CN210262045U - Microporous electroplating device with flowable electroplating solution - Google Patents
Microporous electroplating device with flowable electroplating solution Download PDFInfo
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- CN210262045U CN210262045U CN201920860541.XU CN201920860541U CN210262045U CN 210262045 U CN210262045 U CN 210262045U CN 201920860541 U CN201920860541 U CN 201920860541U CN 210262045 U CN210262045 U CN 210262045U
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Abstract
The utility model discloses a micropore electroplating device that plating solution is flowable, include: the device comprises an upper electroplating cavity, a lower electroplating cavity and a conveying pump; the upper electroplating cavity is provided with an electroplating solution outlet, an electroplating solution inlet and a lead outlet, and the upper electroplating cavity is provided with an upper connecting device; the lower electroplating cavity is provided with an electroplating solution inlet and an electroplating solution outlet, and the lower electroplating cavity is provided with a lower connecting device; the electroplating liquid inlet of the upper electroplating cavity is communicated with the electroplating liquid outlet of the lower electroplating cavity through an electroplating liquid guide pipe, and a conveying pump is arranged on the electroplating liquid guide pipe; when in electroplating, the electroplating solution flowing out of the electroplating solution outlet of the upper electroplating cavity passes through the piece to be electroplated and enters the lower electroplating cavity through the electroplating solution inlet of the lower electroplating cavity; the transfer pump pumps the electroplating solution in the lower electroplating cavity into the upper electroplating cavity. The electroplating solution of the micropore electroplating device of the utility model can be mobile, and can solve the problem that the electroplating solution is difficult to be soaked in the micropores, thereby being capable of carrying out precise electroplating in the micropores.
Description
Technical Field
The utility model belongs to the technical field of the micropore electroplating device, in particular to a micropore electroplating device with flowable electroplating solution.
Background
Electroplating is the process of plating one or more layers of other metals or alloys on the surface of some conductive substrates by using the principle of electrolysis. At present, the electroplating liquid of the known electroplating device is static, and electroplating is carried out under a certain current density by taking a metal to be plated as an anode and a part to be plated as a cathode. The traditional electroplating method and device at present can only be used for carrying out metal deposition on the surface of a material and electroplating in a large hole; this is because the immersion of the plating solution in the pores and the plating cannot be continued and only the deposition on the surface is finally carried out due to the influence of the surface tension of the liquid and the diffusion rate of ions in the liquid. At present, no device is available for precise electroplating in micro-holes.
In view of the above, a new micro-porous electroplating device is needed.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a micropore electroplating device that plating solution is flowable to solve current electroplating device and can not carry out the technical problem that the micropore was electroplated. The utility model discloses a micropore electroplating device, its plating solution is flowable, and the problem that the plating solution is difficult to soak in the micropore can be solved completely to the mobile plating solution to can carry out the precision plating in the micropore.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
a microporous electroplating apparatus in which an electroplating solution is flowable, comprising: the device comprises an upper electroplating cavity, a lower electroplating cavity and a conveying pump;
the upper electroplating cavity is provided with an electroplating solution outlet, an electroplating solution inlet and a lead outlet, and the upper electroplating cavity is provided with an upper connecting device; the lower electroplating cavity is provided with an electroplating solution inlet and an electroplating solution outlet, and the lower electroplating cavity is provided with a lower connecting device; the electroplating liquid inlet of the upper electroplating cavity is communicated with the electroplating liquid outlet of the lower electroplating cavity through an electroplating liquid guide pipe, and a conveying pump is arranged on the electroplating liquid guide pipe;
during electroplating, the upper electroplating cavity is positioned above the lower electroplating cavity; the upper connecting device is fixedly connected with the lower connecting device; the part to be electroplated is positioned between the electroplating solution outlet of the upper electroplating cavity and the electroplating solution inlet of the lower electroplating cavity; the electroplating solution flowing out of the electroplating solution outlet of the upper electroplating cavity passes through the piece to be electroplated and enters the lower electroplating cavity through the electroplating solution inlet of the lower electroplating cavity; the transfer pump pumps the electroplating solution in the lower electroplating cavity into the upper electroplating cavity.
Furthermore, the upper electroplating cavity and the lower electroplating cavity are both cylinders with one end open and the other end closed; an upper connecting flange plate is arranged at the opening end of the upper electroplating cavity, and a lower connecting flange plate is arranged at the opening end of the lower electroplating cavity.
Furthermore, the upper electroplating cavity and the lower electroplating cavity are both cylinders with openings at two ends; an upper connecting flange plate is arranged at the opening end of one end of the upper electroplating cavity, and an upper end cover is arranged at the opening end of the other end of the upper electroplating cavity; the open end of one end of the lower electroplating cavity is provided with a lower connecting flange plate, and the open end of the other end of the lower electroplating cavity is provided with a lower end cover.
Furthermore, the upper electroplating cavity and the lower electroplating cavity are transparent electroplating cavities.
Further, the delivery pump is a peristaltic pump.
A microporous electroplating apparatus in which an electroplating solution is flowable, comprising: the device comprises an upper cavity cover, an upper electroplating cavity, an upper connecting flange plate, a lower cavity cover, a lower electroplating cavity, a lower connecting flange plate, a circulating conduit and a peristaltic pump; the upper electroplating cavity and the lower electroplating cavity are both cylinders with openings at two ends; an upper cavity cover is arranged at an opening at the upper end of the upper electroplating cavity, an upper connecting flange plate is arranged at an opening at the lower end of the upper electroplating cavity, a lead through hole and an electroplating solution introducing through hole are formed in the side wall of the upper electroplating cavity, and the lead through hole is arranged above the electroplating solution introducing through hole; a lower cavity cover is arranged at the lower end opening of the lower electroplating cavity, a lower connecting flange plate is arranged at the upper end opening of the lower electroplating cavity, and an electroplating solution injection through hole and an electroplating solution lead-out through hole are formed in the side wall of the lower electroplating cavity; the electroplating solution leading-in through hole of the upper electroplating cavity is communicated with the electroplating solution leading-out through hole of the lower electroplating cavity through a circulating conduit; the circulating conduit is provided with a peristaltic pump.
Furthermore, an injection guide pipe is arranged on the electroplating solution injection through hole and used for injecting the electroplating solution into the lower electroplating cavity, and the sealing is kept during electroplating; the lead through hole is provided with a lead guide pipe for leading out a conductive wire.
Furthermore, the upper connecting flange plate or the lower connecting flange plate is provided with a filter membrane, and the filter membrane is used for placing a piece to be electroplated.
Furthermore, the connecting structure of the upper cavity cover and the upper electroplating cavity is an adhesive structure, and the connecting structure of the upper connecting flange plate and the upper electroplating cavity is an adhesive structure; the connecting structure of the lower cavity cover and the lower electroplating cavity is a bonding structure, and the connecting structure of the lower connecting flange plate and the lower electroplating cavity is a bonding structure.
Compared with the prior art, the utility model discloses following beneficial effect has:
the electroplating solution of the micropore electroplating device of the utility model can flow, and the flowing electroplating solution can completely solve the problem that the electroplating solution is difficult to infiltrate in micropores; thereby enabling precision plating in the micro-holes. Specifically, the micropore electroplating device comprises an upper cavity and a lower cavity; placing the piece to be plated between the upper chamber and the lower chamber, enabling the originally static electroplating solution to slowly and uniformly flow through the peristaltic pump, enabling the electroplating solution to realize circulation in the micropore electroplating device, pumping the electroplating solution from the upper chamber to the lower chamber, and pumping the electroplating solution back to the upper chamber from the lower chamber through the peristaltic pump, so that the electroplating solution can be recycled, and the effect of saving the electroplating solution is achieved; in addition, the flowing electroplating solution can completely solve the problem that the electroplating solution is difficult to soak in the micropores; the plating solution with reduced metal ion concentration can be discharged as soon as possible in the electroplating process, and the problem of slow diffusion of ions in micropores is avoided, so that electroplating can be stably and continuously carried out, and after a period of time, a micropore structure for precise electroplating can be obtained.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art are briefly introduced below; it is obvious that the drawings in the following description are some embodiments of the invention, and that for a person skilled in the art, other drawings can be derived from them without inventive effort.
FIG. 1 is a schematic diagram of an exploded view of a microporous electroplating apparatus with a flowable electroplating solution according to an embodiment of the present invention;
in the figure, 1, an upper cavity cover; 2. an upper electroplating cavity; 3. the upper part is connected with a flange plate; 4. a lower chamber cover; 5. a lower electroplating cavity; 6. the lower connecting flange plate; 7. an infusion catheter; 8. a circulation conduit; 9. a connecting bolt; 10. a connecting nut; 11. a wire guide.
Detailed Description
In order to make the purpose, technical effect and technical solution of the embodiments of the present invention clearer, the following description, with reference to the drawings in the embodiments of the present invention, clearly and completely describes the technical solution in the embodiments of the present invention; obviously, the described embodiments are some of the embodiments of the present invention. Based on the embodiments disclosed in the present invention, other embodiments obtained by a person skilled in the art without creative efforts shall fall within the protection scope of the present invention.
Referring to fig. 1, a microporous electroplating apparatus with a flowable electroplating solution according to an embodiment of the present invention includes: the device comprises an upper cavity cover 1, an upper electroplating cavity 2, an upper connecting flange 3, a lower cavity cover 4, a lower electroplating cavity 5, a lower connecting flange 6, an injection conduit 7, a circulating conduit 8, a connecting bolt 9, a connecting nut 10, a peristaltic pump and a lead conduit 11.
The upper end part of the upper electroplating cavity 2 is detachably or fixedly provided with an upper cavity cover 1, the lower end part is fixedly provided with an upper connecting flange plate 3, and the side wall of the upper electroplating cavity is provided with a lead through hole and an electroplating solution leading-in through hole; the lead through hole is provided with a lead guide pipe 11 for leading out a conductive wire.
The lower end part of the lower electroplating cavity 5 is detachably or fixedly provided with a lower cavity cover 4, the upper end part is fixedly provided with a lower connecting flange 6, and the side wall of the lower electroplating cavity is provided with an electroplating solution injection through hole and an electroplating solution lead-out through hole; the plating solution injection through hole is provided with an injection conduit 7 which is used for injecting the plating solution into the lower plating cavity 5 and keeps sealed during plating.
The electroplating solution leading-in through hole of the upper electroplating cavity 2 is communicated with the electroplating solution leading-out through hole of the lower electroplating cavity 5 through a circulating conduit 8; the circulating conduit 8 is provided with a peristaltic pump for providing power for circulating the electroplating solution.
The upper connecting flange 3 and the lower connecting flange 6 can be fixedly connected through a connecting bolt 9 and a connecting nut 10. The connecting bolt 9 and the connecting nut 10 can be a hexagon bolt and a hexagon nut respectively.
The utility model discloses a use:
when in use, the electroplating solution lead-out through hole of the lower electroplating cavity 5 is communicated with the liquid pumping end of the peristaltic pump, and the electroplating solution is injected into the through hole for sealing; the electroplating solution lead-in through hole of the upper electroplating cavity 2 is communicated with the liquid outlet end of the peristaltic pump, and a lead wire is led out from the lead wire guide tube 11. The circular flow of the electroplating solution is realized through the peristaltic pump, and the electroplating solution is pumped from the lower electroplating cavity 5 and injected into the upper electroplating cavity 2. The upper connecting flange 3 is fixedly connected with the lower connecting flange 6, a part to be plated is adhered to the filter membrane and placed in the middle of the sealing flange, and the conductive copper adhesive is led out from the middle of the flange.
Optionally, the upper cavity cover 1 and the upper electroplating cavity 2 are tightly bonded through organic glass glue; the upper electroplating cavity 2 and the upper connecting flange 3 are also tightly bonded through organic glass glue or hot melt glue; the lower plating chamber 5 is processed in the same manner.
Optionally, the piece to be plated is adhered to the filter membrane by an adhesive tape, the filter membrane is used for controlling the flow speed of the plating solution more conveniently, the filter membrane part except the piece to be plated is completely sealed by the adhesive tape, so that the filtrate can only flow down from the middle piece to be plated, and the metal sheet to be plated used as the plating anode is placed in the upper plating cavity 2; and meanwhile, a lead is led out through a lead guide pipe 11, conductive copper adhesive is also led out on a piece to be plated so as to facilitate wiring, the two flange plates are fixed by long hexagon bolts, electroplating solution is injected into the lower electroplating cavity 5 from an injection guide pipe 7 during electroplating, then the electroplating solution in the lower electroplating cavity 5 is injected into the through hole to be sealed, the electroplating solution outlet through hole is connected with a liquid pumping end of a peristaltic pump, the electroplating solution is introduced into the through hole and connected with a liquid outlet end of the peristaltic pump, so that the electroplating solution is filled into the upper electroplating cavity from the lower electroplating cavity, when the plating solution submerges a metal plate, electroplating can be started by electrifying, and after a period of time, a sample for micropore precision electroplating.
Optionally, the upper electroplating cavity and the lower electroplating cavity are cylinders with holes at one end or two ends.
The utility model discloses a theory of operation:
the utility model discloses in, to wait to plate the piece and put between two upper and lower cavities, make originally static plating solution slowly and flow uniformly through the peristaltic pump, make the circulation of plating solution realization in electroplating device, take out the lower cavity from the last cavity, take out the last cavity from the lower cavity through the peristaltic pump to let electroplating solution ability reuse, reach the effect of sparingly plating solution. Most importantly, the flowing electroplating solution can completely solve the problem that the electroplating solution is difficult to soak in the micropores, and the electroplating solution with reduced metal ion concentration can be discharged as soon as possible in the electroplating process, so that the problem of slow diffusion of ions in the micropores is avoided, the electroplating can be stably and continuously carried out, and the micropore structure for precise electroplating can be obtained after a period of time.
To sum up, the utility model discloses an electroplating device that micropore precision was electroplated can carry out, it uses the hot melt adhesive will electroplate the cavity from top to bottom respectively with upper and lower bottom surface, ring flange bonding, rethread ring flange and hexagon bolt are sealed, insert the pipe on the cavity, realize the circulation of plating bath through the peristaltic pump, make plating bath and the base member in the micropore soak completely for the plating bath in the micropore flows, finally realizes treating the continuous and even electroplating of plating metal in the micropore. The utility model discloses the problem that the infiltration nature of plating solution in the micropore and ion diffusion rate are not enough has been solved effectively to make the electroplating realize effectively in the micropore, realize the electroplating of accurate structure.
The above embodiments are only used to illustrate the technical solution of the present invention and not to limit the same, although the present invention is described in detail with reference to the above embodiments, those skilled in the art can still modify or equally replace the specific embodiments of the present invention, and any modification or equivalent replacement that does not depart from the spirit and scope of the present invention is within the protection scope of the claims of the present invention.
Claims (9)
1. A microporous electroplating apparatus in which an electroplating solution is flowable, comprising: an upper electroplating cavity (2), a lower electroplating cavity (5) and a delivery pump;
the upper electroplating cavity (2) is provided with an electroplating solution outlet, an electroplating solution inlet and a lead outlet, and the upper electroplating cavity (2) is provided with an upper connecting device;
the lower electroplating cavity (5) is provided with an electroplating solution inlet and an electroplating solution outlet, and the lower electroplating cavity (5) is provided with a lower connecting device;
the electroplating solution inlet of the upper electroplating cavity (2) is communicated with the electroplating solution outlet of the lower electroplating cavity (5) through an electroplating solution guide pipe, and a delivery pump is arranged on the electroplating solution guide pipe;
when the electroplating is carried out,
the upper electroplating cavity (2) is positioned above the lower electroplating cavity (5); the upper connecting device is fixedly connected with the lower connecting device; the part to be electroplated is positioned between the electroplating solution outlet of the upper electroplating cavity (2) and the electroplating solution inlet of the lower electroplating cavity (5); the electroplating solution flowing out of the electroplating solution outlet of the upper electroplating cavity (2) passes through the piece to be electroplated and enters the lower electroplating cavity (5) through the electroplating solution inlet of the lower electroplating cavity (5); the conveying pump pumps the electroplating solution in the lower electroplating cavity (5) into the upper electroplating cavity (2).
2. The microporous electroplating apparatus in which electroplating solution can flow according to claim 1, wherein the upper electroplating chamber (2) and the lower electroplating chamber (5) are both cylinders with one end open and the other end closed;
an upper connecting flange (3) is arranged at the open end of the upper electroplating cavity (2), and a lower connecting flange (6) is arranged at the open end of the lower electroplating cavity (5).
3. The microporous electroplating apparatus in which electroplating solution can flow according to claim 1, wherein the upper electroplating chamber (2) and the lower electroplating chamber (5) are both cylinders with openings at two ends;
an upper connecting flange (3) is arranged at the open end of one end of the upper electroplating cavity (2), and an upper cavity cover (1) is arranged at the open end of the other end;
the open end of one end of the lower electroplating cavity (5) is provided with a lower connecting flange (6), and the open end of the other end is provided with a lower cavity cover (4).
4. The microporous electroplating apparatus in which electroplating solution can flow according to claim 1, wherein the upper electroplating chamber (2) and the lower electroplating chamber (5) are transparent electroplating chambers.
5. The apparatus of claim 1, wherein the delivery pump is a peristaltic pump.
6. A microporous electroplating apparatus in which an electroplating solution is flowable, comprising: the device comprises an upper cavity cover (1), an upper electroplating cavity (2), an upper connecting flange (3), a lower cavity cover (4), a lower electroplating cavity (5), a lower connecting flange (6), a circulating conduit (8) and a peristaltic pump;
the upper electroplating cavity (2) and the lower electroplating cavity (5) are both cylinders with openings at two ends;
an upper cavity cover (1) is arranged at an opening at the upper end of the upper electroplating cavity (2), an upper connecting flange plate (3) is arranged at an opening at the lower end of the upper electroplating cavity (2), a lead through hole and an electroplating solution introducing through hole are formed in the side wall of the upper electroplating cavity (2), and the lead through hole is arranged above the electroplating solution introducing through hole;
a lower cavity cover (4) is arranged at the lower end opening of the lower electroplating cavity (5), a lower connecting flange (6) is arranged at the upper end opening of the lower electroplating cavity (5), and an electroplating solution injection through hole and an electroplating solution lead-out through hole are formed in the side wall of the lower electroplating cavity (5);
the electroplating solution leading-in through hole of the upper electroplating cavity (2) is communicated with the electroplating solution leading-out through hole of the lower electroplating cavity (5) through a circulating conduit (8); the circulating conduit (8) is provided with a peristaltic pump.
7. The microporous electroplating apparatus in which an electroplating solution can flow according to claim 6, wherein the electroplating solution injection through hole is provided with an injection conduit (7) for injecting the electroplating solution into the lower electroplating chamber (5) and keeping the sealing during electroplating;
the lead through hole is provided with a lead guide pipe (11) for leading out a conductive wire.
8. A microporosity electroplating apparatus with a flowable electroplating solution according to claim 6, wherein the upper connecting flange (3) or the lower connecting flange (6) is provided with a filter membrane for placing the parts to be electroplated.
9. A microporous electroplating apparatus in which a plating solution can flow, according to claim 6, characterized in that the connection structure of the upper chamber cover (1) and the upper electroplating chamber (2) is an adhesive structure, and the connection structure of the upper connecting flange (3) and the upper electroplating chamber (2) is an adhesive structure;
the connecting structure of the lower cavity cover (4) and the lower electroplating cavity (5) is an adhesive structure, and the connecting structure of the lower connecting flange plate (6) and the lower electroplating cavity (5) is an adhesive structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920860541.XU CN210262045U (en) | 2019-06-06 | 2019-06-06 | Microporous electroplating device with flowable electroplating solution |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920860541.XU CN210262045U (en) | 2019-06-06 | 2019-06-06 | Microporous electroplating device with flowable electroplating solution |
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| CN210262045U true CN210262045U (en) | 2020-04-07 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201920860541.XU Active CN210262045U (en) | 2019-06-06 | 2019-06-06 | Microporous electroplating device with flowable electroplating solution |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115142111A (en) * | 2022-05-27 | 2022-10-04 | 中国电子科技集团公司第三十八研究所 | Device for improving uniformity of silver plating of small micropores |
-
2019
- 2019-06-06 CN CN201920860541.XU patent/CN210262045U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115142111A (en) * | 2022-05-27 | 2022-10-04 | 中国电子科技集团公司第三十八研究所 | Device for improving uniformity of silver plating of small micropores |
| CN115142111B (en) * | 2022-05-27 | 2023-06-30 | 中国电子科技集团公司第三十八研究所 | Device for improving uniformity of silver plating of micro-pores |
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