KR20180068684A - APPARATUS AND METHOD FOR CONTROL IN horizontal electroplating EQUIPMENT - Google Patents

Abstract

According to an embodiment of the present invention, an apparatus for controlling a plating amount in a width direction of horizontal electroplating equipment is applied to horizontal electroplating equipment including a plurality of plating cells and a plurality of entry, center, and exit nozzles included in the plurality of plating cells to supply a plating solution to control a plating amount in a width direction of a strip, and comprises: a pattern selection unit to use a width and width direction plating amount deviation information of the strip to select one plating pattern among a plurality of plating patterns; a nozzle control value calculation unit to calculate nozzle control values for the entry, center, and exit nozzles for the plating cells in accordance with the plating pattern selected by the pattern selection unit; a plating cell selection unit to select a corresponding plating cell to which a nozzle control value by the nozzle control value calculation unit is to be applied; and a nozzle control unit to use the nozzle control value for the plating cell selected by the plating cell selection unit to control a horizontal electroplating equipment driving unit.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a horizontal electroplating apparatus,

The present invention relates to an apparatus and method for controlling lateral plating amount of a horizontal electroplating facility.

Generally, in order to perform electroplating on a strip, a strip is advanced through an energizing roll for providing a negative electrode and a backup roll for supporting the strip from underneath, and at the same time a negative electrode is attached to the strip. - The anode that hangs the anode through the bus-bar is positioned above and below the strip. The plating solution is filled between the anode and the plating solution. The plating solution flowing into the receiving tank is placed in the lower part. It is the structure that becomes.

However, when a strip having a negative electrode passes between the anodes of the positive electrode filled with the plating solution, a plating deviation in the width direction of the strip occurs. The cause of the plating variation is as follows. First, the strip is plated at a position close to the anode between the upper and lower anodes due to sagging of the strip in the width direction, and the plating on the opposite side is relatively less. Second, This is because when a gas forming a void forms a void in the solution, electricity does not pass between the anode and the strip, and the plating is not uniformly performed.

For example, as the strip progresses, a flow is formed by the advancing direction of the strip and the direction of the plating solution coming out from the solution supply nozzle, and the gases generated thereby are bundled together to form voids And a thickness of the plating amount is small when the cavity is formed in a large size as viewed in the plate width direction.

When a plurality of unit plating shells of the same structure having such fixed solution supply nozzle angles, intervals, and flow rates are repeatedly connected to each other, when voids are formed at the same positions in each unit plating shell, There is a problem that the variation in the widthwise direction of the coated amount gradually increases.

Korean Patent Publication No. 2003-0006208

An embodiment of the present invention can independently disperse formation positions of voids in a plating solution by plating shells by independently controlling flow directions of plating solutions and plating solution flow rates for individual plating cells of a plurality of plating cells, And an apparatus and method for controlling lateral plating amount of a horizontal electroplating apparatus capable of reducing a lateral plating deviation.

According to an embodiment of the present invention, there is provided a plating apparatus comprising: a plurality of plating shells; and a plurality of plating chambers, each of which is provided in each of the plurality of plating cells, A pattern selecting unit that selects one of the plurality of plating patterns by using the plate width and width direction plating amount deviation information of the strip; A nozzle control value calculator for calculating a nozzle control value for each of the inlet, the center and the outlet nozzles for each plating cell according to the plating pattern selected by the pattern selecting unit; A plating shell selecting unit for selecting a corresponding plating shell to which a nozzle control value by the nozzle control value computing unit is applied; And a nozzle control unit for controlling the horizontal plating facility driving unit using the nozzle control value for the plating shell selected by the plating shell selection unit. A lateral plating amount control device for horizontal plating is proposed.

In the solution of this task, one of several concepts described in the following detailed description is provided. The subject matter of the present invention is not intended to identify the core or essential technology of the claimed subject matter, but merely one of the claimed subject matter is described, each of which is specifically set forth in the following detailed description.

According to the embodiment of the present invention, by separately controlling the flow direction of the plating solution and the plating solution flow rate for each individual plating cell of the plurality of plating cells, the formation position of the void in the plating solution can be dispersed for each plating shell , Thereby reducing the plating variation in the width direction.

In addition, the width direction plating amount deviation can be controlled online during operation, and the width direction plating deviation due to other factors (e.g., strip bending, current unevenness, etc.) can be improved.

FIG. 1 is a view illustrating an apparatus for controlling a lateral plating amount of a horizontal electroplating apparatus according to an embodiment of the present invention. Referring to FIG.
2 is a diagram illustrating an example of a nozzle control value calculation unit according to an embodiment of the present invention.
3 is an exemplary view of a unit plating cell to which an embodiment of the present invention is applied.
4 (a) and 4 (b) are explanatory views for explaining the cause of the thickness variation in thickness in the width direction.
5 is an illustration of a computer analysis result of the plating solution flow and void generation position in the unit plated shell.
6 (a) and 6 (b) are a plan view and a side view showing an example of arrangement of nozzles of a unit plating shell according to an embodiment of the present invention.
7 (a) and 7 (b) are illustrations showing variations in the thickness of the plating amount in the width direction before and after the application of the embodiment of the present invention.
8 is a view illustrating an example of a method of controlling a widthwise plating amount of a horizontal electroplating apparatus according to an embodiment of the present invention.

It should be understood that the present invention is not limited to the embodiments described and that various changes may be made without departing from the spirit and scope of the present invention.

In addition, in each embodiment of the present invention, the structure, shape, and numerical values described as an example are merely examples for helping understanding of the technical matters of the present invention, so that the spirit and scope of the present invention are not limited thereto. It should be understood that various changes may be made without departing from the spirit of the invention. The embodiments of the present invention may be combined with one another to form various new embodiments.

In the drawings referred to in the present invention, components having substantially the same configuration and function as those of the present invention will be denoted by the same reference numerals.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art can easily carry out the present invention.

FIG. 1 is a view illustrating an apparatus for controlling a lateral plating amount of a horizontal electroplating apparatus according to an embodiment of the present invention. Referring to FIG.

1, a lateral plating amount control apparatus for a horizontal electroplating apparatus according to an embodiment of the present invention includes a plurality of plating shells # 1 to # 12 and a plurality of plating cells # 1 to # 12 ) To be applied to a horizontal electroplating apparatus including a plurality of inlet, middle and outlet nozzles (12, 14, 13) for supplying a plating solution, so that the widthwise plating amount of the strip 1 can be controlled .

The lateral plating amount control apparatus of the horizontal electroplating apparatus includes a pattern selection unit 100, a nozzle control value calculation unit 200, a plating shell selection unit 300, a nozzle control unit 400, and a horizontal plating facility driving unit 500 .

The lateral plating amount control apparatus of the horizontal electroplating apparatus may further include a plating thickness measuring apparatus 600, a plating amount deviation calculating unit 700, and a pattern correcting unit 800.

The pattern selection unit 100 can select one of the plurality of plating patterns (patterns # 1 to # 4) prepared in advance using the plate width and the plating amount variation information in the width direction of the strip 1 .

Here, the plurality of plating patterns (pattern # 1 to pattern # 4) may be prepared in advance so as to be distinguished from each other according to the plate width and the plating amount deviation information of the strip 1.

The nozzle control value calculator 200 calculates a nozzle control value for each of the inlet side, center and outlet nozzles 12, 14, and 13 for each plating cell according to the plating pattern selected by the pattern selection unit 100 .

For example, the nozzle control value of the nozzle control value calculator 200 may be determined by the angles (15, 17, 16), the inlet, the center and the outlet nozzles 12 , 14, and 13) of the plating solution, and the interval 18 between the central nozzles.

The plating shell selection unit 300 can select a corresponding plating shell to which the nozzle control value by the nozzle control value operation unit 200 is applied.

For example, a plating pattern selected from among the plurality of plating patterns (pattern # 1 to pattern # 4) may be applied to at least one plating cell in the plurality of plating cells # 1 to # 12 for actual driving.

In this way, for actual driving, the plate widths of the strips 1 in the plurality of plating patterns (pattern # 1 to pattern # 4) and the width direction of the strips 1 A plating pattern selected so that voids are uniformly dispersed in the plurality of plating cells # 1 to # 12 according to the plating amount deviation information can be applied.

The nozzle control unit 400 may control the horizontal plating facility driving unit 500 using the nozzle control value for the plating shell selected by the plating shell selection unit 300. [

For example, the nozzle control unit 400 may control each of the plurality of plating shells # 1 to # 12 such that the cavities of the plurality of plating shells # 1 to # 12 are uniformly spaced from each other So that the widthwise plating deviation can be controlled so as not to be large.

The plating thickness gauge 600 may be disposed on the exit side of the horizontal electroplating facility to measure the widthwise plating thickness of the strip during the plating operation of the strip and the measured widthwise plating thickness information may be used to calculate the plating variation deviation (700).

The plating amount deviation calculation unit 700 compares the thickness measured by the plating thickness gauge 600 with the reference thickness to calculate a widthwise plating amount deviation of the strip 1 and provides the plating amount deviation to the pattern correcting unit 800 .

The pattern correcting unit 800 may calculate a pattern correction value for plating pattern correction based on the plating amount deviation from the plating amount deviation calculating unit 700 and provide the pattern correcting value to the pattern selecting unit 100.

Accordingly, the pattern selecting unit 100 can correct the selected plating pattern based on the pattern correction value from the pattern correcting unit 800. [

For example, the pattern selection unit 100 may change the arrangement of the plating patterns selected in each of the plurality of plating cells # 1 to # 12 according to the pattern correction value. For example, the plating patterns may be pattern # 1, pattern # 2, pattern # 3, pattern # 4, pattern # 1, pattern # 2, pattern # 3, The pattern # 2, the pattern # 3, the pattern # 4, the pattern # 4, the pattern # 4, The pattern can be arranged in the pattern # 1, pattern # 1, pattern # 1, pattern # 2, pattern # 3 and pattern # 4.

In the drawings of the present invention, unnecessary redundant explanations may be omitted for the same reference numerals and components having the same function.

2 is a diagram illustrating an example of a nozzle control value calculation unit according to an embodiment of the present invention.

2, the nozzle control value calculator 200 may include a nozzle flow rate calculator 210, a center nozzle interval calculator 220, and a nozzle angle calculator 230 for each of the plating patterns.

The nozzle flow rate calculation unit 210 calculates the flow rate of the plating solution discharged from each of the inlet side, the center side and the outlet side nozzles (12, 14, 13 in FIG. 6) according to the applied plating pattern determined by the pattern selection unit 100 19, 21, 20 in Fig. 6).

6) of the center nozzle (12, 14, 13 in FIG. 6) according to the applied plating pattern determined by the pattern selection unit 100 .

The nozzle angle calculation unit 230 calculates the angle of each of the entrance side, center and exit side nozzles (12, 14, and 13 in Fig. 6) according to the applied plating pattern determined by the pattern selection unit 100 17, and 16 of the first embodiment).

3 is an exemplary view of a unit plating cell to which an embodiment of the present invention is applied.

A unit plating cell (part A in Fig. 1) to which an embodiment of the present invention is applied will be described with reference to Fig.

3, in the unit plating cell, the strip 1 proceeds through the energizing roll 2 for applying the negative (-) and backup roll 3 for supporting the strip 1 from the bottom, A negative electrode is applied to the strip 1 and an anode 4 to which a positive electrode is applied through a bus-bar 6 disposed between two energizing rollers on the input / And the plating solution flowing out while the plating solution 7 is filled between the bus-bars 6 is placed in a receiving tank 8 disposed at the lower part. .

In this structure, the plating solution supply is supplied to the solution supply line 5 disposed at the central position of the anode 4 through the pump, and then supplied through the nozzle 9 to the upper and lower sides of the strip 1, Is supplied to the strip (1). With the supply of the plating solution, the strip 1 is completely immersed, and the plating solution 7 is filled up to a part of the energizing roll 2.

A plurality of unit plated shells are continuously connected to form a horizontal electroplating facility.

As described above, a width direction plating thickness meter 600 (FIG. 1) capable of measuring the thickness of the plating amount in the width direction is disposed on the exit side of the horizontal electroplating apparatus as described above, Can be measured.

On the other hand, with reference to Figs. 4 and 5, the cause of the thickness variation in the thickness direction in the width direction will be described.

4 (a) and 4 (b) are explanatory views for explaining the cause of the thickness variation in thickness in the width direction.

Fig. 4 (a) is a view showing a variation in thickness in the widthwise plating amount due to sagging of the strip in the width direction, and Fig. 4 (b) In the width direction.

4 (a) and 4 (b) show the cause of the plating deviation in the width direction of the strip 1 when the strip 1 having the cathode is passed between the anodes 4 of the anode filled with the plating solution As shown in FIG.

First, referring to FIG. 4 (a), the strips may be plated at a position close to the anode between the upper and lower anodes 4 due to the widthwise deflection of the strip, and the plating on the opposite side may be relatively less.

Next, referring to FIG. 4 (b), when gas generated during electroplating forms a void in the solution, there is no electricity between the anode 4 and the strip 1 So that plating may not be uniformly performed.

5 is an illustration of a computer analysis result of the plating solution flow and void generation position in the unit plated shell.

Referring to FIG. 5, when the unit plating shell is viewed from above, a flow is formed by the progress of the strip 1 and the direction of the plating solution from the nozzle when the strip 1 proceeds, It can be seen that a void is formed at a specific position as they are bundled together. It can be seen that the thickness of the plated layer is small when the cavity is formed in a large size in the width direction of the strip.

When these repeatedly connected unit plated shells of the same structure having the fixed nozzle angle, spacing and flow rate are connected, if the positions where the voids are formed per unit plated shell are the same, The variation in the width direction of the plating amount is seen as a constant shape.

It will be understood that the above-described problems are solved in the description according to the embodiment of the present invention with reference to FIGS. 1 and 2. FIG.

In addition, the arrangement of the nozzles of the unit plating shell according to the embodiment of the present invention will be described in Fig. 6, and the thickness variation of the plating amount in the width direction according to the embodiment of the present invention will be explained in Fig.

FIG. 6A is a plan view showing an example of arrangement of nozzles of a unit plating shell according to an embodiment of the present invention, and FIG. 6B is a plan view showing the arrangement of nozzles of a unit plating shell according to an embodiment of the present invention. Fig.

6A and 6B, the solution supplied to the unit plating shell (portion A in FIG. 1) is supplied through the nozzle 9 at the center portion, and the nozzle 9 is connected to the inlet nozzle 12 The solution supplied to the solution supply line 5 (FIG. 3) through the pump is again supplied to the inlet nozzle 12, the outlet nozzle 13, and the center And is supplied to the strip through each of the nozzles 14.

In this case, the angles 15, 16 and 17 of the inlet nozzle 12, the outlet nozzle 13 and the center nozzle 14 and the interval 18 between the center nozzle 14 are conventionally the same, A flow is formed and a void is always formed at the same position, there is always a problem that a certain widthwise plating deviation occurs.

As described above, according to an embodiment of the present invention, the angles 15, 16, 17 of the inlet nozzle 12, the outlet nozzle 13 and the center nozzle 14, the spacing of the plurality of central nozzles 14 And the flow rates 19, 20 and 21 of the inlet nozzle 18, the outlet nozzle 13 and the center nozzle 14 are controlled independently of each other to solve the problems of the prior art.

FIG. 7A is a view showing an example of thickness variation of a widthwise plating amount before application of an embodiment of the present invention, and FIG. 7B is an example of thickness variation of a widthwise plating amount after application of an embodiment of the present invention. to be.

7 (a) and 7 (b), it can be seen that the thickness variation of the width direction plating amount after application of the embodiment of the present invention is smaller than the thickness variation of the width direction plating amount before application of the embodiment of the present invention .

Hereinafter, a method of controlling the plating amount in the lateral direction of the horizontal electroplating facility will be described with reference to Figs. 1 to 8. Fig. In the present application, a description of the lateral plating amount control apparatus of the horizontal electroplating apparatus and a description of the lateral plating amount control method of the horizontal electroplating apparatus can be complementarily applied to each other, unless otherwise specified.

8 is a view illustrating an example of a method of controlling a widthwise plating amount of a horizontal electroplating apparatus according to an embodiment of the present invention.

1 to 8, a description will be made of a method of controlling the lateral plating amount of the horizontal electroplating apparatus according to an embodiment of the present invention.

First, in step S100 of FIG. 8, the pattern selection unit 100 applies plating (pattern # 1 to pattern # 4) among the plurality of plating patterns (pattern # 1 to pattern # 4) using the plate width and width- The pattern can be determined.

Next, in the step S200 of FIG. 8, the nozzle control value calculation unit 200 calculates the position of each of the entrance, center and exit nozzles 12, 14, and 13 according to the applied plating pattern determined by the pattern selection unit 100 The nozzle control value for the nozzle can be calculated.

Next, in step S300 of FIG. 8, the plating shell selection unit 300 selects a plating cell to which the nozzle control value calculated by the nozzle control value calculation unit 200 among the plurality of plating shells # 1 to # Can be selected.

Next, in step S400 of FIG. 8, the horizontal plating facility drive unit 500 can be controlled by the nozzle control unit 400 using the nozzle control value for the plating shell selected by the plating shell selection unit 300 have.

Next, in step S500 of FIG. 8, the plating amount deviation calculating unit 700 compares the thickness measured by the plating thickness measuring apparatus 600 with the reference thickness, and the plating amount deviation can be calculated.

8, the pattern correcting unit 800 can calculate the pattern correction value for plating pattern correction based on the plating amount deviation from the plating amount deviation calculating unit 700. [

Accordingly, in step S100 of determining the plating pattern, the selected pattern may be corrected by the pattern selection unit 100 based on the pattern correction value from the pattern correction unit 800 .

100: pattern selector
200: nozzle control value operation unit
210: nozzle flow rate calculation unit
220: central nozzle interval calculation unit
230: nozzle angle calculation unit
300: plating shell selection unit
400:
500: Horizontal plating facility driving part
600: Plating Thickness Meter
700: Plating amount deviation calculation unit
800: pattern correction unit

Claims (6)

A plating apparatus comprising: a plurality of plating shells; and a horizontal electroplating apparatus which is contained in each of the plurality of plating cells and includes a plurality of inlet side, middle and outlet nozzles for supplying a plating solution, In the plating amount control device,
A pattern selection unit for selecting one of the plurality of plating patterns by using the plate width and the plating amount variation information in the width direction of the strip;
A nozzle control value calculator for calculating a nozzle control value for each of the inlet, the center and the outlet nozzles for each plating cell according to the plating pattern selected by the pattern selecting unit;
A plating shell selecting unit for selecting a corresponding plating shell to which a nozzle control value by the nozzle control value computing unit is applied; And
A nozzle control unit for controlling the horizontal plating facility driving unit using the nozzle control value for the plating shell selected by the plating shell selection unit;
Wherein the horizontal plating amount control unit controls the widthwise plating amount of the horizontal electroplating unit.
The apparatus of claim 1, wherein the nozzle control unit
And controls each of the plurality of plating shells based on respective nozzle control values.
2. The plating apparatus according to claim 1,
A plating thickness gauge for measuring a plating thickness of the strip in the width direction during the plating operation of the strip;
A plating amount deviation calculating unit for calculating a plating amount variation in the width direction of the strip by comparing the thickness measured by the plating thickness meter with a reference thickness; And
A pattern correcting unit for calculating a pattern correcting value for correcting the plating pattern based on the plating amount deviation from the plating amount deviation calculating unit and providing the pattern correcting value to the pattern selecting unit; Further comprising:
Wherein the pattern selecting unit sets a new plating pattern based on the corrected plating pattern information from the pattern correcting unit
Apparatus for controlling the plating amount in the lateral direction of a horizontal electroplating facility.
The method of claim 1, wherein the nozzle control value of the nozzle control value computing unit
An angle of each of the inlet, the center and the outlet nozzles, a discharge flow rate of the plating solution of each of the inlet, the center and the outlet nozzles, and an interval between the center nozzles
Apparatus for controlling the plating amount in the lateral direction of a horizontal electroplating facility.
2. The apparatus of claim 1, wherein the nozzle control value calculation unit
A nozzle flow rate calculator for determining a discharge flow rate of the plating solution for each of the inlet, the center and the outlet nozzles in accordance with the applied plating pattern determined by the pattern selector;
A center nozzle interval calculating unit for calculating an interval between the center nozzles according to the applied plating pattern determined by the pattern selecting unit; And
A nozzle angle calculation unit for calculating an angle with respect to each of the entrance side, center and exit side nozzles according to the applied plating pattern determined by the pattern selection unit;
Wherein the horizontal plating amount control unit controls the widthwise plating amount of the horizontal electroplating unit.
A control method for controlling a plating amount in a width direction of a strip by being applied to a horizontal electroplating apparatus included in each of the plurality of plating cells and including a plurality of inlet side, In this case,
Selecting a plating pattern from among a plurality of plating patterns by using pattern width and width direction plating variation information of the strip;
Calculating a nozzle control value for each of the entrance side, center and exit nozzles in accordance with the plating pattern for each plating cell determined by the pattern selection unit in the nozzle control value calculation unit;
Selecting a corresponding plating shell to which a nozzle control value calculated by the nozzle control value calculating unit among a plurality of plating cells is to be applied, in the plating shell selecting unit;
Controlling the horizontal plating facility driving unit using the nozzle control value for the plating shell selected by the plating shell selection unit in the nozzle control unit;
Calculating a plating amount deviation by comparing the thickness measured by the plating thickness meter with the reference thickness in the plating amount deviation calculating unit; And
Calculating a pattern correction value for plating pattern correction based on a plating amount deviation from the plating amount deviation calculation unit in the pattern correction unit; Lt; / RTI >
The step of determining the plating pattern may include the step of correcting the selected plating pattern based on the pattern correction value from the pattern correcting unit
A method for controlling the lateral plating amount of a horizontal electroplating facility.

Images