CN2503076Y - Electroplating equipment for plating inwall of pipe fitting - Google Patents
Electroplating equipment for plating inwall of pipe fitting Download PDFInfo
- Publication number
- CN2503076Y CN2503076Y CN 01253719 CN01253719U CN2503076Y CN 2503076 Y CN2503076 Y CN 2503076Y CN 01253719 CN01253719 CN 01253719 CN 01253719 U CN01253719 U CN 01253719U CN 2503076 Y CN2503076 Y CN 2503076Y
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- CN
- China
- Prior art keywords
- anode tube
- anode
- plating
- tube
- pipe fitting
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- Expired - Fee Related
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Abstract
An electroplate equipment suitable for plating internal wall of pipe fittings is provided, which is characterized in that: at least one auxiliary anode device specialized for electroplating internal wall of hollow pipe fittings are arranged in a plating bath. The auxiliary anode device comprises a liquid pump capable of providing fresh plating liquid, a plating liquid shunt valve, an embedded anode tube fixed and connected at each shunt mouth of the shunt valve, an insulating pipe suited outside the anode tube and a stop positioned at the anode tube head; a liquid outlet is opened on a hollow anode tube and corresponding through holes are positioned on the insulating pipe; a ductile is also arranged on the stop, which is communicated with the plating liquid shunt valve. Compared with the prior art, the utility model places the auxiliary anode tube into the through holes of the pipe fittings to be plated to plate the internal and external walls of the pipe fittings with high quality to largely upgrade the overall product quality. The utility model is capable of plating the hollow pipe fittings with the length ranges from 0.2 to 7m and internal diameter ranges from Phi 8 mm to Phi 100 mm.
Description
Technical field: the utility model relates to the electroplating device designing technique, particularly a kind of electroplating device that can be used for electroplating the hollow pipe fitting inwall.
Background technology: be used for various finishings at present and decorate hollow pipe fitting with the especially large and small aperture of ironware (as square tube or pipe class etc. by the plating iron part), have and adopt that japanning is handled, hot dip is handled or cold plating is handled.Manual japanning method is eliminated, if use hot dip, when the tube wall bore can not carry out below less than 1mm, promptly enables hot dip, and the open tube inwall also can't plate.For example adopt the pot galvanize of conventional hot dip technology, the ironware inwall of ported sub is difficult to be coated with, and zinc hot dip material ton cost is more than 2000 yuan, make the user be difficult to bear, (more than 400 ℃) meeting distillation at high temperature such as used chemical article ammonium chloride, zinc chloride, polluted air in the very serious hot dip are polluted in hot dip.If adopt cold plating (promptly electroplating), though plated material ton cost can reduce, also can't electroplate (can only plate outer wall) to the long tube inwall in large and small aperture under the technology at present, almost can't plate the long hollow pipe fitting inwall of 0.5-6m especially.
Summary of the invention:
The purpose of this utility model is a kind of electroplating device that is suitable for hollow pipe fitting inwall plating of design, and it can also carry out high-quality plating to the inwall of the hollow elongated tube in large and small aperture, and galvanized coating uniformity is good.
The utility model is to improve to form on the existing plating technical foundation, it comprises plating tank, negative electrode (being generally plating piece itself), (master) anode, supply with the power source circuit of anodic-cathodic, it is characterized in that in plating tank, also being provided with at least one (one) and be exclusively used in the supplementary anode device of electroplating the hollow pipe fitting inwall, this supplementary anode device comprises the liquid pump that newborn plating bath can be provided, metal system plating bath isocon (also claiming splitter), () plating bath delivery hose, fixedly connected (being spirally connected) (also claims tubular anode in the built-in anode tube at each diffluence pass place of isocon, also can work as negative electrode in case of necessity uses), be socketed in the insulation tube of anode tube outside, and the shelves heads (also claiming dop) that a plating bath water conservancy diversion that is positioned at the anode tube head end is used constitute, wherein on described hollow anode tube, offer fluid hole, the also corresponding small through hole that offers on insulation tube, on the shelves head, also be provided with ductule and the plating bath isocon is connected, when electroplating, pipe fitting to be plated is socketed on retaining (card) head of anode tube, carrying out the galvanized while of pipe fitting outer wall surface to be plated, can allow newborn plating bath enter in the isocon behind the primer fluid pump motor by liquid pump and delivery hose thereof, enter in the isocon electroplate liquid some enter (steel) to be plated pipe fitting inner wall cavity (for the plating bath fluid-space) from retaining (card) ductule, other some enters the anode tube inner chamber from diffluence pass, also enter in (steel) to be plated pipe fitting inner wall cavity via fluid hole on the anode tube and the small through hole on the insulation tube again and electroplate (as zinc-plated).
Compared with the prior art, the utility model utilizes supplementary anode pipe (tubular anode) to insert in the through hole of pipe fitting to be plated, makes that the inner tubal wall of pipe fitting is the same with outer tube wall can both to obtain high-quality plating, and the total quality of plating piece product is greatly improved.The utility model can be 0.2-7m to length, and internal diameter is that the hollow pipe fitting of Φ 8mm-Φ 100mm is electroplated.
Description of drawings: Fig. 1 is a kind of structural representation of the present utility model.Fig. 2 is the structural representation of tubular anode tube component.
Wherein: the 1-plating tank; 2-liquid pump fluid inlet (pipette); the 3-liquid pump; 4-feed liquid hose (newborn plating bath is provided), 5-plating bath isocon (also claim splitter, metal tube is made); the 6-electrode contact (is connected on the isocon; power connection for anode tube), 7-retaining head (also claim dop, play the plating bath guide functions); 8-ductule (the shunting plating bath is used); the built-in anode tube of 9-, 10-insulation tube, 11-insulation tube small through hole; the fluid hole that 12-sun level was offered on the pipe second half section; 13-treats () plating pipe fitting, 14-(new life) plating bath, and 15-is arranged in the newborn plating bath of pipe fitting inner wall cavity to be plated; 16-roof pressure spring; 17-insulation protection head, 18-protects a set screw, 19-diffluence pass.
Embodiment: referring to accompanying drawing as can be known, the utility model also can have following technical characterictic when specific design:
One, the fluid hole of being offered on anode tube 9 12 is the second half sections that are distributed in anode tube.Why like this design is to electroplate usefulness because of the general preceding half section inwall of only enough keeping pipe fitting to be plated of metal ion the newborn plating bath 15 that enters (steel) to be plated pipe fitting inner wall cavity from shelves 7 ductules, 8 shunting, second half section just can only lean on the newborn plating bath that distributes from anode tube to electroplate, and can guarantee that like this inwall of whole steel pipe fitting to be plated obtains uniformly-coating
Two, can be provided with an insulation protection 17 at anode tube 9 tail ends.If the purpose of insulation protection head is more successfully anode tube to be sent in the through hole of (insertion) pipe fitting to be plated, and play the location insulating effect.
Three, the external diameter of described anode tube 9 can be designed to Φ 5mm-Φ 100mm, and the length of anode tube can be designed to 0.2-7.0m.
Four, the front end face of described retaining 7 also can a sheathed roof pressure with spring (stage clip), it can yield berth to head and tightly bump (pressures) on pipe fitting to be plated, more helps the guiding of plating bath mobile
Five, also available solid simple and easy clavate (rod) sun level pipe (rod) replaces tubular hollow anode pipe when anode use (accompanying drawing slightly).Make the heavy anode pipe and replace hollow anode tube can electroplate (being suitable for electroplating than short pipe fitting) too to pipe fitting inner wall, just effect is a bit weaker.
Claims (6)
1, a kind of electroplating device that is suitable for the pipe fitting inner wall plating, it comprises plating tank (1), negative electrode, anode, supply with the power source circuit of anodic-cathodic, it is characterized in that in plating tank (1), also being provided with at least one and be exclusively used in the supplementary anode device of electroplating the hollow pipe fitting inwall, this supplementary anode device comprises the liquid pump (3) that newborn plating bath can be provided, plating bath isocon (5), be fixedly connected on the built-in anode tube (9) that each diffluence pass of isocon (5) (19) is located, be socketed in the outside insulation tube (10) of anode tube (9), and the retaining head (7) that is positioned at the anode tube head end constitutes, wherein on described hollow anode tube (9), offer fluid hole (12), the also corresponding small through hole (11) that offers on insulation tube (10), also being provided with ductule (8) on retaining head (7) is connected with metal system plating bath isocon (5), when electroplating, can allow newborn plating bath enter in the isocon behind the primer fluid pump motor, enter in the isocon plating bath some enter pipe fitting inner wall cavity to be plated from a retaining ductule (8), in addition some enters the anode tube inner chamber from diffluence pass (19), also enter in the pipe fitting inner wall cavity to be plated via the small through hole (11) on fluid hole on the anode tube (12) and the insulation tube again and electroplate.
2, electroplating device according to claim 1 is characterized in that the fluid hole of being offered (12) is the second half section that is distributed in anode tube on anode tube (9).
3, electroplating device according to claim 1 is characterized in that can being provided with an insulation protection head (17) at anode tube (9) tail end.
4, electroplating device according to claim 1, the external diameter that it is characterized in that anode tube (9) are Φ 5mm-Φ 100mm, and the length of anode tube is 0.2-7.0m.
5,, it is characterized in that described anode tube also can be made into solid clavate anode tube bar structure according to claim 1 or 4 described electroplating devices.
6, electroplating device according to claim 1 is characterized in that can being arranged with roof pressure spring (16) at the front end of described retaining head (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01253719 CN2503076Y (en) | 2001-09-12 | 2001-09-12 | Electroplating equipment for plating inwall of pipe fitting |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01253719 CN2503076Y (en) | 2001-09-12 | 2001-09-12 | Electroplating equipment for plating inwall of pipe fitting |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2503076Y true CN2503076Y (en) | 2002-07-31 |
Family
ID=33663166
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 01253719 Expired - Fee Related CN2503076Y (en) | 2001-09-12 | 2001-09-12 | Electroplating equipment for plating inwall of pipe fitting |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2503076Y (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103305885A (en) * | 2013-06-01 | 2013-09-18 | 北京工业大学 | Diversion type auxiliary plating device and plating method aiming at plating inner surface of hollow plated part |
| CN103614755A (en) * | 2013-12-09 | 2014-03-05 | 山西北方机械制造有限责任公司 | Liquid plating device for inner hole of slender pipe fitting |
| TWI595121B (en) * | 2016-09-20 | 2017-08-11 | 翁健名 | Electroplating method for tubular structure |
| CN110468438A (en) * | 2019-08-28 | 2019-11-19 | 佛山市顺德区捷永电器实业有限公司 | A kind of tubing electroplating device |
| CN111621833A (en) * | 2020-05-30 | 2020-09-04 | 常德市联嘉机械有限公司 | Energy-saving electroplating device |
| CN112342598A (en) * | 2020-11-02 | 2021-02-09 | 常德市联嘉机械有限公司 | Convenient-to-use rotary electroplating device with positioning structure |
| CN113789552A (en) * | 2021-11-02 | 2021-12-14 | 四川英创力电子科技股份有限公司 | Device for electroplating through hole on HDI board and working method thereof |
-
2001
- 2001-09-12 CN CN 01253719 patent/CN2503076Y/en not_active Expired - Fee Related
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103305885A (en) * | 2013-06-01 | 2013-09-18 | 北京工业大学 | Diversion type auxiliary plating device and plating method aiming at plating inner surface of hollow plated part |
| CN103305885B (en) * | 2013-06-01 | 2016-06-22 | 北京工业大学 | A kind of flow-guiding type for hollow plating piece inner surface plating assists plating device and plating method |
| CN103614755A (en) * | 2013-12-09 | 2014-03-05 | 山西北方机械制造有限责任公司 | Liquid plating device for inner hole of slender pipe fitting |
| TWI595121B (en) * | 2016-09-20 | 2017-08-11 | 翁健名 | Electroplating method for tubular structure |
| CN110468438A (en) * | 2019-08-28 | 2019-11-19 | 佛山市顺德区捷永电器实业有限公司 | A kind of tubing electroplating device |
| CN110468438B (en) * | 2019-08-28 | 2024-06-07 | 佛山市顺德区捷永电器实业有限公司 | Pipe electroplating equipment |
| CN111621833A (en) * | 2020-05-30 | 2020-09-04 | 常德市联嘉机械有限公司 | Energy-saving electroplating device |
| CN112342598A (en) * | 2020-11-02 | 2021-02-09 | 常德市联嘉机械有限公司 | Convenient-to-use rotary electroplating device with positioning structure |
| CN113789552A (en) * | 2021-11-02 | 2021-12-14 | 四川英创力电子科技股份有限公司 | Device for electroplating through hole on HDI board and working method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |