CN210481547U - Pipe electroplating equipment - Google Patents
Pipe electroplating equipment Download PDFInfo
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- CN210481547U CN210481547U CN201921418175.9U CN201921418175U CN210481547U CN 210481547 U CN210481547 U CN 210481547U CN 201921418175 U CN201921418175 U CN 201921418175U CN 210481547 U CN210481547 U CN 210481547U
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Abstract
A pipe electroplating device comprises an electroplating bath with chemical liquid inside, a pipe body arranged in the electroplating bath and placed in the chemical liquid, and a feeding device for conveying the chemical liquid to an inner wall electroplating area, wherein the inner wall electroplating area is formed inside the pipe body; the feeding device comprises a liquid conveying pipe, a power pump and a chemical liquid pool, wherein the liquid conveying pipe, the power pump and the chemical liquid pool are sequentially communicated, the chemical liquid pool is internally provided with chemical liquid, the liquid conveying pipe extends into the liquid conveying pipe, a plurality of liquid outlet holes are formed in the side portion of the liquid conveying pipe, and the liquid outlet holes are arranged at intervals along the length direction of the liquid conveying pipe. The utility model discloses material feeding unit can be to the interval chemical liquid of carrying of inner wall electroplating, guarantees the electroplating effect of body inner wall.
Description
Technical Field
The utility model relates to an electroplate the processing field, especially relate to an electroplating equipment of idle call copper-plated steel pipe.
Background
The three-meter pipe for the air conditioner generally adopts a pure copper pipe, the production process of the pure copper pipe generally comprises the steps of cutting a straight copper pipe into specified lengths, chamfering the two ends of the straight copper pipe, removing burrs, and then performing subsequent forming and processing, wherein in actual use, the two ends of the copper pipe are respectively welded and sealed with corresponding pipes. The copper pipe has the following defects:
1. the pure copper is soft, so that the copper pipe is easy to deform when being pressed by external force, the size of the copper pipe is unqualified, and the assembly machine is influenced;
2. copper powder is generated in the chamfering process of the copper pipe, the copper powder is adhered to the inner wall of the copper pipe and is difficult to clean, and the residual copper powder influences the operation of the compressor;
3. when the air conditioner operates, the copper pipe needs to bear certain pressure, the pressure resistance of the copper pipe is limited, and certain pipe explosion risks exist in the operation.
Aiming at the problems, in the prior art, a copper-plated steel pipe can be adopted to replace a pure copper pipe, and the copper-plated steel pipe has the following advantages:
1. the material cost is effectively reduced;
2. the copper-plated steel pipe is not easy to deform, the compression resistance of the copper-plated steel pipe is better, the size of the product is stable, and the reject ratio of the installation is reduced;
3. copper powder is not generated in the processing process of the copper-plated steel pipe, the cleaning is simple, and the processing difficulty is small.
Wherein, at least the middle part of the inner wall of the steel pipe needs to be electroplated with a copper layer with the thickness of more than 10 microns, and the steel pipe needs to be placed in the electroplating liquid medicine of the electroplating bath for electroplating. The problems are that in the electroplating process, after copper ions in electroplating liquid medicine inside the steel pipe are consumed, the steel pipe belongs to a slender pipe, the mobility of the electroplating liquid medicine inside the steel pipe is poor, so that the copper ions are supplemented slowly, the electroplating liquid medicine outside the steel pipe and inside the steel pipe is not uniform, the difference of electroplating rates of the outer wall and the inner wall of the steel pipe is large, the electroplating effect of the inner wall of the steel pipe is poor, and a copper layer on the inner wall of the steel pipe cannot meet the requirement, so that certain limitation exists.
SUMMERY OF THE UTILITY MODEL
The utility model aims to overcome at least one of the deficiencies of the prior art and provide a tubular product electroplating device, its material feeding unit can be to the interval chemical liquid of carrying of inner wall electroplating, guarantees the electroplating effect of body inner wall.
The purpose of the utility model is realized like this:
a pipe electroplating device comprises an electroplating bath with chemical liquid inside, a pipe body arranged in the electroplating bath and placed in the chemical liquid, and a feeding device for conveying the chemical liquid to an inner wall electroplating area, wherein the inner wall electroplating area is formed inside the pipe body;
the feeding device comprises a liquid conveying pipe, a power pump and a chemical liquid pool, wherein the liquid conveying pipe, the power pump and the chemical liquid pool are sequentially communicated, the chemical liquid pool is internally provided with chemical liquid, the liquid conveying pipe extends into the liquid conveying pipe, a plurality of liquid outlet holes are formed in the side portion of the liquid conveying pipe, and the liquid outlet holes are arranged at intervals along the length direction of the liquid conveying pipe.
The plating bath is communicated with the chemical liquid pool through a return pipe.
Including the overflow pond, the plating bath stretches into in the overflow pond from the bottom in overflow pond, and the top of plating bath and the inside intercommunication in overflow pond are equipped with the overflow hole on the overflow pond, back flow one end and overflow hole intercommunication.
The diameter of the liquid outlet hole is gradually reduced from the head end of the liquid conveying pipe to the tail end of the liquid conveying pipe;
the distance between the adjacent liquid outlet holes is gradually increased from the head end of the infusion tube to the tail end of the infusion tube.
The bottom of the electroplating bath is provided with a mounting disc, a through hole is formed in the mounting disc, the pipe body is arranged on the through hole, the bottom of the infusion pipe is communicated with the through hole, and a pipeline for connecting the through hole with the power pump is arranged at the bottom of the mounting disc.
And an anode positioning groove positioned outside the through hole is formed in the mounting disc, and a copper rod is inserted into the anode positioning groove.
The mounting disc is provided with a cathode lower positioning seat positioned on the through hole;
the bottom end of the tube body is arranged on the cathode lower positioning seat, and the liquid conveying tube penetrates through the cathode lower positioning seat downwards and extends into the through hole.
A positioning plate is arranged at the upper part of the inner side of the electroplating bath, the side part of the positioning plate is in abutting contact with the inner wall of the electroplating bath, and a through hole for chemical liquid to pass through is formed in the positioning plate;
the bottom of the positioning plate is provided with an upper positioning seat, and the top end of the pipe body is abutted to and contacted with the upper positioning seat.
The bottom surface of the upper positioning seat and the end part, corresponding to the tube body, of the upper surface of the cathode lower positioning seat are respectively provided with a plurality of positioning columns which are uniformly distributed along the circumferential direction, positioning inclined planes are arranged on the inner sides of the positioning columns, and the end part of the tube body is abutted against and contacted with the corresponding positioning inclined planes.
The pipe body is vertically arranged along the length direction of the pipe body.
Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.
Drawings
Fig. 1 is a schematic structural diagram of an embodiment of the present invention.
Fig. 2 is a cross-sectional view of an embodiment of the present invention.
Fig. 3 is a partially enlarged view of the portion of fig. 2A.
Fig. 4 is a schematic structural view of a cathode lower positioning seat according to an embodiment of the present invention.
Detailed Description
The present invention will be further described with reference to the accompanying drawings and examples.
Referring to fig. 1 to 4, the pipe electroplating apparatus includes an electroplating bath 1 having a chemical solution (i.e., an electroplating chemical solution) therein, and a pipe 2 disposed in the electroplating bath 1 and disposed in the chemical solution, wherein an inner wall electroplating section 3 is formed inside the pipe 2, an outer wall electroplating section 21 is formed between an outer side surface of the pipe 2 and an inner wall of the electroplating bath 1, and a feeding device for feeding the chemical solution to the inner wall electroplating section 3;
in the electroplating process of the pipe electroplating equipment, the feeding device continuously conveys chemical liquid to the inside of the pipe body 2, so that copper ions consumed in the electroplating process in the inner wall electroplating interval 3 are supplemented, the flow of the chemical liquid in the inside of the pipe body 2 is promoted, and the electroplating effect of the inner wall of the pipe body 2 is ensured.
Further, the pipe body 2 is vertically arranged along the length direction thereof.
The feeding device comprises a liquid conveying pipe 4, a power pump 5 and a chemical liquid pool 6, wherein the liquid conveying pipe 4, the power pump 5 and the chemical liquid pool 6 are sequentially communicated, the liquid conveying pipe 4 extends into the pipe body 2, a plurality of liquid outlet holes 7 are formed in the side portion of the liquid conveying pipe 4, and the liquid outlet holes 7 are arranged at intervals along the length direction of the liquid conveying pipe 4. The liquid outlet hole 7 is communicated with the side part of the transfusion tube 4.
When the power pump 5 operates, chemical liquid in the chemical liquid pool 6 is pumped into the liquid conveying pipe 4, and the chemical liquid is supplemented to different height positions of the inner wall electroplating section 3 through the liquid outlet holes 7 at the side part of the liquid conveying pipe 4, so that the copper ions are rapidly supplemented, and the electroplating effect of the inner wall of the pipe body 2 is ensured.
The top end of the transfusion tube 4 is flush with the top end of the tube body 2, or the top end of the transfusion tube 4 is lower than the top end of the tube body 2.
Further, the plating tank 1 is communicated with the chemical liquid pool 6 through a return pipe 8.
The electroplating bath 1, the return pipe 8, the chemical liquid pool 6, the power pump 5 and the liquid conveying pipe 4 are sequentially connected end to form a chemical liquid circulating system, so that the circulating flow of the chemical liquid is promoted.
Further, the electroplating bath device comprises an overflow pool 9, the electroplating bath 1 extends into the overflow pool 9 from the bottom of the overflow pool 9, the top of the electroplating bath 1 is communicated with the inside of the overflow pool 9, an overflow hole 10 is arranged on the overflow pool 9, and one end of a return pipe 8 is communicated with the overflow hole 10.
The overflow aperture 10 is arranged in the lower part or bottom of the side of the overflow basin 9.
The pipe electroplating equipment further comprises a support 25 and a fixing seat 26, the electroplating bath 1 is arranged in the support 25, the overflow tank 9 is arranged at the top of the support 25, the chemical liquid tank 6 is positioned at the outer side of the support 25, and the electroplating bath 1 is arranged on the fixing seat 26.
The fixed seat 26 is located at the bottom of the bracket 25, and the power pump 5 is located at the side of the fixed seat 26.
Since the tube body 2 is vertically arranged along the length direction thereof, the infusion tube 4 extends into the tube body 2, and therefore, the infusion tube 4 is also vertically arranged along the length direction thereof.
The power pump 5 pumps the chemical liquid into the infusion tube 4, and the conveying speed of the chemical liquid in the infusion tube 4 is larger as the interior of the infusion tube 4 is closer to the head end of the infusion tube 4.
Further, the diameter of the liquid outlet hole 7 is gradually increased from the head end of the liquid conveying pipe 4 to the tail end of the liquid conveying pipe 4; the distance between the adjacent liquid outlet holes 7 is gradually reduced from the head end of the liquid conveying pipe 4 to the tail end of the liquid conveying pipe 4. The arrangement mode of the liquid outlet holes 7 balances the amount of chemical liquid supplemented to the inner wall of the tube body 2 at each height position of the liquid conveying tube 4, and ensures that copper ions in the electroplating section 3 of the inner wall are uniformly distributed.
Further, the bottom of the electroplating bath 1 is provided with a mounting disc 11, the mounting disc 11 is provided with a through hole 12, the through hole 12 is located at the circle center of the mounting disc 11, the tube body 2 is arranged on the through hole 12, the bottom of the infusion tube 4 is communicated with the through hole 12, and the bottom of the mounting disc 11 is provided with a pipeline 13 for connecting the through hole 12 with the power pump 5.
Furthermore, an anode positioning groove 22 located outside the through hole 12 is arranged on the mounting plate 11, and the copper rod 14 is inserted into the anode positioning groove 22. The number of the anode positioning grooves 22 is several and is arranged along the circumferential direction at intervals.
In the electroplating process, copper ions are electrolyzed from the copper bar 14 and supplemented into the chemical liquid, and the chemical liquid in the inner wall electroplating section 3 and the outer wall electroplating section is uniformly circulated by matching with the chemical liquid circulating system and the feeding device, so that the copper ions are uniformly electroplated on the outer wall and the inner wall of the pipe body 2.
Further, a cathode lower positioning seat 15 positioned on the through hole 12 is arranged on the mounting disc 11;
the bottom end of the tube body 2 is arranged on the cathode lower positioning seat 15 to realize the positioning of the bottom end of the tube body 2, and the infusion tube 4 downwards penetrates through the cathode lower positioning seat 15 and extends into the through hole 12.
The mounting disc 11 is provided with an anode wire 23 and a cathode wire 24, and the anode wire 23 and the cathode wire 24 are both arranged in the mounting disc 11 in a pre-buried mode. The mounting plate 11 is made of an insulating material, so that the anode wire 23 and the cathode wire 24 are prevented from being influenced with each other.
One end of the anode wire 23 extends to the bottom of the anode positioning groove 22 and is connected with the copper bar 14, and the other end of the anode wire 23 penetrates through the side part of the mounting disc 11 and penetrates out of the side part of the electroplating bath 1 and is connected with an external power supply.
One end of the cathode wire 24 extends to the upper surface of the mounting disc 11 and is connected with the bottom of the cathode lower positioning seat 15, and the other end of the cathode wire 24 penetrates through the side part of the mounting disc 11 and penetrates out of the side part of the electroplating bath 1 and is connected with an external power supply.
The infusion tube 4 is an auxiliary anode, and the infusion tube 4 is made of insoluble materials.
Furthermore, a positioning plate 16 is arranged at the upper part of the inner side of the electroplating bath 1, the side part of the positioning plate 16 is in abutting contact with the inner wall of the electroplating bath 1, and a through hole 20 for the chemical liquid to pass through is arranged on the positioning plate 16;
the bottom of the positioning plate 16 is provided with an upper positioning seat 17, and the top end of the tube body 2 is abutted against and contacted with the upper positioning seat 17, so that the top end of the tube body 2 is positioned.
Furthermore, the bottom surface of the upper positioning seat 17 and the upper surface of the cathode lower positioning seat 15 are provided with a plurality of positioning columns 18 uniformly distributed along the circumferential direction corresponding to the end portion of the tube body 2, the inner sides of the positioning columns 18 are provided with positioning inclined planes 19, and the end portion of the tube body 2 is abutted and contacted with the corresponding positioning inclined planes 19.
Compare in traditional tong or the fixed block of 2 lateral surfaces of centre gripping body and medial surface respectively, tong or fixed block are closely laminated with the contact position of 2 sides of body, lead to the contact position cladding material to be difficult to form, adopt the electroplating effect that leans on the locate mode can not influence 2 outer walls of body and inner wall of locating inclined plane 19 and the corresponding tip of body 2.
The above disclosure is only for the purpose of illustrating the preferred embodiments of the present invention and not for the purpose of limiting the same, and the appended claims are intended to cover all such modifications, equivalents, and alternatives falling within the scope of the present invention.
Claims (10)
1. The utility model provides a tubular product electroplating device, includes that inside plating bath (1) that have the chemical liquid and set up body (2) of placing in the chemical liquid in plating bath (1), the inside constitution inner wall of body (2) is electroplated interval (3), its characterized in that: the device also comprises a feeding device for conveying chemical liquid to the inner wall electroplating section (3);
the feeding device comprises a liquid conveying pipe (4), a power pump (5) and a chemical liquid pool (6) with chemical liquid inside, wherein the liquid conveying pipe (4) is sequentially communicated with the chemical liquid pool, the liquid conveying pipe (4) extends into the pipe body (2), a plurality of liquid outlet holes (7) are formed in the side portion of the liquid conveying pipe (4), and the liquid outlet holes (7) are arranged at intervals along the length direction of the liquid conveying pipe (4).
2. The pipe plating apparatus according to claim 1, wherein the plating tank (1) is communicated with the chemical liquid bath (6) through a return pipe (8).
3. The pipe electroplating apparatus according to claim 2, comprising an overflow tank (9), wherein the electroplating bath (1) extends into the overflow tank (9) from the bottom of the overflow tank (9), the top of the electroplating bath (1) is communicated with the inside of the overflow tank (9), the overflow tank (9) is provided with overflow holes (10), and one end of the return pipe (8) is communicated with the overflow holes (10).
4. The tube plating equipment as recited in claim 1, characterized in that the diameter of the liquid outlet hole (7) is gradually increased from the head end of the liquid conveying tube (4) to the tail end of the liquid conveying tube (4);
the distance between the adjacent liquid outlet holes (7) is gradually reduced from the head end of the liquid conveying pipe (4) to the tail end of the liquid conveying pipe (4).
5. The pipe electroplating equipment according to claim 1, wherein a mounting disc (11) is arranged at the bottom of the electroplating bath (1), a through hole (12) is formed in the mounting disc (11), the pipe body (2) is arranged on the through hole (12), the bottom of the infusion pipe (4) is communicated with the through hole (12), and a pipeline (13) for connecting the through hole (12) and the power pump (5) is arranged at the bottom of the mounting disc (11).
6. The pipe electroplating equipment according to claim 5, wherein the mounting plate (11) is provided with an anode positioning groove (22) positioned outside the through hole (12), and the copper rod (14) is inserted into the anode positioning groove (22).
7. The pipe electroplating equipment according to claim 5, wherein the mounting disc (11) is provided with a cathode lower positioning seat (15) positioned on the through hole (12);
the bottom end of the tube body (2) is arranged on the cathode lower positioning seat (15), and the liquid conveying tube (4) downwards penetrates through the cathode lower positioning seat (15) and extends into the through hole (12).
8. The pipe plating apparatus according to claim 7, wherein a positioning plate (16) is provided at an upper portion of an inner side of the plating tank (1), a side portion of the positioning plate (16) is in abutting contact with an inner wall of the plating tank (1), and a through hole (20) for passing a chemical liquid is provided on the positioning plate (16);
an upper positioning seat (17) is arranged at the bottom of the positioning plate (16), and the top end of the pipe body (2) is abutted and contacted with the upper positioning seat (17).
9. The pipe electroplating equipment according to claim 8, wherein the bottom surface of the upper positioning seat (17) and the upper surface of the cathode lower positioning seat (15) are provided with a plurality of positioning columns (18) which are uniformly distributed along the circumferential direction corresponding to the end part of the pipe body (2), the inner sides of the positioning columns (18) are provided with positioning inclined planes (19), and the end part of the pipe body (2) is in abutting contact with the corresponding positioning inclined planes (19).
10. A pipe plating apparatus according to any one of claims 1 to 9, characterized in that the pipe body (2) is arranged vertically along its length.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921418175.9U CN210481547U (en) | 2019-08-28 | 2019-08-28 | Pipe electroplating equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921418175.9U CN210481547U (en) | 2019-08-28 | 2019-08-28 | Pipe electroplating equipment |
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| Publication Number | Publication Date |
|---|---|
| CN210481547U true CN210481547U (en) | 2020-05-08 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921418175.9U Active CN210481547U (en) | 2019-08-28 | 2019-08-28 | Pipe electroplating equipment |
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| Country | Link |
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| CN (1) | CN210481547U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110468438A (en) * | 2019-08-28 | 2019-11-19 | 佛山市顺德区捷永电器实业有限公司 | A kind of tubing electroplating device |
| CN111850645A (en) * | 2020-07-17 | 2020-10-30 | 广东稳帝机械科技有限公司 | Pipe-spraying type local electroplating equipment |
-
2019
- 2019-08-28 CN CN201921418175.9U patent/CN210481547U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110468438A (en) * | 2019-08-28 | 2019-11-19 | 佛山市顺德区捷永电器实业有限公司 | A kind of tubing electroplating device |
| CN110468438B (en) * | 2019-08-28 | 2024-06-07 | 佛山市顺德区捷永电器实业有限公司 | Pipe electroplating equipment |
| CN111850645A (en) * | 2020-07-17 | 2020-10-30 | 广东稳帝机械科技有限公司 | Pipe-spraying type local electroplating equipment |
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