CN213977949U - Plating bath system of edulcoration and heating - Google Patents
Plating bath system of edulcoration and heating Download PDFInfo
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- CN213977949U CN213977949U CN202022259891.6U CN202022259891U CN213977949U CN 213977949 U CN213977949 U CN 213977949U CN 202022259891 U CN202022259891 U CN 202022259891U CN 213977949 U CN213977949 U CN 213977949U
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Abstract
The utility model discloses an impurity-removing and heating electroplating bath system, which comprises an electroplating bath, a filter, a heat exchanger, an adsorption electrolytic cell and a pumping device, wherein the electroplating bath, the filter, the heat exchanger, the adsorption electrolytic cell and the pumping device are communicated through pipelines to form a circulation loop; the plating bath is provided with a plating bath liquid inlet pipe and a plating bath liquid outlet; the filter is provided with a filtering liquid inlet and a filtering liquid outlet communicated with the plating bath liquid inlet pipe; the heat exchanger is positioned outside the electroplating bath and is provided with a heat exchange liquid inlet and a heat exchange liquid outlet connected with the filtering liquid inlet; the adsorption electrolytic cell comprises an adsorption part and an electrolysis part; the tank bottom of the adsorption electrolytic tank is provided with a tank liquid inlet connected with the liquid inlet; a tank liquid outlet pipe connected with the heat exchange liquid inlet is arranged on the upper side of the adsorption electrolytic tank; the pumping device is arranged in the circulating loop and used for driving the electroplating solution to flow. The utility model discloses an electroplating bath system of edulcoration and heating, its temperature is even, adjust the temperature response time short, need not to interrupt the production operation when the edulcoration, has guaranteed the normal clear of production.
Description
Technical Field
The utility model belongs to the technical field of electroplate, concretely relates to plating bath system of edulcoration and heating.
Background
In the existing electroplating tank system, a titanium heating pipe which is vertically arranged at the water inlet side in the tank is adopted for heating. In this way, the titanium heating tube occupies part of the plating bath space, resulting in over-high local temperature in the bath, and low total heat transfer coefficient due to slow flow of plating solution outside the tube, resulting in too long response time of temperature adjustment.
The impurity removal means in the existing electroplating tank system mainly comprises: the continuous circulating filtration is carried out by using a filter to remove insoluble suspended impurities, the electrolysis with small current is adopted to remove soluble harmful metal ions and anions in the working interval, and the active carbon filter element is used for adsorbing organic impurities when the line is stopped regularly, which all relate to the operations of line stopping, core changing and the like and influence the production.
Therefore, a new technology is needed to solve the problems that the local temperature in the tank is too high, the response time of temperature adjustment is too long, and the operation during impurity removal affects the production in the prior art.
SUMMERY OF THE UTILITY MODEL
For solving the above-mentioned problem among the prior art, the utility model provides an electroplating bath system of edulcoration and heating, its temperature is even, adjust the temperature response time short, need not to interrupt the production operation during the edulcoration, has guaranteed the normal clear of production.
The utility model adopts the following technical scheme:
an impurity-removing and heating electroplating bath system comprises an electroplating bath, a filter, a heat exchanger, an adsorption electrolytic cell and a pumping device, wherein the electroplating bath, the filter, the heat exchanger, the adsorption electrolytic cell and the pumping device are communicated through pipelines to form a circulation loop;
the plating bath is provided with a plating bath liquid inlet pipe and a plating bath liquid outlet;
the filter is provided with a filtering liquid inlet and a filtering liquid outlet communicated with the plating bath liquid inlet pipe;
the heat exchanger is positioned outside the electroplating bath and is provided with a heat exchange liquid inlet and a heat exchange liquid outlet which is connected with the filtering liquid inlet and is controlled to be communicated or disconnected through a first valve;
the adsorption electrolytic cell comprises an adsorption part and an electrolytic part which are positioned in the adsorption electrolytic cell; the tank bottom of the adsorption electrolytic tank is provided with a tank liquid inlet which is connected with the liquid inlet and is controlled to be communicated or disconnected by a second valve; a tank liquid outlet pipe connected with the heat exchange liquid inlet is arranged on the upper side of the adsorption electrolytic tank, and a third valve is arranged on the tank liquid outlet pipe;
the pumping device is arranged in the circulating loop and used for driving the electroplating solution to flow.
As a further improvement of the technical proposal of the utility model, the adsorption part is the active carbon arranged at the bottom of the adsorption electrolytic cell.
As a further improvement of the technical solution of the present invention, the electrolysis portion comprises a cathode, an anode and a power source electrically connected to the cathode and the anode, the cathode and the anode are inserted into the adsorption electrolytic cell.
As the utility model discloses technical scheme's further improvement, the heat exchanger is plate heat exchanger.
As a further improvement of the technical proposal of the utility model, the pumping device is a pressure pump.
As a further improvement of the technical proposal of the utility model, the pressure pump is positioned between the heat exchanger and the adsorption electrolytic cell.
As a further improvement of the technical proposal of the utility model, the plating bath liquid outlet is positioned at the bottom of the plating bath.
As a further improvement of the technical proposal of the utility model, the utility model also comprises a liquid replenishing pipe used for replenishing the electroplating liquid, and the outlet end of the liquid replenishing pipe is communicated with the adsorption electrolytic cell.
Compared with the prior art, the beneficial effects of the utility model are that:
in the electroplating bath system for impurity removal and heating, the heat exchanger is arranged outside the electroplating bath, so that the effective space in the electroplating bath is increased, the local overheating phenomenon is eliminated, the uniform temperature is ensured, and the response time of temperature regulation is short; the adsorption electrolytic cell is additionally arranged, the adsorption part can adsorb and remove organic impurities in the electroplating solution, and the electrolysis part can electrolyze and remove harmful metal ions and anions, so that production line stop and core replacement are not required to be interrupted, and the normal operation of production is ensured; in addition, the heat exchanger is arranged in front of the filter, so that the viscosity of the liquid can be reduced, and the filtering effect can be improved.
Drawings
The technology of the present invention will be further described in detail with reference to the accompanying drawings and detailed description:
FIG. 1 is a schematic diagram of the overall structure of a system of a plating tank for removing impurities and heating.
Reference numerals:
10-an electroplating bath; 11-plating bath liquid inlet pipe; 12-plating bath outlet;
20-a filter; 21-filtering the liquid inlet; 22-filtering the liquid outlet;
30-a heat exchanger; 31-a heat exchange liquid inlet; 32-a heat exchange liquid outlet; 33-a first valve;
40-adsorption electrolytic cell; 41-an adsorption part; 42-an electrolysis section; 421-a cathode electrode; 422-positive electrode; 423-power supply; 43-liquid inlet of the pool; 44-a second valve; 45-pool liquid outlet pipe; 46-a third valve;
50-a pumping device;
and 60-a liquid supplementing pipe.
Detailed Description
The conception, specific structure and technical effects of the present invention will be described clearly and completely with reference to the accompanying drawings and embodiments, so as to fully understand the objects, aspects and effects of the present invention. It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The same reference numbers will be used throughout the drawings to refer to the same or like parts.
It should be noted that, unless otherwise specified, when a feature is referred to as being "fixed" or "connected" to another feature, it may be directly fixed or connected to the other feature or indirectly fixed or connected to the other feature. Furthermore, the description of the upper, lower, left, right, etc. used in the present invention is only relative to the mutual positional relationship of the components of the present invention in the drawings.
Referring to fig. 1, a system of a depurating and heating plating bath 10 comprises a plating bath 10, a filter 20, a heat exchanger 30, an adsorption electrolytic cell 40 and a pumping device 50 which are communicated through pipelines to form a circulation loop.
The electroplating bath 10 is provided with a plating bath liquid inlet pipe 11 and a plating bath liquid outlet 12, and the plating bath liquid outlet 12 is positioned at the bottom of the electroplating bath 10. The filter 20 is provided with a filtering liquid inlet 21 and a filtering liquid outlet 22 communicated with the plating bath liquid inlet pipe 11, namely, the electroplating solution filtered by the filter 20 enters the electroplating bath 10 from the filtering liquid outlet 22 through the plating bath liquid inlet pipe 11.
The heat exchanger 30 is positioned outside the plating bath 10 to increase an effective space inside the plating bath 10 and eliminate a local overheating phenomenon. The heat exchanger 30 is provided with a heat exchange liquid inlet 31 and a heat exchange liquid outlet 32 which is connected with the filtering liquid inlet 21 and is controlled to be communicated or disconnected through a first valve 33, specifically, the heat exchange liquid outlet 32 is connected with the filtering liquid inlet 21 through a pipeline, and the first valve 33 is arranged on the pipeline to control to be communicated or closed.
The adsorption electrolytic cell 40 comprises an adsorption part 41 and an electrolysis part 42 which are positioned in the adsorption electrolytic cell 40, and the electrolysis part 42 is positioned on the upper side of the adsorption part 41; the bottom of the adsorption electrolytic cell 40 is provided with a cell liquid inlet 43 which is connected with the liquid inlet and is controlled to be communicated or disconnected through a second valve 44, and the cell liquid inlet 43 is communicated with the plating bath liquid outlet 12 of the plating bath 10 through a pipeline; a tank outlet pipe 45 connected with the heat exchange liquid inlet 31 is arranged on the upper side of the adsorption electrolytic tank 40, and a third valve 46 is arranged on the tank outlet pipe 45; the pumping device 50 is disposed in the circulation loop for driving the flow of the plating solution.
Based on the above structure, the working process of the plating bath 10 system is briefly described: under the driving of the pumping device 50, the electroplating solution is discharged from the plating bath liquid outlet 12 of the electroplating bath 10 to the adsorption electrolytic cell 40, organic impurities in the electroplating solution are adsorbed and removed through the adsorption part 41, harmful metal ions and anions are removed through electrolysis of the electrolysis part 42, the electroplating solution is conveyed from the bath liquid outlet 45 to the heat exchanger 30 for heating, the electroplating solution is conveyed from the heat exchanger 30 to the filter 20 for heating, and finally the electroplating solution is returned to the electroplating bath 10 from the filter 20 again.
In the plating bath 10 system for impurity removal and heating of the utility model, the heat exchanger 30 is arranged outside the plating bath 10, so that the effective space in the plating bath 10 is increased, the local overheating phenomenon is eliminated, and the uniform temperature is ensured; an adsorption electrolytic cell 40 is additionally arranged, an adsorption part 41 of the adsorption electrolytic cell can adsorb and remove organic impurities in the electroplating solution, and an electrolysis part 42 of the adsorption electrolytic cell can remove harmful metal ions and anions through electrolysis; in addition, the heat exchanger 30 is located in front of the filter 20, which can reduce the viscosity of the liquid and improve the filtering effect.
Specifically, the adsorption part 41 is activated carbon disposed at the bottom of the adsorption electrolytic cell 40, and the activated carbon has a good adsorption effect and can effectively remove organic impurities in the electroplating solution.
Specifically, the electrolytic unit 42 includes a cathode 421, an anode 422, and a power supply 423 electrically connected to the cathode 421 and the anode 422, the cathode 421 and the anode 422 are inserted into the adsorption electrolytic cell 40, the cathode 421 attracts and removes metal cations, and the anode 422 attracts and removes anions.
Wherein, the heat exchanger 30 is a plate heat exchanger 30, one side of the plate heater is heating steam, and the other side is plating solution, thereby obviously improving the heat transfer effect and the temperature regulation sensitivity. The pumping device 50 is a booster pump which is located between the heat exchanger 30 and the adsorption electrolytic cell 40.
The plating bath 10 system for impurity removal and heating further comprises a fluid infusion pipe 60 for supplementing the plating solution, the outlet end of the fluid infusion pipe 60 is communicated with the adsorption electrolytic cell 40, and the other end of the fluid infusion pipe 60 is connected with a container filled with the plating solution.
Other contents of the plating bath system with impurity removal and heating of the present invention are referred to in the prior art and are not described herein again.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention in any way, so that any modification, equivalent change and modification made by the technical spirit of the present invention to the above embodiments do not depart from the technical solution of the present invention, and still fall within the scope of the technical solution of the present invention.
Claims (8)
1. An impurity-removing and heating electroplating bath system is characterized by comprising an electroplating bath, a filter, a heat exchanger, an adsorption electrolytic cell and a pumping device, wherein the electroplating bath, the filter, the heat exchanger, the adsorption electrolytic cell and the pumping device are communicated through pipelines to form a circulation loop;
the plating bath is provided with a plating bath liquid inlet pipe and a plating bath liquid outlet;
the filter is provided with a filtering liquid inlet and a filtering liquid outlet communicated with the plating bath liquid inlet pipe;
the heat exchanger is positioned outside the electroplating bath and is provided with a heat exchange liquid inlet and a heat exchange liquid outlet which is connected with the filtering liquid inlet and is controlled to be communicated or disconnected through a first valve;
the adsorption electrolytic cell comprises an adsorption part and an electrolytic part which are positioned in the adsorption electrolytic cell; the tank bottom of the adsorption electrolytic tank is provided with a tank liquid inlet which is connected with the liquid inlet and is controlled to be communicated or disconnected by a second valve; a tank liquid outlet pipe connected with the heat exchange liquid inlet is arranged on the upper side of the adsorption electrolytic tank, and a third valve is arranged on the tank liquid outlet pipe;
the pumping device is arranged in the circulating loop and used for driving the electroplating solution to flow.
2. The edulcoration and heating plating bath system of claim 1, wherein: the adsorption part is active carbon arranged at the bottom of the adsorption electrolytic cell.
3. The edulcoration and heating plating bath system of claim 1, wherein: the electrolysis part comprises a cathode electrode, an anode electrode and a power supply electrically connected with the cathode electrode and the anode electrode, and the cathode electrode and the anode electrode are inserted into the adsorption electrolytic cell.
4. The edulcoration and heating plating bath system of claim 1, wherein: the heat exchanger is a plate heat exchanger.
5. The edulcoration and heating plating bath system of claim 1, wherein: the pumping device is a booster pump.
6. The desmear and heated plating bath system as recited in claim 5, wherein: the booster pump is positioned between the heat exchanger and the adsorption electrolytic cell.
7. The edulcoration and heating plating bath system of claim 1, wherein: the plating bath liquid outlet is positioned at the bottom of the plating bath.
8. The desmear and heated plating bath system as recited in any of claims 1-7, wherein: the device also comprises a liquid replenishing pipe used for replenishing electroplating liquid, and the outlet end of the liquid replenishing pipe is communicated with the adsorption electrolytic cell.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022259891.6U CN213977949U (en) | 2020-10-12 | 2020-10-12 | Plating bath system of edulcoration and heating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022259891.6U CN213977949U (en) | 2020-10-12 | 2020-10-12 | Plating bath system of edulcoration and heating |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213977949U true CN213977949U (en) | 2021-08-17 |
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ID=77255994
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022259891.6U Active CN213977949U (en) | 2020-10-12 | 2020-10-12 | Plating bath system of edulcoration and heating |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213977949U (en) |
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2020
- 2020-10-12 CN CN202022259891.6U patent/CN213977949U/en active Active
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