CN216919467U

CN216919467U - Electroplating device

Info

Publication number: CN216919467U
Application number: CN202220445002.1U
Authority: CN
Inventors: 陈景川; 陈德宁; 罗小兵; 陈秋舵
Original assignee: Dongguan Chuyu New Material Co ltd
Current assignee: Dongguan Chuyu New Material Co ltd
Priority date: 2022-03-02
Filing date: 2022-03-02
Publication date: 2022-07-08
Anticipated expiration: 2032-03-02

Abstract

The utility model discloses an electroplating device which comprises a liquid tank, a first electromagnetic valve, a filter cylinder and an electroplating tank, wherein a second liquid outlet is formed in the bottom end of the outer side face of the electroplating tank, a third pipeline is connected inside the second liquid outlet, one end of the third pipeline is connected to one side of the second electromagnetic valve, the other side of the second electromagnetic valve is connected with a fourth pipeline, one end of the fourth pipeline is connected to one side of the outer portion of the filter cylinder, the other side of the outer portion of the filter cylinder is connected with a fifth pipeline, one end of the fifth pipeline is connected to the input end of a pump body, the output end of the pump body is connected with a sixth pipeline, one end of the sixth pipeline is connected to the inside of a first liquid inlet, and the first liquid inlet is formed in the top end of the outer side face of the liquid tank. The electroplating solution in the electroplating tank can be pumped and filtered and then returned to the interior of the liquid tank at a high position, and the electroplating solution is conveyed back to the electroplating tank from the high position to the low position for electroplating processing, so that the purity of the electroplating solution is improved, and the influence of impurities on the subsequent electroplating quality is avoided.

Description

Electroplating device

Technical Field

The utility model relates to the technical field of electroplating equipment, in particular to an electroplating device.

Background

The electroplating refers to a surface processing method which adopts an electrolysis device, reduces anode metal ions in salt electroplating solution containing anode metal into a metal simple substance by using an oxidation-reduction reaction principle, and deposits the metal simple substance on the surface of a workpiece to be electroplated to form a coating.

At present, when the electroplating box is used for electroplating an electroplated part, as the electroplated part per se has more impurities, part of the impurities enter the electroplating solution after the electroplated part is immersed in the electroplating solution, so that the electroplating solution is polluted, and the electroplating quality of the electroplated part is reduced.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide an electroplating device, which has the advantages that the electroplating solution in an electroplating box is pumped and filtered and then is sent back to the interior of a liquid box at a high position, and the electroplating solution is conveyed back to the electroplating box from the high position to the low position again for electroplating processing, so that the purity of the electroplating solution is improved, and the influence of impurities on the subsequent electroplating quality is avoided, and the problems provided by the technical background are solved.

In order to achieve the purpose, the utility model provides the following technical scheme: the utility model provides an electroplating device, include liquid tank, first solenoid valve, strain a section of thick bamboo and electroplate the case, the outside side bottom of electroplate the case is equipped with the second liquid outlet, the internal connection of second liquid outlet has the third pipeline, the one end of third pipeline is connected to one side of second solenoid valve, the opposite side of second solenoid valve is connected with the fourth pipeline, the one end of fourth pipeline is connected to the outside one side of straining a section of thick bamboo, the outside opposite side of straining a section of thick bamboo is connected with the fifth pipeline, the one end of fifth pipeline is connected to the input of the pump body, the output of the pump body is connected with the sixth pipeline, the one end of sixth pipeline is connected to the inside of first inlet, and first inlet is established on the outside side top of liquid tank.

Preferably, a first liquid outlet is formed in the middle of the bottom surface of the outer portion of the liquid tank, a first pipeline is connected to the inner portion of the first liquid outlet, and one end of the first pipeline is connected to the top surface of the first electromagnetic valve.

Preferably, the bottom surface of the first electromagnetic valve is connected with a second pipeline, one end of the second pipeline is connected to the inside of the second liquid inlet, and the second liquid inlet is formed in the top end of the outer side face of the electroplating box.

Preferably, the two ends of the outer bottom surface of the liquid tank are fixed with the supporting legs.

Preferably, heating rods are fixed on two sides of the inner part of the electroplating box, and a bottom pad is fixed on the bottom surface of the outer part of the electroplating box.

Preferably, slots are formed in two sides of the interior of the filter cylinder, and filter plates are inserted into the slots.

Compared with the prior art, the utility model has the following beneficial effects:

1. according to the electroplating tank, the second electromagnetic valve is arranged, so that electroplating solution in the electroplating tank cannot flow into the fourth pipeline through the third pipeline without permission, the flow stopping and releasing effects are achieved, and the electroplating solution in the electroplating tank cannot flow into the second pipeline through the first pipeline without permission, so that the flow stopping and releasing effects are achieved.

2. According to the utility model, through the matching of the third pipeline, the fourth pipeline, the fifth pipeline, the sixth pipeline and the pump body, the electroplating solution in the electroplating tank can be pumped and sent into the liquid tank, and the effect of active conveying from low to high is achieved.

3. According to the utility model, through the matching of the first pipeline and the second pipeline, the electroplating solution in the liquid tank can flow back to the interior of the electroplating tank again, so that the effect of backflow transmission is achieved, and through the arrangement of the filter plate, the electroplating solution entering the filter cylinder can filter and leave impurities contained in the electroplating solution, so that the effect of filtering the impurities is achieved.

Drawings

FIG. 1 is a schematic diagram of the internal structure of the present invention in a front view;

FIG. 2 is a schematic view of the external appearance structure of the present invention;

FIG. 3 is a schematic top view of the present invention;

fig. 4 is a schematic view of the internal structure of the filter cartridge of the present invention.

The reference numbers and designations in the drawings are as follows:

1. a liquid tank; 2. a first liquid inlet; 3. a sixth pipeline; 4. a first liquid outlet; 5. a first conduit; 6. a first solenoid valve; 7. a second conduit; 8. a support leg; 9. a pump body; 10. a fifth pipeline; 11. a filter cartridge; 12. a fourth conduit; 13. a second solenoid valve; 14. a third pipeline; 15. a second liquid outlet; 16. a heating rod; 17. electroplating box; 18. a bottom pad; 19. a second liquid inlet; 20. a slot; 21. and (4) filtering the plates.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1 to 4, an embodiment of the present invention includes: a plating device comprises a liquid tank 1, a first electromagnetic valve 6, a filter cylinder 11 and a plating tank 17, wherein a second liquid outlet 15 is arranged at the bottom end of the outer side surface of the plating tank 17, a third pipeline 14 is connected inside the second liquid outlet 15, one end of the third pipeline 14 is connected to one side of a second electromagnetic valve 13, through arranging the second electromagnetic valve 13, plating solution in the plating tank 17 cannot flow into the inside of a fourth pipeline 12 through the third pipeline 14 without permission, the effects of stopping and releasing flow are achieved, the other side of the second electromagnetic valve 13 is connected with the fourth pipeline 12, one end of the fourth pipeline 12 is connected to one side of the outside of the filter cylinder 11, the other side of the outside of the filter cylinder 11 is connected with a fifth pipeline 10, one end of the fifth pipeline 10 is connected to the input end of a pump body 9, the output end of the pump body 9 is connected with the sixth pipeline 3, one end of the sixth pipeline 3 is connected to the inside of a first liquid inlet 2, through the cooperation of third pipeline 14, fourth pipeline 12 and fifth pipeline 10 and sixth pipeline 3 and pump body 9, make the plating solution in the electroplating tank 17 can be extracted and sent into the inside of liquid case 1, reached by the effect of low to high initiative transport, and first inlet 2 establishes at the outside side top of liquid case 1, including the installation messenger of liquid case 1 strains the interior plating solution after filtering of section of thick bamboo 11 and can keep in, provided the position of placing.

Specifically, be equipped with first liquid outlet 4 in the middle of the outside bottom surface of liquid tank 1, the internal connection of first liquid outlet 4 has first pipeline 5, and the one end of first pipeline 5 is connected to the top surface of first solenoid valve 6, through setting up first solenoid valve 6, makes the inside plating solution of liquid tank 1 can not flow into the inside of second pipeline 7 through first pipeline 5 without permission, has reached the effect of ending and releasing.

Specifically, the bottom surface of the first electromagnetic valve 6 is connected with the second pipeline 7, one end of the second pipeline 7 is connected to the inside of the second liquid inlet 19, the second liquid inlet 19 is arranged at the top end of the outer side surface of the electroplating box 17, and through the matching of the first pipeline 5 and the second pipeline 7, electroplating liquid in the liquid box 1 can flow back to the inside of the electroplating box 17 again, so that the effect of backflow transmission is achieved, and an electroplated part to be electroplated can be inserted into the electroplating box 17 for electroplating.

Specifically, the two ends of the outer bottom surface of the liquid tank 1 are fixed with the supporting legs 8, and the supporting legs 8 are arranged to enable the liquid tank 1 to be arranged at a high position, so that electroplating liquid can be conveniently conveyed from high to low.

Specifically, heating rods 16 are fixed on two sides of the interior of the electroplating box 17, a bottom pad 18 is fixed on the bottom surface of the exterior of the electroplating box 17, the heating rods 16 are installed to heat the electroplating solution in the electroplating box 17, and the bottom pad 18 is installed to enable the electroplating box 17 to be stably placed for use.

Specifically, the slots 20 are formed in two sides of the interior of the filter cylinder 11, the filter plates 21 are inserted into the slots 20, the filter plates 21 can be inserted into the slots 20 due to the arrangement of the slots 20, the effect of facilitating early-stage installation and later-stage disassembly and cleaning is achieved, and by means of the arrangement of the filter plates 21, electroplating liquid entering the filter cylinder 11 can filter and leave impurities contained in the electroplating liquid, and the effect of filtering the impurities is achieved.

The working principle is as follows: when the utility model is used, a worker firstly supplies power to the external power supply, the operation of the utility model is controlled by a control panel, the worker hangs a plated part to be electroplated to the top end of an electroplating box 17, then the plated part is placed in the electroplating box 17, a heating rod 16 is started, the heating rod 16 heats electroplating solution in the electroplating box 17, the electroplating solution after being heated carries out electroplating processing on the plated part immersed in the electroplating box 17, the plated part is hung and removed by the worker after the electroplating processing of the plated part is finished, the worker needs to filter the electroplating solution after the electroplating solution is used for a certain number of times, the worker opens a second electromagnetic valve 13, the electroplating solution in the electroplating box 17 is discharged to the interior of the electroplating box through a third pipeline 14, then is transmitted to the interior of a fourth pipeline 12 through the second electromagnetic valve 13, the electroplating solution is transmitted to the interior of a filter cylinder 11 through the fourth pipeline 12, and impurities in the interior of the filter cylinder 11 are filtered through a filter plate 21, the plating solution after filtering transmits to the inside of the pump body 9 through the fifth pipeline 10, carry to the inside of first inlet 2 through the sixth pipeline 3 initiative by the pump body 9, the plating solution after should filtering enters into the inside of liquid case 1 through first inlet 2 and keeps in temporarily, need carry out the electroplate process to the plated item at plating case 17, the staff opens first solenoid valve 6, the inside of first pipeline 5 is flowed into through first liquid outlet 4 to the plating solution in its liquid case 1, this plating solution flows into the inside of second inlet 19 through first pipeline 5 and second pipeline 7, finally this plating solution flows back to the inside of plating case 17 again through second inlet 19, the staff just can utilize this clean plating solution of filtering to carry out the electroplating process to the plated item that gets off like this.

It will be evident to those skilled in the art that the utility model is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims

1. An electroplating device comprises a liquid tank (1), a first electromagnetic valve (6), a filter cylinder (11) and an electroplating tank (17), and is characterized in that: the utility model discloses a hydraulic pump, including electroplating tank (17), the outside side bottom of electroplating tank (17) is equipped with second liquid outlet (15), the internal connection of second liquid outlet (15) has third pipeline (14), the one end of third pipeline (14) is connected to one side of second solenoid valve (13), the opposite side of second solenoid valve (13) is connected with fourth pipeline (12), the one end of fourth pipeline (12) is connected to the outside one side of straining a section of thick bamboo (11), the outside opposite side of straining a section of thick bamboo (11) is connected with fifth pipeline (10), the one end of fifth pipeline (10) is connected to the input of the pump body (9), the output of the pump body (9) is connected with sixth pipeline (3), the one end of sixth pipeline (3) is connected to the inside of first inlet (2), and establish on the outside side top of liquid tank (1) first inlet (2).

2. A plating apparatus according to claim 1, wherein: the liquid tank is characterized in that a first liquid outlet (4) is formed in the middle of the bottom surface of the outer portion of the liquid tank (1), a first pipeline (5) is connected to the inner portion of the first liquid outlet (4), and one end of the first pipeline (5) is connected to the top surface of the first electromagnetic valve (6).

3. A plating apparatus according to claim 1, wherein: the bottom surface of the first electromagnetic valve (6) is connected with a second pipeline (7), one end of the second pipeline (7) is connected to the inside of a second liquid inlet (19), and the second liquid inlet (19) is arranged at the top end of the outer side face of the electroplating box (17).

4. An electroplating apparatus according to claim 1, wherein: and two ends of the outer bottom surface of the liquid tank (1) are fixed with supporting legs (8).

5. A plating apparatus according to claim 1, wherein: heating rods (16) are fixed on two sides of the interior of the electroplating box (17), and a bottom pad (18) is fixed on the bottom surface of the exterior of the electroplating box (17).

6. A plating apparatus according to claim 1, wherein: the filter cartridge is characterized in that slots (20) are formed in two sides of the interior of the filter cartridge (11), and filter plates (21) are inserted into the slots (20).