CN208965058U - A kind of ultrasonic wave added electroplanting device - Google Patents
A kind of ultrasonic wave added electroplanting device Download PDFInfo
- Publication number
- CN208965058U CN208965058U CN201821672465.1U CN201821672465U CN208965058U CN 208965058 U CN208965058 U CN 208965058U CN 201821672465 U CN201821672465 U CN 201821672465U CN 208965058 U CN208965058 U CN 208965058U
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- CN
- China
- Prior art keywords
- wall
- electroplating bath
- ultrasonic wave
- sliding
- baffle
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Abstract
The utility model discloses a kind of ultrasonic wave added electroplanting devices, including electroplating bath and the slot cover being bolted at the top of electroplating bath, electroplating bath is internally provided with galvanic anode, electroplating cathode, supersonic generator and mobile mechanism, there are two supersonic generators, it is individually fixed in the front bottom end of electroplating bath inner left wall and right side inner wall, the first sliding rail perpendicular to plating groove bottom wall is provided in the middle part of electroplating bath inner left wall and right side inner wall, mobile mechanism includes movable block and material frame, the two sides of movable block are vertically and fixedly provided with support rod, the outer end of support rod is slidably connected in the first sliding rail by the first sliding-rail sliding, opening is provided in the middle part of slot cover, its top is provided with left baffle and right baffle.The utility model can be such that workpiece and electroplate liquid more fully contacts by the stirring action of ultrasonic wave, and left baffle and right baffle can avoid impurity and fall into the case where splashing out in electrolyte with electrolyte.
Description
Technical field
The utility model belongs to electroplating technology, and in particular to a kind of ultrasonic wave added electroplanting device.
Background technique
Plating is exactly to plate the process of the other metal or alloy of a thin layer on certain metal surfaces using electrolysis principle, is
The technique of the surface of metal or other materials product attachment layer of metal film is set to prevent metal oxygen to play using electrolysis
The effects of changing, improving wearability, electric conductivity, reflective, corrosion resistance and having improved aesthetic appearance.When plating, coated metal or other not
Soluble materials do anode, and workpiece to be plated does cathode, and the cation of coated metal is reduced to form coating in workpiece surface to be plated,
To exclude the interference of other cations, and coating is made uniformly, securely need to cook electroplate liquid with the solution of the cation containing coated metal,
To keep the concentration of coated metal cation constant.Electroplating process is metal ion in plating solution under the action of external electric field, warp
Electrode reaction is reduced into metallic atom, and in the process of the enterprising row metal deposition of cathode, and therefore, it includes that liquid phase passes that this, which is one,
Matter, electrochemical reaction and electrocrystallization and etc. metal electrodeposition process.Current electrolytic cell is all unlimited, and impurity is easy to
It falls into electrolyte, pollutes electrolyte, also, during material frame whereabouts, be easy to splash out electrolyte, cause the wave of electrolyte
Take, in consideration of it, it is necessary to make improvement to traditional electroplanting device.
Summary of the invention
To solve the deficiencies in the prior art, electrolyte is fallen into the purpose of this utility model is to provide avoidable impurity to neutralize
A kind of ultrasonic wave added electroplanting device for avoiding electrolyte from splashing out.
In order to achieve the above objectives, the utility model adopts the following technical solutions:
A kind of ultrasonic wave added electroplanting device, including electroplating bath and the slot cover that is bolted at the top of electroplating bath, electroplating bath
It is internally provided with galvanic anode, electroplating cathode, supersonic generator and mobile mechanism, there are two supersonic generators, solid respectively
Due to the front bottom end of electroplating bath inner left wall and right side inner wall, it is provided in the middle part of electroplating bath inner left wall and right side inner wall
Perpendicular to the first sliding rail of plating groove bottom wall, mobile mechanism includes movable block and material frame, and the two sides of movable block are vertically and fixedly provided with
The outer end of support rod, support rod is slidably connected in the first sliding rail by the first sliding-rail sliding, and opening is provided in the middle part of slot cover,
Its top is provided with left baffle and right baffle, be provided at the top of the slot cover of the left and right side that is open two it is parallel perpendicular to electricity
Second sliding rail of coating bath left side wall, the both ends of left baffle and right baffle bottom outside pass through the second sliding-rail sliding and are slidably connected to
In second sliding rail, to realize moving left and right for left baffle and right baffle.
Preferably, the cross section of aforementioned opening and material frame is round or rectangular, and the size being open is transversal greater than material frame
The size in face, can be with opening convenient for material frame.
More preferably, the size of aforementioned left baffle and right baffle is identical, and the sum of size of the two is greater than the size of opening,
Left baffle and right baffle can block opening, and impurity is avoided to fall into electrolyte, also can avoid electrolyte and splash out.
It is highly preferred that after aforementioned galvanic anode and electroplating cathode are individually fixed in electroplating bath inner left wall and right side inner wall
End middle part.
It is further preferred that the top setting of aforementioned movable block is fluted, material frame is arranged in the groove.
Specifically, the bottom wall and side wall of aforementioned material frame and the bottom of movable block are provided with several mesh, can make
Workpiece and electroplate liquid come into full contact with.
Preferably, it is provided with inlet at the top of aforementioned electroplating bath right side wall, the bottom of left side wall is provided with liquid outlet.
The structure of the ultrasonic wave added electroplanting device for having the beneficial effect that the utility model of the utility model is simple, uses
It is convenient, by the stirring action of ultrasonic wave, workpiece and electroplate liquid can be made more fully to contact；Left baffle and right baffle can be with
Opening is blocked, impurity is avoided to fall into electrolyte, electrolyte is also can avoid and splashes out；Material frame can be good convenient for feeding with opening
Blanking, greatly improves work efficiency and electroplating quality.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the utility model；
Fig. 2 is structural schematic diagram when mobile mechanism is moved upward to top in the utility model；,
Fig. 3 is the top view of slot cover in the utility model.
The meaning of appended drawing reference in figure: 1, electroplating bath, 2, slot cover, 3, galvanic anode, 4, electroplating cathode, 5, ultrasonic wave generation
Device, 6, movable block, 7, material frame, the 8, first sliding-rail sliding, 9, opening, 10, right baffle-plate, 11, right shell body, the 12, second sliding-rail sliding,
13, inlet, 14, liquid outlet, 15, support rod.
Specific embodiment
Specific introduce is made to the utility model below in conjunction with the drawings and specific embodiments.
Referring to Fig. 1,2 and 3, a kind of ultrasonic wave added electroplanting device of the utility model, including electroplating bath 1 and be bolted in
The slot cover 2 at 1 top of electroplating bath, electroplating bath 1 are internally provided with galvanic anode 3, electroplating cathode 4, supersonic generator 5 and movement
Mechanism, there are two supersonic generators 5, is individually fixed in the front bottom end of electroplating bath 1 inner left wall and right side inner wall, plating sun
Pole 3 and electroplating cathode 4 are individually fixed in the middle part of the rear end of 1 inner left wall of electroplating bath and right side inner wall.
It is provided with the first sliding rail perpendicular to 1 bottom wall of electroplating bath in the middle part of 1 inner left wall of electroplating bath and right side inner wall, moves
Motivation structure includes movable block 6 and material frame 7, and the top setting of movable block 6 is fluted, and material frame 7 is arranged in the groove, the bottom of material frame 7
The bottom of wall and side wall and movable block 6 is provided with several mesh, and workpiece and electroplate liquid can be made to come into full contact with.
The two sides of movable block 6 are vertically and fixedly provided with support rod 15, and the outer end of support rod 15 is slided by the first sliding-rail sliding 8
It is connected in the first sliding rail, the middle part of slot cover 2 is provided with opening 9, and top is provided with right baffle-plate 10 and right shell body 11, opening 9
Two parallel the second sliding rails perpendicular to 1 left side wall of electroplating bath, right baffle-plate 10 are provided at the top of the slot cover 2 of left and right side
Pass through the second sliding-rail sliding 12 with the both ends of 11 bottom outside of right shell body to be slidably connected in the second sliding rail, to realize right baffle-plate
10 and right shell body 11 move left and right.
The cross section of opening 9 and material frame 7 is round or rectangular, and the size of opening 9 is greater than the ruler of 7 cross section of material frame
It is very little, it can be with opening 9 convenient for material frame 7.Right baffle-plate 10 is identical with the size of right shell body 11, and the sum of size of the two be greater than open
The size of mouth 9, right baffle-plate 10 and right shell body 11 can block opening 9, impurity avoided to fall into electrolyte, also can avoid electrolyte
It splashes out.
Inlet 13 is provided at the top of 1 right side wall of electroplating bath, the bottom of left side wall is provided with liquid outlet 14.
The structure of the ultrasonic wave added electroplanting device of the utility model is simple, easy to use, by the stirring action of ultrasonic wave,
Workpiece and electroplate liquid can be made more fully to contact；Right baffle-plate 10 and right shell body 11 can block opening 9, and impurity is avoided to fall into
In electrolyte, it also can avoid electrolyte and splash out；Material frame 7 can be convenient for the good blanking of feeding, be substantially increased work with opening 9
Efficiency and electroplating quality.
The basic principles and main features and advantage of the utility model have been shown and described above.The technical staff of the industry
It should be appreciated that above-described embodiment does not limit the utility model in any form, it is all by the way of equivalent substitution or equivalent transformation
Technical solution obtained, all falls in the protection scope of the utility model.
Claims (7)
1. a kind of ultrasonic wave added electroplanting device, including electroplating bath and the slot cover being bolted at the top of electroplating bath, which is characterized in that
The electroplating bath is internally provided with galvanic anode, electroplating cathode, supersonic generator and mobile mechanism, and the ultrasonic wave occurs
There are two devices, is individually fixed in the front bottom end of electroplating bath inner left wall and right side inner wall, the electroplating bath inner left wall and the right side
The first sliding rail perpendicular to plating groove bottom wall is provided in the middle part of the inner wall of side, the mobile mechanism includes movable block and material frame,
The two sides of the movable block are vertically and fixedly provided with support rod, and the outer end of the support rod is slidably connected to by the first sliding-rail sliding
In first sliding rail, be provided with opening in the middle part of the slot cover, top is provided with left baffle and right baffle, on the left of the opening and
Two parallel the second sliding rails perpendicular to electroplating bath left side wall, the right baffle-plate and right gear are provided at the top of the slot cover on right side
The both ends of plate bottom outside pass through the second sliding-rail sliding and are slidably connected in the second sliding rail, to realize left baffle and right baffle
It moves left and right.
2. a kind of ultrasonic wave added electroplanting device according to claim 1, which is characterized in that the opening is transversal with material frame
Face is round or rectangular, and the size being open is greater than the size of material frame cross section.
3. a kind of ultrasonic wave added electroplanting device according to claim 1, which is characterized in that the left baffle and right baffle
Size is identical, and the sum of size of the two is greater than the size of opening.
4. a kind of ultrasonic wave added electroplanting device according to claim 1, which is characterized in that the galvanic anode and plating yin
Pole is individually fixed in the middle part of the rear end of electroplating bath inner left wall and right side inner wall.
5. a kind of ultrasonic wave added electroplanting device according to claim 1, which is characterized in that the top of the movable block is arranged
Fluted, the material frame is arranged in the groove.
6. a kind of ultrasonic wave added electroplanting device according to claim 1, which is characterized in that the bottom wall and side wall of the material frame
And the bottom of movable block is provided with several mesh.
7. a kind of ultrasonic wave added electroplanting device according to claim 1, which is characterized in that the top of the electroplating bath right side wall
Portion is provided with inlet, and the bottom of left side wall is provided with liquid outlet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821672465.1U CN208965058U (en) | 2018-10-16 | 2018-10-16 | A kind of ultrasonic wave added electroplanting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821672465.1U CN208965058U (en) | 2018-10-16 | 2018-10-16 | A kind of ultrasonic wave added electroplanting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208965058U true CN208965058U (en) | 2019-06-11 |
Family
ID=66758628
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821672465.1U Expired - Fee Related CN208965058U (en) | 2018-10-16 | 2018-10-16 | A kind of ultrasonic wave added electroplanting device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208965058U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110257895A (en) * | 2019-06-24 | 2019-09-20 | 江苏守航实业有限公司 | A kind of electrolytic polishing method and device of semiconductor material |
| CN112609227A (en) * | 2020-12-08 | 2021-04-06 | 陈晓萍 | Plating bath |
-
2018
- 2018-10-16 CN CN201821672465.1U patent/CN208965058U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110257895A (en) * | 2019-06-24 | 2019-09-20 | 江苏守航实业有限公司 | A kind of electrolytic polishing method and device of semiconductor material |
| CN112609227A (en) * | 2020-12-08 | 2021-04-06 | 陈晓萍 | Plating bath |
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190611 Termination date: 20211016 |