid-tight after flowing into described electroplate liquid；
Described deposit groove is communicated to described electroplating bath then through described circulation pipe.
2. Novel electroplating device according to claim 1, it is characterised in that described first port is communicated to the bottom of described overflow part.
3. Novel electroplating device according to claim 2, it is characterised in that described rebate on gravity direction lower than described overflow part.
4. Novel electroplating device according to claim 3, it is characterised in that described rebate on gravity direction lower than described overflow part, and higher than described deposit groove.
5. Novel electroplating device according to claim 1, it is characterized in that, described return duct is extended in described overflow part by the bottom of described overflow part, and roundabout in described overflow part is bent to form described rebate, and described first port is higher than the bottom of described overflow part.
6. Novel electroplating device according to claim 5, it is characterized in that, in described rebate, the position of bottom near described overflow part is provided with discharge orifice, and the aperture area of described discharge orifice makes the maximum stream flow of this discharge orifice less than described electroplate liquid flow when described return duct circulates.
7. Novel electroplating device according to claim 5, it is characterised in that be provided with anti-siphon hole in described rebate；Described anti-siphon hole is positioned under the liquid level of the fluid-tight that described rebate is formed after flowing into described electroplate liquid, and higher than described first port, for after the liquid level of described fluid-tight declines, air in described overflow part is conducted to described rebate, makes between described overflow part and described rebate without pressure reduction.
8. the Novel electroplating device according to any one of claim 1-7, it is characterised in that described second port is communicated to the bottom of described deposit groove.
9. the Novel electroplating device according to any one of claim 1-7, it is characterised in that be provided with circulating pump on described circulation pipe.
10. the Novel electroplating device according to any one of claim 1-7, it is characterised in that described rebate is U-shaped or V-arrangement.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610352237.5A CN105803497B (en) | 2016-05-24 | 2016-05-24 | Novel electroplating device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610352237.5A CN105803497B (en) | 2016-05-24 | 2016-05-24 | Novel electroplating device |
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| Publication Number | Publication Date |
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| CN105803497A true CN105803497A (en) | 2016-07-27 |
| CN105803497B CN105803497B (en) | 2018-05-18 |
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| CN201610352237.5A Expired - Fee Related CN105803497B (en) | 2016-05-24 | 2016-05-24 | Novel electroplating device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106119892A (en) * | 2016-08-31 | 2016-11-16 | 铜陵有色金属集团股份有限公司金冠铜业分公司 | The overflow mechanism of electrolyte |
| CN108048884A (en) * | 2018-02-07 | 2018-05-18 | 佛山市南海台冠金属制品有限公司 | Zinc-plated automatic barrel plating production line |
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| CN106119892A (en) * | 2016-08-31 | 2016-11-16 | 铜陵有色金属集团股份有限公司金冠铜业分公司 | The overflow mechanism of electrolyte |
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| CN108048884A (en) * | 2018-02-07 | 2018-05-18 | 佛山市南海台冠金属制品有限公司 | Zinc-plated automatic barrel plating production line |
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| Publication number | Publication date |
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| CN105803497B (en) | 2018-05-18 |
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Granted publication date: 20180518 |