CN103789806A - Electroplating bath - Google Patents
Electroplating bath Download PDFInfo
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- CN103789806A CN103789806A CN201310683838.0A CN201310683838A CN103789806A CN 103789806 A CN103789806 A CN 103789806A CN 201310683838 A CN201310683838 A CN 201310683838A CN 103789806 A CN103789806 A CN 103789806A
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
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Abstract
The invention belongs to the technical field of preparation of solar cells, and in particular relates to an electroplating bath, which is used for depositing elemental copper, gallium, indium or selenium or a copper, gallium, indium or selenium alloy on the surface of a substrate. The electroplating bath comprises an electroplating branch bath and a master bath, wherein the electroplating branch bath is provided with an accommodation cavity for containing an electroplating solution; anodes immersed in the electroplating solution are hung on the lateral surfaces of the electroplating branch bath; a conveying device for carrying the substrate to synchronously move is arranged on the middle part of the electroplating branch bath; the anodes are arranged on the two sides of the conveying device; parts, opposite to the anodes, on the two lateral surfaces of the conveying device are immersed in the electroplating solution; the substrate is attached to the lateral surfaces of the conveying device, and is opposite to the anodes when passing through the electroplating branch bath. According to the electroplating bath, the length of an electroplating production line is reduced, and a small space is occupied; the elemental copper, gallium, indium or selenium or the copper, gallium, indium or selenium alloy is deposited on the front surface of the substrate only, so that few process steps are required; the anodes are opposite to the substrate, so that the uniformity and smooth finish of the surface of a deposited CIGS (copper, indium, gallium and selenium) absorption layer are ensured.
Description
Technical field
The invention belongs to and make solar cell device technical field, relate in particular to a kind of plating tank of volume to volume.
Background technology
CIGS(copper-indium-galliun-selenium) thin-film solar cells has splendid photoabsorption constant, only need the ultra-thin absorption layer of 1.5 microns, photoelectric transformation efficiency is stable, and spectral response range is wide, can be with adjustable, capability of resistance to radiation is strong, without light-induced degradation, has photic gain, low light level gain, and lightweight in addition, cost is low, the advantage of easily installing becomes the emphasis of field of solar energy research.Its typical structure is: metal back electrode Mo layer, CIGS absorption layer, buffer layer CdS, Window layer high resistant i:ZnO, low-resistance ZnO:Al, MgF2 antireflective coating and Ni-Al gate electrode.
CIGS absorption layer is by Cu, In, and Ga, tetra-kinds of Se are elementary composition, and the photoelectric transformation efficiency of battery is relevant with the mol ratio of four kinds of elements, and general requirement Cu/ (In+Ga) is between 0.75～1, and Ga/ (In+Ga) is between 0.3～0.5.The preparation of CIGS absorption layer is CIGS(copper-indium-galliun-selenium) core technology of thin-film solar cells.
Because CIGS absorption layer is made up of multiple element, adopt vacuum-deposited method preparation more.Evaporating deposition technique is as sputtering and selenization technique or coevaporation, and its equipment is extremely expensive, process complexity, and complex process, is difficult to carry out large-scale production.
Now there is report to adopt the method for antivacuum deposition to prepare CIGS absorption layer abroad, particularly, adopt volume to volume to electroplate CIGS absorption layer, as shown in Figure 1, in bath trough 802, be loaded with electroplate liquid 803 is housed, and be provided with the anode 800 being immersed in electroplate liquid 803 and be partially submerged in the great wheel 801 in described electroplate liquid 803, the large and anode 800 of the diameter of described great wheel 801, between the upper and lower every setting, has gap.On described anode 800, be a concave surface 805 towards the face of great wheel 801, the radian of the radian of described concave surface 805 and described great wheel 801 matches, described concave surface 805 forms two tips 804 with described anode 800 sides, flexible substrate 806 is electroplated through cleaning on the periphery of great wheel 801 and being immersed in electroplate liquid 803, deposition CIGS absorption layer.
There is following shortcoming in this scheme:
1, anode 800 need to be processed concave surface 805, complex manufacturing technology, and in the time electroplating, the preferential loss of tip 804 meeting of anode concave surface both sides, the time one, long concave surface 805 shoaled, and cannot guarantee homogeneity and the fast stability of plating of the CIGS absorption layer of electroplating deposition;
2, in the time only need depositing CIGS absorption layer in the one side of described substrate 701, its CIGS element is likely deposited on the another side of substrate 701;
3, in bath trough 802 electroplate liquid 803 flow not smooth, can not discharge timely and effectively electroplate time produce bubble, easily on the CIGS of electroplating deposition absorption layer, produce piebald, have a strong impact on quality product.
In addition, the mode that the disclosed a kind of level of U.S. Patent Publication No. US2007/0227633A1 is electroplated, due to, adopt horizontal linear electroplate, substrate do not have curved around, production line is long, take up room large, in addition, while adopting which to electroplate, anode is positioned at substrate below, there is equally the bubble that negative electrode separates out and arrange the problem of not going out, and anode is positioned over above substrate, there is again the cathode plane electroplate liquid not smooth problem that flows, all can exert an influence to the surface quality of the CIGS absorption layer of electroplating deposition.
Summary of the invention
The object of the present invention is to provide a kind of plating tank, be intended to solve the antivacuum electroplating deposition method of available technology adopting on substrate when deposited copper or gallium or indium or selenium element, the unmanageable difficult problem of its homogeneity.
Embodiments of the invention are achieved in that a kind of plating tank, for by copper or gallium or indium or selenium element deposition in a surface of substrate, comprise
Electroplate pilot trench, there is the container cavity for splendid attire electroplate liquid;
Anode, the sidewall that is tabular setting and hang on described plating pilot trench for depositing CIGS absorption layer,
Be immersed in described electroplate liquid;
Transport unit, is arranged at the middle of described plating pilot trench, moves for carrying described Substrate Synchronous, and the drive path of described transport unit is by the end to end closed forming of multi-line section;
Described anode is immersed in symmetrically arranged parallel sided in electroplate liquid and is oppositely arranged respectively with on described transport unit, and described substrate is attached at and on described transport unit, is immersed in side and be oppositely arranged parallel with described anode in electroplate liquid.
Further, described transport unit comprises an anchor, be installed on described anchor top and support at least one group of home roll wheel of described substrate and be installed on described anchor bottom and coordinates at least one group of rotation from running roller with described home roll wheel, and transport tape, described travelling belt is attached at described home roll wheel and described from the periphery of running roller and carry described substrate and together move.
Further, the drive path of the transport tape on described transport unit is orthogonal, and the opposing parallel interval, two sides that is oppositely arranged and is immersed on described anode and described transport unit in described electroplate liquid arranges.
Further, described home roll wheel and described tangent from the periphery of running roller and the outer side wall of described anchor.
Further, described home roll wheel and described periphery from running roller protrude from the outer side wall of described anchor.
Further, on described transport unit, be also provided with the setting device for regulating described transport tape rate of tension, described setting device and described home roll wheel and be describedly connected from running roller is adjustable.
Further, on described transport tape, be also provided with the adsorption section that adsorbable described substrate is fitted itself and described transport tape.
Further, in described pilot trench, be provided with at least one plating solution jet pipe, on each described plating solution jet pipe, be provided with equally distributed spray orifice.
Further, described spray orifice is tapered hole, the inwall of described spray orifice along in the pipe of described plating solution jet pipe outside pipe direction expand gradually.
Distance between the spray orifice arranging on same plating solution jet pipe further, and the diameter of described spray orifice are than between 20:1 to 5:1.
Further, on same described plating solution jet pipe, be provided with two row's spray orifices, the injection direction of described two row's spray orifices is angle setting.
Further, the injection direction of described spray orifice is towards the diapire of described plating pilot trench.
Further, the depth ratio of the distance of the extremely described pilot trench of described plating solution jet pipe bottom and the electroplate liquid of described plating pilot trench is between 1:7 to 1:20.
Further, be provided with the equal drift net for mild electroplate liquid flow velocity in described plating pilot trench, described equal drift net is between described transport unit and described plating solution jet pipe.
Further, described equal drift net is dull and stereotyped, is provided with equally distributed mesh on described flat board.
Further, the depth ratio of the electroplate liquid in the thickness of described flat board and described plating pilot trench is between 1:50 to 1:300.
Further, described mesh is taper hole, and the diameter edge of the inwall of described mesh straight up direction increases gradually.
Further, described equal drift net to distance and described plating solution jet pipe to the distance of described plating pilot trench diapire of described plating solution jet pipe compares between 2:1 is as for 10:1.
Further, the mesh of described equal drift net is between 5 ?50.
Further, the sidewall of described plating pilot trench is provided with overflow device, and described overflow device is communicated with described plating pilot trench by plating solution return line.
Further, described overflow device is overflow groove, is arranged at the outside of described plating pilot trench sidewall, and one end of described plating solution return line is connected in the bottom of described overflow groove, and the other end is connected in the bottom of described plating pilot trench.
Further, on described plating solution jet pipe, be connected with to regulate the female groove of electroplate liquid of the each constituent concentration of electroplate liquid in described plating pilot trench.
Further, in the exit of the female groove of described electroplate liquid, on described plating solution jet pipe, be provided with for the electroplate liquid in female electroplate liquid groove being pumped to recycle pump in described plating pilot trench and for filtering the filter of dirt residue.
Compared with prior art, a kind of plating tank provided by the invention, by substrate being attached to the side of transport unit, so, extend the length of substrate electroplating operations deposition, increase the area of deposition CIGS absorption layer, like this, reduce the quantity of plating tank, save space, and substrate is attached on transport unit the only one side to substrate and deposits, needn't do Transformatin to the another side of substrate, simplify processing step, simultaneously, anode hang on plating pilot trench side and described substrate is oppositely arranged, described substrate and described anode planes are to plane, in whole deposition process, the surface loss of described anode planes is consistent, the good uniformity coefficient of CIGS absorption layer of described substrate surface deposition and stable sedimentation rate are guaranteed.
Accompanying drawing explanation
Fig. 1 be in prior art on substrate the structural representation of electroplating deposition CIGS absorption layer;
Fig. 2 is the composition schematic diagram of a copper plating groove;
Fig. 3 a is a structural representation of transport unit in Fig. 2;
Fig. 3 b is the another structural representation of transport unit in Fig. 2;
Fig. 3 c is another structural representation of transport unit in Fig. 2;
Fig. 3 d is a structural representation again of transport unit in Fig. 2;
Fig. 4 is that in Fig. 2, the broken section in a copper plating groove is arranged schematic diagram.
Fig. 4 a is the schematic cross-section of an interior plating solution jet pipe of copper plating groove in Fig. 4.
Description of symbols:
Embodiment
In order to make object of the present invention, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein, only in order to explain the present invention, is not intended to limit the present invention.
Below in conjunction with concrete accompanying drawing, realization of the present invention is described in detail.
As figure 2 ?as shown in 4a, be preferred embodiment provided by the invention.
A kind of plating tank that the present embodiment provides, to electroplate the work nest occurring, for by copper or gallium or indium or selenium element deposition in a surface of substrate, be appreciated that, the conductive material that described substrate for the benefit of deposits CIGS absorption layer is made, as aluminium foil, titanium foil, molybdenum foil, brass foil, stainless steel etc.In the present embodiment, described substrate is that 100～600mm is wide, and the 430 stainless steel winding that 50～100nm is thick dry up through cleaning, and the Mo of vacuum sputtering 100～500nm is thick in order Cr, 100～500nm, the Cu of 20～150nm are made.Be that the sputter in advance of described substrate surface has Cr/Mo/Cu.Described substrate has upper and lower two surfaces, for ease of follow-up explanation, the lower surface of described substrate is defined as to front, and the upper surface of described substrate is defined as the back side.Sputter in advance has the Stainless Steel Band 701 of Cr/Mo/Cu by this example, by layer metal deposition in the front of described stainless steel belt.
Conventionally, when described plating tank splendid attire copper plating bath, be called copper plating groove, when splendid attire plating gallium liquid, be called plating gallium groove, when splendid attire plating indium liquid, be called plating indium groove, when splendid attire plating selenium liquid, be called plating selenium groove.
Similar with principle with the structure of plating selenium groove due to copper plating groove, plating gallium groove, plating indium groove, for ease of explanation, the present embodiment selects copper plating groove to describe.Substrate in the present embodiment is Stainless Steel Band.
As shown in Figure 2, described copper plating groove comprises plating pilot trench, anode and the transport unit 506 of splendid attire electroplate liquid for the work of electroplating.Described plating pilot trench is copper facing pilot trench 502, has container cavity, is loaded with copper plating bath 504; Described anode is copper anode 505, and the side that is tabular setting and hang on described copper facing pilot trench 502 for depositing CIGS absorption layer is immersed in described copper plating bath 504; The two sides relative with described transport unit 506 are oppositely arranged, transport unit 506 is arranged at the middle of described copper facing pilot trench 502, be used for carrying described Substrate Synchronous and move, the drive path of described transport unit 506 is by the end to end closed forming of multi-line section; Described copper anode 505 is immersed in symmetrically arranged parallel sided in electroplate liquid and is oppositely arranged respectively with on described transport unit 506, described substrate is attached at and on described transport unit 506, is immersed in side and be oppositely arranged parallel with described anode in electroplate liquid, and has a suitable spacing.
In the present embodiment, described copper anode 505 is tabular, and described copper anode 505 is immersed in the copper plating bath in described copper facing pilot trench 502, so, Anode machining is simple, elongated, Stainless Steel Band 701 relatively to be plated is slightly wide, hangs over the both sides of electroplating pilot trench, and it is convenient and simple to change anode.Described copper anode 505 is distributed in the left and right sides of described transmission mechanism 300 and is oppositely arranged with described Stainless Steel Band 701, has a spacing.By described Stainless Steel Band 701 phase antianodes are arranged, described Stainless Steel Band 701 and described anode planes are to plane, in whole deposition process, the surface loss of described anode planes is consistent, has guaranteed the good uniformity coefficient of CIGS absorption layer of described Stainless Steel Band 701 surface depositions and stable sedimentation rate.In actual production, the thickness of the copper of deposition, arranges the spacing between described copper anode 505 and described Stainless Steel Band 701 as required.Particularly, in the present embodiment, the outline of described transmitting device 506 is Fang Tizhuan, has six faces, on the two sides of described transport unit 506, is oppositely arranged and is partially submerged in copper plating bath 504 with described anode.Wherein, the left and right side of transport unit 506 is relative with the left and right side of described copper plating groove 501 inwalls.When the described copper facing pilot trench 502 of described Stainless Steel Band 701 process, described Stainless Steel Band 701 is attached at left and right side and the bottom surface of described transport unit 506, with parallel being oppositely arranged of described copper anode 505.The drive path of the transport tape on described transport unit 506 is orthogonal, and the opposing parallel interval, left and right side that is oppositely arranged and is immersed on described copper anode 505 and described transport unit 506 in described electroplate liquid arranges.In copper facing pilot trench 502, extend the deposition length of Stainless Steel Band 701, increase the area of deposition CIGS absorption layer, improve the efficiency of deposition, reduce the quantity of copper plating groove, save space.By Stainless Steel Band 701 synchronizing movings described in the rotation portability of described transport unit 506.Left and right side and the bottom surface of Stainless Steel Band 701 back sides and transport unit 506 are affixed, and both synchronizing movings, so, avoid Stainless Steel Band 701 back sides to plate metal level.Only the front of Stainless Steel Band 701 is deposited, needn't do Transformatin to the back side of Stainless Steel Band 701, simplified processing step, improved sedimentation effect, saved cost.
For ease of distinguishing, the spacing between the copper anode 505 in described copper facing pilot trench 502 and described Stainless Steel Band 701 is defined as to the first spacing X1; According to the difference of each coating electroplating technology, described the first spacing X1 is rationally set, when gap hour, the high speed in reversed direction of electroplate liquid passes through, and the bubble of separating out on negative electrode is taken away by plating solution in time, has guaranteed that the surface of settled layer does not have piebald.
Particularly, as Fig. 3 a ?as shown in 3d, described transport unit 506 comprise an anchor 506A, at least one group of home roll wheel 509 and at least one group coordinate with described home roll wheel 509 rotation from running roller 508 and transport tape 507, the rectangular shape in cross section of described anchor 506A, the rectangular setting of described travelling belt 507 is also attached at described home roll wheel 509 and described from the periphery of running roller 508 and carry described substrate and together move.Described home roll wheel 509 is installed on described anchor 506A top and supports described Stainless Steel Band 701; Describedly be installed on described anchor 506A bottom from running roller 508 and also support described Stainless Steel Band 701; Described transport tape 507 is attached at described home roll wheel 509 and describedly from the periphery of running roller 508, carries described Stainless Steel Band 701 and together move along with described home roll wheel 509 and the described rotation from running roller 508.So, simple in structure, on the one hand, guarantee that the back side of described Stainless Steel Band 701 is tightly attached on described transport tape 507
Particularly, as shown in Figure 3 a, the outer side wall of described home roll wheel 509 and the described periphery from running roller 508 and described anchor 506A is tangent.Shown in two nooks at top of anchor 506A be respectively installed with a rotating home roll wheel 509, the periphery of described home roll wheel 509 and top margin and the left and right side of described anchor 506A are tangent, shown in two nooks of bottom of anchor 506A be respectively installed with one rotating from running roller 508, the base of the described periphery from running roller 508 and described anchor 506A and and left and right side tangent.Described transport tape 507 surrounds respectively the rectangular parallelepiped of a sealing from running roller 508 around two home rolls wheel 509 and two.In electroplating pilot trench; described transmission mechanism 300 is all taken turns 509 intermeshing with described home roll; Stainless Steel Band 701 is taken turns 509 engagement places through transmission mechanism 300 and home roll; winding is downwards placed in two of described transport unit 506 bottoms from running roller 508; attach and lay out from the opposite side of described transport unit 506; stainless steel lining bottom back side and transport tape 507 push against and are affixed, and play protection Stainless Steel Band 701 back sides and are not deposited metal level.
Or, as shown in Figure 3 b, described home roll wheel 509 is provided with two, be fixedly arranged on the nook at described anchor 506A top, describedly be provided with two from running roller 508, be arranged at the nook of the bottom of described anchor 506A, described home roll wheel 509 and described periphery from running roller 508 protrude from the outer side wall of described anchor 506A.Described transport tape 507 is sheathed on described home roll wheel 509 and described from the periphery of running roller 508, described home roll wheel 509 and describedly push against described transport tape 507 from running roller 508.
As shown in Figure 3 c, another embodiment of described transport unit 506.Two described home roll wheels 509 are arranged at respectively the nook at described anchor 506A top, describedly be provided with nine from running roller 508, wherein, on the base of three bottoms that are fixedly arranged on described anchor 506A, the both sides of described anchor 506A be respectively fixed with three described in from running roller 508.Described transport tape 507 is sheathed on described home roll wheel 509 and described from the periphery of running roller 508, described home roll wheel 509 and describedly push against described transport tape 507 from running roller 508.
As shown in Figure 3 d, on described transport unit 506, be also provided with one for regulating the setting device 530 of described transport tape 507 rates of tension, described setting device 530 and described home roll wheel 509 and be describedly connected from running roller 508 is adjustable.Particularly, in Fig. 3 d, be not shown specifically, described setting device has a fixed leg and is arranged in the mid-way of described anchor 506A, fixed leg and described home roll wheel 509 and be describedly connected by regulating part from running roller 508, regulating part in the present embodiment is straight dynamic air cylinder, the base of described straight dynamic air cylinder is articulated with described fixed leg, and the piston rod of described straight dynamic air cylinder connects described home roll wheel 509 or described stationary shaft from running roller 508.So, the rate of tension of adjustable described transport tape 507, and then regulate the rate of tension of Stainless Steel Band 701 on described transport tape 507.
Particularly, on described transport tape 507, be also provided with the adsorption section of adsorbable described Stainless Steel Band 701.Described adsorption section in the present embodiment is vacuum cups, described vacuum cups is located at the one side of fitting with described Stainless Steel Band 701 on described transport tape 507, so, can make described Stainless Steel Band 701 fitting on described transport tape 507 of consolidation more, avoid electroplate liquid to penetrate into the back side of described Stainless Steel Band 701.
When concrete application, by being set, a vacuum generator is connected with described vacuum cups, in the time that described Stainless Steel Band 701 has just entered described plating pilot trench ingress, described Stainless Steel Band 701 is positioned at electroplate liquid top, be about to contact that time with described transport tape 507, the suction nozzle that is about on described transport tape 507 touch with described Stainless Steel Band 701 is opened, thereby described Stainless Steel Band 701 is firmly attached on described transport tape 507; When described Stainless Steel Band 701 is taken electroplate liquid out of, be about to leave while electroplating pilot trench, when namely Stainless Steel Band 701 is about to separate with described transport tape 507, the vacuum cups being positioned on the Stainless Steel Band 701 in exit is closed, can make described transport tape 507 separate with described Stainless Steel Band 701, so, avoid electroplate liquid described in vacuum cups suck-back, simultaneously guaranteed described Stainless Steel Band 701 is adsorbed in the firmness on described transport tape 507, avoids the backside deposition metal plating of described Stainless Steel Band 701.
Certainly, for further improving the work-ing life of described transport tape 507, can adopt corrosion resistant material to make, and a return flow line being communicated in described plating pilot trench is set on the air flue of described vacuum cups, namely, once described vacuum cups sucks described electroplate liquid, open described return flow line, and described electroplate liquid is back in corresponding plating pilot trench.Described Stainless Steel Band 701 backside deposition metal levels so, are further guaranteed.
As shown in Figure 2 and Figure 4, for make that copper plating bath 504 in copper facing pilot trench 502 mixes evenly, in described copper facing pilot trench 502, be provided with at least one plating solution jet pipe 511, on described plating solution jet pipe, be provided with equally distributed spray orifice.Particularly, described spray orifice is tapered hole, the inwall of described spray orifice along in the pipe of described plating solution jet pipe 511 outside pipe direction expand gradually.Further, the injection direction of described spray orifice is towards the diapire of described plating pilot trench.So, electroplate liquid sprays downwards through the plating solution jet pipe 511 that is arranged at described copper facing pilot trench diapire 531, and the backward upper stirring electroplate liquid that touches the bottom and bounce back up makes to electroplate mix more even, and concentration is identical everywhere.
Conventionally, spray orifice perforate tapering α is 30 °～60 °.Further, the nozzle spacing arranging on same plating solution jet pipe 511 from the ratio of d1 and described injection diameter d2 between 20:1 to 5:1.In the present embodiment, described nozzle spacing is 2～20mm from d1, and injection diameter d2 is 0.5～3.5mm.Particularly, on same described plating solution jet pipe 511, be provided with two row's spray orifices, the injection direction of described two row's spray orifices is angle setting.Conventionally, the angle β between two row's spray orifices is 60 °～120 °.
Further, be provided with equal drift net 510 in described plating pilot trench, described equal drift net 510 is for the flow velocity of the mild electroplate liquid upwards springing up, and described equal drift net 510 is between described transport unit 506 and described plating solution jet pipe 511.So, when the electroplate liquid springing up is after equal drift net 510 plates, fierce springing up is able to mild, makes described electroplate liquid become tranquil, is difficult for producing bubble, avoids producing piebald on electrolytic coating surface.
Particularly, the depth ratio of described plating solution jet pipe 511 and the distance of pilot trench bottom and the electroplate liquid of described plating pilot trench is between 1:7 to 1:20.So, above-mentioned plating solution jet pipe 511 is located to the correct position in described plating pilot trench, can guarantees that electroplate liquid has preferably mixing effect, avoid remaining dirt to stop up, the spray orifice on plating solution jet pipe 511 simultaneously.
Further, described equal drift net 510 is dull and stereotyped, is provided with equally distributed mesh on described flat board.Particularly, described mesh is arranged to taper hole, namely, opening up bellmouth orifice, the diameter edge of the inwall of described mesh straight up direction increases gradually, and conventionally, current-sharing mesh diameter d3 is 0.5～3.5mm, and current-sharing mesh openings tapering γ is 20 °～75 °.Particularly, the mesh of described equal drift net 510 is between 5 ?50.Conventionally, current-sharing Mesh distance d4 is 1～5mm.
Further, the depth ratio of the electroplate liquid in the thickness of described flat board and described plating pilot trench is between 1:50 to 1:300.Conventionally, all drift net thickness d 5 is 1～5mm.
Particularly, the ratio h1/h2 of the distance h 2 of the distance h 1 of plating solution jet pipe 511 and equal drift net 510 and plating solution jet pipe 511 and pilot trench bottom is between 2:1 to 10:1.So, both guaranteed that copper facing pilot trench bottom was without circulation dead angle, and made again the electroplate liquid that up shoves at the uniform velocity tranquil, thereby do not produce bubble, guaranteed that coating surface did not have piebald.
For ease of explanation, specify that to electroplate pilot trench wide be xmm, long is ymm, common, plating solution jet pipe length L be x ?(15mm～28mm), the radical N of jet pipe is (1/2) * (y/h2) * ctg (β/2), N round numbers.
Particularly, as shown in Figure 2, for avoiding the fluctuation of concentration of copper facing pilot trench 502 interior copper plating baths excessive, described copper facing pilot trench 502 is equipped with the female groove 503 of a copper facing.In like manner, described secondary copper plating groove 502B is equipped with the female groove 503B of a secondary copper facing, for regulating the secondary copper plating bath 504B concentration in described secondary copper plating groove 502B; Described plating gallium pilot trench 516 is all equipped with a female groove 517 of plating gallium, for regulating plating gallium liquid 518 concentration in described plating gallium pilot trench 516; Described plating indium pilot trench 521 is equipped with a female groove 522 of plating indium, for regulating plating indium liquid 523 concentration in described plating indium pilot trench 521; Described plating selenium pilot trench 526 is equipped with a female groove 527 of plating selenium, for regulating the plating selenium concentration in described plating selenium pilot trench 526; So, can make the electroplate liquid concentration in a suitable depositing metal layers all the time in described plating pilot trench.
Particularly, the sidewall of described copper facing pilot trench 502 is provided with overflow device, and described overflow device is communicated with described copper facing pilot trench 502 by plating solution return line 514.Particularly, described overflow device is overflow groove 532, and one end of described plating solution return line 514 is connected in the bottom of described overflow groove 532, and the other end is connected in described 502 bottom.Further, on described plating solution return line 514, be connected with the female groove 503 of copper facing, in the female groove 503 of described copper facing, store the copper plating bath of high density, and can be by electroplate liquid heating or refrigeration in it, adjust the concentration with each composition in the temperature of the electroplate liquid in described copper facing pilot trench 502 and electroplate liquid.
As shown in Figure 3, one end of described plating solution return line 514 is connected in the bottom of described overflow groove 532, and the other end is connected in the female groove 503 of described copper facing.Particularly, on the described plating solution jet pipe 511 in the exit of the female groove of described electroplate liquid, recycle pump 513 is installed and for filtering the filter 512 of dirt residue.So, electroplate liquid flows back in the female groove 503 of copper facing by this overflow groove 532, then passes through the pumping of recycle pump 513 and the filtration of filter 512, is transmitted back to and electroplates pilot trench 502, realizes circulation.So, can realize circulating of copper plating bath 504, and constantly purify the interior electroplate liquid of described copper plating groove 501, keep the clean and bath concentration in copper plating groove 501 to remain stable.Described plating solution return line 514 enters and in copper facing pilot trench 502, is divided into many plating solution jet pipes 511.As shown in Fig. 4 a, the interior section S sum of each plating solution jet pipe 511 is equal to or greater than the interior cross section of described plating solution return line 514.
Be briefly described with regard to the working cycle of copper plating bath 504 below: copper plating bath 504 electroplate liquids in the female groove 503 of described copper facing are extracted out by recycle pump 513, after filter 512 filters, because plating solution return line 514 branches to the plating solution jet pipe 511 in copper facing pilot trench 502, spray orifice on plating solution jet pipe 511 sprays down, the 531 rear bounce-backs of touching copper facing pilot trench diapire upwards spring up, slow down gently through equal drift net 510, it is tranquil that the copper plating bath 504 of fluctuation becomes at once, liquid level in copper facing pilot trench 502 rises, eliminate and surged, crack through copper anode 505 and stainless steel belt, overflow the sidewall of described copper facing pilot trench 502, inflow is arranged in the overflow groove 532 on described copper facing pilot trench 502 sidewalls, pass back into again in the female groove 503 of copper facing, mix with the copper plating bath 504 in the female groove 503 of described copper facing, pumped to described copper facing pilot trench 502 by recycle pump 513 again, so iterative cycles.
For better described Stainless Steel Band 701 being introduced in described plating solution copper groove 502, in ingress and the exit of described plating solution copper groove 502, be provided with a transmission mechanism 300, described transmission mechanism 300 comprises intermeshing pressure roller 301 and carrying roller 302, described Stainless Steel Band 701 is arranged in described pressure roller 301 and described carrying roller 302 engagement places, and described pressure roller 301 and described carrying roller 302 are supported respectively the above and below of described Stainless Steel Band 701.In practical application, described carrying roller 302 is force piece, drives described pressure roller 301 to rotate.Be positioned at the effect that the carrying roller 302 of electroplating pilot trench ingress and exit also has conduction simultaneously, when plating, carrying roller 302 connects power cathode, and conduction of current, at the bottom of stainless steel lining to be plated, making becomes negative electrode at the bottom of stainless steel lining.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, all any modifications of doing within the spirit and principles in the present invention, be equal to and replace and improvement etc., within all should being included in protection scope of the present invention.
Claims (23)
1. a plating tank, for by copper or gallium or indium or selenium element deposition in a surface of substrate, it is characterized in that, comprise
Electroplate pilot trench, there is the container cavity for splendid attire electroplate liquid;
Anode, the sidewall that is tabular setting and hang on described plating pilot trench for depositing CIGS absorption layer,
Be immersed in described electroplate liquid;
Transport unit, is arranged at the middle of described plating pilot trench, moves for carrying described Substrate Synchronous,
The drive path of described transport unit is by the end to end closed forming of multi-line section;
Described anode is immersed in symmetrically arranged parallel sided phase in electroplate liquid respectively with on described transport unit
To arranging, described substrate be attached at the side of being immersed on described transport unit in electroplate liquid and with institute
State that anode is parallel to be oppositely arranged.
2. a kind of plating tank according to claim 1, it is characterized in that: described transport unit comprises an anchor, be installed on described anchor top and support at least one group of home roll wheel of described substrate and be installed on described anchor bottom and coordinates at least one group of rotation from running roller with described home roll wheel, and transport tape, described travelling belt is attached at described home roll wheel and described from the periphery of running roller and carry described substrate and together move.
3. a kind of plating tank according to claim 2, it is characterized in that: the drive path of the transport tape on described transport unit is orthogonal, the opposing parallel interval, two sides that is oppositely arranged and is immersed on described anode and described transport unit in described electroplate liquid arranges.
According to claim 1 ?a kind of plating tank described in any one in 3, it is characterized in that: described home roll wheel and described tangent from the periphery of running roller and the outer side wall of described anchor.
According to claim 1 ?a kind of plating tank described in any one in 3, it is characterized in that: described home roll wheel and described periphery from running roller protrude from the outer side wall of described anchor.
According to claim 1 ?a kind of plating tank described in any one in 3, it is characterized in that: on described transport unit, be also provided with the setting device for regulating described transport tape rate of tension, described setting device and described home roll wheel and be describedly connected from running roller is adjustable.
7. according to a kind of plating tank described in claim 2 or 3, it is characterized in that: on described transport tape, be also provided with the adsorption section that adsorbable described substrate is fitted itself and described transport tape.
According to claim 1 ?a kind of plating tank described in any one in 3, it is characterized in that: in described pilot trench, be provided with at least one plating solution jet pipe, on each described plating solution jet pipe, be provided with equally distributed spray orifice.
9. a kind of plating tank according to claim 8, is characterized in that: described spray orifice is tapered hole, the inwall of described spray orifice along in the pipe of described plating solution jet pipe outside pipe direction expand gradually.
10. a kind of plating tank according to claim 9, is characterized in that: the distance between the spray orifice arranging on same plating solution jet pipe and the diameter of described spray orifice are than between 20:1 to 5:1.
11. a kind of plating tanks according to claim 10, is characterized in that: on same described plating solution jet pipe, be provided with two row's spray orifices, the injection direction of described two row's spray orifices is angle setting.
12. a kind of plating tanks according to claim 11, is characterized in that: the injection direction of described spray orifice is towards the diapire of described plating pilot trench.
13. a kind of plating tanks according to claim 12, is characterized in that: the depth ratio of the distance of the extremely described pilot trench of described plating solution jet pipe bottom and the electroplate liquid of described plating pilot trench is between 1:7 to 1:20.
14. according to a kind of plating tank described in any one in claim 1 ?3,9 ?13, it is characterized in that: in described plating pilot trench, be provided with the equal drift net for mild electroplate liquid flow velocity, described equal drift net is between described transport unit and described plating solution jet pipe.
15. a kind of plating tanks according to claim 14, is characterized in that: described equal drift net, for dull and stereotyped, is provided with equally distributed mesh on described flat board.
16. a kind of plating tanks according to claim 15, is characterized in that: the depth ratio of the electroplate liquid in the thickness of described flat board and described plating pilot trench is between 1:50 to 1:300.
17. a kind of plating tanks according to claim 16, is characterized in that: described mesh is taper hole, and the diameter edge of the inwall of described mesh straight up direction increases gradually.
18. a kind of plating tanks according to claim 17, is characterized in that: described equal drift net to distance and described plating solution jet pipe to the distance of described plating pilot trench diapire of described plating solution jet pipe compares between 2:1 is as for 10:1.
19. a kind of plating tanks according to claim 18, is characterized in that: the mesh of described equal drift net is between 5 ?50.
20. according to claim 1 ?3,9 ?13,15 ?a kind of plating tank described in any one in 19, it is characterized in that: the sidewall of described plating pilot trench is provided with overflow device, described overflow device is communicated with described plating pilot trench by plating solution return line.
21. a kind of plating tanks according to claim 20, it is characterized in that: described overflow device is overflow groove, be arranged at the outside of described plating pilot trench sidewall, one end of described plating solution return line is connected in the bottom of described overflow groove, and the other end is connected in the bottom of described plating pilot trench.
22. a kind of plating tanks according to claim 21, is characterized in that: the female groove of electroplate liquid that is connected with to regulate the each constituent concentration of electroplate liquid in described plating pilot trench on described plating solution jet pipe.
23. a kind of plating tanks according to claim 22, it is characterized in that: in the exit of the female groove of described electroplate liquid, on described plating solution jet pipe, be provided with for the electroplate liquid in female electroplate liquid groove being pumped to recycle pump in described plating pilot trench and for filtering the filter of dirt residue.
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| CN201310683838.0A CN103789806B (en) | 2013-12-12 | 2013-12-12 | Electroplating bath |
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| CN201310683838.0A CN103789806B (en) | 2013-12-12 | 2013-12-12 | Electroplating bath |
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| CN103789806B CN103789806B (en) | 2016-08-17 |
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| CN104862769A (en) * | 2015-05-16 | 2015-08-26 | 中北大学 | Electroplate liquid circulating filtration system |
| CN105390567A (en) * | 2014-09-03 | 2016-03-09 | 亚智科技股份有限公司 | Roll-to-roll processing equipment and system thereof |
| CN105803497A (en) * | 2016-05-24 | 2016-07-27 | 广州杰赛科技股份有限公司 | Novel electroplating device |
| CN106011988A (en) * | 2016-07-07 | 2016-10-12 | 成都乾瑞科技有限公司 | Adjustable electronic component electroplating bath capable of achieving uniform thickness and colour heights |
| CN108265318A (en) * | 2016-12-30 | 2018-07-10 | 上海移宇科技股份有限公司 | Method and device for preparing negative electrode powder of flexible battery |
| CN108307663A (en) * | 2015-10-02 | 2018-07-20 | 环球太阳能公司 | The metallization of flexible polymer sheet material |
| CN114808057A (en) * | 2021-01-29 | 2022-07-29 | 泰科电子(上海)有限公司 | Electroplating device and electroplating system |
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| CN105390567A (en) * | 2014-09-03 | 2016-03-09 | 亚智科技股份有限公司 | Roll-to-roll processing equipment and system thereof |
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| CN108265318A (en) * | 2016-12-30 | 2018-07-10 | 上海移宇科技股份有限公司 | Method and device for preparing negative electrode powder of flexible battery |
| CN108265318B (en) * | 2016-12-30 | 2019-12-20 | 上海移宇科技股份有限公司 | Method and device for preparing flexible battery cathode powder |
| CN114808057A (en) * | 2021-01-29 | 2022-07-29 | 泰科电子(上海)有限公司 | Electroplating device and electroplating system |
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| CN103789806B (en) | 2016-08-17 |
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