CN218969409U

CN218969409U - Electroplating machine and electroplating system

Info

Publication number: CN218969409U
Application number: CN202223201610.7U
Authority: CN
Inventors: 郭忠军
Original assignee: Tongwei Solar Chengdu Co Ltd
Current assignee: Tongwei Solar Chengdu Co Ltd
Priority date: 2022-11-30
Filing date: 2022-11-30
Publication date: 2023-05-05
Anticipated expiration: 2032-11-30

Abstract

An electroplating machine and an electroplating system belong to the technical field of electroplating. The electroplating machine comprises an electroplating tank for containing plating solution and an anode baffle plate arranged in the electroplating tank. The anode baffle is used to separate the cell from the plated metal source. The anode baffle plate is provided with an edge part and a middle part, a plurality of through holes with the depth of 5-8mm are respectively arranged at intervals between the edge part and the middle part, and the density of the through holes at the edge part is smaller than that of the through holes at the middle part. The density of the through holes at the edge part is smaller than that at the middle part, the depth of the through holes is 5-8mm, the edge effect at the edge position of the battery piece can be weakened, the degree of the thicker or wider plating layer formed at the edge position of the battery piece can be further reduced, and the electroplating uniformity of the battery piece is improved.

Description

Electroplating machine and electroplating system

Technical Field

The application relates to the technical field of electroplating, in particular to an electroplating machine and an electroplating system.

Background

Currently, one of the leading edge solar photovoltaic technologies is to replace the traditional silver paste printing with a copper interconnection technology. Another biggest advantage of the copper interconnection technology except cost of the traditional silver paste printing technology is that the copper interconnection can achieve line refinement, reduce shading area and further improve battery conversion efficiency.

However, when a conventional slot-type plating machine is used for plating a battery piece, uniformity of an obtained electroplated copper layer is poor, so that uneven line thickness and uneven width of a grid line are caused, and conversion efficiency of the battery is affected.

Disclosure of Invention

The present utility model provides a plating machine and a plating system, which partially or completely solve the problem of poor uniformity of a plated grid line of a solar cell in the related art.

In a first aspect, examples of the present application provide an electroplating machine comprising an electroplating bath and an anode baffle. The electroplating bath is used for containing the plating solution. The anode baffle is arranged in the electroplating bath and is used for separating the battery piece from the plated metal source. The anode baffle is provided with an edge part and a middle part, a plurality of through holes are arranged at intervals on the edge part and the middle part, and the density of the through holes on the edge part is smaller than that of the through holes on the middle part; the depth of the through hole is 5-8mm.

An anode baffle plate for separating an anode (plated metal source) from a cathode (battery piece) is arranged in the electroplating bath, a plurality of through holes are arranged at the edge part and the middle part of the anode baffle plate at intervals, and a power line generated during electroplating passes through the through holes. Therefore, the distribution of the electric lines of force passing through the anode barrier can be adjusted by adjusting the distribution of the through holes of the anode barrier. In the anode baffle, the density of the through holes at the edge part is smaller than that at the middle part, so that the edge effect of the edge position (high potential area) of the battery piece can be prevented from being too strong, and the thickness deviation degree of a plating layer at the edge position of the battery piece can be reduced, so that more uniform copper plating grid lines can be formed. The edge portion is a region where the anode baffle plate is opposed to the edge position of the battery piece.

In addition, the depth of each through hole is 5-8mm, so that the probability of forming divergent distribution after the electric lines and the electroplating liquid medicine pass through the through holes in the anode baffle plate can be reduced, and the thickness deviation degree of the grid lines at the edge of the battery piece caused by the fact that more electric lines and electroplating liquid medicine are received at the edge position of the battery piece is further reduced.

In an alternative embodiment of the present application, in combination with the first aspect, the density of the through holes of the edge portion is 25% -30%.

The density of the through holes at the edge part is set to be 25-30%, so that the electric lines of force and electroplating liquid penetrating out of the edge part of the anode baffle plate can be further reduced, the excessive thickness of the plating layer at the edge position of the battery piece can be further avoided, and the plating layer thickness of different areas of the battery piece is more uniform.

With reference to the first aspect, in an alternative embodiment of the present application, the anode baffle is in a rectangular flat plate structure; the middle part is rectangular, and the edge part is a frame surrounding the middle part.

Generally, photovoltaic cells are rectangular flat plates. The anode baffle plate is provided in a rectangular flat plate structure, and can be opposite to the rectangular surface of the battery piece. And the edge part of the battery piece is arranged to be a frame shape surrounding the middle part of the rectangle, which can well correspond to the edge area of the battery piece, so that the plating layer of the battery piece is more uniform.

With reference to the first aspect, in an alternative embodiment of the present application, the through holes include a plurality of first through holes disposed at intervals on the edge portion, and a plurality of second through holes disposed at intervals on the middle portion; the aperture of the first through hole is smaller than that of the second through hole.

The aperture of the first through hole arranged at the edge part is smaller than that of the second through hole arranged at the middle part, so that the electric line of force and electroplating liquid penetrating out of the edge part can be further reduced, and the thickness of a plating layer at the edge part of the battery piece is further reduced.

With reference to the first aspect, in an optional embodiment of the present application, the aperture of the first through hole is 3-5mm.

The aperture of the first through hole is set to be 3-5mm, so that the coating can be formed on the edge part of the battery piece, and meanwhile, the excessive thickness of the coating on the edge part of the battery piece can be avoided, and the thickness of the coating in the battery piece is more uniform.

With reference to the first aspect, in an optional embodiment of the present application, the shape of the first through hole is circular, elliptical, triangular or rectangular;

and/or the shape of the second through hole is circular, elliptical, triangular or rectangular.

The first through hole and the second through hole are arranged to be round, oval, triangular or rectangular, the hole structure is simple, and the preparation is convenient.

With reference to the first aspect, in an optional embodiment of the present application, the plurality of first through holes are uniformly spaced at an edge portion.

The first through holes at the edge part are uniformly arranged at intervals, so that the uniformity of the thickness of the plating layer at the edge part of the battery piece can be improved.

In combination with the first aspect, in an optional embodiment of the present application, a first fixing portion is disposed on one side of the plating tank, and is used for limiting the battery piece in the plating tank.

The fixing part of the battery piece is arranged on one side of the electroplating bath, so that the battery pieces of different batches can be placed at the same position in the electroplating bath, and the influence on the electroplating quality of the battery pieces due to the change of the placement positions of the different battery pieces is avoided.

With reference to the first aspect, in an optional embodiment of the present application, the electroplating machine further includes a sprayer; the sprayer is arranged in the electroplating bath and is used for spraying electroplating liquid.

The sprayer is arranged in the electroplating bath, so that the electroplating liquid in the electroplating bath can be sprayed, various components in the electroplating liquid can be uniformly dispersed, and the electroplating quality is further too high.

In a second aspect, examples of the present application provide a plating system comprising a plating machine as provided in any one of the first aspects.

An anode baffle plate for separating an anode (a plated metal source) and a cathode (a battery piece) is arranged in a plating tank of the electroplating machine, so that the distribution of electric lines of force can be adjusted. A plurality of through holes are arranged at intervals at the edge part and the middle part of the anode baffle plate, so that the power line passes through the through holes. And the density of the through holes at the edge part is smaller than that at the middle part, so that the edge effect of the edge position (high potential area) of the battery piece can be prevented from being too strong, and further, the formation of an excessively thick coating at the edge position of the battery piece can be avoided, and further, the uniformity of the coating of the battery piece can be improved.

In addition, the depth of each through hole in the anode baffle plate is 5-8mm, so that the power lines and electroplating liquid medicine in electroplating can be reduced, the probability of divergent distribution is formed after the through holes in the anode baffle plate are penetrated, and further, the situation that the grid lines at the edge positions of the battery pieces are thicker or wider due to the fact that more power lines and electroplating liquid medicine are received at the edge positions of the battery pieces is avoided.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered limiting the scope, and that other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic view of a prior art electroplated baffle plate;

FIG. 2 is a schematic cross-sectional view of a battery plate with non-uniform plating;

FIG. 3 is a schematic view of an electroplating system according to an example of the present application;

fig. 4 is a front view of an anode baffle plate provided by an example of the present application.

Icon: 1-an electroplating system; 10-an electroplating machine; 11-electroplating bath; 111-a first fixing portion; 12-an anode baffle; 121-edge portion; 122-middle; 123-through holes; 1231-first through holes; 1232-a second through hole; 13-sprayer.

100-electroplating a baffle plate; 200-battery pieces; 201-a copper seed layer; 202-a photoresist layer; 203-electroplating copper grid lines; l1-depth.

Detailed Description

Embodiments of the technical solutions of the present application will be described in detail below with reference to the accompanying drawings. The following examples are only for more clearly illustrating the technical solutions of the present application, and thus are only examples, and are not intended to limit the scope of protection of the present application.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs; the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application; the terms "comprising" and "having" and any variations thereof in the description of the present application and in the description of the drawings above are intended to cover non-exclusive inclusions.

In the description of the embodiments of the present application, the technical terms "first," "second," etc. are used merely to distinguish between different objects and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated, a particular order or a primary or secondary relationship. In the description of the embodiments of the present application, the meaning of "plurality" is two or more unless explicitly defined otherwise.

Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the present application. The appearances of such phrases in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. Those of skill in the art will explicitly and implicitly appreciate that the embodiments described herein may be combined with other embodiments.

In the description of the embodiments of the present application, the term "plurality" refers to more than two (including two).

In the description of the embodiments of the present application, the orientation or positional relationship indicated by the technical terms "middle", "length", "width", "thickness", "up", "down", "front", "rear", "bottom", "inner", etc. are based on the orientation or positional relationship shown in the drawings, merely for convenience of describing the embodiments of the present application and simplifying the description, and are not indicative or implying that the apparatus or element in question must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the embodiments of the present application.

In the description of the embodiments of the present application, unless explicitly specified and limited otherwise, the terms "connected," "fixed" and the like are to be construed broadly and include, for example, either fixedly connected, detachably connected, or integrally formed; or may be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the embodiments of the present application will be understood by those of ordinary skill in the art according to the specific circumstances.

Currently, one of the leading edge solar photovoltaic technologies is to replace the traditional silver paste printing with copper interconnection technology. Another biggest advantage of the copper interconnection technology except cost of the traditional silver paste printing technology is that the copper interconnection can achieve line refinement, reduce shading area and further improve conversion efficiency of the battery.

The copper interconnection technology is to deposit a copper seed layer 201 on a silicon base layer of a cell 200, then coat a photoresist layer 202 on the copper seed layer 201, then expose and develop the photoresist layer to remove unnecessary photoresist to form a groove, and then electroplate copper on the copper seed layer 201 in the groove to form an electroplated copper grid line 203.

Electroplating refers to a surface processing method for forming a plating layer by using a plated base metal (e.g., a copper seed layer in a battery piece 200) as a cathode in a salt solution containing a pre-plating metal and depositing cations of the pre-plating metal in the plating solution on the surface of the plated base metal through electrolysis.

However, when the conventional electroplating apparatus is used for electroplating the battery 200, uniformity of the obtained electroplated copper grid line 203 is poor, for example, uneven thickness and uneven width of the grid line affect the conversion efficiency of the battery 200.

Referring to fig. 1, in the conventional slot plating machine, the hollow hole in the plating baffle 100 is elliptical and is located in the middle of the plating baffle 100.

The inventors have found that, when the conventional slot plating machine is used to plate the battery 200, referring to fig. 2, the thickness of the plating layer formed at the edge position of the battery 200 is high. And the width of the plating layer is wider than that of the plating layer at other positions.

Therefore, the electroplating equipment is further improved, so that the situation that the electroplated copper grid line at the edge position of the electroplated battery piece is too thick and too wide can be improved to a certain extent, and the uniformity of the grid line obtained after electroplating is improved. In order to make the objects, technical solutions and advantages of the embodiments of the present application more clear, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application.

The application provides an electroplating system, including an electroplating machine.

Referring to fig. 3 and 4, the electroplating machine 10 includes an electroplating tank 11 and an anode baffle 12. The plating tank 11 is used for containing plating solution. An anode baffle 12 is disposed within the plating cell 11 for separating the battery 200 from the source of plated metal. The anode baffle plate 12 has an edge portion 121 and a middle portion 122, the edge portion 121 and the middle portion 122 are each provided with a plurality of through holes 123 at intervals, and the through hole density of the edge portion 121 is smaller than that of the middle portion 122. The depth L1 of the through hole 123 is 5-8mm.

An anode baffle 12 for separating an anode (plated metal source) and a cathode (battery piece 200) is provided in the plating tank 11, and the distribution of electric lines of force can be adjusted. A plurality of through holes 123 are provided at intervals in both the edge portion 121 and the middle portion 122 of the anode baffle plate 12 such that the electric power lines pass through the through holes 123. In addition, the density of the through holes of the edge portion 121 is smaller than that of the through holes of the middle portion 122, so that the edge effect of the edge position (high potential area) of the battery piece 200 can be prevented from being too strong, and further, the thick and too wide edge plating layer of the battery piece 200 can be prevented from being formed, and the uniform electroplated copper grid line 203 can be formed at the position of the battery piece 200.

Moreover, the depth L1 of each through hole 123 is 5-8mm, so that the electric power lines and the electroplating solution can be prevented from forming divergent distribution after passing through the holes in the anode baffle 12, and further the thicker or wider electroplated copper grid line 203 at the edge position of the battery piece 200 caused by that more electric power lines and electroplating solution are received at the edge position of the battery piece 200 is avoided.

The electroplating bath 11 and the anode baffle 12 in the electroplating machine 10 according to the embodiments of the present application are described in further detail below with reference to the accompanying drawings.

The plating tank 11 is used for holding a plating solution, at least part of an anode (plated metal source, such as a copper plate) and a cathode (battery piece 200) is immersed in the plating solution, and pre-plated metal cations in the plating solution are deposited on the surface of the copper seed layer 201 of the battery piece 200 by electrolysis to form plated copper grid lines 203.

The specific material of the plating tank 11 is not limited in this application, and a person skilled in the art may select the material as needed.

In some possible embodiments, the plating tank 11 may be made of PP, PVC, PVDF, or the like.

The specific shape of the plating vessel 11 is not limited in this application, and the person concerned may make a corresponding choice as required.

In some possible embodiments, the chamber inside plating cell 11 is cubical to accommodate the placement of battery 200. Illustratively, plating cell 11 includes a rectangular bottom plate, and four rectangular side plates surrounding the bottom plate.

Further, in order to facilitate placement of the respective cathode, anode, and anode baffle 12 in the plating tank 11, an anode placement portion, a cathode placement portion, and an anode baffle placement portion may be provided inside the plating tank 11.

Illustratively, the anode baffle placement portion is located in the middle of the plating tank 11, and an insulating first clamping groove is provided in the middle of the bottom plate along the length direction thereof. Two ends of the first clamping groove extend to two opposite side plates respectively, and one edge of the anode baffle plate 12 can be clamped in the first clamping groove.

Illustratively, an anode fixing portion and a cathode fixing portion are provided at the side plates at both sides of the first clamping groove, respectively, to separate the anode and the cathode by an anode baffle 12 provided at the first clamping groove.

Alternatively, two first clamping grooves may be provided in the plating tank 11 at intervals along the longitudinal direction thereof, and the extending direction of the two first clamping grooves is the width direction of the plating tank 11. The electroplating machine 10 may include two anode baffles 12, where the two anode baffles 12 are respectively clamped in the two first clamping grooves. And a cathode clamping groove is arranged between the two first clamping grooves, and two anode clamping grooves are respectively arranged on one sides of the two first clamping grooves, which are far away from each other.

The cathode fixing portion is the first fixing portion 111. The specific arrangement form of the first fixing portion 111 is not limited in this application, and the related person may make corresponding adjustments as needed.

In some possible embodiments, the first fixing portion 111 may be a second clamping groove disposed at the bottom plate and parallel to the first clamping groove, and one edge of the battery piece may be clamped in the first clamping groove. The first clamping groove and the second clamping groove are both insulating.

Alternatively, referring to fig. 3, the first fixing portion 111 includes two limiting slots respectively disposed on two opposite side plates connected to two ends of the first clamping slot.

Alternatively, the first fixing portion 111 may include a hook disposed above the notch of the plating tank 11, on which a clamping piece is hung, and one edge of the top of the battery piece 200 may be clamped by the clamping piece, so as to fix the battery piece 200 at a preset position.

The anode baffle 12 is positioned between the cathode (cell 200) and the anode (e.g., copper plate) to adjust the distribution of the power lines and plating solution.

The anode barrier 12 has insulation. The insulating material may block the power lines from passing through the non-hole areas. The material of the anode baffle 12 is not limited in this application, and the relevant person may make corresponding selections as needed.

In some possible embodiments, the anode baffle 12 may be made of PP, PVC, PVDF, or the like.

It will be appreciated that during electroplating, the power lines in the electroplating machine 10 can only pass through the through holes 123 in the anode baffle plate 12, and the remainder are shielded. In addition, the anode baffle 12 can also prevent various impurities or residues deposited in the plating solution from adhering to the copper plating layer on the surface of the battery plate 200, and can further improve the plating quality.

In the example, the anode baffle 12 has an edge portion 121 and a middle portion 122. The edge portion 121 and the middle portion 122 are each provided with a plurality of through holes 123 at intervals, and the through hole density of the edge portion 121 is smaller than that of the middle portion 122. And the depth L1 of the through hole 123 is 5-8mm.

Since the density of the through holes provided at the edge portion 121 of the anode baffle plate 12 is smaller than that of the through holes provided at the middle portion 122 of the anode baffle plate 12, the edge effect at the edge position (high potential region) of the battery cell 200 can be prevented from being excessively strong, and further, the plating layer at the edge of the battery cell 200 can be prevented from being thicker.

Moreover, the depth L1 of each through hole 123 is 5-8mm, so that the power lines and the electroplating solution can be prevented from forming divergent distribution after passing through the through holes 123 in the anode baffle 12, and further the thicker grid lines at the edge of the battery piece 200 caused by more power lines and electroplating solution received at the edge of the battery piece 200 can be avoided.

The present application is not limited to a specific depth L1 of the through hole 123, and the depth L1 of the through hole 123 may be one or any range between 5mm, 5.5mm, 6mm, 7mm, or 8mm, by way of example.

The depth L1 of each through hole 123 may be arbitrarily selected within the above-described range.

Illustratively, the depth L1 of each through hole 123 at the middle portion 122 is 8mm, and the depth L1 of each through hole 123 at the edge portion 121 is 5mm.

Illustratively, the edge portion 121 includes a through hole 123 having a depth L1 of 5mm, a through hole 123 having a depth L1 of 6mm, and a through hole 123 having a depth L1 of 8mm at the same time.

Hereinafter, for convenience of description, the through hole 123 provided at the edge portion 121 is defined as a first through hole 1231, and the through hole 123 provided at the middle portion 122 is defined as a second through hole 1232.

Without the anode baffles 12, the electric field between the anode and the cathode may have an edge effect when the cell 200 is plated. Specifically, the distribution of the electric lines of force at the edge of the electroplated region of the battery piece 200 is concentrated, and the distribution of the electric lines of force near the middle is sparse, so that the copper layer of the middle electroplated region on the battery piece 200 is thinner, and the copper layer of the edge electroplated region is thicker, namely, the edge effect of 'middle thin and edge thick' occurs. And when the anode baffle plate 12 provided with the plurality of through holes 123 is placed between the anode in the plating tank 11 and the battery plate 200, the electric power line passes through the through holes 123. Therefore, the number of the first through holes 1231 is reduced at the edge 121 of the anode baffle plate 12, so that the electric lines of force at the edge of the battery sheet 200 can be reduced, and the thickness and width of the plating layer at the edge of the battery sheet 200 can be reduced.

The specific form of the edge portion 121 and the middle portion 122 of the anode barrier plate 12 is not limited in this application, and the edge portion 121 refers to the region of the anode barrier plate 12 opposite to the edge portion of the cell sheet 200. In general, the battery cell 200 has a rectangular flat plate shape, and the edge portion of the battery cell 200 has a rectangular partial region extending inward from four sides.

For example, the anode barrier 12 may be provided in a rectangular flat plate shape, and the edge portion 121 of the anode barrier 12 in the rectangular flat plate shape may be a rectangular frame shape with the middle portion 122 in the middle of the rectangular frame shape.

Alternatively, the middle portion 122 in the anode barrier 12 is circular, and the edge portion 121 is frame-shaped around the circular middle portion.

The edge portion 121 has a smaller density of through holes than the center portion 122. Illustratively, the edge portion 121 has a through-hole density of 25% -30%.

The through hole density of the edge portion 121 being 25% -30% means that the sum of the sectional areas of all the first through holes 1231 is 25% -30% of the sectional area of the anode barrier plate 12. Illustratively, the central portion 122 has a through-hole density of 40% -50%.

Illustratively, the via density of the edge portion 121 may be in a range between one or any two of 25%, 26%, 27%, 29%, and 30%.

Further, the plurality of first through holes 1231 are uniformly spaced apart from the edge 121.

That is, the distances between any adjacent two first through holes 1231 at the edge portion 121 are equal.

Further, the present application is not limited to the pore size of each first via 1231, and in some possible embodiments, the pore size of the first via 1231 is 3-5mm.

The present application is not limited to a particular shape of the first through-hole 1231, and in some possible embodiments, the shape of the first through-hole 1231 may be circular, elliptical, triangular, or rectangular.

The aperture of the first through hole 1231 is 3-5mm, which means the diameter of a circular hole or the long axis of an elliptical hole, or the diameter of a circumscribing circle of a triangular hole and a rectangular hole.

Further, the edge portion 121 may be provided with first through holes 1231 of different hole patterns. That is, the edge portion 121 is provided with both a circular hole and an elliptical hole.

Further, a second through hole 1232 of a different hole type may be provided at the middle portion 122. That is, the middle portion 122 is provided with both circular holes and elliptical holes.

In order to further prevent impurities such as anode mud in the plating solution from adhering to the cell 200 through the anode baffle plate 12, a filter screen may be provided on the side of the anode baffle plate 12 close to the anode.

The electric lines of force and plating solution can pass through the filter screen and pass out from the holes in the anode baffle plate 12, and impurity particles can not pass out from the holes in the copper anode baffle plate 12 due to the blocking of the filter screen, so that the plating quality is further improved.

In order to improve the uniformity of dispersion of the plating solution stored in the plating vessel 11, in some possible embodiments, the plating machine 10 further includes a shower 13.

The sprayer 13 is used for spraying the plating solution stored in the plating tank 11 so that a plurality of components in the plating solution can be uniformly dispersed.

The particular arrangement of the sprayer 13 is not limited by the present application, and in some possible embodiments, the sprayer 13 includes a spray head and a liquid pump. The liquid pump pumps the electroplating solution in the electroplating tank 11, and the pumped electroplating solution flows back into the electroplating tank 11 from the spray head, so that the fluidity of the electroplating solution in the electroplating tank 11 is increased, and the dispersion uniformity of the electroplating solution is further improved.

The examples of the present application also provide an electroplating system 1 comprising an electroplating machine 10.

The specific arrangement of the plating system 1 is not limited in this application, and in some possible embodiments, the plating system 1 further includes a cleaning device for cleaning the plated battery piece to remove the plating solution on the surface of the battery piece.

Illustratively, the cleaning apparatus includes a chain conveyor, and a shower plate disposed above the chain conveyor. The electroplated battery piece 200 is placed on a chain conveyor, and cleaning liquid sprayed out by a spraying plate is cleaned in the conveying process of the chain conveyor.

Further, a drying box may be further provided to dry the sprayed battery piece 200.

Illustratively, one end of the chain conveyor extends to the outer wall of the electroplating tank 11, and the other end of the chain conveyor penetrates out of the chamber in the drying box, so that the electroplated battery piece 200 can be sequentially sprayed and cleaned through the spraying plate and dried through the drying box under the action of the chain conveyor.

The working principle of the electroplating machine provided by the embodiment of the application is as follows:

an anode baffle 12 is provided in the plating tank 11, and an anode (plated metal source) and a cathode (battery piece 200) are provided on both sides of the anode baffle 12. A plurality of through holes 123 are provided at intervals in both the edge portion 121 and the middle portion 122 of the anode baffle plate 12, and electric lines of force generated at the time of plating pass through the through holes 123, so that the distribution of electric lines of force can be adjusted by the anode baffle plate 12. In addition, the density of the through holes of the edge portion 121 is smaller than that of the through holes of the middle portion 122, so that the edge effect of the edge position (high potential area) of the battery piece 200 can be prevented from being too strong, and the thickness deviation degree of the plating layer at the edge position of the battery piece 200 can be reduced, so that more uniform copper plating grid lines can be formed.

In addition, the depth of each through hole 123 is 5-8mm, so that the power lines and electroplating liquid medicine during electroplating can be reduced, the probability of divergent distribution is formed after the through holes 123 in the anode baffle 12 are penetrated, and the situation that the grid lines at the edge of the battery piece 200 are thicker due to the fact that more power lines and electroplating liquid medicine are received at the edge of the battery piece 200 is further avoided.

The foregoing description is only of the preferred embodiments of the present application and is not intended to limit the same, but rather, various modifications and variations may be made by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. An electroplating machine, comprising:

an electroplating bath for containing a plating solution;

the anode baffle is arranged in the electroplating bath and used for separating the battery piece from a plated metal source; the anode baffle plate is provided with an edge part and a middle part, a plurality of through holes are formed in the edge part and the middle part at intervals, and the density of the through holes of the edge part is smaller than that of the through holes of the middle part; the depth of the through hole is 5-8mm.

2. The electroplating machine of claim 1, wherein the edge portion has a through hole density of 25% -30%.

3. The electroplating machine of claim 1, wherein the anode baffle is a rectangular flat plate structure; the middle part is the rectangle, the marginal portion is the frame shape around the middle part.

4. The plating machine as recited in claim 3, wherein said through holes include a plurality of first through holes provided at intervals in said edge portion, and a plurality of second through holes provided at intervals in said middle portion; the aperture of the first through hole is smaller than that of the second through hole.

5. The electroplating machine according to claim 4, wherein the first through hole has a pore diameter of 3-5mm.

6. The electroplating machine of claim 4, wherein the first through hole is circular, elliptical, triangular or rectangular in shape;

the shape of the second through hole is round, oval, triangular or rectangular.

7. The plating machine as recited in claim 6, wherein a plurality of said first through holes are provided at regular intervals in said edge portion.

8. The electroplating machine of claim 1, wherein a first fixing portion is disposed on one side of the electroplating tank and is used for limiting the battery piece in the electroplating tank.

9. The electroplating machine of claim 1, further comprising a sprayer; the sprayer is arranged in the electroplating bath and is used for spraying the electroplating liquid.

10. An electroplating system, comprising: the electroplating machine of any one of claims 1-9.