CN217895775U - Continuous electroplating area shielding type immersion plating device - Google Patents
Continuous electroplating area shielding type immersion plating device Download PDFInfo
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- CN217895775U CN217895775U CN202221407572.8U CN202221407572U CN217895775U CN 217895775 U CN217895775 U CN 217895775U CN 202221407572 U CN202221407572 U CN 202221407572U CN 217895775 U CN217895775 U CN 217895775U
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- bottom cover
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- 238000007654 immersion Methods 0.000 title claims abstract description 64
- 238000007747 plating Methods 0.000 title claims abstract description 60
- 238000009713 electroplating Methods 0.000 title claims abstract description 54
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 35
- 238000003860 storage Methods 0.000 claims abstract description 19
- 238000009434 installation Methods 0.000 claims description 14
- 238000002791 soaking Methods 0.000 claims description 4
- 238000004891 communication Methods 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 12
- 238000009826 distribution Methods 0.000 abstract description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 238000000034 method Methods 0.000 abstract description 4
- 230000003139 buffering effect Effects 0.000 abstract description 3
- 239000007788 liquid Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 4
- 238000007598 dipping method Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000005253 cladding Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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- Electroplating Methods And Accessories (AREA)
Abstract
The utility model discloses an area shielding type immersion plating device for electric continuous plating, which conveys plating solution pumped out by a water pump to a bottom cover through a water inlet pipe, the top of the bottom cover is provided with a small water storage tank which can store a small part of plating solution, prevents the plating solution from being sprayed out through the water inlet pipe and directly entering the immersion tank of an immersion plating body and simultaneously plays a role in buffering the newly-fed plating solution and the stored plating solution when exchanging, and realizes the stable output of the plating solution; the method comprises the steps that a water storage tank of a bottom cover is filled with a plating solution to be plated, the water storage tank enters an immersion tank, the immersion tank is divided into a shielding area and an electroplating area according to the structural characteristics of a product, a row of small holes are formed in the bottom of the electroplating area, the plating solution enters the immersion tank through the small holes and is just positioned in the center of a product conveying position, and an anode is made into a U-shaped mesh plate structure, so that the current distribution around the anode is uniform, the electroplating effect of the electroplating area and the non-electroplating effect of the shielding area are realized, the immersion plating purpose can be efficiently achieved, the product is uniformly electroplated, the production cost is reduced, and the product quality is improved.
Description
Technical Field
The utility model relates to a technical field of dip-plating device especially relates to a regional formula of shielding dip-plating device of continuous electroplating.
Background
At present, in the continuous electroplating industry, some products are required to be electroplated in partial areas because of the complex structural characteristics, irregular shapes and the like of the products, and the products are not required to be electroplated in some areas, so that the products can be divided into areas which are not electroplated and areas which are required to be electroplated when being electroplated; when electroplating, because do not need the shielding device of electroplating regional specific setting, when electroplating, the regional cladding material that plates that will appear not electroplating easily, and the thick scope management and control of the product membrane in the region that needs electroplating is unstable, and the regional thickness of thick or partial electroplating that causes electroplating is inconsistent, not only leads to the fact the waste on the cost as a whole, still can increase the appearance of defective products, has reduced holistic production efficiency, the increase of rejection rate, greatly increased manufacturing cost. In addition, the current distribution during plating is not uniform, which causes the film thickness to be non-uniform.
Aiming at the situation, a non-electroplating area and an electroplating area need to be separated, and then the distribution of current is improved in the electroplating area; the prior art does not have a device for efficiently solving the above problems. Therefore, an improvement of an immersion plating apparatus for electroplating is required.
Disclosure of Invention
The utility model aims at overcoming the defects of the prior art and providing a continuous electroplating area shielding type immersion plating device, which conveys the plating solution pumped out by a water pump to a bottom cover through a water inlet pipe, the top of the bottom cover is provided with a small water storage tank which can store a small part of plating solution, the purpose is to prevent the plating solution from being sprayed out through the water inlet pipe and directly entering into the immersion plating tank of an immersion plating body, the water storage tank simultaneously plays a role in buffering the newly-fed plating solution and the stored plating solution during exchange, and the plating solution is stably output; the method comprises the steps that a water storage tank of a bottom cover is filled with a to-be-plated liquid, the to-be-plated liquid enters an immersion tank, the immersion tank is divided into a shielding area and an electroplating area according to the structural characteristics of a product, a row of small holes are formed in the bottom of the electroplating area, the to-be-plated liquid enters the immersion tank through the row of small holes and is just positioned in the center of a product conveying position, and an anode is made into a U-shaped grid plate structure, so that the current distribution around the immersion tank is uniform, the electroplating effect of the electroplating area and the non-electroplating effect of the shielding area are realized, the area shielding type immersion plating effect is achieved, the purpose of immersion plating can be efficiently achieved, the product is uniformly electroplated, electroplating materials are not wasted, the production cost is reduced, and the product quality is improved.
The utility model provides a technical scheme that its technical problem adopted is: a continuous electroplating area shielding type immersion plating device comprises a strip-shaped bottom cover, water inlet pipes arranged at two ends of the bottom cover, an immersion tank body arranged at the top of the bottom cover, and a U-shaped anode arranged in the immersion tank body; a water storage groove communicated with the water inlet pipe is recessed in the top of the bottom cover; the immersion tank is internally provided with a U-shaped immersion tank and an anode mounting groove for mounting a U-shaped anode, the U-shaped immersion tank is divided into a shielding area and an electroplating area, and the bottom of the electroplating area is provided with a row of small holes for realizing the communication between the U-shaped immersion tank and the water storage tank; the two ends of the U-shaped anode extend inwards to form anode installation sheets, and the anode installation sheets are fixedly installed at the two ends of the U-shaped soaking tank through anode fixing screws.
Furthermore, the U-shaped anode is a U-shaped screen plate.
Furthermore, the bottom cover and the immersion tank body are fixedly installed through bottom cover fixing screws.
Further, the U-shaped anode is arranged in the anode mounting groove, the anode mounting piece extends inwards from the end part of the inner side of the U-shaped anode to form a right-angled state, and the anode mounting piece protrudes from the end part of the anode mounting groove and covers the end part of the U-shaped soaking tank.
To sum up, the utility model discloses a continuous electroplating's area shields formula immersion plating device carries the plating solution that the water pump was taken out to the bottom through the inlet tube, and the bottom top sets up a little catch basin, and the catch basin can store the small part plating solution, and the purpose prevents that the plating solution through the inlet tube from spraying and going out and directly get into the immersion bath of the body of immersion plating, and the catch basin plays the cushioning effect of the plating solution of newly-advancing and the plating solution of storage when exchanging simultaneously, realizes exporting the plating solution steadily; the method comprises the steps that a water storage tank of a bottom cover is filled with a plating solution to be plated, the water storage tank enters an immersion tank, the immersion tank is divided into a shielding area and an electroplating area according to the structural characteristics of a product, a row of small holes are formed in the bottom of the electroplating area, the plating solution enters the immersion tank through the small holes and is just positioned in the center of a product conveying position, and an anode is made into a U-shaped mesh plate structure, so that the current distribution around the anode is uniform, the electroplating effect of the electroplating area and the non-electroplating effect of the shielding area are realized, the area shielding type immersion plating effect is achieved, the immersion plating purpose can be efficiently achieved, the electroplating of the product is uniform, electroplating materials are not wasted, the production cost is reduced, and the product quality is improved.
Drawings
FIG. 1 is an exploded view of a zone-shielded immersion plating apparatus for continuous plating according to embodiment 1 of the present invention;
the reference numbers in the drawings are as follows: 1. a steeping trough body; 2.U-shaped anodes; 3. a water inlet pipe; 4. a bottom cover; 5. an anode fixing screw; 6. a bottom cover fixing screw; 7.U-shaped dipping tanks; 8. a water storage tank; 9. an anode mounting piece; 10. an anode mounting groove.
Detailed Description
Example 1
The area-shielded immersion plating device for continuous electroplating described in this embodiment 1, as shown in fig. 1, includes a strip-shaped bottom cover 4, water inlet pipes 3 installed at two ends of the bottom cover, an immersion tank body 1 installed at the top of the bottom cover, and a U-shaped anode 2 installed in the immersion tank body; a water storage tank 8 communicated with the water inlet pipe is sunken in the top of the bottom cover; the immersion tank body is internally provided with a U-shaped immersion tank 7 and an anode mounting groove 10 for mounting a U-shaped anode, the U-shaped immersion tank is divided into a shielding area and an electroplating area, and the bottom of the electroplating area is provided with a row of small holes (not shown in the figure) for realizing the communication between the U-shaped immersion tank and the water storage tank; the two ends of the U-shaped anode extend inwards to form anode installation pieces 9, and the anode installation pieces are fixedly installed at the two ends of the U-shaped soaking tank through anode fixing screws 5.
In this embodiment 1, the U-shaped anode is a U-shaped mesh plate.
In the embodiment 1, the bottom cover and the immersion tank body are fixed by the bottom cover fixing screws 6.
In this embodiment 1, the U-shaped anode is installed in the anode installation groove, the anode installation piece extends inward from the inner end of the U-shaped anode to form a right angle state, and the anode installation piece protrudes from the end of the anode installation groove and covers the end part position of the U-shaped dipping tank.
The continuous electroplating area shielding type immersion plating device conveys the plating solution pumped out by the water pump to the bottom cover through the water inlet pipe, the top of the bottom cover is provided with a small water storage tank which can store a small part of the plating solution, the aim is to prevent the plating solution from being ejected out through the water inlet pipe and directly entering the immersion tank of the immersion plating body, and the water storage tank simultaneously plays a role in buffering the newly-fed plating solution and the stored plating solution during exchange, thereby realizing the stable output of the plating solution; the method comprises the steps that a water storage tank of a bottom cover is filled with a to-be-plated liquid, the to-be-plated liquid enters an immersion tank, the immersion tank is divided into a shielding area and an electroplating area according to the structural characteristics of a product, a row of small holes are formed in the bottom of the electroplating area, the plating liquid enters the immersion tank through the row of small holes and is just positioned in the center of a product conveying position, an anode is made into a U-shaped mesh plate structure, the current distribution around the anode is uniform, the electroplating effect of the electroplating area and the non-electroplating effect of the shielding area are achieved, the area shielding type immersion plating effect is achieved, the immersion plating purpose can be efficiently achieved, the electroplating of the product is uniform, electroplating materials are not wasted, the production cost is reduced, and the product quality is improved
The above description is only a preferred embodiment of the present invention, and is not intended to limit the technical solutions of the present invention in any way. Any simple modification, equivalent change and modification made to the above embodiments according to the technical essence of the present invention still fall within the scope of the technical solution of the present invention.
Claims (4)
1. A zone shielding type immersion plating device for continuous electroplating is characterized by comprising a strip-shaped bottom cover, water inlet pipes arranged at two ends of the bottom cover, an immersion tank body arranged at the top of the bottom cover, and a U-shaped anode arranged in the immersion tank body; a water storage groove communicated with the water inlet pipe is recessed in the top of the bottom cover; the immersion tank is internally provided with a U-shaped immersion tank and an anode mounting groove for mounting a U-shaped anode, the U-shaped immersion tank is divided into a shielding area and an electroplating area, and the bottom of the electroplating area is provided with a row of small holes for realizing the communication between the U-shaped immersion tank and the water storage tank; the two ends of the U-shaped anode extend inwards to form anode installation sheets, and the anode installation sheets are fixedly installed at the two ends of the U-shaped soaking tank through anode fixing screws.
2. The continuous electroplating zone-shielding type immersion plating device according to claim 1, wherein the U-shaped anode is a U-shaped screen.
3. The continuous electroplating zone-shielding type immersion plating device according to claim 2, wherein the bottom cover and the immersion tank body are fixedly installed by bottom cover fixing screws.
4. A continuous area coverage type immersion plating apparatus as claimed in claim 3, wherein said U-shaped anode is installed in the anode installation groove, the anode installation piece is extended inwardly from the inner end of the U-shaped anode to form a right angle state, the anode installation piece is protruded from the end of the anode installation groove and covers the end portion position of the U-shaped immersion groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221407572.8U CN217895775U (en) | 2022-06-07 | 2022-06-07 | Continuous electroplating area shielding type immersion plating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221407572.8U CN217895775U (en) | 2022-06-07 | 2022-06-07 | Continuous electroplating area shielding type immersion plating device |
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| Publication Number | Publication Date |
|---|---|
| CN217895775U true CN217895775U (en) | 2022-11-25 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221407572.8U Active CN217895775U (en) | 2022-06-07 | 2022-06-07 | Continuous electroplating area shielding type immersion plating device |
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| CN (1) | CN217895775U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117552071A (en) * | 2024-01-11 | 2024-02-13 | 宁波惠金理化电子有限公司 | Hardware electroplating equipment and use method thereof |
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2022
- 2022-06-07 CN CN202221407572.8U patent/CN217895775U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117552071A (en) * | 2024-01-11 | 2024-02-13 | 宁波惠金理化电子有限公司 | Hardware electroplating equipment and use method thereof |
| CN117552071B (en) * | 2024-01-11 | 2024-03-29 | 宁波惠金理化电子有限公司 | Hardware electroplating equipment and use method thereof |
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Denomination of utility model: A continuous electroplating area shielding immersion device Granted publication date: 20221125 Pledgee: China Co. truction Bank Corp Jiangmen branch Pledgor: Wanming electroplating Intelligent Technology (Jiangmen) Co.,Ltd. Registration number: Y2024980011369 |