CN213334632U

CN213334632U - Intelligent semiconductor heat supply boiler

Info

Publication number: CN213334632U
Application number: CN202021724933.2U
Authority: CN
Inventors: 杨琴娜; 白璐; 廖洪; 刘全寿; 刘鑫
Original assignee: Qinghai Huatong Boiler Manufacturing Co ltd
Current assignee: Qinghai Huatong Boiler Manufacturing Co ltd
Priority date: 2020-08-18
Filing date: 2020-08-18
Publication date: 2021-06-01
Anticipated expiration: 2030-08-18

Abstract

The utility model relates to a heat supply boiler technical field, concretely relates to intelligence semiconductor heat supply boiler, which comprises a housin, the both sides of casing are provided with inlet tube and outlet pipe respectively, be provided with the booster pump on the inlet tube, the inside of casing is provided with the filter column that communicates in proper order, deposits water chamber and heater, be provided with the filtration filler in the filter column, it is provided with level sensor to deposit the water chamber, the bottom of depositing the water chamber is passed through water knockout drum and heater intercommunication, the heater includes a plurality of semiconductor heating pipes, water collector and outlet pipe intercommunication are passed through to the bottom of semiconductor heating pipe, still be provided with the controller in the casing, booster pump heater and level sensor all with the controller electricity is connected. The intelligent semiconductor heat supply boiler can effectively reduce impurities in water and prolong the service life of the semiconductor heat supply boiler by pretreating media entering the heater.

Description

Intelligent semiconductor heat supply boiler

Technical Field

The utility model relates to a heat supply boiler technical field especially relates to an intelligence semiconductor heat supply boiler.

Background

The semiconductor boiler is a heating mode which is just started in recent years, and the use efficiency of the semiconductor boiler is higher and higher along with the gradual improvement of the manufacturing technology of the semiconductor boiler. And the method also becomes a key for improving the large energy environment in China to some extent.

The use of the semiconductor heater realizes water-electricity separation, and the safety is obviously improved. However, the semiconductor boiler is easy to generate scaling phenomenon in the using process, and the scaling phenomenon gradually reduces the heating efficiency of the boiler along with the prolonging of the using time, and even normal heat transfer can not be continued. In the prior art, the surface treatment is generally needed to be carried out on the medium conveying pipeline to reduce the scaling phenomenon in the use process, but the scaling prevention effect of the pipeline is usually gradually reduced along with the time lapse in the use process, and the cost for replacing the pipeline and the heater is higher.

SUMMERY OF THE UTILITY MODEL

In order to solve the technical problem, an object of the utility model is to provide an intelligence semiconductor heat supply boiler, through carrying out the pretreatment to the medium that gets into in the heater, can effectively reduce the impurity of aquatic to reduce pipeline scale deposit phenomenon's emergence, promote this semiconductor heat supply boiler's life.

In order to achieve the technical effects, the utility model adopts the following technical scheme:

the utility model provides an intelligence semiconductor heat supply boiler, includes the casing, the both sides of casing are provided with inlet tube and outlet pipe respectively, be provided with the booster pump on the inlet tube, the inside of casing is provided with the filter column that communicates in proper order, deposits water cavity and heater, be provided with in the filter column and filter the filler, it is provided with level sensor to deposit the water cavity, water knockout drum and heater intercommunication are passed through to the bottom of depositing the water cavity, the heater includes a plurality of semiconductor heating pipes, water collector and outlet pipe intercommunication are passed through to semiconductor heating pipe's bottom, still be provided with the controller in the casing, booster pump heater and level sensor all with the controller electricity is connected.

Further, the inlet tube is also provided with a first flow regulating valve, and the first flow regulating valve is electrically connected with the controller.

Further, the bottom and the inlet tube intercommunication of filter column, the top is through connecting the pipe fitting and depositing water chamber intercommunication, filter column is interior by supreme first polypropylene filtering layer, adsorbed layer, ion exchange resin layer and the second polypropylene filtering layer of having set gradually down.

Further, the adsorption layer comprises at least one of activated carbon and diatomite.

Furthermore, a second flow regulating valve is arranged between the water storage cavity and the water separator, a temperature sensor is further arranged in the water outlet pipe, and the second flow regulating valve and the temperature sensor are both electrically connected with the controller.

Compared with the prior art, the beneficial effects of the utility model are that:

on the one hand, the utility model provides a pair of intelligence semiconductor heat supply boiler carries out the pretreatment through the inside at the casing sets up the filter column to the medium that gets into the heater, can reduce the impurity in the medium effectively, especially ion concentration to reduce the emergence of scale deposit phenomenon.

On the other hand, the utility model provides a pair of intelligence semiconductor heat supply boiler deposits the water cavity through setting up, can carry out the medium after the pretreatment in non-heating period and carry to depositing the water intracavity and save to supply the heating period to use, and it sets up level sensor to deposit the water intracavity, can make the medium volume that deposits the water intracavity maintain relatively invariable, in order to reduce the potential safety hazard.

Drawings

Fig. 1 is a schematic view of an overall structure of an intelligent semiconductor heat supply boiler according to an embodiment of the present invention;

fig. 2 is a cross-sectional view of an intelligent semiconductor heating boiler a-a' according to an embodiment of the present invention;

the reference signs are: 10-shell, 101-water inlet pipe, 102-water outlet pipe, 11-box door, 12-filter column, 13-connecting pipe fitting, 14-water storage cavity, 15-water separator, 15 a-second flow regulating valve, 16-semiconductor heating pipe, 17-water collector and 20-controller.

Detailed Description

Embodiments of the present invention will be described in detail below with reference to the accompanying drawings. The following examples are only for illustrating the technical solutions of the present invention more clearly, and therefore are only examples, and the protection scope of the present invention is not limited thereby.

In the description of the present invention, "a plurality" means two or more unless otherwise specified; the terms "upper", "lower", "left", "right", "inner", "outer", "front", "rear", "head", "tail", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are merely for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "connected" and "connected" are to be interpreted broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; may be directly connected or indirectly connected through an intermediate. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

As shown in fig. 1-2, the intelligent semiconductor heat supply boiler provided by this embodiment includes a casing 10, a door 11 is hinged on the casing 10, a water inlet pipe 101 and a water outlet pipe 102 are respectively disposed on two sides of the casing 10, a booster pump and a first flow regulating valve are disposed on the water inlet pipe 101, and a filtering column 12, a water storage cavity and a heater which are sequentially communicated are disposed inside the casing 10. The bottom of the filter column 12 is communicated with a water inlet pipe 101, the top of the filter column is communicated with a water storage cavity through a connecting pipe fitting 13, the bottom of the water storage cavity is communicated with the top of the heater through a water separator 15, and the bottom of the heater is communicated with a water outlet pipe 102 through a water collector 17. The inside of the connecting pipe 13 is also provided with a pressure sensor. The inside of casing 10 still is provided with controller 20, booster pump, first flow control valve and pressure sensor all with controller 20 is connected. When the intelligent semiconductor heat supply boiler is used, a medium flows out of the water outlet pipe 102 through the water inlet pipe 101 after sequentially passing through the filter column 12, the water storage cavity and the heater, and is heated in the process.

In this embodiment, a filtering filler is disposed in the filtering column 12, a plurality of filtering layers are disposed inside the filtering column 12, and the filtering layers sequentially include a first polypropylene filtering layer, an adsorption layer, an ion exchange resin layer, and a second polypropylene filtering layer from bottom to top. The adsorption layer is a mixture of activated carbon and diatomite. Polypropylene mesh cloth is further arranged on two sides of the adsorption layer and the ion exchange resin layer to divide the filter layers into cells. The first polypropylene filter layer is convenient for primarily filtering media, and the adsorption layer adsorbs the media to remove heavy metals, organic matters and inorganic matters in the media, so that the corrosion of the conveying pipeline and the heating pipeline can be effectively slowed down. The ion exchange resin can effectively replace ions in a medium so as to slow down the scaling of the pipeline and prolong the service life of the pipeline.

In this embodiment, a liquid level sensor is disposed in the water storage cavity, and the liquid level sensor is electrically connected with the controller 20 so as to transmit liquid level detection data to the controller 20. The bottom of the water storage cavity is communicated with a heater through a water separator 15, the heater comprises a plurality of semiconductor heating pipes 16 which are arranged in parallel, and the bottoms of the semiconductor heating pipes 16 are communicated with a water outlet pipe 102 through a water collector 17. A second flow regulating valve 15a is arranged between the water storage cavity and the water separator 15, and the second flow regulating valve 15a is electrically connected with the controller 20. The medium in the water storage cavity enters the heater through the water separator 15 to be heated, and the controller 20 controls the flow regulating valve to regulate the flow rate of the medium entering the heater.

In this embodiment, a temperature sensor is further disposed in the water outlet pipe 102, and the temperature sensor is electrically connected to the controller 20. The temperature sensor facilitates detection of the heated medium temperature and transmits the detected temperature to the controller 20 in real time.

In the present embodiment, the controller 20 is of a model STM32F103C8T6, and the liquid level sensor is a floating ball type liquid level sensor.

When the intelligent semiconductor heat supply boiler provided by the embodiment is used, a medium is pumped into the filter column 12 through the booster pump for filtering, and the medium can be sequentially filtered, adsorbed and replaced in the process of moving from the bottom to the top of the filter column 12, so that the content of various organic matters and inorganic matters in the medium is reduced, the water quality is improved, and the generation of scale is fundamentally reduced. The substrate processed by the filter column 12 enters the water storage cavity through the connecting pipe 13, in the process, the pressure in the connecting pipe 13 is detected through the pressure sensor, the detection data can reflect the blocking and stasis conditions inside the filter column 12, and if the pressure detection data is smaller than a set threshold value, the filter column 12 can be taken out for regeneration processing, so that the processing capacity of the filter column 12 is improved. The liquid level sensor in the water storage cavity transmits detection data to the controller 20, and when the detection data of the liquid level sensor is smaller than a liquid level setting threshold value, the controller 20 can supplement the liquid level of the water storage cavity in time by controlling the work of the booster pump and the first flow regulating valve. The medium in the water storage cavity enters the semiconductor heating pipe 16 through the water separator 15 to be heated, the heated medium is discharged through the water outlet pipe 102, the temperature sensor detects the temperature of the medium flowing through the water outlet pipe 102, and the controller 20 controls the second flow regulating valve 15a to regulate the flow rate of the medium entering the heater according to the detection data so as to keep the temperature of the flowing medium uniform.

Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art will understand that the present invention can be modified or replaced with other embodiments without departing from the spirit and scope of the present invention, which should be construed as limited only by the appended claims. The technology, shape and construction parts which are not described in detail in the present invention are all known technology.

Claims

1. An intelligence semiconductor heating boiler which characterized in that: including casing (10), the both sides of casing (10) are provided with inlet tube (101) and outlet pipe (102) respectively, be provided with the booster pump on inlet tube (101), the inside of casing (10) is provided with filter column (12) that communicate in proper order, deposits water cavity and heater, be provided with in filter column (12) and filter the filler, it is provided with level sensor in the water cavity to deposit, water distributor (15) and heater intercommunication are passed through to the bottom in water cavity, the heater includes a plurality of semiconductor heating pipe (16), water collector (17) and outlet pipe (102) intercommunication are passed through to the bottom of semiconductor heating pipe (16), still be provided with controller (20) in casing (10), heater and level sensor all with booster pump controller (20) electricity is connected.

2. An intelligent semiconductor heating boiler according to claim 1, characterized in that: the water inlet pipe (101) is further provided with a first flow regulating valve, and the first flow regulating valve is electrically connected with the controller (20).

3. An intelligent semiconductor heating boiler according to claim 1, characterized in that: the bottom and inlet tube (101) intercommunication of filter column (12), the top is through connecting pipe fitting (13) and deposit water chamber intercommunication, filter column (12) are interior by supreme first polypropylene filtering layer, adsorbed layer, ion exchange resin layer and the second polypropylene filtering layer of having set gradually down.

4. An intelligent semiconductor heating boiler according to claim 1, characterized in that: a second flow regulating valve (15a) is arranged between the water storage cavity and the water distributor (15), a temperature sensor is further arranged in the water outlet pipe (102), and the second flow regulating valve (15a) and the temperature sensor are both electrically connected with the controller (20).