CN100595344C

CN100595344C - Continuous electroplating apparatus

Info

Publication number: CN100595344C
Application number: CN200810020061A
Authority: CN
Inventors: 庄伟荣; 钱晓华; 袁建中
Original assignee: SUZHOU RONGFENG CHEMICAL INDUSTRY ENVIRONMENTAL PROTECTION EQUIPMENT Co Ltd
Current assignee: SUZHOU RONGFENG CHEMICAL INDUSTRY ENVIRONMENTAL PROTECTION EQUIPMENT Co Ltd
Priority date: 2008-03-19
Filing date: 2008-03-19
Publication date: 2010-03-24
Anticipated expiration: 2028-03-19
Also published as: CN101250736A

Abstract

The invention relates to a continuous electroplating device used for plating metal coatings on the surface of a metallic strip through the electrolytic reaction mode, which comprises a groove body, adriving system which is used to drive the metallic strip to pass through the groove body, at least one anode plate is arranged in the groove body, wherein the metallic strip is connected with the cathode of the power supply, the anode plate is connected with the anode of the power supply, and gap is existed between the anode plate and the metallic strip, the continuous electroplating device further comprises an anode box used for installing the anode plate, a plating solution supplying system used for transporting plating solution to the anode box, wherein the anode box comprises a box body, amulti-layer damping grid which is arranged in the box body and is used to divide the box body into a plurality of plating solution cavities, a plating solution inlet which is communicated with the lowest plating solution cavity is arranged on the box body, a plating solution outlet which is communicated with the highest plating solution cavity is arranged on the upper portion of the anode plate,wherein the anode plate and the plating solution outlet are arranged on the same side of the box, the plating solution outlet has various widths along the direction of height thereof, the continuous electroplating device with small gap and no edge cover structure has high electroplating efficiency, low production cost, and homogeneous coating after being electroplated.

Description

Continuous electroplating apparatus

Technical field

The invention belongs to the plated metal field, especially relate to a kind of continuous electroplating apparatus.

Background technology

At present, in the production of steel plate galvanized since electro-galvanized layer have in conjunction with closely, advantage such as impurity component is few, be extensive use of electroplating technology, the electrolytic galvanized sheet that mainly contains the electrolytic tinplate that is used to the system of producing jar industry and be used for car industry etc.When steel plate is carried out coating, adopt the electroplanting device with different designs according to the needs of practical application, the design of electroplanting device is one of key character of electroplating technology.Over nearly 20 years, the exploitation of constantly being devoted to novel electroplanting device in the world wide exists in the electroplating technology to solve: as when producing the single face plated product, coated metal is in the deposition and the winding of non-coating side; The working current of single plating tank is little, incompatible with the thickness coating requirement, facility investment and cost height; Problems such as coated metal alloying constituent instability.

The single face that discloses a kind of metal strip in WO94/10360 is electroplated film coating apparatus, around driven negative electrode charged roller the metal strip that guides an outside to be coated is contiguously arranged, this metal strip through deflector roll to be fed to charged roller with the as far as possible little spacing of charged roller, after coating, see off by another deflector roll at relative opposite side.Metal strip passes a clearance space, and a kind of plating bath also flows through this space, and metal strip is coated with coating in this space.The side of the clearance space that is made of belt surface and the plate that is oppositely arranged is sealed, and sealing member is in the axial adjusted of charged roller, to adapt to by the different in width of the metal strip of coating.Each sealing member is supported on the fringe region of plating metal band respectively with a seal section, the seal section of these supports contacts with the surface of a wrapping angle with the plated film metal strip, and the size of this wrapping angle provides enough sealings when metal strip enters plating bath.This device can carry out single-face plating to the metal strip of different in width.Though the time to narrow metal strip coating, use less than portion's section of charged roller avoided galvanization coating, but there is defective in the support of seal section on metal strip, particularly to extremely thin metal strip, can be left a trace by these seal sections that the metal strip of coating is pulled through, therefore, in a follow-up operation, the fringe region of this band must be cut away.

The patent No. is " ZL98803897.8 "; the Chinese invention patent that name is called " device that carries out the continuous electroplating deposition process " discloses a kind of zone that does not need to charged roller and has done effective protection; thereby avoid the device of undesirable galvanization coating, this device mainly is that a mask tape of being made by electrically insulating material all is set in each side of charged roller.Owing to the mask tape need be set, make that the electroplating device setting becomes complicated, cost is also higher, and this electroplanting device can only be used for the single-face plating of metal strip.

The size of current density is one of crux factor that influences electroplating efficiency, by electrochemistry as can be known, the high speed plating bath allows to use higher current density, in order to obtain high current density, improve electroplating efficiency, mainly be by plating bath is pumped into the coating bath from circulation groove in the prior art, make full use of gravity the plating bath in the coating bath is quickened that this is just very high to the control accuracy requirement of pumping capacity.

Summary of the invention

Technical problem to be solved by this invention is the continuous electroplating apparatus that a kind of little gap, non-flanged cover structure are provided in order to overcome the deficiencies in the prior art, and this electroplanting device electroplating efficiency height, production cost are low, and the coating after the plating is even.

For achieving the above object, the technical solution used in the present invention is:

A kind of continuous electroplating apparatus that is used to make metal plating on the metallic strip surface band, comprise cell body, be used to drive the transmission system of metal strip by cell body, be arranged on intravital at least one plate of groove, metal strip links to each other with the negative pole of power supply, plate is connected with the positive pole of power supply, has the gap between plate and the metal strip, continuous electroplating apparatus also comprises the anode box that is used to install plate, be used for carrying in the anode case plating bath plenum system of plating bath, anode box comprises casing, be arranged in the casing and casing be divided into the multilayer damping grid in a plurality of plating baths chamber, casing has the plating bath inlet that is connected with undermost plating bath chamber, the plating bath outlet that is positioned at the top of plate and is connected with the plating bath chamber of the superiors, plate, the plating bath outlet is positioned at the homonymy of casing, and the two opposite side walls of plating bath outlet changes along short transverse.

Cell body is vertical coating bath.Continuous electroplating apparatus also comprises the regulating mechanism that is used to regulate the size in gap between plate and the metal strip.Regulating mechanism is a hydro-cylinder, and the piston rod of hydro-cylinder and anode box are fixedly connected.

Casing adopts glass reinforced plastic to make, and the basic material of glass reinforced plastic is a fire-retardant epoxy resin.The plating bath outlet is " V " shape, the plating bath delivery system comprises circulation groove, is used for carrying in the anode case variable frequency pump of plating bath, the rotating speed of adjusting variable frequency pump can accurately be regulated the plating bath flow makes casing have different filled height, thereby can make plating bath outflow width consistent with the width of metal strip.

Be evenly distributed with fluid hole on the described plate, guarantee plating bath pressure optimal allocation on pole plate.

The bottom of casing removably is provided with cover plate, and is convenient to the intravital rubbish of case is in time cleared up.

Vertical range between plate and the metal strip from up to down reduces gradually.

Because the technique scheme utilization, the present invention compared with prior art has following advantage;

Electroplanting device includes the anode box with multilayer damping grid, when anode box is used for fixing the installation plate as carrier, also can be used for regulating the flow velocity and the fluid state of plating bath, make plating bath be the laminar flow regime pole plate of flowing through, guarantee all even edge thickening that prevents of coating, need not to be provided with complicated side cover system; Gap between plate and the metal strip can be very little, allows to use less groove to press, and reduces production costs; Because plating bath is from top to bottom by the gap between plate and the metal strip, plating bath quickens under the effect of gravity, can obtain high flow velocities, thereby can electroplate under higher current density, and the coating that obtains is careful, and is smooth, and anti-corrosion capability is stronger.

Description of drawings

Fig. 1 is a synoptic diagram of the present invention;

Fig. 2 is the left cross-sectional schematic of anode box of the present invention;

Fig. 3 is the main cross-sectional schematic of anode box of the present invention;

1, cell body; 2, metal strip; 3, plate; 4, anode box; 5, conductive rollers; 6, gap; 7, registration roller; 40, casing; 41, plating bath chamber; 42, damping grid; 400, plating bath inlet; 401, plating bath outlet; 43, cover plate.

Embodiment

Below the specific embodiment of the present invention is described:

As shown in Figure 1 to Figure 3, be that example is elaborated to present embodiment with the electroplanting device that is used to the galvanizing technique of steel:

The both sides that the zinc-plated device of continuous electric mainly comprises cell body 1, plate 3, metal strip 2, be separately positioned on cell body 1 are used for fixing two anode boxs 4, the transfer system of metal strip 2, plating bath delivery system, other utility appliance that plate 3 is installed.

Cell body 1 is vertical coating bath, is welded with carbon steel, and the liner acid-resisting rubber is connected with various flanges, refluxing opening etc. on the cell body 1.

Metal strip 2 enters from a side oral area of cell body 1, spreads out of from the opposite side oral area, is provided with rotating conductive rollers 5 respectively in the both sides of cell body 1 oral area, the bottom centre position that is positioned at cell body 1 is provided with registration roller 7, the AC gear motor is adopted in the transmission of conductive rollers 5, and variable frequency control is 5.5 kilowatts.Also be provided with the pinch roll (not shown) on each conductive rollers 5, pinch roll is used to make metal strip 2 to combine well with conductive rollers 5, makes metal strip 2 be with negative electricity. and registration roller 7, the roll surface line with rubber is accurately located the metal strip 2 of cell body 1 inlet below.

The both sides of cell body 1 are provided with two anode boxs that are arranged side by side 4 respectively.

Anode box 4 comprises casing 40, be arranged on the multilayer damping grid 42 in the casing 40, and damping grid 42 is divided into a plurality of plating baths chamber 41 with casing 40, the sidepiece relative that plate 3 is positioned at anode box 4 with metal strip 2, and constitute the partial sidewall of casing 40.Casing 40 has the plating bath inlet 400 that is connected with undermost plating bath chamber 41, the plating bath outlet 401 that is positioned at the top of plate 3 and is connected with the plating bath chamber 41 of the superiors, and plating bath outlet 401 and plate 3 are positioned at the homonymy of casing 40.

The plating bath plenum system comprises circulation groove, be used for the variable frequency pump that the plating bath with circulation groove pumps.

Plating bath is pumped in the anode box 4 by variable frequency pump, each layer damping grid 42 flow through successively to the plating bath at anode box 4 tops outlet 401, overflow in the gap 6 of plate 3 and metal strip 2 from plating bath outlet 401 then, plate 3 is selected insoluble electrode, dimensional stabilizing, material are to cover one deck IrO on the Ti metal ₂Plating bath quickens in the gap 6 between plate 3 and metal strip 2 under action of gravity, thereby plating bath is less than lower part in upper part speed in gap, and in lower part, the speed of plating bath can be up to about 4M/S.Plating bath speed towards cell body 1 bottom increases progressively under action of gravity, will cause the contraction of bottom section plating bath, causes occurring the uneven fluid that is mingled with air pocket towards metal strip 2 limit portions.For fear of the generation of this phenomenon, prevent by using the V-arrangement gap.The method that obtains the V-arrangement gap is with anode box 4 slight inclination, makes the upper end of plate 3 and the distance between the metal strip 2 be slightly larger than distance between lower end and the metal strip 2.

The bottom centre position place of casing 40 removably is provided with cover plate 43, with the convenient inside of removing the rubbish in the casing 40 and cleaning casing 40.

In addition, be evenly distributed with fluid hole on the plate 3, because plate 3 constitutes the partial sidewall of casing 40, when plating bath passes through casing 40 from bottom to top, the fluid hole that plating bath also can pass on the plate 3 enters into gap 6 so that the pressure distribution optimizing, thereby the flow optimizing, this is particularly important for the single face plating.The purpose of taking above these measures is evenly to be full of plating bath for the gap between the metal strip 2 that guarantees plate 3 and respective width.This is very important to obtaining along the well-proportioned coating of strip width direction.

Plating bath outlet 401 has different width along its short transverse, be " V " shape in the present embodiment, can realize that by the rotating speed of adjusting variable frequency pump or the opening degree of manual shift plating bath inlet 400 plating bath enters the size of the flow in the anode box 4, filled height with plating bath in the plating bath chamber 41 that changes the superiors, assurance exports the width of the effusive plating bath of 401 overflows and the width of metal strip is consistent from plating bath, only be full of plating bath in the gap 6 between metal strip 2 and plate 3, thereby, plating bath can be on a plane parallel with metal strip 2 surfaces, edge along metal strip 2 freely flows out gap 6, because thickness of coating is uniformly on whole metal strip end face, can be diffused in the non-coating in theory and goes.Thereby, no longer need complicated side cover system, thereby dwindle spacing, reduce cost, raise the efficiency.

Continuous electroplating apparatus also comprises the regulating mechanism that is used to regulate the distance between plate 3 and the metal strip 2, and regulating mechanism is a hydro-cylinder, and the piston rod of hydro-cylinder is fixedlyed connected with anode box 4.Adjustment structure can be controlled the position of anode box automatically, prevents that plate 3 and metal strip 2 from directly contacting the conversion of burning and being beneficial to the single-face plating and the two-sided coating of metal strip.

Carrying out single face when plating, having only in the anode box 4 of coating side to have pumped into plating bath, the anode box of opposite side 4 is removed by hydro-cylinder, and electric current also switches on the plate 3 of coating side, and the plate 3 of opposite side breaks away from electroplating processs.Use this structure, can avoid the edge thickening phenomenon of zinc layer effectively, and the zinc layer is at the wrapping phenomena of the non-coating of opposite side.The fluid width of plating bath under action of gravity is redefined for the width of metal strip and equates, the zinc layer promptly stops in the limit of metal strip portion, the complete like this side cover system that can unnecessaryly re-use complexity.When carrying out two-sided plating, anode box 4 is shifted to metal strip 2, and the plating bath supply valve is opened automatically, and plating bath also is pumped into the top of this anode box 4.

Claims

1, a kind of continuous electroplating apparatus that is used to make metal plating on the metallic strip surface band, comprise cell body (1), be used to drive the transmission system of metal strip (2) by described cell body (1), be arranged at least one plate (3) in the described cell body (1), described metal strip (2) links to each other with the negative pole of power supply, described plate (3) is connected with the positive pole of power supply, has gap (6) between described plate (3) and the described metal strip (2), it is characterized in that: described continuous electroplating apparatus also comprises the anode box (4) that is used to install described plate (3), be used in described anode box (4), carrying the plating bath plenum system of plating bath, described anode box (4) comprises casing (40), be arranged in the described casing (40) and described casing (40) be separated into the multilayer damping grid (42) in a plurality of plating baths chamber (41), described casing (40) has the plating bath that is connected with undermost described plating bath chamber (41) and goes into (400), the plating bath outlet (401) that is positioned at the top of described plate (3) and is connected with the described plating bath chamber (41) of the superiors, described plate (3), described plating bath outlet (401) is positioned at the homonymy of described casing (40), and the distance between the two opposite side walls of described plating bath outlet (401) changes along short transverse.

2, continuous electroplating apparatus according to claim 1 is characterized in that: described cell body (1) is vertical coating bath.

3, continuous electroplating apparatus according to claim 1 is characterized in that: described plating bath plenum system comprises circulation groove, is used for carrying to described anode box (4) variable frequency pump of plating bath.

4, continuous electroplating apparatus according to claim 1 is characterized in that: described plating bath outlet (401) is " V " shape.

5, continuous electroplating apparatus according to claim 1 is characterized in that: it also comprises the regulating mechanism of the size that is used to regulate described gap (6).

6, continuous electroplating apparatus according to claim 5 is characterized in that: described regulating mechanism is a hydro-cylinder, and the piston rod of hydro-cylinder is fixedlyed connected with described anode box (4).

7, continuous electroplating apparatus according to claim 1 is characterized in that: described anode box (4) is made by glass reinforced plastic, and the basic material of glass reinforced plastic is a fire-retardant epoxy resin.

8, continuous electroplating apparatus according to claim 1 is characterized in that: the bottom of described casing (40) removably is provided with cover plate (43).

9, continuous electroplating apparatus according to claim 1 is characterized in that: described plate is evenly distributed with fluid hole on (3), and described plate (3) constitutes the partial sidewall of described casing (4).

10, continuous electroplating apparatus according to claim 1 is characterized in that: the vertical range between described plate (3) and the described metal strip (2) diminishes from top to bottom gradually.