CN103834974A - Horizontal-type electroplating tank device for realization of homogeneous thickness distribution of coating of metal band - Google Patents
Horizontal-type electroplating tank device for realization of homogeneous thickness distribution of coating of metal band Download PDFInfo
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- CN103834974A CN103834974A CN201210473681.4A CN201210473681A CN103834974A CN 103834974 A CN103834974 A CN 103834974A CN 201210473681 A CN201210473681 A CN 201210473681A CN 103834974 A CN103834974 A CN 103834974A
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Abstract
The invention discloses a horizontal-type electroplating tank device for realization of homogeneous thickness distribution of a coating of a metal band, the horizontal-type electroplating tank device comprises a tank body and a metal band therein, an upper and a lower electroplating zone are formed by the upper and the lower surface of the metal band and a positive pole vertically arranged in the horizontal-type electroplating tank device, the upper and the lower electroplating zone are provided with a liquid inlet pipe and a liquid outlet pipe for inflow and outflow of an electroplating liquid, a buffer cavity is arranged at an inflow port of the electroplating liquid, a buffer damping plate is arranged in the buffer cavity, a plurality of through holes of different diameters are processed on the buffer damping plate, the electroplating liquid flows through the buffer cavity to a zone close to the metal band, and then enters respectively into the upper and lower electroplating zone. By designing of the buffer cavity and the buffer damping plate, homogenization treatment of transverse distribution of a fluid in a space segment of the buffer cavity can be realized, wherein the space segment is close to the metal band, the treated fluid enters into the upper and lower electroplating zone so as to achieve transverse homogeneous distribution of the obtained coating.
Description
Technical field
The present invention relates to metal strip electroplating processing unit field, be specifically related to a kind of at continous metal strip process for producing line, the uniform control method of thickness of coating lateral distribution while realizing metal strip both sides continuous electroplating metal.
Background technology
In order to promote the surface property of metal strip, industrial user need to plate layer of metal by the mode of electroplating on the surface of metal strip sometimes, for example, the nickel plating technology of surface of steel plate, the thickness of its nickel layer is only 100mg/m conventionally
2.The object of nickel plating or for the surface corrosion-resistant erosion performance boost of metal strip, or as a kind of preprocessing means, eliminate the defect that metallic strip surface exists, electroplate other metal for next step and prepare.Aforesaid thickness of coating is commonly referred to as average, and in reality, and often coating is in the lateral distribution of metal strip inhomogeneous, and showing as thickness differs, thereby produces quality problems, as aberration etc.The major cause that causes thickness thickness to differ is that the electroplating region fluid parameter of metal strip both sides is inhomogeneous in the lateral distribution of metal strip, thereby the thickness of the coating obtaining is also inhomogeneous along lateral distribution.
Plating to metallic surface on continous metal strip production line completes conventionally in electroplating bath device.Especially, according to the difference in the orientation in metal strip electroplating district, coating bath is divided into two classes, i.e. rectilinear coating bath technology and horizontal coating bath technology.Wherein, horizontal coating bath mainly contains two kinds in the concrete application of industry member, and fluid cushion formula level trough and jet-type level trough, be shown in respectively Fig. 1 and Fig. 2.When the horizontal coating bath of above-mentioned two class is produced for flash plating, all exist deficiency.Be described as follows: the horizontal coating bath structure of fluid cushion formula is as Fig. 1, and metal strip 1 is through electroplating bath device, and respectively there is a pair of roller the front and back of coating bath, and top roll 2 is conductive rollers, and lower roll is support roll 3.The upper and lower surface of metal strip has respectively been arranged positive plate assembly 4, and the outside of electroplating region is cell body 5, in order to collect the backflow of electroplate liquid.The principal feature of this coating bath is that electroplate liquid 6 enters into respectively upper and lower electroplating region from the middle input duct 7 of plating tank, and by 8 recycle systems that are back to outside coating bath.Although fluid cushion formula level trough also has the cushion chamber design of plating solution, but the object of Cushioning Design is to set up the stressed equilibrium relationship of metal strip in order to realize between upper and lower electroplating region herein, this is because the span of fluid cushion formula level trough is large, " sagging " that now produce because of deadweight with steel can not be ignored, need to take technical measures to avoid, cause " anode and cathode " short circuit because of deadweight to prevent being with steel.Therefore, the design of fluid cushion formula level trough cushion chamber is mainly in order to be with steel " picking-up ", and to prevent short circuit.This is at the fluid parameter of electroplating region, processes above as the horizontal homogenizing of flow etc., and means do not realize, and the coating obtaining is thus in the defect that transversely exists thickness distribution inequality of metal strip.
For jet-type level trough, see Fig. 2.Metal strip 1 is through electroplating bath device, and respectively there is a pair of roller the front and back of coating bath, and top roll 2 is conductive rollers, and lower roll is support roll 3.The upper and lower surface of metal strip has respectively been arranged positive plate assembly 4, and the outside of electroplating region is cell body 5, in order to collect the backflow of electroplate liquid.Its principal feature is, the slit of the spray beam assembly 7 that electroplate liquid 6 is arranged by a side enters into a side of coating bath electroplating region, eject from the opposite side of electroplating region, and by 8 recycle systems that are back to outside coating bath.Because electroplate liquid is to connect by pipeline from the two ends of spray beam assembly 7, and enter into electroplating region by slit, there is no the design of cushion chamber, obviously, due to the ununiformity of liquid motion, cause electroplate liquid along skewness in the direction of metal broadband, the coating obtaining is thus in the defect that transversely exists thickness distribution inequality of metal strip.
In prior art, also have about the patent documentation of controlling coating uniformity coefficient.As the Chinese invention patent " control method of transverse uniformity of plating of strip steel of horizontal electroplating bath patent " that publication number is CN101717979A, a kind of control method that is applicable to middle part input electroplate liquid and has the horizontal electroplating bath transverse regularity of static pressure clamping band steel ability is proposed.The side-play amount that it is characterized in that the baffle plate of the plating solution by make Dai Gang center and entrance outlet after first installation or maintenance is that 0 this behave realizes described control method of transverse uniformity.This patent is mainly applicable to the horizontal coating bath of intermediate input plating solution, and because the overall span of this type of coating bath is longer, band steel is when through electroplating region, and the sag that gravity produces can not be ignored.Thereby, similar with aforesaid fluid cushion formula level trough, described control method is mainly in order to prevent that metal strip is because deadweight causes " anode and cathode " short circuit, next is only to realize being laterally uniformly distributed of electroplate liquid is target, therefore the coating, obtaining is in the defect that transversely still exists thickness distribution inequality of metal strip.
Summary of the invention
Therefore, the technical problem to be solved in the present invention is to provide one and is applicable in the production of continous metal strip flash plating, the horizontal electroplating bath device that metal strip thickness of coating is evenly distributed, this device can be avoided in existing level coating bath, thereby the thickness of coating lateral distribution that metal strip transversely causes due to the skewness of fluid is inhomogeneous, thereby produce the shortcoming of mass defect.
Technical scheme of the present invention is: one realizes the equally distributed horizontal electroplating bath device of metal strip thickness of coating, comprise the metal strip in cell body, cell body, the positive plate of arranging up and down in the upper and lower surface of described metal strip and described plating tank device forms upper and lower electroplating region, described upper and lower electroplating region is provided with for the input duct of electroplate liquid inflow and outflow and flows out pipeline, influx place at electroplate liquid is provided with cushion chamber, buffer damping plate is installed in described cushion chamber, on described buffer damping plate, has processed the through hole of some different diameters; Described electroplate liquid flows through cushion chamber near behind the region of metal strip, enters into respectively upper and lower electroplating region.
The horizontal electroplating bath device that metal strip thickness of coating according to the present invention is evenly distributed, wherein, described cushion chamber is rectangular structure, along electroplating region lateral distribution.
Further, a side of described cushion chamber is communicated with described input duct, and the opposite side of described cushion chamber is connected with described electroplating region by the narrow slit being in tilted layout.The connecting passage of cushion chamber and electroplating region is designed to narrow slit structure, and the size of the narrow slit narrow slit of inclination is selected and the cross sectional area of plating solution adapts.The speed V that common ducted flow Q is plating solution and the product of flow area A.When flow is certain, flow area (being above-mentioned cross sectional area) is little, now could keep speed a larger value, and bath flow rate is very fast.So design narrow slit size will be determined according to flow Q and desired speed V.Narrow slit is designed to skewedly can make that fluid is more stable, fluid distribution is more even.
According to the equally distributed horizontal electroplating bath device of metal strip thickness of coating of realizing of the present invention, wherein, described buffer damping plate is one deck or more than one deck, and cushion chamber is divided into two or more district along short transverse.
Wherein, the aperture that concentrates on the through hole of the fluid inlet band of position of electroplate liquid on described buffer damping plate is less than the aperture of fluid inlet neighboring area through hole.Be that the through hole of buffer damping plate is divided into the through hole of the fluid inlet band of position that concentrates on electroplate liquid and is distributed in the through hole of fluid inlet neighboring area, the through-hole aperture of described fluid inlet position is less than the through-hole aperture of fluid inlet neighboring area.
Cushion chamber is a cuboid structure, within cushion chamber damping sheet is arranged on cushion chamber.Electroplate liquid is input in cushion chamber by input duct (being two pipelines), goes out cushion chamber from an other effluent, and cushion chamber damping sheet is crossed in centre.Therefore, face the region of two input channels on damping sheet, aperture is smaller, i.e. damping more greatly.At other positions of damping sheet, more greatly, such object is electroplate liquid while passing damping sheet in aperture, and substep is more more even, prevents that plating solution from concentrating, thus the even substep of parameter on prior width.
Further, the aperture of the through hole of the fluid inlet band of position of described electroplate liquid is 8-12mm.The size in aperture depends on the through-current capability of coating bath, is calculated and is determined in conjunction with actual tests by fluid mechanical emulation, and this scope is a scope in preferred implementation.
Further, the through-hole diameter of described fluid inlet neighboring area is than the large 4-6mm of fluid inlet band of position through-hole diameter., with respect to upper one preferred embodiment, the aperture of described fluid inlet neighboring area through hole is preferably 13-17mm.The through-hole diameter of fluid inlet neighboring area is than the large 5mm of fluid inlet band of position through-hole diameter left and right, and it is concentrated in order to prevent plating solution substep doing like this.
The present invention's beneficial effect is compared with prior art:
In prior art, in the time that belt steel surface plates very thin metal level, conventionally can cause the problem of uneven thickness.The present invention is by arranging cushion chamber structure in electroplate liquid ingress, the buffer damping plate with some through holes is set in cushion chamber, realize the inhomogeneity control of coating transverse gage, than existing level formula plating tank coating transverse gage distribution control techniques, there is electroplating region fluid parameter being transversely evenly distributed of metal strip, thus the advantage of the quality of coating having obtained.
Coating bath structure of the present invention has been emphasized the design of cushion chamber, electroplate liquid enters into cushion chamber through input duct, process one deck or some layers have the buffer damping of different pore size and central position, hole layout, plating solution is entered into eliminated in the horizontal fluid after the opposite side of buffer damping plate to concentrate, make fluid parameter being transversely uniformly distributed at electroplating region.Fluid parameter, if flow is being transversely uniformly distributed of metal strip electroplating district, can realize thickness of coating being evenly distributed transversely.
Electroplate liquid enters into the opposite side of buffer damping plate by whole through holes from a side of buffer damping plate.By the distribution of different pore size and central position, hole, realize in the space segment of cushion chamber near metal strip the transversely homogenizing of fluid parameter.The fluid of lateral distribution homogenizing enters into upper and lower electroplating region, thereby the lateral distribution of the coating obtaining is also uniform.
Brief description of the drawings
Fig. 1 is fluid cushion horizontal electroplating bath schematic diagram in prior art.
Fig. 2 sprays horizontal electroplating bath schematic diagram in prior art.
Fig. 3 is horizontal coating bath schematic diagram of the present invention.
Fig. 4 is buffer damping plate schematic diagram of the present invention.
In figure, 1-metal strip, 2-conductive rollers, 3-support roll, 4-positive plate assembly, 5-cell body, 6-electroplate liquid, 7-input duct, 8-fluid pipeline, 9-buffer damping plate, the through hole of the 91-fluid inlet band of position, the through hole of 92-fluid inlet neighboring area.
Embodiment
Horizontal electroplating bath of the present invention as shown in Figure 3.Metal strip 1 is through electroplating bath device, and respectively there is a pair of roller the front and back of coating bath, and top roll 2 is conductive rollers, and lower roll is support roll 3.The upper and lower surface of metal strip has respectively been arranged positive plate assembly 4, and the outside of electroplating region is cell body 5, in order to collect the backflow of electroplate liquid.Electroplate liquid 6 enters into respectively upper and lower electroplating region from the middle input duct 7 of plating tank, and is back in the recycle system outside coating bath by fluid pipeline 8.The Frame Design that in positive plate assembly 4, upper and lower anode is installed is the structure with cushion chamber.Influx place at electroplate liquid is provided with cushion chamber structure, and electroplate liquid, entering before upper and lower electroplating region, first passes through cushion chamber, and buffer damping plate 9 is installed in described cushion chamber, has processed the through hole of some different diameters on described buffer damping plate 9; Described electroplate liquid 6 flows through cushion chamber near behind the region of metal strip 1, enters into respectively upper and lower electroplating region.Now, fluid parameter, as flow etc., even along the lateral distribution of metal strip, thus the coating electroplate liquid of metal strip upper and lower surface is evenly distributed.
Described cushion chamber, along the lateral distribution of electroplating region, is rectangular structure.One side joint electroplate liquid input duct 7 of cushion chamber, opposite side connects electroplating region by the narrow slit being in tilted layout.Electroplate liquid 6 enters into respectively upper and lower cushion chamber from 7 points of two-way of input duct, and buffer damping plate 9 has been arranged at the middle part of cushion chamber.Described buffer damping plate 9 can be arranged one deck or multilayer, is arranged on cushion chamber inside, and cushion chamber is divided into two or multiple district along short transverse.On buffer damping plate 9, processed the through hole of some different diameters, electroplate liquid is passed after buffer damping plate, fluid parameter, as flow etc., realizes lateral distribution even, thereby it is also even along lateral distribution to realize the thickness of the coating obtaining.
The structure of buffer damping plate, is shown in Fig. 4, is single piece, on processed the through hole 91 of different sizes, through hole 92.Wherein through hole 91 concentrates on the fluid inlet band of position of plating solution, and through hole 92 concentrates on fluid inlet neighboring area, and the aperture of through hole 91 is less than the aperture of through hole 92.Electroplate liquid enters into the opposite side of buffer damping plate by whole through holes from a side of buffer damping plate.By the distribution of different pore size and central position, hole, realize in the space segment of cushion chamber near metal strip the transversely homogenizing of fluid parameter.The fluid of lateral distribution homogenizing enters into upper and lower electroplating region, thereby the lateral distribution of the coating obtaining is also uniform.
In the electroplating region ingress of a band steel continuous electroplating zinc production line, arrange the electroplating bath device of horizontal electronickelling, the electronickelling of realization with steel matrix, significant parameter is as follows: the parameter of the supply pump of electroplate liquid is flow Q=400M3/H and lift 22m, and nickel layer thickness requirement is 100mg/m
2, the lateral distribution accuracy requirement of thickness of coating is≤10%, with steel transversely, measures the one-tenth-value thickness 1/10 of several points, within 110% and 90% the sea line that is distributed in its average of one-tenth-value thickness 1/10.
The accurate control of thickness of coating is to carry out in the lateral distribution of electroplating region inside by accurate control electroplate liquid.Be that electroplate liquid is under the effect of Send out pump, enter into electroplating region, requiring unit width flow distribution precision is≤10%, on unit width profile of flowrate, within flux values is controlled at 110% and 90% sea line of average, thereby the transverse gage of acquisition nickel layer is uniformly distributed.
See Fig. 4, one preferred embodiment in, through hole 91 its diameters of the fluid inlet band of position on buffer damping plate are 10mm, totally 10,5 one group, totally two groups, two groups are arranged symmetrically.The diameter of the through hole 92 of fluid inlet neighboring area is 15mm.
Claims (7)
1. realize the equally distributed horizontal electroplating bath device of metal strip thickness of coating for one kind, comprise cell body (5), metal strip (1) in cell body (5), the positive plate (4) of arranging up and down in the upper and lower surface of described metal strip (1) and described plating tank device forms upper and lower electroplating region, described upper and lower electroplating region is provided with input duct (7) and the fluid pipeline (8) for electroplate liquid (6) inflow and outflow, it is characterized in that: the influx place at electroplate liquid is provided with cushion chamber, buffer damping plate (9) is installed in described cushion chamber, on described buffer damping plate (9), process the through hole of some different diameters, described electroplate liquid (6) flows through cushion chamber near behind the region of metal strip (1), enters into respectively upper and lower electroplating region.
2. one according to claim 1 realizes the equally distributed horizontal electroplating bath device of metal strip thickness of coating, it is characterized in that: described cushion chamber is rectangular structure, along electroplating region lateral distribution.
3. one according to claim 1 and 2 realizes the equally distributed horizontal electroplating bath device of metal strip thickness of coating, it is characterized in that: a side of described cushion chamber is communicated with described input duct (7), the opposite side of described cushion chamber is connected with described electroplating region by the narrow slit being in tilted layout.
4. one according to claim 1 realizes the equally distributed horizontal electroplating bath device of metal strip thickness of coating, it is characterized in that: described buffer damping plate (9), for one deck or more than one deck, is divided into two or more district by cushion chamber along short transverse.
5. realize the equally distributed horizontal electroplating bath device of metal strip thickness of coating according to the one described in claim 1 or 4, it is characterized in that: the aperture that concentrates on the through hole of the fluid inlet band of position of electroplate liquid on described buffer damping plate (9) is less than the aperture of fluid inlet neighboring area through hole.
6. one according to claim 5 realizes the equally distributed horizontal electroplating bath device of metal strip thickness of coating, it is characterized in that: the aperture of the through hole of the fluid inlet band of position of described electroplate liquid is 8-12mm.
7. one according to claim 5 realizes the equally distributed horizontal electroplating bath device of metal strip thickness of coating, it is characterized in that: the through-hole diameter of described fluid inlet neighboring area is than the large 4-6mm of fluid inlet band of position through-hole diameter.
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| CN201210473681.4A CN103834974B (en) | 2012-11-20 | 2012-11-20 | One realizes metal tape thickness of coating equally distributed horizontal electroplating bath device |
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| CN201210473681.4A CN103834974B (en) | 2012-11-20 | 2012-11-20 | One realizes metal tape thickness of coating equally distributed horizontal electroplating bath device |
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| CN103834974B CN103834974B (en) | 2016-10-05 |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104313668A (en) * | 2014-09-30 | 2015-01-28 | 苏州芯航元电子科技有限公司 | Electrochemical treatment trough for electron production wire |
| CN108914178A (en) * | 2018-09-19 | 2018-11-30 | 江西华度电子新材料有限公司 | A method of it is uneven to solve galvanoplastic preparation wick thickness |
| CN112725872A (en) * | 2020-12-22 | 2021-04-30 | 华东交通大学 | Device and method for high-speed electrodeposition of metal on surface of continuous carbon fiber |
| CN113957388A (en) * | 2020-07-21 | 2022-01-21 | 宝山钢铁股份有限公司 | Vacuum coating device adopting guide plate type structure to uniformly distribute metal steam |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108914178A (en) * | 2018-09-19 | 2018-11-30 | 江西华度电子新材料有限公司 | A method of it is uneven to solve galvanoplastic preparation wick thickness |
| CN113957388A (en) * | 2020-07-21 | 2022-01-21 | 宝山钢铁股份有限公司 | Vacuum coating device adopting guide plate type structure to uniformly distribute metal steam |
| CN112725872A (en) * | 2020-12-22 | 2021-04-30 | 华东交通大学 | Device and method for high-speed electrodeposition of metal on surface of continuous carbon fiber |
| CN112725872B (en) * | 2020-12-22 | 2023-11-24 | 华东交通大学 | Device and method for high-speed electrodeposition of metal on surface of continuous carbon fiber |
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