CN110468438A - A kind of tubing electroplating device - Google Patents
A kind of tubing electroplating device Download PDFInfo
- Publication number
- CN110468438A CN110468438A CN201910804404.9A CN201910804404A CN110468438A CN 110468438 A CN110468438 A CN 110468438A CN 201910804404 A CN201910804404 A CN 201910804404A CN 110468438 A CN110468438 A CN 110468438A
- Authority
- CN
- China
- Prior art keywords
- electroplating
- tube body
- tubing
- hole
- tube
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000009713 electroplating Methods 0.000 title claims abstract description 61
- 239000007788 liquid Substances 0.000 claims abstract description 49
- 230000010412 perfusion Effects 0.000 claims abstract description 45
- 239000000126 substance Substances 0.000 claims abstract description 43
- 239000012530 fluid Substances 0.000 claims abstract description 17
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 30
- 229910052802 copper Inorganic materials 0.000 claims description 26
- 239000010949 copper Substances 0.000 claims description 26
- 230000003247 decreasing effect Effects 0.000 claims description 3
- 238000009434 installation Methods 0.000 claims description 3
- 230000005611 electricity Effects 0.000 claims description 2
- 238000007747 plating Methods 0.000 abstract description 15
- 230000000694 effects Effects 0.000 abstract description 6
- 238000001802 infusion Methods 0.000 abstract description 2
- 229910000831 Steel Inorganic materials 0.000 description 16
- 239000010959 steel Substances 0.000 description 16
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 7
- 229910001431 copper ion Inorganic materials 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 239000003814 drug Substances 0.000 description 5
- 239000013589 supplement Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000002198 insoluble material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000009827 uniform distribution Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/04—Tubes; Rings; Hollow bodies
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
Including the internal electroplating bath with chemical liquids and the tube body being placed in chemical liquids in electroplating bath is arranged in a kind of tubing electroplating device, and section is electroplated in the Inner Constitution inner wall of tube body, further includes the feed device of inward wall plating section conveying chemical liquids；The feed device includes that the perfusion tube being sequentially communicated, kinetic pump and the internal chemical liquid pool with chemical liquids, perfusion tube protrude into tube body, and infusion tube side part is provided with several fluid holes, and several fluid holes are intervally arranged along the length direction of perfusion tube.Feed device of the present invention can inward wall plating section convey chemical liquids, guarantee the electroplating effect of inboard wall of tube body.
Description
Technical field
The present invention relates to plating manufacture field more particularly to a kind of electroplating devices of idle call copper facing steel pipe.
Background technique
Three mitrons of idle call generally use pure copper tube, and the production technology of pure copper tube usually cuts into straight copper tube specified
Length after, carry out Dual-head chamfering and removing flash removed, then carry out subsequent molding and processing, in actual use, copper pipe
Both ends carry out welded seal with corresponding tubing respectively.It is had the disadvantage in that using copper pipe
1, it since the material is soft for fine copper, is easily deformed when copper pipe is by external force pressure, causes copper tube size unqualified, influence to install；
2, copper pipe can generate copper powder in chamfer process, and copper powder is adhered to the inner wall of copper pipe and is difficult to clean completely, remaining
The operation of copper powder influence compressor；
3, when operation of air conditioner, copper pipe needs to bear certain pressure, and the anti-pressure ability of copper pipe is limited, exists in operation certain
Booster risk.
In view of the above-mentioned problems, in the prior art, pure copper tube can be replaced using copper facing steel pipe, be had using copper facing steel pipe following
Advantage:
1, material cost is effectively reduced；
2, copper facing steel pipe is unlikely to deform, and copper facing steel pipe compressive property is more preferable, and product size is stablized, and reduces installation fraction defective；
3, there is no copper powder generation in copper facing steel pipe process, cleaning is simple, and difficulty of processing is small.
Wherein, steel pipe inner wall at least middle part needs to be electroplated 10 μm or more of layers of copper, and steel pipe needs to be placed in the plating of electroplating bath
It is electroplated in liquid medicine.Problem is, in electroplating process, after the copper ion consumption in steel duct electroplating liquid medicine, due to steel pipe
Belong to elongated tubular, the poor fluidity of steel duct electroplating liquid medicine causes the supplement of copper ion more slow, steel pipe outside and steel pipe
Internal electroplating liquid medicine is uneven, and the rate of deposition of outer wall of steel pipe and inner wall differs greatly, the electroplating effect difference of steel pipe inner wall and
The layers of copper of steel pipe inner wall is unsatisfactory for requiring, and has some limitations.
Summary of the invention
It is an object of the invention at least overcome one of above-mentioned the shortcomings of the prior art, and provide a kind of tubing plating
Equipment, feed device can inward wall plating section convey chemical liquids, guarantee the electroplating effect of inboard wall of tube body.
The object of the present invention is achieved like this:
A kind of tubing electroplating device is placed in chemical liquids in electroplating bath including the internal electroplating bath with chemical liquids and setting
Tube body, it further includes the feed device of inward wall plating section conveying chemical liquids that section, which is electroplated, in the Inner Constitution inner wall of tube body；
The feed device includes the perfusion tube being sequentially communicated, kinetic pump and the internal chemical liquid pool with chemical liquids, perfusion tube
It protrudes into tube body, infusion tube side part is provided with several fluid holes, and several fluid holes are intervally arranged along the length direction of perfusion tube.
The electroplating bath is connected to by return pipe with chemical liquid pool.
Including run-off, electroplating bath protrudes into run-off from the bottom of run-off, the top of electroplating bath and run-off it is interior
Portion's connection, run-off are equipped with overflow hole, and return pipe one end is connected to overflow hole.
The diameter of the fluid hole is gradually decreased from the head end of perfusion tube to the end of perfusion tube；
The distance between adjacent fluid hole is gradually increased from the head end of perfusion tube to the end of perfusion tube.
The plating trench bottom is provided with mounting disc, and mounting disc is equipped with through-hole, and tube body is arranged on through-hole, perfusion tube bottom
Portion is connected to through-hole, and installation pan bottom is equipped with the pipeline of connection through-hole and kinetic pump.
The anode locating slot being provided on the outside of through-hole in the mounting disc is fitted with copper rod on anode locating slot.
Positioning seat under the cathode on through-hole is provided in the mounting disc；
The tube body bottom end is placed under cathode on positioning seat, and perfusion tube is passed down through positioning seat under cathode and protrudes into through-hole.
Top on the inside of the electroplating bath is provided with positioning plate, the side of positioning plate and the inner wall abutting contact of electroplating bath,
The perforation passed through for chemical liquids is provided on positioning plate；
The positioning plate bottom is provided with positioning seat, the top of tube body and upper positioning seat abutting contact.
The end that the upper surface of positioning seat corresponds to tube body under the bottom surface of the upper positioning seat and cathode is equipped with several edges
Circumferentially uniformly distributed positioning column is provided with positioning inclined-plane, the end of tube body and corresponding positioning inclined-plane abutting contact on the inside of positioning column.
The tube body is vertically arranged along its length.
Additional aspect and advantage of the invention will become obviously in following description section, and reality through the invention
It tramples and recognizes.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of one embodiment of the invention.
Fig. 2 is the cross-sectional view of one embodiment of the invention.
Fig. 3 is the portion Fig. 2A partial enlarged view.
Fig. 4 is the structural schematic diagram of positioning seat under one embodiment of the invention cathode.
Specific embodiment
The invention will be further described with reference to the accompanying drawings and embodiments.
Referring to figures 1-4, this tubing electroplating device, including the internal electroplating bath 1 with chemical liquids (i.e. electroplating liquid medicine) and
The tube body 2 being placed in chemical liquids in electroplating bath 1 is set, and section 3,2 lateral surface of tube body is electroplated in the Inner Constitution inner wall of tube body 2
Outer wall is constituted between 1 inner wall of electroplating bath, section 21 is electroplated, further include the feeding dress that inward wall plating section 3 conveys chemical liquids
It sets；
During this tubing electroplating device is electroplated, feed device constantly to 2 delivered inside chemical liquids of tube body, supplements inner wall plating
The copper ion that section 3 consumes in the plating process, while promoting the flowing of 2 internal chemical liquid of tube body, guarantee the electricity of 2 inner wall of tube body
Plate effect.
Further, the tube body 2 is vertically arranged along its length.
The feed device includes the chemical liquid pool 6 that the perfusion tube 4 being sequentially communicated, kinetic pump 5 and inside have chemical liquids,
Perfusion tube 4 protrudes into tube body 2, and 4 side of perfusion tube is provided with several fluid holes 7, and several fluid holes 7 are along the length side of perfusion tube 4
To being intervally arranged.The side of the perforation perfusion tube 4 of fluid hole 7.
When kinetic pump 5 is run, the chemical liquids in chemical liquid pool 6 are pumped into perfusion tube 4, chemical liquids pass through perfusion tube 4
The fluid hole 7 of side adds to the different height position in inner wall plating section 3, realizes the quick supplement of copper ion, guarantees tube body 2
The electroplating effect of inner wall.
The top of perfusion tube 4 is concordant with the top of tube body 2, alternatively, the top of perfusion tube 4 is lower than the top of tube body 2.
Further, the electroplating bath 1 is connected to by return pipe 8 with chemical liquid pool 6.
Electroplating bath 1, return pipe 8, chemical liquid pool 6, kinetic pump 5 and perfusion tube 4 head and the tail be sequentially connected and constitute chemical liquids and follow
Bad system promotes circulating for chemical liquids.
Further, including run-off 9, electroplating bath 1 protrude into run-off 9 from the bottom of run-off 9, the top of electroplating bath 1
Portion is connected to the inside of run-off 9, and run-off 9 is equipped with overflow hole 10, and 8 one end of return pipe is connected to overflow hole 10.
The lower part or bottom of 9 side of run-off is arranged in overflow hole 10.
This tubing electroplating device further includes bracket 25 and fixing seat 26, and electroplating bath 1 is arranged in bracket 25, and run-off 9 is set
It sets at the top of bracket 25, chemical liquid pool 6 is located at the outside of bracket 25, and electroplating bath 1 is arranged in fixing seat 26.
Fixing seat 26 is located at the bottom of bracket 25, and kinetic pump 5 is located at the side of fixing seat 26.
It being vertically arranged along its length in view of tube body 2, perfusion tube 4 protrudes into tube body 2, so, perfusion tube 4 is similarly edge
The length direction of its own is vertically arranged.
Chemical liquids are pumped into perfusion tube 4 by kinetic pump 5, are conveyed inside perfusion tube 4 closer to the chemical liquids of 4 head end of perfusion tube
Rate is bigger.
Further, the diameter of the fluid hole 7 is gradually increased from the head end of perfusion tube 4 to the end of perfusion tube 4；It is adjacent
The distance between fluid hole 7 is gradually decreased from the head end of perfusion tube 4 to the end of perfusion tube 4.The set-up mode of such fluid hole 7
Amount of each height and position of perfusion tube 4 to 2 inner wall of tube body supplement chemical liquids is balanced, guarantees that inner wall plating 3 copper ion of section is uniform
Distribution.
Further, 1 bottom of electroplating bath is provided with mounting disc 11, and mounting disc 11 is equipped with through-hole 12, and through-hole 12
In the center location of mounting disc 11, tube body 2 is arranged on through-hole 12, and 4 bottom of perfusion tube is connected to through-hole 12,11 bottom of mounting disc
Pipeline 13 equipped with connection through-hole 12 and kinetic pump 5.
Further, the anode locating slot 22 positioned at 12 outside of through-hole, anode locating slot are provided in the mounting disc 11
Copper rod 14 is fitted on 22.The quantity of anode locating slot 22 is several and circumferentially spaced arrangement.
In electroplating process, 14 electrolyzing copper ion of copper rod is simultaneously added in chemical liquids, and fiting chemical liquid follows bad system and send
Expect device, makes the chemical liquids uniform circulation in inner wall plating section 3 and outer wall plating section, guarantee copper ion uniformly-coating in tube body
On 2 outer wall and inner wall.
Further, positioning seat 15 under the cathode on through-hole 12 is provided in the mounting disc 11；
2 bottom end of tube body is placed under cathode on positioning seat 15, realizes the positioning of 2 bottom end of tube body, and perfusion tube 4 is passed down through cathode
Lower positioning seat 15 simultaneously protrudes into through-hole 12.
Anode line 23 and cathode line 24 are provided in mounting disc 11, anode line 23 and cathode line 24 pass through pre-buried mode
It is arranged in mounting disc 11.Mounting disc 11 avoids influencing each other between anode line 23 and cathode line 24 using the material of insulation.
23 one end of anode line extends to the bottom of anode locating slot 22 and connect with copper rod 14, and 23 other end of anode line passes through
11 side of mounting disc is simultaneously pierced by from the side of electroplating bath 1 and connect with external power supply.
24 one end of cathode line extends to the upper surface of mounting disc 11 and connect with the bottom of positioning seat 15 under cathode, cathode line
24 other ends pass through 11 side of mounting disc and are pierced by from the side of electroplating bath 1 and connect with external power supply.
Perfusion tube 4 is impressed current anode, and perfusion tube 4 uses insoluble material.
Further, the top of 1 inside of electroplating bath is provided with positioning plate 16, the side of positioning plate 16 and electroplating bath 1
Inner wall abutting contact, be provided with the perforation 20 passed through for chemical liquids on positioning plate 16；
16 bottom of positioning plate is provided with positioning seat 17, the top of tube body 2 and upper 17 abutting contact of positioning seat, realizes tube body
The positioning on 2 tops.
Further, the upper surface of positioning seat 15 corresponds to the end of tube body 2 under the bottom surface of the upper positioning seat 17 and cathode
Portion is equipped with several positioning columns 18 being evenly distributed, and the inside of positioning column 18 is provided with positioning inclined-plane 19, the end of tube body 2 with
Corresponding positioning 19 abutting contact of inclined-plane.
Compared to traditional clamp hand perhaps fixed block clamp hand or fixation for clamping 2 lateral surface of tube body and medial surface respectively
The contact position of block and 2 side of tube body fits closely, and contact position coating is caused to be difficult to be formed, using positioning inclined-plane 19 with
The electroplating effect that will not influence tube body 2 outer wall and inner wall against positioning method of 2 respective end of tube body.
The above disclosure is only a preferred embodiment of the invention, rather than limits claim of the invention with this
Protection scope still belongs to the range that the present invention is protected according to equivalent variations made in the scope of the present invention.
Claims (10)
1. a kind of tubing electroplating device is placed in electroplating bath (1) including the internal electroplating bath (1) with chemical liquids and setting
Section (3) are electroplated in the Inner Constitution inner wall of tube body (2) in chemical liquids, tube body (2), it is characterised in that: further include inward wall electricity
Plate the feed device of section (3) conveying chemical liquids；
The feed device includes the perfusion tube (4) being sequentially communicated, kinetic pump (5) and the internal chemical liquid pool with chemical liquids
(6), perfusion tube (4) protrudes into tube body (2), and perfusion tube (4) side is provided with several fluid holes (7), and several fluid holes (7) are along defeated
The length direction of liquid pipe (4) is intervally arranged.
2. tubing electroplating device according to claim 1, which is characterized in that the electroplating bath (1) by return pipe (8) with
Chemical liquid pool (6) connection.
3. tubing electroplating device according to claim 2, which is characterized in that including run-off (9), electroplating bath (1) is from overflowing
The bottom of stream pond (9) is protruded into run-off (9), and the top of electroplating bath (1) is connected to the inside of run-off (9), on run-off (9)
Equipped with overflow hole (10), return pipe (8) one end is connected to overflow hole (10).
4. tubing electroplating device according to claim 1, which is characterized in that the diameter of the fluid hole (7) is by perfusion tube
(4) head end is gradually increased to the end of perfusion tube (4)；
The distance between adjacent fluid hole (7) is gradually decreased from the head end of perfusion tube (4) to the end of perfusion tube (4).
5. tubing electroplating device according to claim 1, which is characterized in that electroplating bath (1) bottom is provided with installation
Disk (11), mounting disc (11) are equipped with through-hole (12), and tube body (2) is arranged on through-hole (12), perfusion tube (4) bottom and through-hole
(12) it is connected to, mounting disc (11) bottom is equipped with the pipeline (13) of connection through-hole (12) and kinetic pump (5).
6. tubing electroplating device according to claim 5, which is characterized in that be provided with to be located on the mounting disc (11) and lead to
Anode locating slot (22) on the outside of hole (12) is fitted with copper rod (14) on anode locating slot (22).
7. tubing electroplating device according to claim 5, which is characterized in that be provided with to be located on the mounting disc (11) and lead to
Positioning seat (15) under cathode on hole (12)；
Tube body (2) bottom end is placed on positioning seat under cathode (15), and perfusion tube (4) is passed down through positioning seat under cathode (15) simultaneously
It protrudes into through-hole (12).
8. tubing electroplating device according to claim 7, which is characterized in that the top setting on the inside of the electroplating bath (1)
Have positioning plate (16), the side of positioning plate (16) and the inner wall abutting contact of electroplating bath (1), is provided with and is used on positioning plate (16)
The perforation (20) that chemical liquids pass through；
Positioning plate (16) bottom is provided with positioning seat (17), the top of tube body (2) and upper positioning seat (17) abutting contact.
9. tubing electroplating device according to claim 8, which is characterized in that the bottom surface of the upper positioning seat (17) and yin
The end for extremely descending the upper surface of positioning seat (15) to correspond to tube body (2) is equipped with several positioning columns (18) being evenly distributed, positioning
Positioning inclined-plane (19), the end of tube body (2) and corresponding positioning inclined-plane (19) abutting contact are provided on the inside of column (18).
10. -9 described in any item tubing electroplating devices according to claim 1, which is characterized in that the tube body (2) is along its length
Direction is vertically arranged.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910804404.9A CN110468438B (en) | 2019-08-28 | 2019-08-28 | Pipe electroplating equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910804404.9A CN110468438B (en) | 2019-08-28 | 2019-08-28 | Pipe electroplating equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110468438A true CN110468438A (en) | 2019-11-19 |
| CN110468438B CN110468438B (en) | 2024-06-07 |
Family
ID=68513916
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910804404.9A Active CN110468438B (en) | 2019-08-28 | 2019-08-28 | Pipe electroplating equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110468438B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113322505A (en) * | 2021-06-02 | 2021-08-31 | 深圳市金源康实业有限公司 | Water-pumping type electroplating device and process for electroplating inside guide pipe in flowing mode |
| CN114411230A (en) * | 2022-03-01 | 2022-04-29 | 中国原子能科学研究院 | Electroplating device and electroplating method for pipe fitting |
| CN115491740A (en) * | 2022-11-01 | 2022-12-20 | 中国工程物理研究院材料研究所 | Static outer wall tubular uranium electroplating device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1112791A (en) * | 1997-06-26 | 1999-01-19 | Hashimoto Kinzoku Kogyo Kk | Device for plating inner face of metallic pipe |
| CN1319685A (en) * | 2000-01-28 | 2001-10-31 | 杨聚泰 | Equipment and technology for electroplating steel pipe inner wall by using auxiliary anode and spray-plating zinc solution |
| CN2503076Y (en) * | 2001-09-12 | 2002-07-31 | 林光喜 | Electroplating equipment for plating inwall of pipe fitting |
| JP2010116617A (en) * | 2008-11-14 | 2010-05-27 | Nakajima Kinzoku Kk | Plating method for inner wall of thin tube |
| CN103614755A (en) * | 2013-12-09 | 2014-03-05 | 山西北方机械制造有限责任公司 | Liquid plating device for inner hole of slender pipe fitting |
| CN204918806U (en) * | 2015-07-10 | 2015-12-30 | 黄激扬 | Pendulum commentaries on classics formula long tube inner wall electroplating device |
| CN108468074A (en) * | 2018-05-18 | 2018-08-31 | 秦皇岛瀚丰长白结晶器有限责任公司 | Crystallizer copper pipe stream plating appts |
| CN210481547U (en) * | 2019-08-28 | 2020-05-08 | 佛山市顺德区捷永电器实业有限公司 | Pipe electroplating equipment |
| CN212404320U (en) * | 2020-06-23 | 2021-01-26 | 广东正慧实业有限公司 | Electroplating device in hole |
-
2019
- 2019-08-28 CN CN201910804404.9A patent/CN110468438B/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1112791A (en) * | 1997-06-26 | 1999-01-19 | Hashimoto Kinzoku Kogyo Kk | Device for plating inner face of metallic pipe |
| CN1319685A (en) * | 2000-01-28 | 2001-10-31 | 杨聚泰 | Equipment and technology for electroplating steel pipe inner wall by using auxiliary anode and spray-plating zinc solution |
| CN2503076Y (en) * | 2001-09-12 | 2002-07-31 | 林光喜 | Electroplating equipment for plating inwall of pipe fitting |
| JP2010116617A (en) * | 2008-11-14 | 2010-05-27 | Nakajima Kinzoku Kk | Plating method for inner wall of thin tube |
| CN103614755A (en) * | 2013-12-09 | 2014-03-05 | 山西北方机械制造有限责任公司 | Liquid plating device for inner hole of slender pipe fitting |
| CN204918806U (en) * | 2015-07-10 | 2015-12-30 | 黄激扬 | Pendulum commentaries on classics formula long tube inner wall electroplating device |
| CN108468074A (en) * | 2018-05-18 | 2018-08-31 | 秦皇岛瀚丰长白结晶器有限责任公司 | Crystallizer copper pipe stream plating appts |
| CN210481547U (en) * | 2019-08-28 | 2020-05-08 | 佛山市顺德区捷永电器实业有限公司 | Pipe electroplating equipment |
| CN212404320U (en) * | 2020-06-23 | 2021-01-26 | 广东正慧实业有限公司 | Electroplating device in hole |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113322505A (en) * | 2021-06-02 | 2021-08-31 | 深圳市金源康实业有限公司 | Water-pumping type electroplating device and process for electroplating inside guide pipe in flowing mode |
| CN114411230A (en) * | 2022-03-01 | 2022-04-29 | 中国原子能科学研究院 | Electroplating device and electroplating method for pipe fitting |
| CN115491740A (en) * | 2022-11-01 | 2022-12-20 | 中国工程物理研究院材料研究所 | Static outer wall tubular uranium electroplating device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110468438B (en) | 2024-06-07 |
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