CN214271077U

CN214271077U - Novel electroplating pool with uniform electroplating

Info

Publication number: CN214271077U
Application number: CN202022997397.XU
Authority: CN
Inventors: 齐鹏
Original assignee: Anhui Xinhuamei Intelligent Equipment Technology Co ltd
Current assignee: Anhui Xinhuamei Intelligent Equipment Technology Co ltd
Priority date: 2020-12-10
Filing date: 2020-12-10
Publication date: 2021-09-24
Anticipated expiration: 2030-12-10

Abstract

The utility model belongs to the technical field of electroplate processing equipment, especially, relate to a electroplate even novel electroplating bath, including the cell body, all be provided with a plurality of vertical fixed side spray tubes on the left side wall of cell body and the right side wall, the side spray tube with it is provided with the positive pole screen still to fix between the cell body, side spray tube from the top down evenly is provided with a plurality of nozzles, the nozzle with side spray tube mutually perpendicular. The utility model discloses a to the even electroplating of product, the plating layer that forms on the product is even unanimous, has saved a large amount of metal ions, realizes the electroplating in the hole of product, has avoided traditional electroplating bath to be difficult to carry out the difficult problem of electroplating to the hole of product.

Description

Novel electroplating pool with uniform electroplating

Technical Field

The utility model belongs to the technical field of electroplating process equipment, especially, relate to a electroplate even novel electroplating bath.

Background

Electroplating is a process of plating a thin layer of other metals or alloys on the surface of some metals by using the principle of electrolysis, and is a process of attaching a layer of metal film on the surface of a metal or other material product by using the action of electrolysis so as to prevent metal oxidation (such as corrosion), improve wear resistance, conductivity, light reflection, corrosion resistance (such as copper sulfate and the like), improve the appearance and the like, and the outer layer of a plurality of coins is also plated.

In the electroplating process of the existing electroplating tank, workpieces and anodes are soaked in electroplating solution to be electrified to realize electroplating, but the electroplating method has the defects of uneven electroplating, particularly holes are formed in a plurality of workpieces, the existing electroplating method is difficult to electroplate the holes, and the problem of uneven electroplating also exists.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide an electroplate even novel electroplating bath, it is inhomogeneous to aim at solving the electroplating bath existence among the prior art and be difficult to electroplate, electroplate the hole, has wasted a large amount of metal ion class of technical problem.

In order to achieve the above object, the embodiment of the utility model provides a pair of electroplate even novel electroplating bath, including the cell body, all be provided with a plurality of vertical fixed side spray tubes on the left side wall of cell body and the right side wall, the side spray tube with still fixed being provided with the positive pole screen between the cell body, side spray tube from the top down evenly is provided with a plurality of nozzles, the nozzle with side spray tube mutually perpendicular.

Optionally, a first shielding assembly is fixedly arranged between the anode screen and the side nozzle, and the first shielding assembly is used for shielding the left and right edges and the bottom edge of the anode screen.

Optionally, the first shielding assembly comprises a first baffle and two second baffles, the first baffle is fixedly mounted at the lower edge of the anode screen, and the two second baffles are respectively and fixedly mounted at the left and right edges of the anode screen.

Optionally, the cell body still includes driving piece and clamping part, the driving piece fixed mounting be in on the cell body, one end of clamping part with the driving piece is connected, the other end of clamping part is used for the centre gripping product.

Optionally, a signal transmitter is arranged at the upper end of the side nozzle, and a signal receiver is arranged at the other end of the clamping piece.

Optionally, electroplate even electroplating bath still including the third baffle, the third baffle with the side nozzle butt, the side nozzle is located the positive pole screen with between the third baffle, be provided with on the third baffle a plurality of with the nozzle is in the through-hole on same water flat line.

Optionally, the electroplating pool with uniform electroplating further comprises at least two metal mesh fixing seats, the two metal mesh fixing seats are respectively and fixedly installed on the left side wall surface and the right side wall surface of the pool body, and grooves are formed in the metal mesh fixing seats.

The embodiment of the utility model provides an electroplate above-mentioned one or more technical scheme in even novel electroplating bath have one of following technological effect at least: when using, be equipped with the plating solution in advance in the cell body, then will treat that the product of processing is put into the cell body, and make product and side spray tube mutually perpendicular, then begin the circular telegram and electroplate, the positive pole screen sends the electron, the nozzle on the side spray tube spouts the plating solution to the product, because a plurality of side spray tubes are even fixed mounting on the lateral wall face of cell body, a plurality of nozzles are evenly fixed on the side spray tube again, make the electron of spouting to the product through the nozzle even, thereby realize the even electroplating to the product, the plating layer that forms on the product is even unanimous, a large amount of metal ion has been saved, when being equipped with the hole on the product, make the hole of product and nozzle be in same water flat line, can make the hole of electron spout to the product, realize the electroplating to the hole of product, the difficult problem that traditional electroplating bath is difficult to electroplate the hole of product has.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the embodiments or the prior art descriptions will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without inventive labor.

Fig. 1 is a schematic structural view of a novel electroplating tank with uniform electroplating provided by the embodiment of the utility model.

Fig. 2 is a schematic structural diagram of a novel electroplating tank with uniform electroplating provided by the embodiment of the utility model.

Fig. 3 is a schematic structural view of a novel electroplating tank with uniform electroplating provided by the embodiment of the present invention.

Wherein, in the figures, the respective reference numerals:

cell body 1, third baffle 2, metal mesh fixing base 3, side spray tube 11, anode screen 12, driving piece 13, holder 14, through-hole 21, nozzle 111, first sheltering from subassembly 112, signal transmitter 113, signal receiver 141, first baffle 1121.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below by referring to the drawings are exemplary and intended to explain the embodiments of the present invention and are not to be construed as limiting the present invention.

In the description of the embodiments of the present invention, it should be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in the orientation or positional relationship indicated in the drawings, which is only for convenience in describing the embodiments of the present invention and simplifying the description, and do not indicate or imply that the device or element so indicated must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the embodiments of the present invention, "a plurality" means two or more unless specifically limited otherwise.

In the embodiments of the present invention, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly, e.g., as fixed or detachable connections or as an integral part; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the embodiments of the present invention can be understood by those skilled in the art according to specific situations.

In an embodiment of the present invention, as shown in fig. 1, a novel electroplating tank with uniform electroplating is provided, including a tank body 1, a plurality of vertically fixed side spraying pipes 11 are disposed on both left and right side walls of the tank body 1, the side spraying pipes 11 and an anode screen 12 are further fixedly disposed between the tank body 1, a plurality of nozzles 111 are uniformly disposed on the side spraying pipes 11 from top to bottom, and the nozzles 111 are perpendicular to the side spraying pipes 11.

In this embodiment, when in use, the tank body 1 is filled with electroplating solution in advance, then a product to be processed is placed in the tank body 1, the product is perpendicular to the side spray pipes 11, then the anode screen 12 is electrified to perform electroplating, the nozzles 111 on the side spray pipes 11 spray the electroplating solution to the product, since the side spray pipes 11 are uniformly and fixedly mounted on the side wall surface of the tank body 1, and the nozzles 111 are uniformly fixed on the side spray pipes 11, the electrons sprayed to the product through the nozzles 111 are uniform, so that the product is uniformly electroplated, the electroplated layer formed on the product is uniform, a large amount of metal ions are saved, when the product is provided with holes, the holes of the product and the nozzles 111 are on the same horizontal line, so that the electrons are sprayed to the holes of the product, the electroplating of the holes of the product is realized, and the problem that the holes of the product are difficult to electroplate in a traditional electroplating tank is avoided.

In another embodiment of the present invention, as shown in fig. 2, a first shielding assembly 112 is fixedly disposed between the anode screen 12 and the side nozzle 11, and the first shielding assembly 112 is used for shielding the left and right edges and the bottom edge of the anode screen 12. When the electroplating device is used, the first shielding assembly 112 shields the edge position of the anode screen 12, namely, the current edge effect of the anode screen 12 is shielded, and the electroplating layer at the edge position of a product can be effectively prevented from being too thick only by the middle position of the anode screen 12 to participate in the electroplating of the product, so that the electroplating is more uniform, and the waste of metal ions is avoided.

In another embodiment of the present invention, as shown in fig. 2, the first shielding assembly 112 includes a first baffle 1121 and two second baffles, the first baffle 1121 is fixedly installed at the lower end edge of the anode screen 12, and the two second baffles are respectively fixedly installed at the left and right end edges of the anode screen 12. When the electroplating device is used, the first baffle 1121 shields the lower end edge of the anode screen 12, and the two second baffles shield the left and right end edges of the anode screen 12, so that the problem caused by the current edge effect is solved, electroplating is more uniform, and waste of metal ions is avoided.

In another embodiment of the present invention, as shown in fig. 2, the cell body 1 further includes a driving member 13 and a clamping member 14, the driving member 13 is fixedly mounted on the cell body 1, one end of the clamping member 14 is connected to the driving member 13, and the other end of the clamping member 14 is used for clamping a product. When the electroplating tank is used, a product is placed into the tank body 1, the product is clamped and fixed through the clamping piece 14, and when electroplating is performed, the driving piece 13 drives the clamping piece 14 to move left and right, so that the clamping piece 14 drives the product to move left and right, and the product can be electroplated more uniformly.

In another embodiment of the present invention, as shown in fig. 2, the upper end of the side nozzle 11 is provided with a signal transmitter 113, and the other end of the clamping member 14 is provided with a signal receiver 141. When the device is used, the signal emitter 113 continuously sends out signals, the clamping piece 14 clamps one end of a product and then moves downwards to place the product in the tank body 1, and after the signal receiver 141 receives the signals sent by the signal emitter 113, the signal receiver indicates that the clamping piece 14 has moved downwards to a specified position at the moment, the height of the product is just high, the nozzle 111 can just electroplate the through hole 21 of the product, and the problem that the electroplating effect is affected due to the fact that the product is placed too low or too high is avoided.

In another embodiment of the present invention, as shown in fig. 3, the electroplating tank for uniform electroplating further includes a third baffle 2, the third baffle 2 abuts against the side spraying pipe 11, the side spraying pipe 11 is located between the anode screen 12 and the third baffle 2, and the third baffle 2 is provided with a plurality of through holes 21 which are located on the same horizontal line with the nozzle 111. When the electroplating device is used, the liquid medicine and the metal ions sprayed out from the nozzle 111 are sprayed out through the through hole 21 to form a linear flowing effect, so that electroplating adhesion on a product is uniform, the problem of over-thick electroplating of partial areas is avoided, and a large amount of metal ions are saved.

In another embodiment of the present invention, as shown in fig. 1, the electroplating tank with uniform electroplating further includes at least two metal mesh fixing seats 3, two metal mesh fixing seats 3 are respectively and fixedly installed on the left and right side wall surfaces of the tank body, and the metal mesh fixing seats 3 are provided with grooves. When the metal mesh fixing seat is used, metal ions plated as required are embedded into the groove, so that the metal mesh is fixedly installed on the metal mesh fixing seat 3, and when the metal mesh fixing seat needs to be replaced, the metal mesh is taken out of the groove, and the metal mesh fixing seat is simple and convenient.

The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.

Claims

1. The utility model provides an electroplate even novel electroplating pool, a serial communication port, including the cell body, all be provided with a plurality of vertical fixed side spray pipes on the left side wall of cell body and the right side wall, the side spray pipe with still the fixed positive pole screen that is provided with between the cell body, side spray pipe from the top down evenly is provided with a plurality of nozzles, the nozzle with side spray pipe mutually perpendicular.

2. The novel electroplating pool with uniform electroplating according to claim 1, wherein a first shielding component is fixedly arranged between the anode screen and the side spray pipe, and the first shielding component is used for shielding the left and right side edges and the bottom edge of the anode screen.

3. The novel electroplating pool with uniform electroplating according to claim 2, wherein the first shielding assembly comprises a first baffle and two second baffles, the first baffle is fixedly arranged at the lower end edge of the anode screen, and the two second baffles are respectively and fixedly arranged at the left and right end edges of the anode screen.

4. The novel electroplating pool with uniform electroplating according to any one of claims 1-3, wherein the pool body further comprises a driving member and a clamping member, the driving member is fixedly mounted on the pool body, one end of the clamping member is connected with the driving member, and the other end of the clamping member is used for clamping a product.

5. The novel electroplating pool with uniform electroplating according to claim 4, wherein the upper end of the side spray pipe is provided with a signal transmitter, and the other end of the clamping piece is provided with a signal receiver.

6. The novel electroplating tank with uniform electroplating according to any one of claims 1 to 3, characterized in that the novel electroplating tank with uniform electroplating further comprises a third baffle, the third baffle abuts against the side nozzle, the side nozzle is located between the anode screen and the third baffle, and the third baffle is provided with a plurality of through holes which are located on the same horizontal line with the nozzle.

7. The novel electroplating bath with uniform electroplating according to any one of claims 1-3, further comprising at least two metal mesh fixing seats, wherein the two metal mesh fixing seats are respectively fixedly installed on the left and right side wall surfaces of the bath body, and the metal mesh fixing seats are provided with grooves.