CN217203022U - Electroplating device for improving electroplating uniformity - Google Patents
Electroplating device for improving electroplating uniformity Download PDFInfo
- Publication number
- CN217203022U CN217203022U CN202220330595.7U CN202220330595U CN217203022U CN 217203022 U CN217203022 U CN 217203022U CN 202220330595 U CN202220330595 U CN 202220330595U CN 217203022 U CN217203022 U CN 217203022U
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- Prior art keywords
- wall
- electroplating
- pipe
- fixedly connected
- flow guide
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- 238000009713 electroplating Methods 0.000 title claims abstract description 79
- 238000007747 plating Methods 0.000 claims abstract description 52
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 20
- 238000007789 sealing Methods 0.000 claims description 27
- 239000000919 ceramic Substances 0.000 claims description 23
- 239000007788 liquid Substances 0.000 claims description 20
- 238000011084 recovery Methods 0.000 claims description 6
- 238000001914 filtration Methods 0.000 claims description 5
- 229910021645 metal ion Inorganic materials 0.000 abstract description 16
- 238000012797 qualification Methods 0.000 abstract description 5
- 230000007613 environmental effect Effects 0.000 abstract description 4
- 238000000034 method Methods 0.000 abstract description 3
- 239000002184 metal Substances 0.000 description 6
- 150000001768 cations Chemical class 0.000 description 4
- 238000005086 pumping Methods 0.000 description 3
- 238000004065 wastewater treatment Methods 0.000 description 3
- 241001233242 Lontra Species 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000009827 uniform distribution Methods 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000002198 insoluble material Substances 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
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- Electroplating Methods And Accessories (AREA)
Abstract
The utility model relates to an electroplating device technical field just discloses an improve electroplating device of electroplating homogeneity, including the plating bath, two connecting rods of the inner wall fixedly connected with of plating bath, two the common fixedly connected with positive pole kuppe of the pole wall of connecting rod, the bottom mounting intercommunication of positive pole kuppe has the water pump, the bottom of water pump and the bottom inner wall fixed connection of plating bath, the inner wall fixedly connected with top honeycomb duct and the bottom honeycomb duct of plating bath, the equal fixed intercommunication in side of top honeycomb duct and bottom honeycomb duct has the solenoid valve, two the common fixed intercommunication of input of solenoid valve has the U-shaped pipe, the fixed intercommunication of outer wall of U-shaped pipe has the branch pipe. The utility model discloses can effectively improve the homogeneity of plating layer thickness in plating a piece electroplating to and improved a qualification rate and the quality of electroplating process, the device still has the ability that metal ion retrieved moreover, and can effectively improve the environmental protection performance of device.
Description
Technical Field
The utility model relates to an electroplating device technical field especially relates to an improve electroplating homogeneity's electroplating device.
Background
The purpose of electroplating is to plate a metal or alloy coating on a substrate, altering the surface properties or dimensions of the substrate. The plating can enhance the corrosion resistance of metal, increase the hardness, prevent abrasion, improve the conductivity, smoothness, heat resistance and beautifulness of the surface, when in plating, the plating metal or other insoluble materials are used as the anode, the workpiece to be plated is used as the cathode, the cations of the plating metal are reduced on the surface of the workpiece to be plated to form a plating layer, in order to eliminate the interference of other cations and ensure the plating layer to be uniform and firm, the solution containing the plating metal cations is used as the plating solution to keep the concentration of the plating metal cations unchanged.
In the current electroplating process, the condition that the concentration distribution of electroplating solution at the periphery of a plated part in an electroplating bath is uneven can lead to poor uniformity of the thickness of the plating layer in the plated part and easily influence the qualification rate and quality of electroplating processing of the plated part.
SUMMERY OF THE UTILITY MODEL
The utility model aims at solving the problem that the plating layer thickness of the plated part is poor due to the uneven distribution of the plating solution at the periphery of the plated part in the plating bath in the prior art, and easily influencing the plating yield and quality of the plated part, and providing an electroplating device for improving the electroplating uniformity.
In order to realize the purpose, the utility model adopts the following technical scheme:
an electroplating device for improving electroplating uniformity comprises an electroplating bath, wherein the inner wall of the electroplating bath is fixedly connected with two connecting rods, the rod walls of the two connecting rods are fixedly connected with an anode air guide sleeve, the bottom end of the anode diversion cover is fixedly communicated with a water pump, the bottom end of the water pump is fixedly connected with the inner wall of the bottom end of the electroplating bath, the inner wall of the electroplating bath is fixedly connected with a top flow guide pipe and a bottom flow guide pipe, the side ends of the top flow guide pipe and the bottom flow guide pipe are both fixedly communicated with electromagnetic valves, the input ends of the two electromagnetic valves are jointly and fixedly communicated with a U-shaped pipe, the outer wall of the U-shaped pipe is fixedly communicated with a branch pipe, the input end of the branch pipe is fixedly communicated with the output end of the water pump, the outer walls of the top flow guide pipe and the bottom flow guide pipe are fixedly communicated with a plurality of output pipes, and the outer wall of the electroplating bath is fixedly communicated with a recovery mechanism.
Preferably, retrieve the mechanism include with plating bath outer wall fixed connection's drawing liquid pump, the fixed intercommunication of input of drawing liquid pump has the check valve, check valve matched with fixing hole has been seted up to the outer wall of plating bath, the fixed intercommunication of output of drawing liquid pump has the hose, the fixed intercommunication of output of hose has seals the stopper, the outer wall threaded connection who seals the stopper has the filter tube, the outer wall of filter tube is connected with the lower fixed surface of plating bath, the fixed intercommunication of side of filter tube has water pipe head, the inner wall connection of filter tube has ceramic filter element.
Preferably, the outer wall of the ceramic filter element is movably sleeved with a limiting ring, and the outer wall of the limiting ring is fixedly connected with the inner wall of the filter pipe.
Preferably, the outer wall of the sealing plug is movably sleeved with a sealing ring, and the outer walls of two sides of the sealing ring are respectively movably connected with the outer wall of the sealing plug and the outer wall of the filtering pipe.
Preferably, the outer wall of the sealing plug is fixedly connected with two rotating rods which are symmetrically distributed.
Preferably, the outer walls of the top draft tube and the bottom draft tube are fixedly communicated with a plurality of bent tubes.
Preferably, the outer wall fixedly connected with of ceramic filter core supports the otter board, the outer wall of support otter board and the inner wall fixed connection of filter tube, the feed liquor end of ceramic filter core and the inner wall swing joint who seals the stopper.
Compared with the prior art, the utility model provides an improve electroplating device of electroplating homogeneity possesses following beneficial effect:
1. the electroplating device for improving the electroplating uniformity is provided with the water pump, the anode air guide sleeve, the output pipe and the electromagnetic valve, when a plated part is electroplated, firstly the anode is placed on the inner side of the anode air guide sleeve, simultaneously pouring electroplating solution into the electroplating bath, submerging the top ends of the top flow guide pipe and the anode flow guide cover by the electroplating solution, then starting the electromagnetic valve and the water pump, conveying metal ions generated by the anode to the periphery of the plated part through the branch pipe, the U-shaped pipe, the top flow guide pipe, the bottom flow guide pipe, the conveying pipe and the bent pipe by the water pump through the anode flow guide cover, and regulating the quantity of the metal ions conveyed to the periphery of the plated part through the electromagnetic valve, thereby realizing the uniform distribution of the concentration of the electroplating solution around the plated part in the electroplating bath and further ensuring the uniform thickness of the plating layer of the plated part, the mechanism can effectively improve the uniformity of the thickness of the plating layer in the electroplating of the plated part, and improve the qualification rate and the quality of the electroplating processing of the plated part.
2. This improve electroplating device of electroplating homogeneity, through being provided with the filter tube, ceramic filter element and drawing liquid pump, when the plating solution needs the discharge in the plating bath, at first start the drawing liquid pump, the drawing liquid pump passes through the hose and carries the plating solution in the filter tube, and filter through ceramic filter element, metal ion in the plating solution can be held back to ceramic filter element, realize metal ion reuse, and be favorable to waste water treatment, this mechanism makes the device have the ability that metal ion retrieved, and can improve the feature of environmental protection performance of device.
The device does not involve the part all the same with prior art or can adopt prior art to realize, the utility model discloses can effectively improve the homogeneity of plating layer thickness in plating a piece is electroplated to and improved a qualification rate and the quality of plating a piece electroplating process, the device still has the ability that metal ion retrieved moreover, and can effectively improve the feature of environmental protection of device.
Drawings
FIG. 1 is a schematic structural view of an electroplating apparatus for improving electroplating uniformity according to the present invention;
FIG. 2 is a schematic structural diagram of a portion A of an electroplating apparatus for improving electroplating uniformity according to the present invention.
In the figure: 1 electroplating bath, 2 connecting rods, 3 anode air guide sleeve, 4 water pump, 5 top guide pipe, 6 bottom guide pipe, 7 electromagnetic valve, 8U-shaped pipe, 9 recovery mechanism, 91 liquid pump, 92 one-way valve, 93 hose, 94 sealing plug, 95 filtering pipe, 96 water pipe joint, 97 ceramic filter element, 10 branch pipe, 11 output pipe, 12 spacing ring, 13 sealing ring, 14 rotating rod, 15 elbow pipe, 16 supporting screen plate.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.
As shown in fig. 1-2, in embodiment 2, based on embodiment 1, the outer wall of the electroplating bath 1 is fixedly communicated with a recovery mechanism 9, the recovery mechanism 9 includes a liquid pumping pump 91 fixedly connected to the outer wall of the electroplating bath 1, an input end of the liquid pumping pump 91 is fixedly communicated with a check valve 92, the outer wall of the electroplating bath 1 is provided with a fixed through hole matched with the check valve 92, an output end of the liquid pumping pump 91 is fixedly communicated with a hose 93, an output end of the hose 93 is fixedly communicated with a sealing plug 94, an outer wall of the sealing plug 94 is in threaded connection with a filter pipe 95, an outer wall of the sealing plug 94 is movably sleeved with a sealing ring 13, outer walls of two sides of the sealing ring 13 are respectively movably connected with the outer wall of the sealing plug 94 and the outer wall of the filter pipe 95, the sealing ring 13 can improve the sealing performance of the connection of the sealing plug 94, the outer wall of the sealing plug 94 is fixedly connected with two symmetrically distributed rotating rods 14, and the rotating rods 14 can facilitate the rotation of the opening of the sealing plug 94.
The outer wall of the filter pipe 95 is fixedly connected with the lower surface of the electroplating bath 1, the side end of the filter pipe 95 is fixedly communicated with a water pipe joint 96, the inner wall of the filter pipe 95 is connected with a ceramic filter element 97, the ceramic filter element 97 filters, the ceramic filter element 97 can intercept metal ions in electroplating liquid, metal ions are recycled, and wastewater treatment is facilitated.
The outer wall of the ceramic filter element 97 is movably sleeved with a limit ring 12, the outer wall of the limit ring 12 is fixedly connected with the inner wall of the filter pipe 95, the limit ring 12 can improve the placing stability of the ceramic filter element 97 in the filter pipe 95, the outer wall of the ceramic filter element 97 is fixedly connected with a support screen plate 16, the outer wall of the support screen plate 16 is fixedly connected with the inner wall of the filter pipe 95, the liquid inlet end of the ceramic filter element 97 is movably connected with the inner wall of the sealing plug 94, the support screen plate 16 can ensure the placing stability of the ceramic filter element 97 and improve the filtering reliability of the ceramic filter element 97, and the water pump 4 and the liquid pump 91 are both electrically connected with an external power supply through a control switch.
In the utility model, when a plating part is electroplated, firstly, the anode is placed at the inner side of the anode air guide sleeve 3, meanwhile, plating solution is poured into the plating bath 1, and the plating solution submerges the top of the top honeycomb duct 5 and the anode air guide sleeve 3, then the electromagnetic valve 7 and the water pump 4 are started, the water pump 4 conveys metal ions generated by the anode through the anode air guide sleeve 3 to the periphery of the plating part through the branch pipe 10, the U-shaped pipe 8, the top honeycomb duct 5, the bottom honeycomb duct 6, the conveying pipe 11 and the elbow pipe 15, and the quantity of the metal ions conveyed to the periphery of the plating part is adjusted through the electromagnetic valve 7, thereby realizing the uniform distribution of the concentration of the plating solution at the periphery of the plating part in the plating bath 1, further ensuring the uniform thickness of the plating layer of the plating part, the mechanism can effectively improve the uniformity of the thickness of the plating layer in the plating part electroplating, and improve the qualification rate and quality of the electroplating processing of the plating part, when the plating solution in the plating bath 1 needs to be discharged, at first start drawing liquid pump 91, drawing liquid pump 91 passes through hose 93 and carries the plating solution to filter tube 95 in, and filters through ceramic filter core 97, and metal ion in the plating solution can be held back to ceramic filter core 97, realizes metal ion reuse, is favorable to waste water treatment moreover, and this mechanism makes the device have the ability that metal ion retrieved, and can improve the feature of environmental protection of device.
The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.
Claims (7)
1. An electroplating device for improving electroplating uniformity comprises an electroplating bath (1) and is characterized in that two connecting rods (2) are fixedly connected to the inner wall of the electroplating bath (1), an anode flow guide cover (3) is fixedly connected to the rod walls of the two connecting rods (2) together, a water pump (4) is fixedly communicated with the bottom end of the anode flow guide cover (3), the bottom end of the water pump (4) is fixedly connected with the inner wall of the bottom end of the electroplating bath (1), a top flow guide pipe (5) and a bottom flow guide pipe (6) are fixedly connected to the inner wall of the electroplating bath (1), electromagnetic valves (7) are fixedly communicated with the side ends of the top flow guide pipe (5) and the bottom flow guide pipe (6), a U-shaped pipe (8) is fixedly communicated with the input end of the two electromagnetic valves (7), a branch pipe (10) is fixedly communicated with the outer wall of the U-shaped pipe (8), and the input end of the branch pipe (10) is fixedly communicated with the output end of the water pump (4), the outer walls of the top flow guide pipe (5) and the bottom flow guide pipe (6) are fixedly communicated with a plurality of output pipes (11), and the outer wall of the electroplating bath (1) is fixedly communicated with a recovery mechanism (9).
2. An electroplating apparatus according to claim 1, wherein the plating bath is provided with a plating bath chamber, the recovery mechanism (9) comprises a liquid pump (91) fixedly connected with the outer wall of the electroplating bath (1), the input end of the liquid pump (91) is fixedly communicated with a one-way valve (92), the outer wall of the electroplating bath (1) is provided with a fixed through hole matched with the one-way valve (92), the output end of the liquid pump (91) is fixedly communicated with a hose (93), the output end of the hose (93) is fixedly communicated with a sealing plug (94), the outer wall of the sealing plug (94) is in threaded connection with a filter pipe (95), the outer wall of the filter pipe (95) is fixedly connected with the lower surface of the electroplating bath (1), the side end of the filtering pipe (95) is fixedly communicated with a water pipe joint (96), and the inner wall of the filtering pipe (95) is connected with a ceramic filter element (97).
3. The electroplating device for improving the electroplating uniformity as claimed in claim 2, wherein a limiting ring (12) is movably sleeved on the outer wall of the ceramic filter element (97), and the outer wall of the limiting ring (12) is fixedly connected with the inner wall of the filter pipe (95).
4. The electroplating device for improving the electroplating uniformity as claimed in claim 2, wherein the sealing plug (94) is movably sleeved with a sealing ring (13), and the outer walls of two sides of the sealing ring (13) are respectively movably connected with the outer wall of the sealing plug (94) and the outer wall of the filter pipe (95).
5. An electroplating device for improving electroplating uniformity according to claim 2, wherein two symmetrically distributed rotating rods (14) are fixedly connected to the outer wall of the sealing plug (94).
6. The electroplating apparatus for improving electroplating uniformity according to claim 1, wherein the outer walls of the top flow guide pipe (5) and the bottom flow guide pipe (6) are fixedly communicated with a plurality of bent pipes (15).
7. The electroplating device for improving the electroplating uniformity as claimed in claim 2, wherein a supporting screen plate (16) is fixedly connected to the outer wall of the ceramic filter element (97), the outer wall of the supporting screen plate (16) is fixedly connected to the inner wall of the filter pipe (95), and the liquid inlet end of the ceramic filter element (97) is movably connected to the inner wall of the sealing plug (94).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220330595.7U CN217203022U (en) | 2022-02-18 | 2022-02-18 | Electroplating device for improving electroplating uniformity |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220330595.7U CN217203022U (en) | 2022-02-18 | 2022-02-18 | Electroplating device for improving electroplating uniformity |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217203022U true CN217203022U (en) | 2022-08-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220330595.7U Expired - Fee Related CN217203022U (en) | 2022-02-18 | 2022-02-18 | Electroplating device for improving electroplating uniformity |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217203022U (en) |
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2022
- 2022-02-18 CN CN202220330595.7U patent/CN217203022U/en not_active Expired - Fee Related
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| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20220816 |
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| CF01 | Termination of patent right due to non-payment of annual fee |