CN103834974B - One realizes metal tape thickness of coating equally distributed horizontal electroplating bath device - Google Patents
One realizes metal tape thickness of coating equally distributed horizontal electroplating bath device Download PDFInfo
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- CN103834974B CN103834974B CN201210473681.4A CN201210473681A CN103834974B CN 103834974 B CN103834974 B CN 103834974B CN 201210473681 A CN201210473681 A CN 201210473681A CN 103834974 B CN103834974 B CN 103834974B
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Abstract
The invention discloses the horizontal electroplating bath device that a kind of metal tape thickness of coating is evenly distributed, including cell body, its interior metal tape, the positive plate arranged up and down in the upper and lower surface of described metal tape and described plating bath arrangement forms upper and lower electroplating region, described upper and lower electroplating region is provided with the input duct for electroplate liquid inflow and outflow and drain pipe road, cushion chamber structure it is provided with at the inflow entrance of electroplate liquid, described cushion chamber is provided with buffer damping plate, described buffer damping plate machined the through hole of some different-diameters；Described electroplate liquid flows through cushion chamber extremely behind the region of metal tape, has respectively entered upper and lower electroplating region.The present invention is by cushion chamber and the design of buffering damping sheet, achieve cushion chamber cross direction profiles Homogenization Treatments of fluid in the space segment of metal tape, handled fluid enters into upper and lower electroplating region, thus realizes obtained coating being uniformly distributed in the horizontal.
Description
Technical field
The present invention relates to metal strip electroplating process equipment applications, be specifically related to a kind of at continuous metal strip process for producing line,
Realize thickness of coating cross direction profiles uniform control method during the continuous electroplating metal of metal tape both sides.
Background technology
In order to promote the surface property of metal tape, industrial user plates one sometimes on the surface of metal tape by the way of plating
Layer metal, such as, the nickel plating technology of surface of steel plate, the thickness of its nickel coating is generally only 100mg/m2.The purpose of nickel plating or
Person can promote for the surface corrosion resistance of metal tape, or as a kind of preprocessing means, eliminates what surfaces of metallic strip existed
Defect, electroplates other metal for next step and prepares.Aforesaid thickness of coating is commonly referred to as average, and in reality, often plates
Layer, in the cross direction profiles of metal tape uneven, shows as thickness and differs, thus produce quality problems, such as aberration etc..Cause thickness
The main cause that degree thickness differs is that the electroplating region fluid parameter of metal tape both sides is uneven in the cross direction profiles of metal tape, thus institute
The thickness of the coating obtained transversely is distributed the most uneven.
On continuous metal strip production line, the plating to metal surface generally completes in electroplating bath device.Especially, charged according to metal
The difference in the orientation in plating district, is divided into two classes, the most rectilinear coating bath technology and horizontal coating bath technology by coating bath.Wherein, horizontal
Coating bath mainly has two kinds in the concrete application of industrial quarters, and i.e. fluid cushion formula level trough and injecting type level trough, be shown in Fig. 1 and Fig. 2 respectively.
The above-mentioned two horizontal coating baths of class, when flash plating produces, all also exist deficiency.It is described as follows: fluid cushion formula horizontal coating bath structure such as figure
1, metal tape 1 is respectively arranged with a pair roller before and after electroplating bath device, coating bath, and upper roller 2 is conductive rollers, and lower roll is backing roll 3.
The upper and lower surface of metal tape respectively arranges positive plate assembly 4, and the outside of electroplating region is cell body 5, in order to collect the backflow of electroplate liquid.
The electroplate liquid 6 that is mainly characterized by of this coating bath has respectively entered upper and lower electroplating region from the middle input duct 7 of electroplating bath, and by 8
It is back in the blood circulation outside coating bath.Although the cushion chamber that fluid cushion formula level trough also has plating solution designs, but Cushioning Design herein
Purpose be the equilibrium relation in order to realize setting up metal tape stress between upper and lower electroplating region, this is because fluid cushion formula level trough
Span is big, and now strip steel produces " sagging " can not be ignored because of deadweight, needs to take technical measures to avoid, in case leukorrhagia stopping
Steel causes " anode and cathode " short circuit because of deadweight.Therefore, fluid cushion formula level trough cushion chamber be mainly designed in order to by strip steel " torr
Rise ", prevent short circuit.This processes at the fluid parameter of electroplating region, such as laterally homogeneousization of flow etc., and means are not come real
Existing, thus obtained coating is in the defect that transversely there is thickness distribution inequality of metal tape.
For injecting type level trough, see Fig. 2.Metal tape 1 is respectively arranged with a pair roller, upper roller before and after electroplating bath device, coating bath
2 is conductive rollers, and lower roll is backing roll 3.The upper and lower surface of metal tape respectively arranges positive plate assembly 4, and the outside of electroplating region is
Cell body 5, in order to collect the backflow of electroplate liquid.It is mainly characterized by, the spray beam assembly 7 that electroplate liquid 6 is arranged by side
Slit, enters into the side of coating bath electroplating region, ejects from the opposite side of electroplating region, and the cyclic system being back to outside coating bath by 8
In system.Owing to electroplate liquid is to be connected by pipeline from the two ends of spray beam assembly 7, and enter into electroplating region by slit, do not have
The design of cushion chamber, it is clear that due to the inhomogeneities of fluid motion, cause electroplate liquid skewness along direction, metal broadband,
Thus obtained coating is in the defect that transversely there is thickness distribution inequality of metal tape.
Prior art is also related to control the patent documentation of plating uniformity.China such as Publication No. CN101717979A
Patent of invention " control method of transverse uniformity of plating of strip steel of horizontal electroplating bath patent ", it is proposed that one is applicable to middle part input
Electroplate liquid and there is the control method of horizontal electroplating bath transverse regularity of static pressure clamping strip steel ability.It is characterized in that by just
The side-play amount making the baffle plate of the plating solution of strip steel center and inlet port after secondary installation or maintenance is that 0 this behave is to realize
The control method of transverse uniformity stated.This patent is primarily adapted for use in the horizontal coating bath of intermediate input plating solution, due to this type of coating bath
Overall span is longer, and strip steel is when through electroplating region, and the sag that gravity produces can not be ignored.Thus, and aforesaid fluid cushion formula water
Rising as high as the banks similar, described control method is primarily to prevent metal tape from causing " anode and cathode " short circuit due to deadweight,
Being laterally uniform as target with realize electroplate liquid, therefore, the coating obtained transversely remains thickness at metal tape
The defect of degree skewness.
Summary of the invention
Therefore, the technical problem to be solved in the present invention be to provide one be applicable to continuous metal strip flash plating produce, metal tape plate
Layer thickness profile uniform horizontal electroplating bath device, this device can be avoided in existing level coating bath, metal tape transversely due to
The skewness of fluid thus the thickness of coating cross direction profiles that causes uneven, thus the shortcoming producing mass defect.
The technical scheme is that one realizes metal tape thickness of coating equally distributed horizontal electroplating bath device, including groove
The positive plate arranged up and down in metal tape in body, cell body, the upper and lower surface of described metal tape and described plating bath arrangement is formed
Lower electroplating region, described upper and lower electroplating region is provided with the input duct for electroplate liquid inflow and outflow and flows out pipeline, in the inflow of electroplate liquid
It is provided with cushion chamber at Kou, described cushion chamber is provided with buffer damping plate, described buffer damping plate machined some differences straight
The through hole in footpath；Described electroplate liquid flows through cushion chamber extremely behind the region of metal tape, has respectively entered upper and lower electroplating region.
The horizontal electroplating bath device that metal tape thickness of coating according to the present invention is evenly distributed, wherein, described cushion chamber is for long
Cube structure, along electroplating region cross direction profiles.
Further, the side of described cushion chamber connects with described input duct, and the opposite side of described cushion chamber is by being in tilted layout
Narrow slit be connected with described electroplating region.The interface channel of cushion chamber Yu electroplating region is designed to narrow slit structure, the narrow slit narrow slit of inclination
Size select and the cross sectional area of plating solution adapts.Generally speed V that flow Q is plating solution in pipeline and flow area
The product of A.Flow is certain when, flow area (the most above-mentioned cross sectional area) is little, now could keep speed
A bigger value, i.e. bath flow rate is very fast.So design narrow slit size to be come according to flow Q and required speed V
Determine.Narrow slit is designed to skewed can make that fluid is more stable, fluid distrbution evenly.
Metal tape thickness of coating equally distributed horizontal electroplating bath device, wherein, described buffer damping is realized according to the present invention
Plate is one layer or more than one layer, and along short transverse, cushion chamber is divided into two or more district.
Wherein, described buffer damping plate concentrates on the aperture of through hole of the inlet band of position of electroplate liquid less than inlet periphery
The aperture of areas through holes.The i.e. through hole of buffer damping plate is divided into the through hole of the inlet band of position concentrating on electroplate liquid and is distributed in
The through hole of inlet neighboring area, the through-hole aperture of described inlet position is less than the through-hole aperture of inlet neighboring area.
Cushion chamber is a cuboid structure, within cushion chamber damping sheet is arranged on cushion chamber.Electroplate liquid by input duct (is
Two pipelines) it is input in cushion chamber, flow out cushion chamber from other side, cushion chamber damping sheet is crossed in centre.Therefore, in resistance
Facing the region of two input channels on Buddhist nun's plate, aperture is smaller, i.e. damping is a little big.At other positions of damping sheet then
Aperture is the biggest, and such purpose is electroplate liquid when passing damping sheet, and substep is more uniformly distributed, and prevents plating solution from concentrating, thus
Parameter even distribution on width in advance.
Further, the aperture of the through hole of the inlet band of position of described electroplate liquid is 8-12mm.The size in aperture depends on
The through-current capability of coating bath, is calculated by fluid mechanical emulation and combines actual tests and determine, this scope is a preferred implementation
In scope.
Further, the through-hole diameter of described inlet neighboring area is than the inlet band of position big 4-6mm of through-hole diameter.Then
Relative to upper one preferred embodiment, the aperture of described inlet neighboring area through hole is preferably 13-17mm.Inlet week
The through-hole diameter of edge regions, than the inlet band of position big about the 5mm of through-hole diameter, this is done to prevent plating solution substep collection
In.
The present invention compared with prior art provides the benefit that:
In prior art when the metal level that belt steel surface plating is very thin, it will usually the problem causing uneven thickness.The present invention passes through
Electroplate liquid porch arranges cushion chamber structure, arranges the buffer damping plate with some through holes, it is achieved coating is horizontal in cushion chamber
The control of thickness evenness, compared to existing level formula electroplating bath coating transverse gage distributed controll technology, has electroplating region fluid
Parameter being transversely evenly distributed at metal tape, thus the advantage of the quality of coating obtained.
The coating bath structure of the present invention highlights the design of cushion chamber, and electroplate liquid enters into cushion chamber through input duct, through one layer
If or dried layer has different pore size and the buffer damping of center, hole layout so that plating solution enters into another of buffer damping plate
Rear flank eliminates fluid in the horizontal and concentrates so that fluid parameter being transversely uniformly distributed at electroplating region.Fluid parameter, such as stream
Amount being transversely uniformly distributed in metal strip electroplating district, can realize thickness of coating being evenly distributed transversely.
Electroplate liquid enters into the opposite side of buffer damping plate from the side of buffer damping plate by whole through holes.By different pore size and
The distribution of center, hole, it is achieved cushion chamber in the space segment of metal tape, the transversely homogenization of fluid parameter.Laterally
The fluid of distribution uniformity enters into upper and lower electroplating region, thus the cross direction profiles of the coating obtained also is uniform.
Accompanying drawing explanation
Fig. 1 is fluid cushion horizontal electroplating bath schematic diagram in prior art.
Fig. 2 is injection horizontal electroplating bath schematic diagram in prior art.
Fig. 3 is the horizontal coating bath schematic diagram of the present invention.
Fig. 4 is the buffer damping plate schematic diagram of the present invention.
In figure, 1-metal tape, 2-conductive rollers, 3-backing roll, 4-positive plate assembly, 5-cell body, 6-electroplate liquid, 7-input duct,
8-drain pipe road, 9-buffer damping plate, the through hole of the 91-inlet band of position, the through hole of 92-inlet neighboring area.
Detailed description of the invention
The horizontal electroplating bath of the present invention is as shown in Figure 3.Metal tape 1 is respectively arranged with a pair roller before and after electroplating bath device, coating bath,
Upper roller is conductive rollers 2, and lower roll is backing roll 3.The upper and lower surface of metal tape respectively arranges positive plate assembly 4, outside electroplating region
Face is cell body 5, in order to collect the backflow of electroplate liquid.Electroplate liquid 6 has respectively entered from the middle input duct 7 of electroplating bath up and down
Electroplating region, and be back in the blood circulation outside coating bath by drain pipe road 8.The framework that in positive plate assembly 4, upper and lower anode is installed
It is designed as the structure with cushion chamber.Being provided with cushion chamber structure at the inflow entrance of electroplate liquid, electroplate liquid is electroplated up and down in entrance
Qu Qian, first passes around cushion chamber, is provided with buffer damping plate 9 in described cushion chamber, if machined on described buffer damping plate 9
The through hole of dry different-diameter；Described electroplate liquid 6 flows through cushion chamber extremely behind the region of metal tape 1, has respectively entered power-on and power-off
Plating district.Now, fluid parameter, such as flow etc., uniform along the cross direction profiles of metal tape, so that metal tape upper and lower surface
Coating electroplate liquid is evenly distributed.
Described cushion chamber is along the cross direction profiles of electroplating region, for rectangular structure.One side joint electroplate liquid input duct 7 of cushion chamber,
Opposite side connects electroplating region by the narrow slit being in tilted layout.Electroplate liquid 6 has respectively entered from 7 points of two-way of input duct and buffers up and down
Chamber, the middle part of cushion chamber arranges buffer damping plate 9.Described buffer damping plate 9 can arrange one layer or multilamellar, installs
Inside cushion chamber, cushion chamber is divided into two or multiple district along short transverse.Machined on buffer damping plate 9 some not
Through hole with diameter so that after electroplate liquid passes buffer damping plate, fluid parameter, such as flow etc., it is achieved cross direction profiles is uniform,
Thus the thickness realizing obtained coating is the most transversely evenly distributed.
The structure of buffer damping plate, is shown in Fig. 4, for single piece, on machined the through hole of the different size of inlet band of position
91, the through hole 92 of inlet neighboring area.Wherein the through hole 91 of the inlet band of position concentrates on the inlet lane place of plating solution
Territory, the through hole 92 of inlet neighboring area concentrates on inlet neighboring area, and the aperture of the through hole 91 of the inlet band of position is little
Aperture in the through hole 92 of inlet neighboring area.Electroplate liquid enters into buffering from the side of buffer damping plate by whole through holes
The opposite side of damping sheet.By different pore size and the distribution of center, hole, it is achieved cushion chamber in the space segment of metal tape,
The transversely homogenization of fluid parameter.The fluid of cross direction profiles homogenization enters into upper and lower electroplating region, thus the coating obtained
Cross direction profiles is also uniform.
In the electroplating region porch of a strip steel continuous electroplating zinc production line, arrange the electroplating bath device of horizontal electronickelling, it is achieved band
The electronickelling of steel matrix, major parameter is as follows: the parameter of the supply pump of electroplate liquid is flow Q=400M3/H and lift 22m,
Nickel plating layer thick requires as 100mg/m2, the cross direction profiles required precision of thickness of coating is≤10%, and i.e. strip steel is transversely,
Measure several point one-tenth-value thickness 1/10, one-tenth-value thickness 1/10 be distributed in the 110% of its average and the horizontal line of 90% within.
Accurately controlling of thickness of coating is by accurately controlling what electroplate liquid was carried out in the cross direction profiles within electroplating region.I.e. electroplate
Liquid, under the effect of rear pump, enters into electroplating region, it is desirable to unit width flow distribution precision is≤10%, i.e. unit width stream
On amount scattergram, flow value controls within the 110% of average and the horizontal line of 90%, thus obtains the transverse gage of nickel coating
It is uniformly distributed.
See Fig. 4, in one preferred embodiment, its diameter of through hole 91 of the inlet band of position on buffer damping plate
For 10mm, totally 10,5 one group, totally two groups, two groups are arranged symmetrically.The through hole 92 of inlet neighboring area straight
Footpath is 15mm.
Electroplate liquid 6 enters into the cushion chamber space segment near strip steel from the side of buffer damping plate 9 by whole through holes, passes through
Different pore size and the distribution of center, hole, by the distribution of one or more layers buffer damping plate convection cell, it is achieved cushion chamber is near band
In the area of space of steel, the transversely homogenization of fluid parameter.After the fluid of cross direction profiles homogenization enters into upper and lower electroplating region,
Thus the cross direction profiles of the coating obtained also is uniform.
Claims (6)
1. realize a metal tape thickness of coating equally distributed horizontal electroplating bath device, including cell body (5), cell body (5)
The positive plate (4) arranged up and down in interior metal tape (1), the upper and lower surface of described metal tape (1) and described plating bath arrangement
Forming upper and lower electroplating region, described upper and lower electroplating region is provided with the input duct (7) for electroplate liquid (6) inflow and outflow and drain pipe road
(8), it is characterised in that: at the inflow entrance of electroplate liquid, it is provided with cushion chamber, described cushion chamber is provided with buffer damping plate (9),
The through hole of some different-diameters is machined on described buffer damping plate (9)；Described electroplate liquid (6) flows through cushion chamber near gold
After belonging to the region of band (1), have respectively entered upper and lower electroplating region；
Described buffer damping plate (9) is more than one layer, and along short transverse, cushion chamber is divided into more than two districts.
One the most according to claim 1 realizes metal tape thickness of coating equally distributed horizontal electroplating bath device, its
It is characterised by: described cushion chamber is rectangular structure, along electroplating region cross direction profiles.
One the most according to claim 1 and 2 realizes metal tape thickness of coating equally distributed horizontal electroplating bath device,
It is characterized in that: the side of described cushion chamber connects with described input duct (7), the opposite side of described cushion chamber is by tilting
The narrow slit arranged is connected with described electroplating region.
One the most according to claim 1 realizes metal tape thickness of coating equally distributed horizontal electroplating bath device, its
It is characterised by: concentrate on the aperture of through hole of the inlet band of position of electroplate liquid on described buffer damping plate (9) less than feed liquor
The aperture of mouth neighboring area through hole.
One the most according to claim 4 realizes metal tape thickness of coating equally distributed horizontal electroplating bath device, its
It is characterised by: the aperture of the through hole of the inlet band of position of described electroplate liquid is 8-12mm.
One the most according to claim 4 realizes metal tape thickness of coating equally distributed horizontal electroplating bath device, its
It is characterised by: the through-hole diameter of described inlet neighboring area is than the inlet band of position big 4-6mm of through-hole diameter.
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| CN201210473681.4A CN103834974B (en) | 2012-11-20 | 2012-11-20 | One realizes metal tape thickness of coating equally distributed horizontal electroplating bath device |
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| CN201210473681.4A CN103834974B (en) | 2012-11-20 | 2012-11-20 | One realizes metal tape thickness of coating equally distributed horizontal electroplating bath device |
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| CN103834974B true CN103834974B (en) | 2016-10-05 |
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| CN113957388B (en) * | 2020-07-21 | 2022-08-16 | 宝山钢铁股份有限公司 | Vacuum coating device adopting guide plate type structure to uniformly distribute metal steam |
| CN112725872B (en) * | 2020-12-22 | 2023-11-24 | 华东交通大学 | Device and method for high-speed electrodeposition of metal on surface of continuous carbon fiber |
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