JP2011225923A - Horizontal type fluid support plating device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a horizontal type fluid support plating device in which the flow of a plating solution in an electrolytic cell is made uniform, the deposition of sludge in the electrolytic cell is prevented even when a plating solution producing a large quantity of the sludge is used and the deterioration of plating quality due to the effect of the flow rate is prevented.SOLUTION: In the horizontal type fluid support plating device having: an upper hydrostatic pressure pad 16 and a lower hydrostatic pressure pad 17 which are arranged between a first and second insoluble anodes 12, 13 and between a third and forth insoluble anodes 14, 15 respectively and each has slits 37-40 for supplying the plating solution; a first and second electrification rolls 21, 23 upper and lower paired with each other, arranged in the inlet side and the outlet side of the first to forth insoluble electrodes 12-15 to have a certain space from the first to forth insoluble electrodes 12-15 and holding a strip 11 between the upper and lower sides; and backup rolls 22, 24, at least two lines of linear slits 37-40 are arranged in parallel with a certain space over the entire width to intersect the strip 11 at a right angle in the upper hydrostatic pressure pad 16 and the lower hydrostatic pressure pad 17.

Description

The present invention mainly relates to a horizontal fluid support plating apparatus that performs electrolytic treatment on the surface of a metal strip (for example, a steel strip).

For example, as described in Patent Document 1, an insoluble anode is disposed oppositely on the upper and lower surfaces of a strip (a metal strip, specifically, a steel plate), and current-carrying rolls that serve as cathodes on the entry side and the exit side of the insoluble anode And a slit provided in the central part of each of the upper and lower anodes, and a plating solution is allowed to flow from the slit, and the strip passing between the upper and lower opposing anodes is supported by a fluid comprising this plating solution. A horizontal fluid support plating apparatus using a fluid pad (static pressure pad) is known.

FIG. 5 shows the shape of the slit 51 used in the fluid pad mechanism 50 used in the horizontal type fluid support plating apparatus according to the conventional example in plan view. It has diagonal portions 53 and 54 that are diagonally arranged inside. In the slit 51, static pressure is generated at a portion surrounded by the frame portion 52, and the oblique portions 53 and 54 serve to generate static pressure evenly inside the frame portion 52. 55 denotes a strip, 56 to 59 denote first to fourth insoluble anodes (56 and 57 denote upper insoluble anodes), and 60 denotes a resin static pressure pad.

Japanese Patent Laid-Open No. 61-21319

However, when plating (for example, tin plating) is performed using the slit 51 shown in FIG. 5 and plating that is easily affected by uneven flow or a plating solution that is liable to generate sludge, the flow in the width direction is unsatisfactory. As shown in FIG. 6, the sludge 62 partially accumulates on the lower static pressure pad 60 and the lower insoluble anodes 58 and 59 as shown in FIG. Sludge 62 accumulates on the uneven flow portion having a low flow rate, disturbs the flow of the electrolyte, and degrades the plating quality. Furthermore, there is a problem that the sludge 62 covers the lower anode surface and promotes consumption of the electrodes.
In addition, the slits provided on both sides in the width direction of the frame portion 52 cause uneven flow of the left and right plating solutions if the strip 55 meanders or is biased, resulting in uneven flow of the plating solution. As a result, there was a problem of causing sludge accumulation.

The present invention has been made in view of such circumstances. 1) While maintaining the effect of a horizontal fluid-supported electrolytic cell that holds the strip by flowing the plating solution from the slit, 2) the flow of the plating solution in the electrolytic cell. Even if 3) plating that is susceptible to variations in the flow of the plating solution, or 4) the use of an electrolyte that generates a lot of sludge, slush accumulation in the electrolytic cell is prevented and affected by the flow rate. It is an object of the present invention to provide a horizontal fluid support plating apparatus that does not cause deterioration of plating quality.

The horizontal type fluid support plating apparatus according to the first aspect of the present invention that meets the above-mentioned object is as follows: 1) First and second disposed with a gap in the transport direction of the strip above the strip transported in a horizontal state. An insoluble anode and third and fourth insoluble anodes disposed below the strip with a gap in the transport direction of the strip; 2) between the first and second insoluble anodes and the third An upper static pressure pad and a lower static pressure pad disposed between the fourth insoluble anodes and facing each other with a slit for supplying a plating solution, and 3) the first to fourth insoluble anodes The first and fourth insoluble anodes are arranged with a gap on the entry side and the exit side, and have first and second energizing rolls and backup rolls that sandwich the strip from above and below. In horizontal fluid support plating equipment,
The upper static pressure pad and the lower static pressure pad are arranged in parallel with at least two straight slits perpendicular to the transport direction of the strip and extending across the entire width of the strip, and The static pressure pad is constituted by the side walls and the slits provided on both sides of the static pressure pad and the lower static pressure pad.

A horizontal fluid support plating apparatus according to a second invention is the horizontal fluid support plating apparatus according to the first invention, wherein the flow rate of the plating solution passing through the slit, and the strip and the first to fourth insolubles. The flow rate of the plating solution passing between the anode and the anode is in the range of 0.6 to 2.5 m / sec. In this case, it is preferable that the flow rate of the plating solution passing through the slit is larger than the flow rate of the plating solution passing between the strip and the insoluble anode, so that the strip can be supported more stably.

A horizontal fluid support plating apparatus according to a third invention is the horizontal fluid support plating apparatus according to the first and second inventions, wherein the inclination angle of the slit is in the range of 0 to 45 degrees. In addition, when there are two slits and only one of them is inclined, it is preferable that the slit arranged on the downstream side of the strip is inclined backward with respect to the traveling direction of the strip.

A horizontal fluid support plating apparatus according to a fourth invention is the horizontal fluid support plating apparatus according to the first to third inventions, wherein the plating flows between the first to fourth insoluble anodes and the strip. The ratio of the minimum flow rate to the average liquid flow rate is in the range of 0.92 to 0.96.
The most preferable plating to which the first to fourth inventions are applied includes, for example, tin plating, nickel plating, chromium plating, copper plating and the like.

Since the upper static pressure pad and the lower static pressure pad are arranged in parallel with at least two straight slits across the entire width of the strip perpendicular to the conveying direction of the passing strip, ~ Sludge accumulation caused by disturbance of the plating solution in the flow path can be made uniform in the flow path formed between the fourth insoluble anode and the strip (the electrolytic cell is formed including the side wall). Can be prevented. As a result, non-uniform plating solution due to sludge deposition, which has been a problem in the past, can be prevented, and deterioration of plating quality can be prevented.

In particular, by setting the ratio of the minimum flow rate to the average flow rate of the plating solution flowing between the first to fourth insoluble anodes and the strip to 0.92 to 0.96, plating defects (plating burn, plating unevenness), etc. Disappears.

It is sectional drawing of the horizontal type fluid support plating apparatus which concerns on one embodiment of this invention. It is explanatory drawing of the horizontal type fluid support plating apparatus. It is arrow BB sectional drawing in FIG. It is CC sectional view taken on the line in FIG. It is sectional drawing of the horizontal type fluid support plating apparatus which concerns on a prior art example. It is arrow AA sectional drawing in FIG.

As shown in FIGS. 1 to 4, a horizontal fluid support plating apparatus 10 according to an embodiment of the present invention has a strip 11 on an upper side of a strip (metal strip, for example, a steel strip) 11 that is conveyed in a horizontal state. The first and second insoluble anodes 12 and 13 are arranged with a gap in the conveying direction of the first sheet, and the first and second insoluble anodes 12 and 13 are arranged below the strip 11 with a gap in the conveying direction of the strip 11. The third and fourth insoluble anodes 14 and 15 are disposed opposite to the two insoluble anodes 12 and 13.

Between the first and second insoluble anodes 12 and 13 and between the third and fourth insoluble anodes 14 and 15, an upper static pressure pad 16 and a lower static pressure pad made of resin, which is an example of an insulator. 17 are arranged facing each other. In addition, both sides (width direction) of the first and third insoluble anodes 12 and 14 and both sides of the second and fourth insoluble anodes 13 and 15 have a U-shaped cross section made of a resin which is an example of an insulating material. Side walls 18 and 19 are provided, and the whole has a cylindrical shape with a rectangular cross section. The inner dimensions of the side walls 18 and 19 are about the strip width +50 to 300 mm. Side walls 18 a and 19 a are also provided at both ends of the upper static pressure pad 16 and the lower static pressure pad 17.

The widths of the first to fourth insoluble anodes 12 to 15 are the same as the width of the strip 11 or wide within a small range.
There is a gap with the first and third insoluble anodes 12 and 14 on the upstream side of the first and third insoluble anodes 12 and 14 (the entrance side of the first to fourth insoluble anodes 12 to 15). In a state where the strip 11 is sandwiched, an energizing roll 21 is provided above and a backup roll 22 is provided below. In addition, there is a gap with the second and fourth insoluble anodes 13 and 15 on the downstream side of the second and fourth insoluble anodes 13 and 15 (the exit side of the first to fourth insoluble anodes 12 to 15). In the state where the strip 11 is sandwiched, the energizing roll 23 is provided on the upper side and the backup roll 24 is provided on the lower side.

The current-carrying rolls 21 and 23 are connected to the negative side of the plating power source, hold the strip 11 at the cathode, and between the first to fourth insoluble anodes 12 to 15 connected to the positive side of the plating power source. A current path for plating is formed. Resistance members 26 to 29 made of an insulating material are provided at the upstream end portions of the first and third insoluble anodes 12 and 14 and the downstream end portions of the second and fourth insoluble anodes 13 and 15. Thus, the electrolytic solution 30 formed by the first to fourth insoluble anodes 12 to 15 is filled with the plating solution.

The upper static pressure pad 16 and the lower static pressure pad 17 have the same width as the inner widths of the side walls 18 and 19, and both the upper static pressure pad 16 and the lower static pressure pad 17 are connected to each other. And plating solution chambers 32 and 33 surrounding the lower static pressure pad 17 are formed. In FIG. 3, reference numerals 34 and 35 denote plating solution supply ports.

The upper static pressure pad 16 and the lower static pressure pad 17 are provided with two linear slits 37 to 40 parallel to each other across the entire width of the strip 11 and across the entire width of the strip 11. It has been. The slits 37 to 40 are provided vertically or inclined with respect to the strip 11 within a range of 90 to 45 degrees (inclination angle of 0 to 45 degrees). In this embodiment, the slits 37 and 39 on the upstream side are vertical, and the slits 38 and 40 are inclined 20 to 40 degrees toward the upstream side. By configuring the slit in this way, the ratio of the minimum flow rate to the average flow rate of the plating solution flowing between the first to fourth insoluble anodes 12 to 15 and the strip 11 is in the range of 0.92 to 0.96. Easy to be.

In this embodiment, the gap interval between the slits 37 to 40 for supplying the plating solution is 0.4 to 0.6 times the interval (for example, 9 mm) between the first to fourth insoluble anodes 12 to 15 and the strip 11. (For example, 4 mm), the flow rate of the plating solution passing through the slits 37 to 40 is increased to suppress the bending of the strip 11. The flow rate of the plating solution that passes through the slits 37 to 40 and the flow rate of the plating solution that passes between the strip 11 and the first to fourth insoluble anodes 12 to 15 are 0.6 to 2.5 m / second, respectively. Preferably it is in the range. Here, when the flow rate of the plating solution is less than 0.6 m / sec, the electric passage is not filled with the plating solution, and when it exceeds 2.5 m / sec, the running cost is increased and the plating solution gets over the energizing roll. It flows out of the apparatus along the upper surface of the strip.
Further, the side walls 18a and 19a and the slits 37 to 40 provided on both sides of the upper static pressure pad 16 and the lower static pressure pad 17 constitute a static pressure pad that holds the strip 11 in a fixed position.

The flow of the plating solution when the horizontal fluid support plating apparatus 10 using the upper static pressure pad 16 and the lower static pressure pad 17 is used is shown in FIG. 2 and FIG. 3, but becomes substantially uniform as shown in the figure. ing. As shown in FIG. 4, in the case of a plating solution (for example, a tin plating solution) using the horizontal fluid support plating apparatus 10, traces of sludge are recognized at the lower corners of the U-shaped side walls 18 and 19. However, since it was not the upper part of the third insoluble anode 14, there was no particular problem for the plating of the strip 11.

Although the embodiment has been described using specific numbers, the numerical values can be changed without departing from the scope of the present invention.
Moreover, in the said embodiment, although the slit was 2 strip | lines, this invention is applied also when increasing a number further.

10: Horizontal fluid support plating apparatus, 11: Strip, 12: First insoluble anode, 13: Second insoluble anode, 14: Third insoluble anode, 15: Fourth insoluble anode, 16: Upper static pressure Pad, 17: lower static pressure pad, 18, 19: side wall, 18a, 19a: side wall, 21: energizing roll, 22: backup roll, 23: energizing roll, 24: backup roll, 26-29: resistance member, 30: Electrolyzer, 32, 33: Plating solution chamber, 34, 35: Plating solution supply port, 37-40: Slit

Claims (4)

1) The first and second insoluble anodes disposed above the strip to be transported in a horizontal state with a gap in the transport direction of the strip and the clearance below the strip in the transport direction of the strip. And 3) a slit for supplying a plating solution between the first and second insoluble anodes and between the third and fourth insoluble anodes. And 3) a gap between the first to fourth insoluble anodes on the entry side and the exit side of the first to fourth insoluble anodes. In a horizontal type fluid support plating apparatus having a current-carrying roll and a backup roll that are first and second upper and lower pairs arranged to sandwich the strip from above and below,
The upper static pressure pad and the lower static pressure pad are arranged in parallel with at least two straight slits perpendicular to the transport direction of the strip and extending across the entire width of the strip, and A horizontal fluid support plating apparatus, wherein a static pressure pad is constituted by side walls provided on both sides of the static pressure pad and the lower static pressure pad and the slit. 2. The horizontal fluid support plating apparatus according to claim 1, wherein a flow rate of the plating solution passing through the slit and a flow rate of the plating solution passing between the strip and the first to fourth insoluble anodes are each 0. A horizontal fluid-supporting plating apparatus characterized by being in the range of 6 to 2.5 m / sec. 3. The horizontal fluid support plating apparatus according to claim 1, wherein the slit has an inclination angle in a range of 0 to 45 degrees. 4. The horizontal fluid support plating apparatus according to claim 1, wherein a ratio of a minimum flow rate to an average flow rate of the plating solution flowing between the first to fourth insoluble anodes and the strip is 0.92. A horizontal fluid support plating apparatus characterized by being in a range of ˜0.96.

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